Multilead Component Patents (Class 29/741)
  • Patent number: 11065738
    Abstract: Embodiments disclosed herein include devices and methods for aligning an electrical device. The electrical device aligning tool may include a body member, comprising an end panel at each opposing longitudinal end of the body member and forming a longitudinally perpendicular angle with the body member. The tool may also include an intersecting member coupled to the body member and positioned such that a length of the intersecting member longitudinally intersects the body member at an angle. Additionally, the intersecting member may include an expanding and contracting mechanism, and lateral members coupled to the expanding and contracting mechanism such that the lateral members move horizontally along a front surface of the intersecting member, with respect to a movement of the expanding and contracting mechanism.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: July 20, 2021
    Assignee: NONCONDUCTIVE TOOL COMPANY, LLC
    Inventor: Warren Tarbell
  • Patent number: 10939597
    Abstract: A component mounting device includes a conveyance unit that conveys a placement member on which a mounting target is placed, a head unit movable in a horizontal plane, and a controller. The controller transfers the mounting target from the conveyance unit to a transfer position by controlling movement of the head unit in the horizontal plane in a state in which the placement member is held by one or a plurality of heads of the head unit.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: March 2, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Naoki Suzuki, Norimitsu Suzuki
  • Patent number: 10916273
    Abstract: A plugging calibration tool is provided. The plugging calibration tool includes a body and a slide clamp assembly. The body includes keying portions, flanges and a calibrator. The slide clamp assembly includes a slide clamp, which is movable between the keying portions and the flanges, and biasing and locking elements. The biasing and locking elements are respectively configured to bias the slide clamp toward and to lock the slide clamp in abutment with a tool head, which is fittable between the keying portions and the slide clamp, such that the tool head engages with the keying portions. A head of a screw engaged with the tool head is receivable in the calibrator and rotatable in the calibrator such that the head of the screw is drawn into abutment with a calibration surface of the calibrator while the tool head engages with the keying portions.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: February 9, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Arthur Higby, Mateusz Koziol, Enrico A. Romano
  • Patent number: 10779451
    Abstract: An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: September 15, 2020
    Assignee: BotFactory, Inc.
    Inventors: Michael Knox, Andrew Ippoliti, Georgios Kyriakou, Carlos Ospina, Nicolas Vansnick
  • Patent number: 10733136
    Abstract: Semiconductor substrate sections joined by an integral flexible cable are utilized to form a device comprising a connector. The connector can be surface mounted on through-holes and soldered for enhanced robustness.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: August 4, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventor: Khoon Guan Tee
  • Patent number: 10721851
    Abstract: A cut and clinch device is provided with a pair of slide bodies, unit main body that holds the pair of slide bodies so as to be capable of moving towards and away from each other, and pitch changing mechanism that changes an insertion hole spacing distance that is a distance between insertion holes formed in the pair of slide bodies. Also, the leaded component held by the component holding tool is imaged by the imaging device before the leads are inserted into the through-holes of the board, and based on the imaging data, the lead spacing distance that is the distance between the pair of leads of the leaded component is calculated. Then, the pair of slide bodies are moved towards or away from each other such that the calculated lead spacing distance and the insertion hole spacing distance are the same.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: July 21, 2020
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventor: Takuya Iwata
  • Patent number: 10557220
    Abstract: One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: February 11, 2020
    Assignee: SIREN CARE, INC.
    Inventors: Jie Fu, Ran Ma, Henk Jan Scholten
  • Patent number: 10548231
    Abstract: An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. Conductive traces having varying thickness may be produced on a common substrate. Conductive regions are printed to electrically isolate traces and optional to present an approximately level surface.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: January 28, 2020
    Assignee: BotFactory Inc.
    Inventors: Michael Knox, Andrew Ippoliti, Georgios Kyriakou, Carlos Ospina, Nicolas Vansnick
  • Patent number: 10499551
    Abstract: An electronic component mounting system is disclosed. An elapsed time acquiring section acquires an elapsed time from printing onto circuit board by solder printer. A raising and lowering operation changing section changes raising and lowering operation of component holding tool based on the elapsed time from printing acquired by the elapsed time acquiring section. A mounter mounts an electronic component on the solder printed on circuit board by performing raising and lowering of the component holding tool at the raising and lowering operation changed by the raising and lowering operation changing section.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: December 3, 2019
    Assignee: FUJI CORPORATION
    Inventor: Katsushi Ota
  • Patent number: 10426070
    Abstract: The method for assembling a component on a board is configured by a transfer pressing step that assembles a target gripping location of a component by gripping the target gripping location using a component transfer device, performing positioning, and applying a pressing force to a board side, and a pressing step that simultaneously assembles each corresponding portion of the component by positioning at least two holding claws of a component gripping device in predetermined positions, and applying a pressing force to the component on the board side using each holding claw.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: September 24, 2019
    Assignee: FUJI CORPORATION
    Inventor: Mitsuru Sanji
  • Patent number: 10342298
    Abstract: A device and system that can be used to assist actuation of a buckle release is disclosed. A device can comprise a first arm and a second arm joined by a U-shaped connecting portion. The device can also comprise a button contact feature. The device can be inserted over a buckle with the button contact feature over a buckle release button, and the device used to assist engagement of the buckle release button by a person operating the device. A system can comprise a device and various additional features or accessories.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: July 9, 2019
    Inventors: Kristin Riley-Carter, Mauro Riley-Guglielmo
  • Patent number: 10141704
    Abstract: A connector release tool (100) includes a shaft (102) having a proximal end (104) defining a handle (106) and an operative distal end (108) defining a shroud portion (110). The shroud portion (110) includes sidewalls (112) extending away from the distal end (108) and terminating at a datum surface (114) and a channel (116) defined therebetween. The shroud portion (110) further includes a plurality of contact pins (118) extending away from the distal end (108) and into the channel (116) of the shroud portion (110), each contact pin (118) adapted to engage an associated push-button connector of a terminal block (20) and allow removal of one or more wires (24) coupled to the terminal block (20).
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: November 27, 2018
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Ronald E. Boyd, Jr., Kim Albright
  • Patent number: 10136569
    Abstract: A device for installing an elastic sealing ring on an electronic device includes a clamp module and a pressing module. The clamp module includes a sliding column defining two grooves, two linkage plates, and two pins secured on the bottom end of the linkage plates. The pressing module includes a bracket and a knockout plate. The linkage plates are rotatably installed on the bracket and the sliding column can slide relative to the bracket. The knockout plate can slide relative to the bracket, to install the sealing ring on an electronic device.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: November 20, 2018
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ting-Hui Deng, Long-Fong Chen, Chung-Yuan Chen
  • Patent number: 10117368
    Abstract: A board work device provided with mounting head that performs work with respect to a circuit board, slider on which the mounting head is mounted, moving device that moves the slider to any position, and support pin gripping device for gripping support pins which is provided on the slider on the opposite side to the side on which the mounting head is mounted.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: October 30, 2018
    Assignee: FUJI CORPORATION
    Inventors: Takayuki Mizuno, Hidetoshi Kawai, Hidetoshi Ito, Masahiro Kondo
  • Patent number: 9992918
    Abstract: Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: June 5, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideaki Watanabe, Kiyoshi Imai, Shigeki Imafuku, Toshiyuki Koyama
  • Patent number: 9894820
    Abstract: Methods of and devices for removing SMT DDR DIMM connectors are provided. The devices are configured to remove long SMT DDR DIMM connectors softly and automatically, including DDR 3 and DDR 4 DIMM connectors. In the event when any solder is not melted, the device comprises a release mechanism to automatically release the connectors, such that damages to the connector can be avoided.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: February 13, 2018
    Assignee: Flextronics AP, LLC
    Inventors: Virgilio Encabo Bautista, Sr., William Uy
  • Patent number: 9877093
    Abstract: A linear vibrator includes a stator having a housing including a receiving space therein, a moveable unit, an elastic member suspending the moveable unit in the receiving space, and a protection member located between the stator and the moveable unit. The protection member forms a first bevel along a vibration direction of the moveable unit, one of the stator and the moveable unit includes a second bevel corresponding to the first bevel. The second bevel keeps a distance from the first bevel for rubbing each other when the linear vibrator falls.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: January 23, 2018
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventors: Chengliang Wang, Fuhu Zhang
  • Patent number: 9867320
    Abstract: Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: January 9, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideaki Watanabe, Shigeki Imafuku, Toshiyuki Koyama
  • Patent number: 9691651
    Abstract: A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: June 27, 2017
    Assignee: Brooks Automation, Inc.
    Inventor: Matthew W. Coady
  • Patent number: 9684030
    Abstract: Disclosed is drum-type IC burn-in and test equipment including burn-in equipment. The burn-in equipment includes therein a first working platform, a second working platform, a drum-type burn-in device, and a parts pickup device. The first working platform includes a first parts disposition section and a parts feeding device. The second working platform includes a parts transferring device. The drum-type burn-in device is rotatably mounted between the first and second working platforms and includes multiple planar sections circumferentially mounted thereto with each planar section having at least one burner mounted thereon. This arrangement allows a parts feeding device to sequentially dispose unburned ICs and a parts transferring device to sequentially pick up completely-burned ICs. As such, the drum-type burn-in device helps increase the number of ICs disposed and also helps improve the throughput and increase the manufacturing speed.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: June 20, 2017
    Inventor: An-Sung Wang
  • Patent number: 9640932
    Abstract: A tool for installation and removal of a connector of a gas-insulated switchgear termination includes a housing defining an operation chamber therein, a mounting assembly selectively disposed in the operation chamber of the housing and adapted for securely installing a sleeve member of a gas-insulated switchgear termination on a conical connector member of the gas-insulated switchgear termination or removing the sleeve member securely sleeved on the conical connector member from the conical connector member, an actuator assembly adapted for actuating motion of the mounting assembly, and a friction reducing assembly adapted for reducing friction and resistance occurring during the motion of the mounting assembly.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: May 2, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Qi Su, Jinquan Yang, Meng Zhuang, Yong Ding
  • Patent number: 9629290
    Abstract: A base includes apertures and surface features for precisely aligning central processing units (CPUs) and jackets with each other. Applicator heads are used to exert contact force against respective jackets during adhesive bonding to the CPUs. Each jacket functions as a gripping or handling feature during subsequent positioning or transport of the corresponding CPU. Such CPUs can be inserted into servers or other entities by way of automated mechanisms or manual operations with reduced risk of damage, misalignment or other problems.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: April 18, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Norton, Joseph Allen
  • Patent number: 9321409
    Abstract: An installation frame for accommodating a device in a predefined installation opening is described. The installation frame has wall sections which enclose a largely cuboid cavity which is open at least on the front for accommodating the device, front edges of at least a portion of the wall sections forming flange-like outwardly projecting edge sections for resting against a front edge of the installation opening.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: April 26, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventor: Bernward Anders
  • Patent number: 9174315
    Abstract: In a component mounting method and apparatus capable of mounting components on a board having a non-planar component mounting surface, a board holding table in a board holding device is turned based on board holding device information and board information to direct a normal line to a mounting portion on the non-planar component mounting surface in the vertical direction. Thus, after being picked up and moved by a component loading device onto the normal line to the mounting portion, a component can be mounted through a movement of the component loading device in the vertical direction only. Further, compensation amounts for the position of the mounting portion are calculated based on a turn amount, the board holding device information and the board information, and a compensated mounting position is calculated from the compensation amounts and the board information accurately in the horizontal and vertical directions.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: November 3, 2015
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Noriaki Iwaki, Tsuyoshi Hamane
  • Patent number: 9032612
    Abstract: A mounting head 16 includes shaft members 23 respectively provided with suction nozzles 22, rotation driving motors 24 for individually conducting rotary movements of the shaft members 23, and vertical movement driving motors 25 which are arranged in a staggered arrangement in an opposite direction to a staggered arrangement of the shaft members 23, and adapted to individually conduct vertical movements of the shaft members 23. The rotation driving motors 24 directly drive the shaft members 23, and the vertical movement driving motors 25 move the shaft members 23 up and down, together with the rotation driving motors 24.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 19, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinji Yamamoto, Yutaka Kinoshita, Nobuhiro Nakai, Hiroyuki Fujiwara
  • Publication number: 20150128410
    Abstract: Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a chuck unit which chucks one of the plurality of leads of the electronic component to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.
    Type: Application
    Filed: October 30, 2014
    Publication date: May 14, 2015
    Inventors: Hideaki WATANABE, Kiyoshi IMAI, Shigeki IMAFUKU, Toshiyuki KOYAMA
  • Publication number: 20150128411
    Abstract: Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.
    Type: Application
    Filed: October 30, 2014
    Publication date: May 14, 2015
    Inventors: Hideaki WATANABE, Shigeki IMAFUKU, Toshiyuki KOYAMA
  • Publication number: 20150121690
    Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tools can be made by wire electrode discharge machining (WEDM) process. In the embodiments, the connector tool includes reinforced ribbed end walls, ribbed internal walls, interconnected walls and contours that reduce tool and connector damage. In other embodiments, the connector tools include guiding structures that align the connector tool to the connector before seating the connector so that the connector tool aligns to the connector pins and body to avoid damage to the connector and/or the substrate. In another embodiment, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 7, 2015
    Inventors: Robert Lee Barnhouse, Stephen H. Hancock, Martin H. Kainec
  • Patent number: 8997337
    Abstract: A manufacturing apparatus for an electronic component includes a plurality of press members provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, the plurality of press members contacting a housing of a connector and pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit coupled with the pair of arm sections and adapted to measure a stress generated at the pair of arm sections when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: April 7, 2015
    Assignee: Fujitsu Limited
    Inventors: Shunsuke Sone, Hirokazu Yamanishi
  • Publication number: 20150008806
    Abstract: A cabinet for housing electronic plug-in cards has front and rear card baskets for inserting plug-in cards and first and second vertical backplanes. The front side of the first backplane faces the front of the cabinet and the front side of the second backplane faces the back of the cabinet. A distance piece connects the two backplanes and a counterbore is disposed in at least one of the rear sides of the two backplanes. The depth of the counterbore or the residual thicknesses of the backplane after drilling the counterbore is sized such that the distance between the front side of the second backplane and the front of the cabinet is a predetermined value. This ensures that the plug-in cards pushed onto the second backplane are completely received inside the rear card basket and the front plate of the plug-in cards ends flush with the rear card basket.
    Type: Application
    Filed: July 2, 2014
    Publication date: January 8, 2015
    Inventors: Dietmar Mann, Sergej Dizel, Dietmar Gauges, Jochen Müller
  • Patent number: 8925188
    Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: January 6, 2015
    Assignee: Fujitsu Limited
    Inventors: Toru Nishino, Kazuyuki Ikura
  • Patent number: 8898893
    Abstract: Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: December 2, 2014
    Assignee: Universal Instruments Corporation
    Inventor: Koenraad Gieskes
  • Patent number: 8869386
    Abstract: A device includes a vacuum nozzle, a driver, a light source, a measuring unit, and a controller. The vacuum in the nozzle picks up and holds a light receiver. The driver drives the nozzle to press the light receiver onto a substrate such that the light receiver is electrically connected to the substrate. A light source in the nozzle illuminates the light receiver causing the generation of a first electrical signal. The measuring unit measures a second electrical signal that is a part of the first electrical signal, and the driver is controlled drive the nozzle to press harder until the second electrical signal stops increasing, the degree of conductivity between the light receiver and the substrate being then at the maximum.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: October 28, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Chen Lai
  • Patent number: 8793867
    Abstract: A head nozzle unit includes a pair of motion guides located parallel to each other, a pair of movable blocks disposed on the pair of motion guides and movable independently of each other, a guide member transversely connected to the pair of motion guides via the pair of movable blocks, a pair of head nozzle parts disposed on opposite lateral surfaces of the guide member, the pair of head nozzle parts movable independently of each other and operable to pick up and mount electronic parts, and a driver that moves the pair of movable blocks in cooperation with one another and that moves the pair of head nozzle parts in predetermined directions. Further, an apparatus and method for mounting electronic parts includes the head nozzle unit. The pair of head nozzle parts alternately and sequentially performs a series of mounting processes of picking up the electronic parts and mounting the picked up electronic parts.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: August 5, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Tae-Young Lee, Boo-Goan Choi
  • Patent number: 8797046
    Abstract: A method of sharing a test resource at a plurality of test sites executes respective test flows at the plurality of test sites with an offset in time, the respective test flows accessing the test resource at a predetermined position in the test flow.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: August 5, 2014
    Assignee: Advantest (Singapore) Pte Ltd
    Inventors: Jochen Rivoir, Markus Rottacker
  • Patent number: 8782875
    Abstract: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate (13) is carried in from the substrate distributing unit (M3B) into conveyors (10A, 10D) which are closest to the component supplying units (20A, 20B) among the conveyors (10A, 10B, 10C, 10D).
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: July 22, 2014
    Assignee: Panasonic Corporation
    Inventors: Takeyuki Kawase, Yoshiyuki Kitagawa, Shuzo Yagi
  • Patent number: 8773159
    Abstract: A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: July 8, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Kousuke Murakami, Yoshihiro Toyoda
  • Patent number: 8756800
    Abstract: An electronic component mounting method is disclosed. The method includes the following steps: applying a paste remaining on a stamping pin to the bottom wall of at least one reservoir; forming the paste retained in the at least one reservoir to a predetermined film thickness by a clearance regulation section; causing the paste formed into a film to adhere to the stamping pin; stamping the paste to a substrate; and mounting the electronic components held by a mounting head to the substrate on which the paste has been stamped.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: June 24, 2014
    Assignee: Panasonic Corporation
    Inventor: Tsutomu Hiraki
  • Patent number: 8739393
    Abstract: It is an object to provide an electronic component mounting method that makes it possible to assure stable pickup operation even when a dimensional error attributable to a difference in production lot exists in electronic components or carrier tapes. During electronic component mounting adopting a tape splicing technique for splicing a carrier tape 15 already loaded on a tape feeder to a newly loaded carrier tape 15A, when an optical sensor 30 has detected a joint J between the already-loaded carrier tape 15 and the newly-loaded carrier tape 15A, a height measurement device 12 performs measurement of a component pickup height targeted for components P housed in the carrier tape 15A in connection with the tape feeder for which the joint J has been detected. Component pickup height data showing a target lowering height to which pickup nozzles 10a are to be lowered are updated on the basis of the measurement result.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: June 3, 2014
    Assignee: Panasonic Corporation
    Inventors: Shinji Yamamoto, Yasuyuki Ishitani
  • Patent number: 8739392
    Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: June 3, 2014
    Assignee: Intel Corporation
    Inventors: Tod Byquist, Daniel P. Carter
  • Patent number: 8720045
    Abstract: A component mounting device which is provided with a transport unit which has a transport region and transports a substrate in the transport region; a plurality of supply regions which are lined up along the transport direction of the substrate due to the transport unit and are able to supply each component; a control unit which sets a mounting region which is a region where the component is mounted in the transport region of the transport unit according to the disposing of the supply region of the component which is necessary for the substrate out of the plurality of supply regions; and a mounting unit which takes out the component which is necessary for the substrate from at least one supply region out of the plurality of supply regions and performs mounting the component on the substrate in the mounting region which has been set.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: May 13, 2014
    Assignee: Sony Corporation
    Inventor: Takeshi Nakamura
  • Patent number: 8707548
    Abstract: An electronic component mounting apparatus includes a head unit, component supply device, camera unit, and controller controlling the head unit and component supply device. The component supply device has a holder holding electronic component accommodating tapes, each having storage cells arranged in a row, the storage cells storing electronic components, and a feeder forwarding the electronic component accommodating tapes and moving the storage cells to a suction area where the electronic component can be suctioned by the nozzle. The camera unit is fixed to a head support, and captures an image of the suction area. The controller analyzes the image of the suction area obtained by the camera unit. When the controller determines that a portion of the electronic component accommodating tape in the suction area is a spliced portion based on a result of the analysis, the controller determines that the electronic component accommodating tape is changed.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: April 29, 2014
    Assignee: Juki Corporation
    Inventor: Tomotaka Abe
  • Patent number: 8707550
    Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: April 29, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Keng Yew James Song, Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting Yu He
  • Patent number: 8683683
    Abstract: In a method for positioning and mounting, on a carrier body (6), an LED assembly (1) preassembled on a circuit board (4), the circuit board (4) having the LED assembly (1) is placed and glued onto the carrier body (6), the LED assembly (1) being brought into the prescribed position relative to the carrier body (6) after being placed on the carrier body (6) by a positioning body (11) having centering elements (17) that contact the LED assembly (1) on one side and the carrier body (6) on the other, wherein the circuit board (4) having the LED assembly (1) is aligned with the carrier body (6). The positioning body (11) has a leg (15, 16) extending from a connecting part (12) and having centering elements (17) for contacting the LED assembly (1) on one side and the carrier body (6) on the other side.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: April 1, 2014
    Assignee: Continental Automotive GmbH
    Inventors: Franz Knoll, Michael Maryschka, Gregor Svobodnik, Boris Thaller
  • Patent number: 8677614
    Abstract: Provided are a chip mounting method and device. The chip mounting device comprises: a bonding head on which a device is loaded; and a controller which places the bonding head at a preparation height above a board, determines a search height at which a mounting position on the board, on which the device is to be mounted, is searched for by the controller, and lowers the bonding head from the preparation height to a bonding height via the search height and mounts the device on the mounting position on the board, by controlling movements of the bonding head, wherein the controller determines that the device touches the board if at least one of a plurality of conditions is satisfied.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: March 25, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Bong-Joon Kim
  • Patent number: 8671557
    Abstract: A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: March 18, 2014
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Daisuke Koizumi, Shigeyuki Maruyama, Kazuhiro Tashiro, Naoyuki Watanabe
  • Patent number: 8667671
    Abstract: A vacuum nozzle control apparatus includes a nozzle module having a vacuum hole, a vacuum providing module configured to provide a vacuum to the vacuum hole through a vacuum line, and a vacuum control module configured to selectively form the vacuum in the vacuum hole through the vacuum line, or release the vacuum formed in the vacuum hole through a release line branched off from the vacuum line to expose the vacuum hole to air.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: March 11, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Byung-Ju Kim
  • Patent number: 8667670
    Abstract: A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: March 11, 2014
    Assignee: Sony Corporation
    Inventor: Keisuke Ishida
  • Patent number: 8653846
    Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: February 18, 2014
    Assignee: Advantest Corporation
    Inventors: Yoshinari Kogure, Yasuhide Takeda
  • Patent number: 8635766
    Abstract: A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulator. The movement range regulator allows the component storing section to move between a supply position P1 which is set for supplying the electronic components and a retracted position P2 to which the component storing section is retracted for the purpose of maintenance of the electronic component working apparatus. In addition, the movement range regulator regulates the range of relative movement of the component storing section with respect to the electronic component working apparatus to a movement amount L4 that is previously established.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: January 28, 2014
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventors: Naoki Hanamura, Manabu Ihara