Means To Fasten Electrical Component To Wiring Board, Base, Or Substrate Patents (Class 29/739)
  • Patent number: 11330749
    Abstract: A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: May 10, 2022
    Assignee: FUJI CORPORATION
    Inventor: Masashi Hayakawa
  • Patent number: 11297751
    Abstract: An automatic exchanging device for moving in an arrangement direction of multiple component mounting machines alongside the front face of a component mounting line to set feeders to and/or remove feeders from a feeder setting base of each component mounting machine, and a control device for controlling the movement of the automatic exchanging device. The control device monitors the operational states of the multiple component mounting machines and, when an error requiring the work of the operator occurs in any one of the component mounting machines, sets a predetermined range including the component mounting machine to a movement prohibited area of the automatic exchanging device to move the automatic exchanging device out of the movement prohibited area until it is determined that the work is completed.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: April 5, 2022
    Assignee: FUJI CORPORATION
    Inventor: Hideya Kuroda
  • Patent number: 11284551
    Abstract: Provided is a method for determining the maximum number of constant tables at table locations in one or more pick-and-place lines for the placement of components on modules using pick-and-place machines, the fittings on the constant tables being used in all the fitting families of a pick-and-place line, one fitting family including a set of modules which can be produced on a pick-and-place line with a common component fitting, wherein the maximum number of constant tables is determined by calculation using mixed-integer liner optimization on the basis of input data describing the pick-and-place infrastructure, wherein the pick-and place infrastructure can include in particular the pick-and-place lines having the pick-and-place machines, each with pick-and-place head, at least one transport system for the modules, the said constant tables, and further tables which can be variably fitted.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: March 22, 2022
    Inventors: Alexander Pfaffinger, Christian Royer
  • Patent number: 11257970
    Abstract: Disclosed is a solar cell panel module including a solar cell panel; a wiring enclosure electrically connected to the solar cell panel and mounted on or at a back surface of the solar cell panel; and an adhesive member disposed between the wiring enclosure and the solar cell panel to attach the wiring enclosure and the solar cell panel. An air gap opened to an outside and having a thickness corresponding to a thickness of the adhesive member is provided between the solar cell panel and the wiring enclosure by the adhesive member.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: February 22, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Yoonsuk Choi, Joongtae Kim, Juhwan Yun
  • Patent number: 11240949
    Abstract: Component mounting line includes multiple component mounting machines arranged along a conveyance direction of a board, feeder storage container that stores multiple feeders that are attachable and detachable to component mounting machine, and exchanging robot capable of exchanging feeder between feeder storage container and each of the component mounting machines, in which feeder storage container is installed in the same arrangement as the multiple component mounting machines, and exchanging robot moves along the conveyance direction of the board and exchanges feeder. Accordingly, regardless of which of the component mounting machines feeder is used in, replenishment and collection may be performed in feeder storage container, so that an operator can easily replenish and collect feeder.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: February 1, 2022
    Assignee: FUJI CORPORATION
    Inventors: Masahiro Kondo, Jun Iisaka, Hidetoshi Kawai
  • Patent number: 11191200
    Abstract: The component mounting method is a method for mounting a component using a component mounter including a mounting head, a component camera as an imaging device configured to image a component, a first component holding section provided on the mounting head and capable of holding a first component, and a second component holding section capable of holding a second component at a position lower than the first component, the component mounting method having steps wherein the first component holding section picks up the first component, the imaging device images the first component, the second component holding section picks up the second component while the first component holding section holds the first component, and the second component is imaged while the first component holding section holds the first component and the second component holding section holds the second component.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: November 30, 2021
    Assignee: FUJI CORPORATION
    Inventor: Koushi Kuno
  • Patent number: 11158631
    Abstract: Provided is a semiconductor device comprising a semiconductor substrate that includes a transistor region; an emitter electrode that is provided on the semiconductor substrate; a first dummy trench portion that is provided on the transistor region of the semiconductor substrate and includes a dummy conducting portion that is electrically connected to the emitter electrode; and a first contact portion that is a partial region of the transistor region, provided between an end portion of a long portion of the first dummy trench portion and an end portion of the semiconductor substrate, and electrically connects the emitter electrode and a semiconductor region with a first conductivity type provided in the transistor region.
    Type: Grant
    Filed: October 27, 2019
    Date of Patent: October 26, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yuichi Harada
  • Patent number: 11150675
    Abstract: Mechanical vibrations are generated on a frame of an aerial vehicle as a response to operation of the aerial vehicle, such as rotation of motors and/or propellers. Likewise, environmental conditions, such as wind, humidity, etc., may also cause vibrations on the frame of aerial vehicles. These vibrations may be destructive to the aerial vehicle, impact stability of the aerial vehicle, and/or result in audible sounds. Disclosed are systems and methods for measuring and/or predicting the vibrations on the frame of the aerial vehicle, generating anti-vibrations, and outputting those anti-vibrations such that the anti-vibrations modify vibrations on the frame of the aerial vehicle.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: October 19, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Brian C. Beckman, Scott A. Green
  • Patent number: 11153999
    Abstract: In mounter, work using multiple suction nozzles is executed by executing an exchange of suction nozzles between nozzle station and mounting head. In addition, placement positions of suction nozzles at nozzle station are set so that the distance between accommodation section at the nozzle station and part camera is shorter for the suction nozzle to be exchanged more times at the nozzle station. Then, for exchange of suction nozzles during mounting work, the suction nozzle attached to the mounting head is returned to a placement section corresponding to a set placement position. As a result, placement positions at the nozzle station are rearranged into the set placement positions, so that the distance that the mounting head moves for nozzle exchange can be made shorter, which makes it possible to reduce the time required for nozzle exchange.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: October 19, 2021
    Assignee: FUJI CORPORATION
    Inventor: Yasunobu Yamamoto
  • Patent number: 11134600
    Abstract: An assembly system that includes a robot adapted to grip an electronic device to be mounted on a circuit board, a first vision system that identifies a position and a posture of the electronic device gripped by the robot, a fixing device that fixe a plurality of circuit boards thereon, and a second vision system that identifies a position and a posture of the circuit board fixed on the fixing device. The robot mounts the gripped electronic device on a circuit board under the visual guidance of the first vision system and the second vision system. The view field of the second vision system is not capable of completely covering a surface region of all circuit boards fixed on the fixing device. The assembly system further includes a moving mechanism that moves the second vision system in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction, so that the second vision system completes identification of all circuit boards on the fixing device step by step.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: September 28, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Polska Sp. z.o.o., TE Connectivity Corporation, Kunshan League Automechanism Co., Ltd.
    Inventors: Yingcong Deng, Jaroslaw Kowalski, Andrzej Przybylski, Jaroslaw Grzebski, Dandan Zhang, Lvhai Hu, Fengchun Xie, Yun Liu, Roberto Francisco-Yi Lu, Haidong Wu, Hui Xiao
  • Patent number: 11117229
    Abstract: An automatic assembly machine fora combined control button, includes a frame, a power distribution control box, a turntable and turntable drive disposed on the frame so as to fit with each other, wherein the base fixtures fitting controller bases are evenly disposed along the circumference of the turntable; the front side of the frame located at the right side of the turntable is disposed with a base feeding mechanism; the rear side of the base feeding mechanism located on the frame is provided with a base transportation device fitting with the base fixtures; and the left side of the base transportation device along the rotating direction of the turntable is provided with a button assembly mechanism cooperating with the base fixtures.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: September 14, 2021
    Assignee: DONGGUAN UNIVERSITY OF TECHNOLOGY
    Inventors: Jun Deng, Chuliang He
  • Patent number: 11019761
    Abstract: A mounting head that is included in a component mounter for mounting a component on a board and sucks the component by a nozzle is provided. The mounting head includes: a nozzle shaft that is disposed to be freely upward and downward movable and has the nozzle installed at a lower end of the nozzle shaft; an imaging element holder that moves upward and downward according to upward and downward movement of the nozzle shaft; and an imaging element that is held by the imaging element holder and images an area including a lower end of the nozzle.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: May 25, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Mami Kikuchi
  • Patent number: 11006561
    Abstract: A component mounter includes a mounting head configured to revolve multiple nozzle holders to which multiple pickup nozzles can detachably be attached individually in a circumferential direction and to allow the multiple pickup nozzles to rotate on their own axes while being interlocked with each other and two Z-axis drive devices provided at two locations on a revolving orbit of the multiple pickup nozzles to raise and lower the pickup nozzles situated at the two locations. Then, when a component supplied from a component supply device can be picked up at any of multiple different nozzle angles of the pickup nozzle, the component mounter moves the pickup nozzle to a revolving angle at which the pickup nozzle can be raised and lowered and then lowers the pickup nozzle to pick up the component at a nozzle angle of the multiple nozzle angles which involves a smaller moving amount.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: May 11, 2021
    Assignee: FUJI CORPORATION
    Inventors: Jun Iisaka, Hidetoshi Ito
  • Patent number: 10999961
    Abstract: A positioning device including a support tab, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically from on a top of each sliding block, a base on which the support table is supported, a cylinder installed in a chamber of the base, a ball received in the cylinder, a piston rod slidably mounted in the cylinder that pushes the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: May 4, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (China) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Zhiyong Dai, Dandan Zhang, Roberto Francisco-Yi Lu, Songping Chen, Xiangyou Hou, Qinglong Zeng, Lvhai Hu, Yun Liu
  • Patent number: 10966361
    Abstract: A dedicated correction value related to the mounting position of an upper surface recognition component with a characteristic section on an upper surface thereof is memorized in correction value folder 43a of an HDD, and when performing mounting work of mounting the upper surface recognition component on a board, a position deviation amount of the characteristic section is acquired based on an image of the upper surface of the upper surface recognition component captured by a mark camera, and the component is mounted at the mounting position based on the acquired position deviation amount and the dedicated correction value. Accordingly, it is possible to mount the specific component at a corrected mounting position such that the position of the characteristic section is appropriate, thereby improving mounting accuracy for the upper surface recognition component.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: March 30, 2021
    Assignee: FUJI CORPORATION
    Inventors: Takeshi Sakurayama, Mitsuru Sanji, Hidenori Goto, Kota Niwa
  • Patent number: 10798861
    Abstract: A mounter capable of curtailing interference between a mounting head that has a component holding section, and an exchange-use component holding section and a storage section that holds the exchange-use component holding section. A controller of the mounter reads head identification information for identifying the mounting head from the mounting head. Also, different quantities of protruding sections are formed on nozzle tray in accordance with the height in the Z-axis direction. Also, pressure switches that are pressed by protruding sections so as to turn on and off are provided on loading plate on which nozzle tray is loaded. By this, the controller is able to determine whether interference will occur between the mounting head and nozzle tray based on the detection signal of the pressure switches before the mounting head is moved.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: October 6, 2020
    Assignee: FUJI CORPORATION
    Inventors: Koji Kawaguchi, Kohei Sugihara, Yoji Fujita
  • Patent number: 10730100
    Abstract: A method for joining two components is disclosed. In an embodiment of the method, a joining element is inserted into the two components, and during the joining process, at least one parameter quantifying the joining process is determined. The joining element is inserted by a robot and the at least one parameter quantifying the joining process is determined by the robot. A device for joining two components is also disclosed.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: August 4, 2020
    Assignee: Daimler AG
    Inventor: Daniel Kohl
  • Patent number: 10729049
    Abstract: In component mounting device, if a rotary head held by a head holder greatly deviates from a specified reference, a CPU executes a process for a holding error. The process for the holding error includes a process of holding a rotary head again by the head holder or the like, for example. If the rotary head greatly deviates from a specified reference and the component mounting process is executed as is, there is a fear that poor precision will occur during component mounting. Therefore, the CPU does not execute the component mounting process but executes the process for the holding error.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: July 28, 2020
    Assignee: FUJI CORPORATION
    Inventors: Satoru Nishiyama, Hidetoshi Kawai, Kazuhiro Kusunoki
  • Patent number: 10729047
    Abstract: An automatic splicing device provided with a communication device configured to communicate with a component mounter or a host computer that is connected to the component mounter such that communication is possible, a connection control device configured to control connecting of the a first tape and a second tape, and a display device configured to display information related to connecting of the first tape and the second tape.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: July 28, 2020
    Assignee: FUJI CORPORATION
    Inventors: Masato Shibuya, Daisuke Nakamura
  • Patent number: 10640290
    Abstract: A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: May 5, 2020
    Assignee: Mycronic AB
    Inventors: Nils Jacobsson, Roger Jonasson
  • Patent number: 10602650
    Abstract: In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: March 24, 2020
    Assignee: FUJI CORPORATION
    Inventors: Shigeto Oyama, Satoshi Yoshioka, Hirotaka Hirayama, Satoshi Ushii
  • Patent number: 10566712
    Abstract: Embodiments are directed to an electrical contact for use in an LGA connector having a split beam cantilever. The contact includes a base adapted for retention in an LGA connector. The contact also includes two cantilever beams extending from the base. The cantilever beams are each connected to the base at a first end of each respective cantilever beam. The contact includes a neck defining a region where a second end of each the two cantilever beams are connected. A contact tip extends from the neck.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: February 18, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Brian Beaman
  • Patent number: 10535970
    Abstract: An apparatus and method for press-fitting a connector to a circuit board is provided. The apparatus has a universal press block fixedly connected to a machine press head. A bottom plate of the universal press block has multiple locating holes. A locating block is fixedly connected to the bottom plate. A press block is fixedly connected to the locating block at a predetermined position suitable for press-fitting the connector. The press block has a press block head, a press block body and a sensor provided between the head and the body. The press block head is movable to contact the connector to apply a pressing force to the connector. The sensor detects the pressing force and generates a signal indicative of the pressing force. The press block body receives the signal from the sensor and controls the movement of the press block head based on the signal.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: January 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Qiuyi Yu, Na Fan, Zhao Lin, Xingquan Dong, WeiFeng Zhang
  • Patent number: 10537050
    Abstract: A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: January 14, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ryan N. Elsasser, Brian E. Hanrahan, Steven J. James, Oswald J. Mantilla, Enrico A. Romano, Yuet-Ying Yu
  • Patent number: 10530109
    Abstract: A connector support assembly is configured to securely retain an electrical connector during a manufacturing process. The connector support assembly may include a base, a first securing member, and a second securing member. The first and/or second securing members is movable, and is configured to be moved between an open position in which a mating connector of the electrical connector is positioned between the first and second securing members, and a clamped position in which the mating connector is securely clamped between the first and second securing members.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: January 7, 2020
    Assignee: The Boeing Company
    Inventor: Eerik J. Helmick
  • Patent number: 10516223
    Abstract: Embodiments are directed to an electrical contact for use in an LGA connector having a split beam cantilever. The contact includes a base adapted for retention in an LGA connector. The contact also includes two cantilever beams extending from the base. The cantilever beams are each connected to the base at a first end of each respective cantilever beam. The contact includes a neck defining a region where a second end of each the two cantilever beams are connected. A contact tip extends from the neck.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: December 24, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Brian Beaman
  • Patent number: 10512201
    Abstract: A member preparation method includes a request rank determining step of determining a request member rank of a member fitted to production of a mounting board based on board information and component information including a mounting position of a component mounted on the mounting board. Furthermore, the member preparation method includes a fitting member extracting step of extracting a fitting member fitted to the request member rank in a plurality of members based on a production plan of the mounting board and retained member information in which a member rank is associated with each of the plurality of the members. Furthermore, the member preparation method includes a use member selecting step of selecting a use member in the fitting member, and a member preparation instructing step of generating an instruction to prepare the use member.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: December 17, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Atsushi Nakazono
  • Patent number: 10420267
    Abstract: An electronic component mounting apparatus includes: a mounting head including a holder for extracting an electronic component and mounting the electronic component onto a substrate, the mounting head being movable in a horizontal direction; an imaging camera disposed on the mounting head for imaging a component extraction position, when the holder is at the component extraction position; a recognition unit for recognizing, based on an image captured by the imaging camera, a positional deviation between the component extraction position and a position of a housing portion where a component is stored in a component feeding unit or a position of the component in the housing portion; and a controller for correcting the component extraction position to a position shifted by a positional deviation recognized by the recognition unit before the component feeding unit extracts a subsequent component, and causing the mounting head to move to the corrected position.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: September 17, 2019
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Osamu Kanai, Kunimune Komaike, Hideyuki Kamasuka
  • Patent number: 10399221
    Abstract: A robot includes an arm, and a force detector provided in the arm and detecting a force, wherein at least one of a first object and a second object is moved in a direction in which the first object and the second object are closer to each other by the arm, and, if contact of the first object with a position different from an insertion portion of the second object is determined based on output of the force detector, the first object and the second object are separated.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: September 3, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Masakazu Kobayashi, Tsuguya Kojima, Masaki Miyasaka
  • Patent number: 10345319
    Abstract: This invention relates to an apparatus for conducting immunoassay test. The apparatus includes a groove unit having a groove along a vertical direction configured to hold a rod-shaped portion of a probe along the vertical direction, and a push pin configured to move along a horizontal direction, the push pin being capable of residing at a first position and a second position. A tip of the push pin is capable of pressing the rod-shaped portion of the probe against the groove when the push pin resides at the first position. The distance between the tip of the push pin and the groove is larger than a diameter of the rod-shaped portion of the probe when the push pin resides at the second position.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: July 9, 2019
    Assignee: Access Medical Systems, Ltd.
    Inventors: Hong Tan, Ming Xia, Yushan Tan, Jun Chen, Erhua Cao, Genqian Li, Robert F. Zuk
  • Patent number: 10347514
    Abstract: A component-handling device for removing components from a structured component supply and for storing the removed components at a reception device, where the reception device is newly adjusted after being initially put into operation after the replacement of device components or after maintenance work, in order to comply with the precision requirements when handling the components. The component-handling device has a self-adjustment device which permits it to adjust the device efficiently in terms of time and with high precision without manual intervention by an operator. The self-adjustment device is composed of a multiplicity of optical sensors and a controller. Adaptation of the measurement results acquired by means of the optical sensors using position sensors and property sensors installed originally for component inspection during fabrication gives rise to a high degree of process reliability and at the same time permits device components to be inspected for damage.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: July 9, 2019
    Assignee: Muehlbauer GmbH & Co. KG
    Inventors: Konstantin Koch, Markus Ferstl, Franz Brandl, Rainer Miehlich, Siarhei Lakhadanau
  • Patent number: 10334769
    Abstract: A method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head is provided, in which the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. An electronic component mounting system is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. The control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: June 25, 2019
    Assignee: FUJI CORPORATION
    Inventor: Mitsuru Sanji
  • Patent number: 10310172
    Abstract: An apparatus for installing LED light bar is provided. The apparatus includes a platform at which a component with a LED light bar to be installed is placed; a rotatable arm and a first driving device disposed on a side of the platform. The rotatable arm is provided with a locating member, and one end of the arm is fixed relative to the platform; the first driving device drives the arm to rotate about the fixed end from a first position to a second position. When the arm is located at the first position, the LED light bar to be installed may be placed at the arm, and the locating member may fix the LED light bar on a predetermined position of the arm; when the arm rotates to the second position, the LED light bar adheres to the surface of the component for installing the LED light bar thereon.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: June 4, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Yuqi Mei, Chunlei Cao, Ying Zang, Haiyan Wang
  • Patent number: 10299386
    Abstract: A placement machine for equipping a substrate with unhoused chips is described. The placement machine has a chassis on which is mounted a feed device, providing a wafer which has a multiplicity of chips. A lifting device is mounted on the chassis, and a substrate-receiving device for receiving the substrate is mounted on the lifting device is movable relative to the chassis by the lifting device. The substrate-receiving device has a one-piece support element, which constitutes at least an upper part of the substrate-receiving device, wherein the substrate to be equipped can be laid on the one-piece support element; and a transport device for transporting the substrate on an upper side of the one-piece support element along a transport direction. The transport device is spatially integrated in the one-piece support element on the upper side of the one-piece support element.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: May 21, 2019
    Assignee: ASM ASSEMBLY SYSTEMS GMBH & CO. KG
    Inventor: Martin Pruefer
  • Patent number: 10290979
    Abstract: A network connector assembly comprises a header housing having two pins forming a pin pair. A first pin end portion can be connected to a counter connector. A second pin end portion can be connected to a PCB. A first electrically conductive shielding member is arranged laterally to the pin pair. A second electrically conductive shielding member is arranged intermediate the pin pair. The second pin end portions form a press fit connector configured to connect to the PCB. The second pin end portions comprise a press protrusion configured to cooperate with a press tool while being pressed in a PCB-opening of the PCB. The second electrically conductive shielding member defines a tool opening arranged at a position that allows movement of a press tool through the tool opening along a tool axis to access the press protrusion.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: May 14, 2019
    Assignee: Aptiv Technologies Limited
    Inventors: Harald Pankau, Daniel Hackbarth, Gert Droesbeke, Jean Razafiarivelo
  • Patent number: 10285319
    Abstract: There is provided a component mounting line management device that can determine whether an installation device detachably attached to a component mounting machine is used, when communication between a configuration management device and the component mounting machine is impossible. In the component mounting line management device (1) according to the present invention, each component mounting machine or each installation device includes an installation device information memory device (11). The installation device information memory device (11) stores installation device identification information of the installation device attached at an installation position, and location information on the installation position in correlation with each other. Each component mounting machine includes a communication-abnormal-time installation device determination section (12).
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: May 7, 2019
    Assignee: FUJI CORPORATION
    Inventor: Jun Iisaka
  • Patent number: 10278317
    Abstract: A board working device includes: a board conveyance device; multiple heads; and a control device which performs control such that a printed circuit board is positioned in multiple locations in order from an upstream side relative to the progress direction of the printed circuit board, and work performed using a first head of the multiple heads, and further, once the work is completed by the first head at the most downstream side position out of the multiple locations relative to the progress direction of the printed circuit board, performs control such that work is started using a second head of the multiple heads, with the work of the second head being performed with the printed circuit board being positioned in order from a downstream side position out of the multiple locations relative to the progress direction of the printed circuit board.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: April 30, 2019
    Assignee: FUJI CORPORATION
    Inventor: Kenji Hara
  • Patent number: 10269596
    Abstract: A transfer device with three transfer bases comprises: a first machine base that carries a substrate; and at least one transfer assembly that is located above the first machine base, wherein the at least one transfer assembly comprises: a second machine base that carries a target device; a third machine base that is located above the second machine base; and a transfer head that is disposed on the third machine base for acquiring the target device from the second machine base and transferring the target device to a prescribed location on the substrate. In this disclosure, since the transfer assembly is located above the first machine base, a path that the transfer head needs to move along to complete the transfer process is shorter, thereby improving the production efficiency.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: April 23, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xiaolong He, Zhifu Li, Zhiyuan Ji, Jikai Yao
  • Patent number: 10165717
    Abstract: A component mounting device which improves pickup accuracy of a component without delaying cycle time. A feeder which is capable of continuously feeding a first carrier tape and a second carrier tape to a component supply position without splicing, identification device for imaging a component which is a first component after switching from the first carrier tape to the second carrier tape using the imaging device and identifying a center position of the component before picking up the component, and correction control device for subjecting the X-axis slide to positional correction based on the identification carried out by the identification device such that the suction nozzle picks up the component at the center of the component.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: December 25, 2018
    Assignee: FUJI CORPORATION
    Inventors: Hiroyasu Ohashi, Hiroki Murase
  • Patent number: 10139249
    Abstract: A metrology system includes a timing estimator, a sensor, and a position estimator. The timing estimator receives a control signal transmitted at a first timing of a first control loop and estimates a second timing at which the control signal is transmitted in a second control loop subsequent to the first control loop. The sensor senses position information of a wafer. The position estimator estimates the position information of the wafer at the estimated second timing based on the sensed position information of the wafer and outputs the estimated position information of the wafer based on a position request signal.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: November 27, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hong Won Kim, Ho Hyun Lee
  • Patent number: 10068790
    Abstract: An electrostatic chuck device that adsorbs a plate-like specimen with an electrostatic adsorption electrode and cools the plate-like specimen, including an electrostatic chuck portion, a forming material of which is a ceramic sintered body, and that has one main surface that is a placement surface on which the plate-like specimen is placed, in which a plurality of protrusions supporting the plate-like specimen are provided on the placement surface, the protrusion has a top surface that is in contact with the plate-like specimen and supports the plate-like specimen, and has a cross-sectional area that gradually increases vertically downward from a height position of the top surface, and a cross-sectional area at a distance 0.6 ?m vertically downward from a lower end of the top surface of the protrusion is 110% or less of a cross-sectional area of a lower end of the top surface.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: September 4, 2018
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Hitoshi Kouno, Fumihiro Gobou
  • Patent number: 10014605
    Abstract: An electrical connector includes a housing having pockets formed in a receiving end of the housing. A terminal module is inserted into the pockets wherein the terminal modules are constructed from a stitch plate including a plurality of terminals retained therein, A cover having a plurality of spaced apart walls form thereon is arranged on the stitch plate and is moved into engagement with the stitch plate with the walls disposed in the intervening space between adjacent terminals. The connector assembly is pressed onto a circuit board in which a force is applied to the connector housing and is directly transferred to the terminal tails of the terminal modules causing electrical contact between conductive holes of the circuit board and the terminals.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: July 3, 2018
    Assignee: Molex, LLC
    Inventors: Kurt Dekoski, David Langolf, David Jennings
  • Patent number: 9984186
    Abstract: An electronic computer-aided design tool includes a design module and a printed electronics printer coupled to the design module. The design module determines one or more design specifications for an electronic device. The printed electronics printer produces one or more printed electronics prototypes of the electronic device based at least in part on at least on at least one of the design specifications. In some embodiments, the electronic computer-aided design tool includes a prototype testing unit that tests prototypes made by the printed electronics printer.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: May 29, 2018
    Inventor: Hanan Potash
  • Patent number: 9980420
    Abstract: The assembling machine is provided with fiducial marks which are attached to a defined position on a moving head, and an image processing section which recognizes the holding state of the component by the holding member based on high resolution data which is generated by super-resolution processing which uses a plurality of items of image data. The image processing section includes a displacement amount calculation section which calculates each displacement amount of imaging positions of other items of image data in relation to the imaging position of reference data, a positioning processing section which performs the positioning of the other items of image data in relation to the reference data, and a reconstruction processing section which generates the high resolution data based on the plurality of items of image data which are positioned.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: May 22, 2018
    Assignee: FUJI MACHINE MFG. Co., LTD.
    Inventors: Masafumi Amano, Hiroshi Oike, Hirotake Esaki
  • Patent number: 9964966
    Abstract: Mechanical vibrations are generated on a frame of an aerial vehicle as a response to operation of the aerial vehicle, such as rotation of motors and/or propellers. Likewise, environmental conditions, such as wind, humidity, etc., may also cause vibrations on the frame of aerial vehicles. These vibrations may be destructive to the aerial vehicle, impact stability of the aerial vehicle, and/or result in audible sounds. Disclosed are systems and methods for measuring and/or predicting the vibrations on the frame of the aerial vehicle, generating anti-vibrations, and outputting those anti-vibrations such that the anti-vibrations modify vibrations on the frame of the aerial vehicle.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: May 8, 2018
    Assignee: Amazon Technologies, Inc.
    Inventors: Brian C. Beckman, Scott A. Green
  • Patent number: 9946238
    Abstract: An apparatus is provided that includes an automation system that detects threats within a secured geographic area, a wireless wearable device worn by a human user that detects activities of the user, and a processor of the automation system that wirelessly receives the detected activities of the human user from the wearable device as the user enters the secured area, that associates at least one of the detected activities with a predetermined action, and that automatically implements a physical change within the secured area in support of the predetermined action.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: April 17, 2018
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Kamal Kannan, Savari Raj, Arumugakumar Mookan, Deepak S, Balaji Sambamoorthy
  • Patent number: 9910428
    Abstract: Each of a plurality of tape feeders arranged in a component feed section includes a display part which displays setting information stored in a feeder storage part, an operation input part which displays the setting information in the display part and a modification process part which outputs a signal for modifying the setting information stored in a main body storage part and the feeder storage part in accordance with an input of a modification operation. The modification operation of the setting information can be carried out in a flexible form and with a good working property.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: March 6, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Satoshi Kawaguchi, Shigekazu Yoneyama, Tatsuo Yamamura, Kazunori Kanai
  • Patent number: 9887475
    Abstract: A low-cost electrical connector that is capable of providing a single or a multiplicity of continuous electrical connections between two individual printed circuit boards, and method of making thereof.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: February 6, 2018
    Assignee: Honeywell International Inc.
    Inventor: Garry M. Loy
  • Patent number: 9876293
    Abstract: A semiconductor device having a tubular part is able to prevent the solder from spattering when soldering the tubular part. The semiconductor device has a insulated substrate that has a circuit layer on a front surface thereof, a tubular part that is soldered to the circuit layer, and an external terminal that is inserted into the tubular part and connected electrically to the tubular part. The tubular part has a cylinder portion and a flange portion that is connected to one longitudinal end of the cylinder portion. The flange portion has a first projection, a second projection and a third projection that face the circuit layer. The distance between the first projection and the second projection, the distance between the second projection and the third projection, and the distance between the third projection and the first projection each are greater than the inner diameter of the cylinder portion.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: January 23, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Kazunaga Onishi, Rikihiro Maruyama, Wan Azha Bin Wan Mat
  • Patent number: 9698505
    Abstract: A connector includes: a press-fit pin including a press-fit portion configured to be press-fitted into a through-hole of a circuit board and a pressed portion configured to be coupled to the press-fit portion and receive a pressing force for press-fitting the press-fit portion into the through-hole; and a press-fit member including a through-hole configured to removably hold the press-fit pin and a pressing portion configured to transfer the pressing force to the pressed portion of the press-fit pin held in the through-hole such that the press-fit portion protrudes.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: July 4, 2017
    Assignee: FUJITSU LIMITED
    Inventor: Takehide Miyazaki