Fuse Making Patents (Class 29/623)
  • Patent number: 5974661
    Abstract: The thin film, circuit device is a subminiature overvoltage protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components.The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device to a PC board. The second subassembly includes a voltage variable polymer material with non-linear characteristics, and the third subassembly includes a cover coat for protecting the circuit protection device.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: November 2, 1999
    Assignee: Littelfuse, Inc.
    Inventor: Andrew J. Neuhalfen
  • Patent number: 5943764
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: August 31, 1999
    Assignee: Littelfuse, Inc.
    Inventors: Vladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Patent number: 5926084
    Abstract: A fuse includes at least one ceramic part at least partially surrounded by a sinterable mass coating that is electrically conductive after a sintering process. The sinterable mass coating is disposed in the vicinity of the two remote sides of the first part. The fuse also includes a second part firmly connected to the first part by the mass coating. The second part has an electrically conductive surface and a fuse element. A method for manufacturing a blowout fuse includes fixing a first part of the fuse made from metal or a ceramic material to a second part of the fuse made from metal or a ceramic material using a sinterable mass. This method includes the steps of applying a mass to be fixed by sintering to at least one portion of the surface of the first part and/or one portion of the surface of the second part. The mass acts as an intermediate layer between the two parts to be connected and wholly or partially covers both surfaces.
    Type: Grant
    Filed: January 16, 1997
    Date of Patent: July 20, 1999
    Assignee: Wickmann-Werke GmbH
    Inventor: Bernd Frochte
  • Patent number: 5861809
    Abstract: A resonant tag used with an electronic article surveillance system for detecting the presence of the tag within a surveilled area utilizing electromagnetic energy at a frequency within a predetermined detection frequency range includes a resonant circuit capable of resonating at a frequency within the predetermined detection frequency range. The resonant circuit includes an inductor formed at least in part on a surface of a dielectric substrate of the tag. The inductor is formed with a discontinuity or gap, causing an electrical open circuit. The open circuit is closed with a fuse secured proximate to the gap and wirebonded to the portions of the inductor proximate to the gap. The fuse is melted by a current greater than a predetermined level flowing therethrough. Such a high current may be induced in the inductor by an external electromagnetic field. Melting of the fuse causes an open circuit condition, which alters the frequency at which the tag resonates.
    Type: Grant
    Filed: September 22, 1997
    Date of Patent: January 19, 1999
    Assignee: Checkpoint Systems, Inc.
    Inventors: Eric Alan Eckstein, Lawrence Appalucci, Gary Thomas Mazoki
  • Patent number: 5844477
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: December 1, 1998
    Assignee: Littelfuse, Inc.
    Inventors: Vladmir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Patent number: 5821847
    Abstract: To effectively prevent the efflux at the time of depositing a fusible metal, a fuse includes a clamping piece in the longitudinal middle portion of a fusible element, a fusible metal having a low melting point is clamped by and deposited on the clamping piece, in which the fusible metal is deposited on the fusible element while parts of the fusible metal exposed when fusible metal is clamped with the clamping piece, are covered with enclosing walls that are formed by bending the fusible element on both sides of the clamped part to the sides of the fusible metal.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: October 13, 1998
    Assignee: Yazaki Corporation
    Inventor: Mitsuhiko Totsuka
  • Patent number: 5812046
    Abstract: A method for manufacturing a subminiature fuse includes the steps of applying metallized coatings to surfaces at axially opposite ends of a hollow fuse body, placing a fuse element in an internal cavity in the fuse body, the fuse element extending from the first end to the second end of the cavity, placing a one of a solder and brazing preform and end termination at each of the first and second ends of the cavity, and heating the assembled fuse body, fuse element, solder preforms and end terminations to a temperature sufficient to cause the solder preforms to bond the fuse element to the end terminations and for the end terminations to bond with the metallized end portions of the fuse body, wherein the end terminations form hermetic seals closing the ends of the cavity. A subminiature fuse according to the invention includes a fuse body with a fuse element diagonally disposed in the body. The fuse body includes metallized end portions to which the end terminations are bonded.
    Type: Grant
    Filed: January 30, 1997
    Date of Patent: September 22, 1998
    Assignee: Cooper Technologies, Inc.
    Inventors: Russell Brown, Farid Ghaderi, Varinder K. Kalra, Keith A. Spalding, Joan L. Winnett, Stephen J. Whitney
  • Patent number: 5802703
    Abstract: A method of forming a chain of fuse-links made from an electrically conductive metal plate. Each fuse-link P4 has an arc-shaped fusing portion 1 and a couple of terminal portions 4, 4 constituting a pair of wing-shaped members connected to each end of the arc-shaped fusing portion 1. A carrier strap 9 has a plurality of vertical connecting pieces 8 each positioned at fixed intervals for retaining the plurality of fuse-links P4. Each of a plurality of interconnection pieces 7' is connected to the vertical connecting piece 8 at one end and connected to a side edge of specific side one of the couple of terminal portions at the other end. The other end of the interconnection piece 7' is bent so that the end edges of the couple of terminal portions 4, 4 rise above the carrier strap 9.
    Type: Grant
    Filed: April 2, 1997
    Date of Patent: September 8, 1998
    Assignee: Yazaki Corporation
    Inventors: Mitsuhiko Totsuka, Hisashi Hanazaki
  • Patent number: 5790008
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate with a groove on side surfaces and a plurality of conductive terminal pad layers. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: January 14, 1997
    Date of Patent: August 4, 1998
    Assignee: Littlefuse, Inc.
    Inventors: Vladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Patent number: 5790007
    Abstract: A board fuse includes an insulating board having a through-hole window in the middle of the insulating board and fusible elements laid over the insulating board. Further, the fusible elements are continuous metal wires substantially equal in cross section. The fusible elements are uniform and accurate in cross section and accurate in current capacity. The fusible elements extend across the window in such a manner that, at the window, they are not in contact with the insulating board. Hence, when heat is generated in any one of the fusible elements by electric current, the heat generated at the window is not absorbed by the insulating board and is increased as required, thus blowing the fusible element accurately. Accordingly, the board fuse is free from the difficulties caused by the heat generation, that is, the production of a bad smell, at worst the production of white smoke.
    Type: Grant
    Filed: March 20, 1996
    Date of Patent: August 4, 1998
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Jun Yasukuni
  • Patent number: 5774037
    Abstract: A subminiature circuit protector includes a substrate carrying a metal fuse element hermetically sealed in a glass sleeve cartridge. The fuse element may comprise a film deposited on the substrate, or, alternatively a metal strip or wire. Leads extend from opposing ends of the sleeve for connection in a circuit, and a gas is sealed in the sleeve to provide a suitable environment to improve operating lifetime and interrupting capability. A method for making a circuit protector includes placing a substrate carrying a fuse element in a glass sleeve and placing leads in contact with the fuse element. The assembly is heated in the presence of a gas below atmospheric pressure to a temperature sufficient to soften the glass. The pressure is then increased to cause the ends of the glass sleeve to form a hermetic seal about the leads.
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: June 30, 1998
    Assignee: Cooper Industries, Inc.
    Inventor: Leon Gurevich
  • Patent number: 5752310
    Abstract: A slowly-breaking fuse includes a housing made of a synthetic resin, a fuse element including a pair of terminal members for an electrical connection, and a melting member mounted between the terminal members, the melting member being smaller in thickness than the terminal member, the melting member having a narrow elongated central portion and a pair of base portions between which the narrow elongated central portion is mounted, and a cross-sectional area increased member provided at an opposite end of the melting member.
    Type: Grant
    Filed: June 2, 1997
    Date of Patent: May 19, 1998
    Assignee: Yazaki Corporation
    Inventors: Hiroki Kondo, Mitsuhiko Totsuka, Toshiharu Kudo, Hisashi Hanazaki
  • Patent number: 5713124
    Abstract: A current-limiting device is provided having a low profile configuration (generally flat polyhedron) that defines a cavity of predetermined dimensions and an elongated circuitous path through the cavity. The device also includes provisions for supporting a current-limiting fusible element along the path. The cavity is filled with a pulverulent arc-quenching filler material. In one specific arrangement, the path of the fusible element is defined by one or more U-shaped sections substantially spanning the length or width of the cavity. The fusible element is arranged in a predetermined geometry to include a length of the fusible element that is longer than the overall straight-line path via a configuration of steps or bends along its length.
    Type: Grant
    Filed: December 23, 1996
    Date of Patent: February 3, 1998
    Assignee: S&C Electric Company
    Inventor: Hiram S. Jackson
  • Patent number: 5664320
    Abstract: A subminiature circuit protector includes a substrate carrying a metal fuse element hermetically sealed in a glass sleeve cartridge. The fuse element may comprise a film deposited on the substrate, or, alternatively a metal strip or wire. Leads extend from opposing ends of the sleeve for connection in a circuit, and a gas is sealed in the sleeve to provide a suitable environment to improve operating lifetime and interrupting capability. A method for making a circuit protector includes placing a substrate carrying a fuse element in a glass sleeve and placing leads in contact with the fuse element. The assembly is heated in the presence of a gas below atmospheric pressure to a temperature sufficient to soften the glass. The pressure is then increased to cause the ends of the glass sleeve to form a hermetic seal about the leads.
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: September 9, 1997
    Assignee: Cooper Industries
    Inventor: Leon Gurevich
  • Patent number: 5661448
    Abstract: A chain of fuse-links is made from an electrically conductive metal plate. Each fuse-link P4. has an arc-shaped fusing portion 1 and a couple of terminal portions 4, 4 constituting a pair of wing-shaped members connected to each end of the arc-shaped fusing portion 1. A carrier strap 9 has a plurality of vertical connecting pieces 8 each positioned at fixed intervals for retaining the plurality of fuse-links P4. Each of a plurality of interconnection pieces 7 is connected to the vertical connecting piece 8 at one end and connected to a side edge of specific side one of the couple of terminal portions at the other end. The other end of the interconnection piece 7' is bent so that the end edges of the couple of terminal portions 4, 4 rise above the carrier strap 9.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: August 26, 1997
    Assignee: Yazaki Corporation
    Inventors: Mitsuhiko Totsuka, Hisashi Hanazaki
  • Patent number: 5655292
    Abstract: A fuse holder (2) for use in electrical apparatus includes a tubular body (6) having outer and inner ends (10, 16). A first electrical contact element (22) and a mounting flange (8) are secured to the inner and outer ends, preferably using resilient retaining rings (53, 68) engaging circular grooves (52, 20; 62, 20) formed in the opposed surfaces. A tubular second electrical contact element (32) is secured within the tubular body and preferably has a flexible electrical terminal strap (24) which extends out through an opening (23) formed in the tubular body. Fluid-tight seals are provided between the inner surface (14) of the tubular body and the outer surfaces (46, 58, 30) of the first and second electrical contact elements and the mounting flange assembly by using pairs of O-rings (38, 50 and 70); an adhesive (39) is also used to secure these elements to the body.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: August 12, 1997
    Assignee: Kuhlman Electric Corporation
    Inventors: John L. Fisher, J. Donald Richerson, Ronald F. Dornbrock, John E. Cloyd, Stephen D. Smith
  • Patent number: 5631620
    Abstract: There is disclosed a fusible link which obviates the need for a spacer for supporting a fuse element. An insulative housing includes an integral bottom wall through which at least one pair of through holes are formed. A fuse element extends through these through holes, and includes terminal portions and resilient retaining piece portions. The resilient retaining piece portion and the bent terminal portion holds the bottom wall of the housing, thereby retaining the fuse element relative to the housing.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: May 20, 1997
    Assignee: Yazaki Corporation
    Inventors: Mitsuhiko Totsuka, Toshiharu Kudo
  • Patent number: 5612662
    Abstract: A thermal fuse includes a leaf spring formed of a narrow sheet metal strip. The leaf spring has ends and at least two contact points at the ends. At least one of the contact points is a soldering point for connection with corresponding circuit contacts of a circuit substrate. The leaf spring has at least one spring arm interconnecting the contact points. The spring arm has a roof-shaped deformation in the vicinity of one contact point. The spring arm has a flat and elongated spring segment with a transition adjoining the deformation and a transition extending to the other contact point. The spring segment is bending resistant in the vicinities of the transitions, for transforming a compressive deformation applied to the roof-shaped deformation into a lateral movement and into an arching of the spring segment, with both ends of the leaf spring attached to the circuit substrate without pretensioning.
    Type: Grant
    Filed: February 7, 1995
    Date of Patent: March 18, 1997
    Assignee: Siemens Aktiengesellschaft
    Inventors: Karl G. Drekmeier, Gerhard Winter
  • Patent number: 5606301
    Abstract: A micro-chip fuse and a method of manufacturing the fuse is disclosed which includes a fusible element made of a metallic film that is formed by a depositioning process. Through-bores are provided through a first substrate and filled with a photosensitive resist to make smooth the surface of the first substrate. After curing the resist, metal is deposited on the surface of the first substrate to form a metallic film. A photosensitive resist is applied to the metallic film and a photomask is placed on the resist to effect an exposure and a development. The metallic film is etched and the resists are removed to form the fusible elements made of the metallic film extending over the through-bores. A second substrate is placed under the first substrate, and a third substrate including recesses for cover the through-bores is placed on the first substrate to laminate them. Electrodes are provided on the ends of the substrates. The laminated substrates are divided into individual micro-chip fuses.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: February 25, 1997
    Assignee: SOC Corporation
    Inventor: Koh Ishimura
  • Patent number: 5552757
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: September 3, 1996
    Assignee: Littelfuse, Inc.
    Inventors: Vladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Patent number: 5546066
    Abstract: The present invention provides a delayed-fusion fuse by which its predetermined durability can be reliably ensured, and its stable pre-arcing time-current characteristics can be obtained, even when a current exceeding the steady-state current such as a motor lock current frequently flows in the fuse. The delayed-fusion fuse includes a pair of electric connecting sections formed on both sides of a fusible section having a narrow fusing portion made of an electrically conductive metal. Also, the delayed-fusion fuse includes a metallic chip made of low fusing point metal for absorbing heat generated in the fusible section, and a covering and adhering section for holding the metallic chip on the fusible section. A thin metallic layer forms a solid solution with the low fusing point metal, where the solid solution requires an energy of formation which is higher than that of the formation of a solid solution made of the electrically conductive metal and the low fusing point metal.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: August 13, 1996
    Assignee: Yazaki Corporation
    Inventors: Hiroki Kondo, Mitsuhiko Totsuka, Toshiharu Kudo, Hisashi Hanazaki
  • Patent number: 5543774
    Abstract: In order to reduce the costs of assembled printed circuit boards, a printed board fuse functions with great reliability at low manufacturing costs. By coating a large area of a printed board with metal, for example, by plating, a well-defined thickness of a metal layer may be achieved in which a fuse has been separated. The well-defined thickness also allows well-defined geometry of the fuse cross-sectional area and fuse length to be achieved and therefore its resistance and interruption characteristics will also be very accurately defined. In case of a temperature rise, the metal layer surrounding the fuse will have a heat dissipating effect on the fuse, providing a substantially reduced risk of board fire.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: August 6, 1996
    Assignee: Telefonaktiebolaget Ericsson
    Inventor: C. Stefan L. Lof
  • Patent number: 5488346
    Abstract: A connection terminal includes a pair of connection portions interconnected through a fusion portion, and each of the connection portions is defined by a bottom plate, opposite side plates formed respectively on opposite sides of the bottom plate, and a top plate. A spring portion extending from the top plate is folded back from a front side thereof to be disposed within the connection portion so that a mating connection terminal can be held between the spring portion and the bottom plate. The connection terminal is stamped from an electrically-conductive metal sheet in such a manner that the spring portion extending from the top plate is extended along and disposed generally adjacent to the fusion portion before the spring portion is folded back.
    Type: Grant
    Filed: June 21, 1994
    Date of Patent: January 30, 1996
    Assignee: Yazaki Corporation
    Inventors: Hiroki Kondo, Mitsuhiko Totsuka, Toshiharu Kudo
  • Patent number: 5485137
    Abstract: A method for manufacturing a fuse comprising a fuse element (10), in the form of a single wire, which is formed together with at least one terminal (11,11a,11b), in the form of a number of twisted wires. The fuse element and the conductor(s) are formed from the same wire, whereby part of the wire is moved back and forth a number of times to form at least one ring (21) or loop. The ring or loop is twisted into a conductor (11,11a,11b) in the form of a number of twisted strands, whereby one of the twisted strands is formed to be included, in part, in the terminal (11,11a,11b) twisted together with an additional number of wires and to constitute, in part, a fuse element (10).
    Type: Grant
    Filed: April 29, 1994
    Date of Patent: January 16, 1996
    Assignee: Asea Brown Boveri AB
    Inventors: Borje Maleus, Jan Tjerngren
  • Patent number: 5453726
    Abstract: A thick film surface mountable fuse assembly for high reliability applications. In the first embodiment the fuse assembly consists of an insulative substrate on which a single low mass thick film fusible elements is disposed. The substrate utilized is a thermally and electrically insulative ceramic. Thick film contact pads permit the attachment of end-caps which are in electrical contact with the fusible element. The fusible element is covered with a coating of low temperature melting arc suppressant glass. The arc suppressant glass is substantially devoid of air thus reducing the risk of a catastrophic failure of the fuse. In a second embodiment of the fuse assembly, the thermally insulated substrate and thick film components are housed in a insert molded housing. In a third embodiment of the fuse assembly, solder bumps are deposited on the thick film contact pads, forming a flip chip package.
    Type: Grant
    Filed: December 29, 1993
    Date of Patent: September 26, 1995
    Assignee: AEM (Holdings), Inc.
    Inventor: Jeffrey D. Montgomery
  • Patent number: 5440802
    Abstract: A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality of wire elements on the substrate over the film columns and perpendicular to the film columns. A cover of green, unfired ceramic is bonded to the substrate over the wire elements and film columns to form a laminate. The laminate is then die cut into individual fuses, which are then fired to cure the ceramic and form an intermetallic bond between the wire elements and the metal film. End termination coatings are then applied to the fuses to facilitate connecting the fuses in an electrical circuit. The invention relates to a chip fuse manufactured according to the method.
    Type: Grant
    Filed: September 12, 1994
    Date of Patent: August 15, 1995
    Assignee: Cooper Industries
    Inventors: Stephen Whitney, Vernon Spaunhorst, Joan Winnett, Varinder Kalra
  • Patent number: 5367280
    Abstract: An electrical thick-layer fuse 10 and a method of manufacturing such a fuse is described. Here a conductive paste is printed onto a substrate 12 for the manufacture of a resistive layer 24. A dielectric layer 22 is however expediently first applied to the substrate in the manner of a podium to which the resistive layer 24 is then applied in overlapping manner. Two electrodes 14, 16 having a spacing d from one another are then applied onto this resistive layer 24, with a web of the resistive layer 24 forming a thick-film fuse being left between the two electrodes. The web width is set by laser treatment.
    Type: Grant
    Filed: July 7, 1993
    Date of Patent: November 22, 1994
    Assignee: Roederstein Spezialfabriken fuer Bauelemente der Elektronik und Kondensatoren der Starkstromtechnik GmbH
    Inventors: Egon Thiel, Theo Grieb, Konrad Walch
  • Patent number: 5357234
    Abstract: A fuse that includes an insulating housing made from two housing pieces made of thermoplastic material, terminals extending through slots in the ends of the housing, and a fusible element having ends connected to both of the terminals. The housing includes a tubular portion and slotted end portions located at each of the two ends of the tubular portion. Each of the terminals has an internal portion inside the housing to which a fusible element is attached, an external portion outside of the housing, and a middle portion between the internal and external portions and located within one of the slots.
    Type: Grant
    Filed: April 23, 1993
    Date of Patent: October 18, 1994
    Assignee: Gould Electronics Inc.
    Inventors: Robert M. Pimpis, Richard J. Perreault, George F. Walker, Jr., David E. Suuronen, Edward J. Knapp, Jr.
  • Patent number: 5309625
    Abstract: A card type fuse aimed at reducing production costs and improving a forming precision of an exothermic fusing portion 2a. The card type fuse comprises an insulation substratum 1, fuse circuits 2 arranged on the insulation substratum 1 and having a narrow exothermic fusing portion 2a, and a cover layer 3 covering fuse circuits 2. The cover layer 3 is made of a heat resisting film. The fuse circuits 2 are printed on the heat resisting film by means of a conductive paste. The insulation substratum 1 is made of a heat resisting thermoplastic resin suitable for an SMT. The insulation substratum 1 is integrally formed on the side having the fuse circuits on the heat resisting film.
    Type: Grant
    Filed: June 3, 1993
    Date of Patent: May 10, 1994
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Yasuhiko Onishi
  • Patent number: 5296833
    Abstract: A surface mount fuse device comprising an alumina-glass-fuse-glass-alumina laminated structure provides high voltage ratings and superior mechanical and thermal properties.
    Type: Grant
    Filed: April 16, 1993
    Date of Patent: March 22, 1994
    Assignee: AVX Corporation
    Inventors: Barry N. Breen, Michael Dakhiya, Irina Daynov
  • Patent number: 5272804
    Abstract: A sub-miniature fuse for electrical protection includes an assembly of an outer tube and an inner tube made of insulating material. The inner tube has electrodes and a fusible metal link sputtered onto its outer surface. The assembly of inner and outer tubes is terminated electrically at its ends with axial leads, or with surface mounting pads, or with radial leads.
    Type: Grant
    Filed: May 27, 1992
    Date of Patent: December 28, 1993
    Assignee: Morrill Glasstek, Inc.
    Inventors: Vaughan Morrill, Jr., John H. Scandrett, David K. Hudson
  • Patent number: 5270679
    Abstract: A terminal assembly for a fuse using multiple end plate pieces to collar a terminal element around a neck portion, the end plate pieces being attached to a housing.
    Type: Grant
    Filed: February 8, 1993
    Date of Patent: December 14, 1993
    Assignee: Gould Inc.
    Inventor: David P. Gulbrandsen
  • Patent number: 5245308
    Abstract: A Class L fuse comprises a pair of conductive elements at the opposite ends of the fuse. A fusible element is secured to and makes electrical contact with each of the conductive elements. A generally cylindrical housing encloses the fusible element. Finally, an insulating, free-flowing arc barrier-forming body or sealant is disposed within the housing. In particular, the arc barrier-forming body or sealant is disposed between a portion of the fusible element and each of the conductive elements.
    Type: Grant
    Filed: July 20, 1992
    Date of Patent: September 14, 1993
    Assignee: Littelfuse, Inc.
    Inventor: Cesar Herbias
  • Patent number: 5228188
    Abstract: SMD fuses having consistent operating characteristics are fabricated by forming a repeating lithographic fuse element pattern on an insulative substrate, passivating the structure, bonding a protective glass plate over the passivation layer, slicing the assembly so formed, terminating the slices and cutting the slices into individual fuses. Fuses thus manufactured may be of any desired dimensions, including standard and non-standard chip sizes.
    Type: Grant
    Filed: July 24, 1992
    Date of Patent: July 20, 1993
    Assignee: AVX Corporation
    Inventors: Avner Badihi, Robert W. Franklin, Barry N. Breen
  • Patent number: 5224261
    Abstract: An electrical component, particularly a fuse for a surface-mount component, is formed by sputtering an electrical conductor onto a square tube, sleeving the tube into an outer tube, filling the assembly with a room-temperature vulcanizing silicone sealant, cutting the assembly into segments, and metallizing the ends of each segment.
    Type: Grant
    Filed: May 22, 1992
    Date of Patent: July 6, 1993
    Assignee: Morrill Glasstek, Inc.
    Inventor: Vaughan Morrill, Jr.
  • Patent number: 5198792
    Abstract: A miniature electrical fuse has electrical lead wires (8) to permit the fuse to be connected into a circuit without use of a fuse holder. Wires (8) are resistance welded to electrically conductive end caps (4) closing off the end of a non-conductive tubular housing (3) containing a fusible element (1). Element (1) is connected to the caps (4) by solder joints (7) and caps (4) are connected to housing (3) by solder joints (6). The solder is a lead/tin alloy of high melting point. The end walls of the caps (4) are comparatively thick in relation to their side walls in the range 1.3 to 1 and 2.1 to 1.
    Type: Grant
    Filed: June 12, 1992
    Date of Patent: March 30, 1993
    Assignee: Cooper Industries, Inc.
    Inventors: Martin D. Bacon, Peter J. Drayton, Rognvald R. Peterson
  • Patent number: 5196819
    Abstract: A fusible printed circuit includes one or more conductors extending along a dielectric substrate. The circuit can be flexible or rigid. Each conductor is comprised of a layer of electrically conductive material and has one or more gaps formed in the conductive layer at locations opposite a segment of the fusible material so that electrical current flowing through each conductor is required to pass, in its entirety, through the segment of fusible material at the location of each gap in the layer of conductive material. The integral fuses are designed to specific electrical parameters and may be located randomly along circuit runs. The fusible material is cold welded to the conductors at the gaps. Pressure concentrators support the fuses and minimize motion stress on the fuses. The fuses can be sealed within a protective overlay which captures debris when the fuses are blown and controlled venting of the debris can also be provided.
    Type: Grant
    Filed: March 23, 1992
    Date of Patent: March 23, 1993
    Assignee: Rock Ltd. Partnership
    Inventor: Joseph A. Roberts
  • Patent number: 5142262
    Abstract: A slow blowing fuse includes an open-ended rigid housing defining a fuse element-containing space therein. Conductive end caps close off the ends of the housing and act as electric terminals for the fuse. A spiral wound fuse element in said space extends between the end caps. The spiral wound fuse element comprises a core of flexible material around which is spirally wound a fuse filament which is electrically connected to the end caps. The spiral wound fuse element is sandwiched between the end caps to provide a configuration where at least the central portion thereof is located adjacent to the housing walls.
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: August 25, 1992
    Assignee: Littelfuse, Inc.
    Inventor: Daniel Onken
  • Patent number: 5140295
    Abstract: An elongated substrate made of an electric insulating material carries an elongated conductive track made of aluminium which has a constriction in its centre part in order to increase the heating of the said centre part with a view to reducing as much as possible the volume of material to melt. The ends of the track each comprise an annular part which partially covers a nickel or aluminium pad. The connection and cooling of the ends is carried out by connection brackets. This fuse is calculated in such a way that for a rated current IN, a maximum temperature variation .DELTA.T and a length of the electric conductor designated 2b, thermal equilibrium is obtained when the relationship between the cross section S of the said conductor and that S' of the base material corresponds approximately to:S=.rho.'.sub.th..rho..sub.e.b.sup.2.IN.sup.2 /2S'..DELTA.Tmaxwhere .rho.'.sub.th is the thermal resistivity of the substrate and .rho..sub.e the electrical resistivity of the conductive track.
    Type: Grant
    Filed: May 6, 1991
    Date of Patent: August 18, 1992
    Assignee: Battelle Memorial Institute
    Inventors: Jacques Vermot-gaud, Georges Melet, Bogdan Zega
  • Patent number: 5131137
    Abstract: An electrical component, particularly a fuse for a surface-mount component, is formed by sputtering an electrical conductor onto a square tube, sleeving the tube into an outer tube, filling the assembly with a room-temperature vulcanizing silicone sealant, cutting the assembly into segments, and metallizing the ends of each segment.
    Type: Grant
    Filed: April 4, 1990
    Date of Patent: July 21, 1992
    Assignee: Morrill Glasstek, Inc.
    Inventor: Vaughan Morrill, Jr.
  • Patent number: 5099219
    Abstract: A fusible flexible printed circuit includes one or more conductors extending along a flexible dielectric substrate. Each conductor is comprised of a layer of electrically conductive material and a layer of fusible material extending along part or all of said conductive layer. One or more gaps is formed in the conductive layer at location opposite a segment of the fusible layer so that electrical current flowing through each conductor is required to pass in its entirety through the layer of fusible material at the location of each gap in the layer of conductive material. The integral fuses are designed to specific electrical parameters and may be located randomly along circuit runs. Preferably, the circuit is reinforced at the locations of the fuses by metal support strips designed to minimize motion stress on the fuses and the fuses are sealed within bubbles in a protective overlay which capture debris when the fuses are blown.
    Type: Grant
    Filed: February 28, 1991
    Date of Patent: March 24, 1992
    Assignee: Rock, Ltd. Partnership
    Inventor: Joseph A. Roberts
  • Patent number: 5097247
    Abstract: An apparatus for protecting circuitry includes a heat actuated fuse which opens at a predetermined temperature and a resistive device disposed proximate the fuse for heating the fuse in response to an electrical current passed through the device. The fuse includes first and second electrodes bridged by a solder link which melts at the predetermined temperature and retreats to the electrodes. A quantity of flux-containing material is disposed on the link to promote rapid and complete retreat of the solder when the fuse is actuated.
    Type: Grant
    Filed: June 3, 1991
    Date of Patent: March 17, 1992
    Assignee: North American Philips Corporation
    Inventor: Bernhard E. Doerrwaechter
  • Patent number: 5040284
    Abstract: A sub-miniature fuse for electrical protection includes an assembly of an outer tube and an inner tube made of insulating material. The inner tube has electrodes and a fusible metal link sputtered onto its outer surface. The assembly of inner and outer tubes is terminated electrically at its ends with axial leads, or with surface mounting pads, or with radial leads.
    Type: Grant
    Filed: July 12, 1990
    Date of Patent: August 20, 1991
    Assignee: Morrill Glasstek
    Inventors: Vaughan Morrill, Jr., John H. Scandrett, David K. Hudson
  • Patent number: 4995886
    Abstract: A high voltage circuit interrupter, having telescopic tubular insulating and conducting casings, contains an expulsion end sealing construction which hermetically seals and controls the expulsion rate of the interrupter. The expulsion end includes a sleeve, a thin, rupturable diaphragm affixed against the sleeve by cyanoacrylate cement, and an end cap. Epoxy cement is applied into the cap so that the space between the diaphragm and the end cap are filled forming a sealant layer therebetween. A main ferrule secures the strain element, and an auxiliary ferrule secures both the main ferrule and the end cap onto the end of the tubular insulating casing.
    Type: Grant
    Filed: June 20, 1990
    Date of Patent: February 26, 1991
    Assignee: Westinghouse Electric Corp.
    Inventors: Frank L. Cameron, George A. Smith
  • Patent number: 4988969
    Abstract: A subminiature fuse is disclosed comprising two terminals (20, 30), two substrates (80, 90), a fusible conductor (140), an insulating coating (180), and a unitary housing (170). The unitary housing is protected from the interrupt arc by the substrates (80, 90) and the housing (170) is sealed to provide increased mechanical strength, thus reducing the risk of a catastrophic failure of the fuse. The upper portion of the fuse terminals are shaped into finger like projections (70) adaptable to mechanically holding the fusible conductor (140) and a substrate (80), thus facilitating the manufacturing process. In one embodiment the fusible conductor and adjacent portions of the terminals and substrates are coated with a insulating coating or adhesive (180). The insulating coating (180) conducts heat away from the fusible conductor (140) during normal operation. To further protect the housing in the event of a short circuit interruption, a substrate (90) is placed between the housing and the fusible conductor.
    Type: Grant
    Filed: April 23, 1990
    Date of Patent: January 29, 1991
    Assignee: Cooper Industries, Inc.
    Inventor: Leon Gurevich
  • Patent number: 4965925
    Abstract: An improved electrical fuse having axial leads (5) and comprising a fuse wire in a cylindrical sleeve (2) supported at its ends by lead carrying end caps (3) is coated over the length of the fuse body by an adherent insulating layer of plastic (7). Improved humidity resistance and mechanical strength are achieved and control of coating thickness is improved. Use of hot plastic for the adherent insulating layer (7) reflows solder joint (4) reducing instances of open or high resistance fuses which must be rejected. Also, the i.sup.2 t performance is significantly improved over other adherent coatings.
    Type: Grant
    Filed: April 17, 1989
    Date of Patent: October 30, 1990
    Inventor: John M. Monter
  • Patent number: 4958426
    Abstract: To obtain a stable adhesion between a fused portion of a fuse terminal and a low fusing point metal, the low fusing point metal is clad or welded by an electron beam to the fused portion of the fuse terminal. To manufacture the fuse terminal at low cost, the low fusing point metal is first clad or welded to the middle portion of a fusible conductor sheet material; the sheet material is punched into a development shape of the fuse terminal with the low fusing point material located at the fused portion; the punched sheet metal is bent into a fuse terminal shape before cut away from the sheet material.
    Type: Grant
    Filed: October 20, 1989
    Date of Patent: September 25, 1990
    Assignee: Yazaki Corporation
    Inventors: Takayoshi Endo, Yuuji Hatagishi
  • Patent number: 4944084
    Abstract: A fuse comprising a fuse element made by fixing a low-melting-point metal chip to a high-melting-point metal conductor, in which oxidatoin of the portions of the metal chip that are in contact with the metal conductor is prevented by [either partially fusing or soldered the metal chip to the metal conductor, or by] forming a layer of oxidation resistant material over the metal chip and then partially fusing the metal chip to the metal conductor.
    Type: Grant
    Filed: March 22, 1989
    Date of Patent: July 31, 1990
    Assignee: Yazaki Corporation
    Inventors: Kinya Horibe, Hirohiko Fujimaki
  • Patent number: 4928384
    Abstract: A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, ceramic coating (18) and plastic body (20). External lead (24) configuration can be axial, radial or surface mount. The method of manufacturing the fuse (10) is improved by utilizing a wire bonding technique in order to improve the quality of the manufacturing process and increase the reliability in performance of the fuse and reduce manufacturing cost.
    Type: Grant
    Filed: October 6, 1989
    Date of Patent: May 29, 1990
    Assignee: Cooper Industries, Inc.
    Inventor: Leon Gurevich
  • Patent number: 4926543
    Abstract: A sub-miniature fuse for electrical protection includes an assembly of an outer tube and an inner tube made of insulating material. The inner tube has electrodes and a fusible metal link sputtered onto its outer surface. The assembly of inner and outer tubes is terminated electrically at its ends with axial leads, or with surface mounting pads, or with radial leads.
    Type: Grant
    Filed: August 21, 1989
    Date of Patent: May 22, 1990
    Assignee: Morrill Glasstek, Inc.
    Inventors: Vaughan Morrill, Jr., John H. Scandrett, David K. Hudson