Abstract: A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulator. The movement range regulator allows the component storing section to move between a supply position P1 which is set for supplying the electronic components and a retracted position P2 to which the component storing section is retracted for the purpose of maintenance of the electronic component working apparatus. In addition, the movement range regulator regulates the range of relative movement of the component storing section with respect to the electronic component working apparatus to a movement amount L4 that is previously established.

Abstract: An image taking system including: (a) a CMOS or CCD image sensor; (b) an interest-region setter configured to set regions of interest within an image taking area of the image sensor; (c) an acquiring-condition determiner configured to determine an image-data acquiring condition required for acquiring at least two image data generated in at least two of the regions of interest; and (d) an image-data acquirer configured to acquire the at least two image data. The acquiring-condition determiner includes an exposure-time determining portion configured to determine, as the image-data acquiring conditions, at least two different exposure times required for acquiring the at least two image data generated in the at least two regions of interest. The image-data acquirer includes an exposure-time-based-image-data acquiring portion configured to acquire the at least two image data, such that the acquired at least two image data are based on the at least two different exposure times.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards of N-sheets on the second board transfer device, it is realized to suppress the occurrence of an intermediate stock of either boards where the first boards of the M-sheets and the second boards of the N-sheets are required.

Abstract: A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tools can be made by wire electrode discharge machining (WEDM) process. In the embodiments, the connector tool includes reinforced ribbed end walls, ribbed internal walls, interconnected walls and contours that reduce tool and connector damage. In other embodiments, the connector tools include guiding structures that align the connector tool to the connector before seating the connector so that the connector tool aligns to the connector pins and body to avoid damage to the connector and/or the substrate. In another embodiment, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. In the embodiments, the connector tools can be made by wire electrode discharge machining (VVEDM) process. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.

Abstract: A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

Abstract: A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

Abstract: A manufacturing apparatus for a backlight unit includes a feed mechanism, a testing mechanism, and an attachment mechanism. The feed mechanism arranges a plurality of light-emitting diodes in a row. The testing mechanism tests the light-emitting diodes. The attachment mechanism positions the light-emitting diodes to a circuit board. The attachment mechanism comprises a support assembly and a laminating device, in which the support assembly receives the light-emitting diodes tested by the at least one testing unit, the support assembly is opposite to the circuit board, and the laminating device laminates the light-emitting diodes to the circuit board. A method for manufacturing the backlight unit is also provided.

Abstract: In a component mounting apparatus, a picking member picks components and mounts them on a board through movements of a plurality of moving members driven by motors. The apparatus is provided with a regenerative electric power control section for controlling regenerative electric power produced by regenerating a motion energy when each of the motors is decelerated; power supply sections for the motors each for exchanging electric power with the regenerative electric power control section; and a control section. When two moving members are moved, the control section begins to start and accelerate one of the two moving members in synchronized relation with a timing of beginning to decelerate and stop the other moving member and controls the regenerative electric power control section to utilize a regenerative electric power which is obtained from the motor driving the other moving member, in starting the motor which drives the one moving member.

Abstract: It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic component mounting system is configured by arranging, on an upstream side of a component loading unit having a plurality of substrate conveyance mechanisms, a screen printer M2 having a plurality of individual printing mechanisms and a coating and inspection machine M4 that applies a coat of a resin for use in boding an electronic component and that inspects a coated state. The coating and inspection machine M4 is equipped with a coating head 15 that performs operation for coating substrates conveyed by substrate conveyance mechanisms 12A and 12B from the screen printer M2 with the resin and an inspection head 16 that performs pre-coating inspection and post-coating inspection.

Abstract: An opposing first plate and second plate are slideably disposed with respect to each other using self-aligning plate registration means. Circuit board registration means and component registration means are provided for the initial X-Y alignment and registration of the circuit board and socket contact elements with one or more electrically conductive leads of an electronic component such as a focal plane array (FPA). A non-contact portion is provided on the first plate to eliminate plate contact with the first component surface which may comprise the lens of an FPA. The first and second plates are urged together such that an even, controlled and substantially planar compressive force is applied, permitting the efficient insertion of the electrically conductive leads into the socket contacts.

Abstract: A pin adjuster for electronic components adjusts and fixes pins of an electronic component while the electronic component is being installed on a circuit board such that the pins correspond in position to and connect to a plurality of contacts on the circuit board, respectively. The pin adjuster includes an insulating body and a plurality of channels. The channels each penetrate the insulating body and have an entry end and an exit end. The entry ends correspond in position to the pins of the electronic component, respectively, and the exit ends correspond in position to the contacts, respectively, such that the pins are adjusted and fixed in place by penetrating the channels, respectively. The pin adjuster enables the pins to be aligned with and connected to the contacts rapidly and precisely, thereby shortening the time taken to mount the electronic component on the circuit board and streamlining manual operation.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: A mounting apparatus including: a holding portion capable of holding and releasing an electronic component including a plurality of electrodes; a movement mechanism configured to move the holding portion; a coating portion in which a coating object to be applied onto the plurality of electrodes is set; and a controller configured to control the holding portion to hold the electronic component, control the movement mechanism to move the holding portion to a position above the coating portion, control the holding portion to release the electronic component above the coating portion so that the coating object is applied onto the electrodes, control the holding portion to hold the released electronic component again, control the movement mechanism to move the holding portion to a position above one of a substrate and another electronic component, and control the electronic component to be mounted on one of the substrate and the another electronic component.

Abstract: The present invention relates to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. One such arrangement involves a foil carrier structure, which includes a foil adhered to a carrier having cavities. Some methods of the present invention involve attaching dice to the foil and encapsulating the foil carrier structure in a molding material. In one embodiment, the molding material presses against the foil, which causes portions of the foil to distend into the cavities of the carrier. As a result, recessed and raised areas are formed in the foil. Afterwards, the carrier is removed and portions of the raised areas in the foil are removed through one of a variety of techniques, such as grinding. This process helps define and electrical isolate contact pads in the foil. The resulting molded foil structure may then be singulated into multiple semiconductor packages.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. A global measuring system is provided for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate. The local measuring system is located closer to the substrate carrier than the global measuring system.

Abstract: A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.

Abstract: An aligning device for electronic components and a bonding device using the aligning device. The aligning device includes a chamber, a flexible bellows within the chamber, two block used to hold an electronic component, a driving unit configured to move either of the two blocks relative to each other and located in an airtight chamber and an image port having a window through which one of the electronic components can be observed.

Abstract: In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachment section 30 is provided within a range of movement of a working head, such as a loading head and a paste coating head, wherein a nozzle stocker 9 and a paste trial coating unit 10 can be removably attached as a working unit for performing specific additional operation appropriate for working function of the working head. The nozzle stoker 9 and the paste trial coating unit 10 are attached to the working unit attachment section 30 according to the type of working head.

Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Abstract: Provided are a semiconductor chip attaching apparatus and a semiconductor chip attaching method. The semiconductor chip attaching apparatus includes a collet body comprising a pick-up pad and a pad support and a collet plate on the collet body, the collet plate having a central portion. A lower surface of the edge portion contacts an upper surface of the pad support. An edge portion of the lower surface is spaced apart from the upper surface of the pad support. The apparatus further includes a first pipe extending through the collet plate and the collet body. The collet plate includes a second pipe in the edge portion.

Abstract: A component mounting system including mounting machines along a direction of conveying a circuit board; a feeder mount base in each of the mounting machines; a feeder removably mounted on the feeder mount base of each of the mounting machines; a mounting head in each of the mounting machines, the mounting head sucking a component supplied from the feeder for mounting on the circuit board; a moving mechanism in each of the mounting machines, the moving mechanism configured to removably mount and move the mounting head; an inspection camera unit configured to image an inspection target part of the circuit board; and an inspection image processing unit mounted, replaceably with the feeder, on the feeder mount base where the inspection camera unit is mounted, the inspection image processing unit processing an image signal output from the inspection camera unit to inspect the inspection target part.

Abstract: A suction nozzle sucking a first electronic component that is mounted on a substrate and has first and second electrodes includes a first sucking area with an opening formed in an area corresponding to the first electrode and a second sucking area with an opening formed in an area corresponding to the second electrode.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing the loading head. In a loading head having two rows of nozzles (L1 and L2) including a plurality of nozzle shafts arranged in rows and at a predetermined nozzle arrangement pitch, a ? rotary drive mechanism that rotates the nozzle shafts around their axes is configured so as to include driven pulleys (28) coupled to the respective nozzle shafts; a plurality of idlers (30) interposed between the two rows of nozzles (L1 and L2); and endless drive belts (29A and 29B) that transmit rotation of the ?-axis motors (27A and 27B) to the driven pulleys (28).

Abstract: There is a need for providing an electronic component mounting apparatus, a component supply apparatus, and an electronic component mounting method capable of reducing inadvertent insertion of component supply tape and ensuring high reliability or capable of reducing wrong insertion of component supply tape, supplying new electronic component tape, and ensuring a high operation rate. Supply tape is inserted into an insertion entry of a component supply apparatus. An electronic component mounted on the supply tape is absorbed and is mounted on a printed board. Information about the electronic component mounted on the supply tape is read. Based on the read information, the component supply apparatus for inserting the supply tape is selected. The insertion entry is opened while it is closed when no supply tape is mounted.

Abstract: A carrier adapted to receive and align multiple electronic components, the carrier having receptacles each being adapted to receive an assigned one of the multiple electronic components, a first plate comprising a plurality of first abutting sections, the first abutting sections form one of boundaries of the respective assigned receptacles, a second plate comprising a plurality of second abutting sections, the second abutting sections form another of the boundaries of the respective assigned receptacles, and the first plate and the second plate are arranged slidably relative to each other.

Abstract: It is intended to allow for efficiently performing a feeder replacement operation. A feeder 50 is formed in a shape elongated in one direction to allow a replacement operation therefor to be performed in such a manner that it is inserted and pulled out relative to a feeder installation section 150, along a longitudinal direction thereof. A rear end 111 which is a trailing one of longitudinally opposite ends of each of a plurality of feeders 50A, 50B, - - - , in an insertion direction, is provided with a guide portion for guiding one 50C of the feeders to be installed in adjacent relation to ones of the remaining feeders. For example, the guide portion can be formed by rounding corners of the rear end 111 of the feeder 50.

Abstract: A wiring design method for a wiring board comprises, if design rule errors are found in the wiring design, selecting one of the design rule errors as a selected design rule error, specifying a predetermined number of the second connection terminals as selected second connection terminals that correspond to the selected design rule error, and moving the selected second connection terminals to predetermined coordinate positions. Each time when the selected second connection terminals are moved to the post-movement coordinate positions, the method comprises connecting the second connection terminals and the first connection terminals, conducting the design rule check, and determining whether no design rule errors are detected newly and the selected design rule error is not detected either.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tools can be made by wire electrode discharge machining (WEDM) process. In the embodiments, the connector tool includes reinforced ribbed end walls, ribbed internal walls, interconnected walls and contours that reduce tool and connector damage. In other embodiments, the connector tools include guiding structures that align the connector tool to the connector before seating the connector so that the connector tool aligns to the connector pins and body to avoid damage to the connector and/or the substrate. In another embodiment, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.

Abstract: A chip mounting system in which a whole system can be compact including a transfer stage and a tool holding member between a chip feeding section and a substrate holding section. In the chip mounting system, a transfer stage is disposed between a chip feeding stage and a substrate holding stage. A pick-up head and a mounting head are provided movably in a Y-axis direction in which the chip feeding stage and the substrate holding stage are aligned. A movable table which is movable in an X-axis direction, which intersects the Y-axis direction at right angles, is provided in a overwrapping movable region of the chip feeding stage and the substrate holding stage. The transfer stage and a tool holding member, which holds at least one of replacement tools for a pick-up tool and a mounting tool, are provided on the movable table.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tools can be made by wire electrode discharge machining (WEDM) process. In the embodiments, the connector tool includes reinforced ribbed end walls, ribbed internal walls, interconnected walls and contours that reduce tool and connector damage. In other embodiments, the connector tools include guiding structures that align the connector tool to the connector before seating the connector so that the connector tool aligns to the connector pins and body to avoid damage to the connector and/or the substrate. In another embodiment, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.

Abstract: An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.

Abstract: The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component.

Abstract: A component suction method including feeding components accommodated in component storage spaces of a tape base to a predetermined position, lowering a nozzle capable of sucking the components supplied to the predetermined position, stopping the nozzle at a predetermined distance from an upper surface of the tape base, pushing an undersurface of the component up when the nozzle is at a bottom dead center position or a position adjacent to the center, vacuum-sucking the component by the nozzle at the bottom dead center position or at the position adjacent to the center, and moving the component sucked by the nozzle to a predetermined position of a board after the vacuum-sucking.

Abstract: A method for managing error information of a printed circuit board layout system is provided. The system provides an error file recording names of all the errors to be displayed in wiring diagrams, generates wiring diagram files, outputs a first user interface showing one wiring diagram. Each of the wiring diagram files includes an attribute table for describing error information. The attribute table comprises the names and the set of coordinates. The method comprises obtaining the error file and the attribute table, outputting a second user interface comprising a first display area and a second display area, outputting the name in the first display area, analyzing the obtained attribute table to provide a classifying table. Then outputting one selected name and at least one set of coordinates corresponding to the one selected name in the second display area according to the classifying table. A related system is also provided.

Abstract: A method of mounting supply components includes the step of inserting dish-like members into a base. Each dish-like member holds components. One dish-like member can stay inserted in the base while the other dish-like member is removed from the base and refilled with components.

Abstract: An electronic component installation apparatus 4 which constructs an electronic component mounting line 1 and installs an electronic component on a substrate is configured to include substrate conveyance lanes L1, L3 as two conveyance paths for feed which respectively feed the substrate carried from the upstream side to the downstream side, the conveyance paths for feed in which substrate positioning parts for positioning and holding the substrate in installation work positions are disposed between two component installation parts 22A, 22B for taking the electronic components out of component supply parts 23A, 23B and transferring and installing the electronic components to the substrate, and a substrate conveyance lane L2 as a return conveyance path which returns the substrate carried from the downstream side to the upstream side and is disposed in a state of being sandwiched between the substrate conveyance lanes L1, L3.

Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element being alignable with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligning with the substrate alignment element to position one or more components at a specified location on the substrate.

Abstract: An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle with a gripper and two cameras. The first camera determines a position of the chip before the flipping apparatus receives the chip and also determines a position of the flipped chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the chip to it. The apparatus also comprises an optical switch, e.g., a rotatable mirror located in the field of view of the first camera. The mirror operates to rotate with the gripper of the flipping apparatus but at half the angle.

Abstract: A backlight module assembling apparatus for attaching a reflector plate to a driving circuit board is disclosed. The backlight module assembling apparatus includes an assembling portion and a pressing movably connected to the assembling portion. The assembling portion defines a receiving space configured for receiving and positioning a driving circuit board therein. The assembling portion includes a top plate and a first opening defined in the top plate. The first opening communicates with the receiving space. The assembling portion includes a number of blades arranged around the first opening for cutting a reflector plate. The pressing portion includes a pressing plate. The pressing plate is movable toward and away from the blade and configured for pressing the reflector plate against the blades thus allowing the blades cutting the reflector plate to a shape conforming to the first opening and attaching the reflector plate to the driving circuit board.

Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.

Abstract: In a construction in which the intermediate stage 5 is interposed between the substrate positioning stage 4 and the electronic component supply stage 3; and in which it is possible to select either a mode of the bonding head 10A transferring to the substrate positioning stage 4 the electronic component P taken out of the electronic component supply stage 3 by the pickup head 6 and mounted on the intermediate stage 5 or a mode for transporting the electronic components, which has been taken directly out of the electronic component supply stage 3, to the substrate positioning stage 4 by means of the bonding head 10A, the pickup head moving mechanism 7 for moving the pickup head 6 is coupled in a suspended manner to the lower surface of the beam member 8b of the gantry 8 positioned at the end of the base 2, and a space S that allows entry of a portion of the electronic component supply stage 3 is assured at a position beneath the pickup head moving mechanism 7.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board (PCB). The connector tool is a machined structure having a plurality of walls that define intersecting slots that mate with an array of male connector pins and include one or more ribs to reduce damage if the tool is dropped on the floor. The ribbed walls strengthen the connector tool, but do not interfere with the mating array of male connector pins. The connector tool also includes push shoulders to contact the connector apart from the array of male connector pins so as to seat the connector onto the PCB without connector tool and connector damage.

Abstract: A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conveyor, a pass conveyor and a reject conveyor. The infeed conveyor extends from a point outside of the electronic apparatus manufacturing cell envelope on the first side to a point inside of the envelope. The pass conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the second side. The reject conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the first side.

Abstract: A removing apparatus, for removing an electrical connector from a PCB, comprises a base, a pulling member, a pair of opposite clipping members, a lower supporting member and at least one resilient member. The pulling member connects to the base to be operated to bring the base up and down. The two clipping members pivotally mount to the base. The lower supporting member mounts below the base. The resilient member located between the base and the lower supporting member. When the base moves downwardly, the latch of the clipping member can engage with the electrical connector and pick it up from the PCB, when the base moves back, it is easy and secure to remove the electrical connector from the PCB.

Abstract: An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.

Abstract: In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.

Abstract: A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.