Abstract: A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.

Abstract: A back-up table for a chip mounter. The back-up table for a chip mounter includes a base plate, a back-up plate spaced a predetermined distance from the base plate to support a back-up pin that supports a printed circuit board, and at least one set of link units installed between the base plate and the back-up plate and facing opposite to each other. The back-up table further comprises a first driving part installed between the opposite facing link units and operating the link units to raise and lower the back-up plate, and a second driving part serially connected to the first driving part.

Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Abstract: A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point.

Abstract: A placement unit for mounting electric components onto substrates has means for moving perpendicularly to the substrate, a housing, a built-in, rotatable holder for the components, and a rotary drive for the holder mounted within the housing. The holder is connected via an axially elastic coupling to the rotary drive in a manner which is at least temporarily torsionally rigid, wherein the coupling includes a separable coupling having coupling elements arranged to be uncoupled in an axial direction. The holder is pre-stressed axially toward the component against the rotary drive by an adjustable pressure device, wherein the coupling surfaces of the coupling elements form an axial stop for the holder, and wherein the coupling surfaces separate from one another by an axial application force that acts on the holder and prevails over the axial pre-stress.

Abstract: Packaged semiconductor components, apparatus for packaging semiconductor devices, methods of packaging semiconductor devices, and methods of manufacturing apparatus for packaging semiconductor devices. One embodiment of an apparatus for packaging semiconductor devices comprises a first board having a front side, a backside, arrays of die contacts, arrays of first backside terminals electrically coupled to the die contacts, arrays of second backside terminals, and a plurality of individual package areas that have an array of the die contacts, an array of the first backside terminals, and an array of the second backside terminals.

Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like metal foil by a constant length toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

Abstract: The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than ?, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than ?, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.

Abstract: A core component of a medical electrical lead extends within an inner conductive surface of a conductive ring such that an outer surface of the core holds a portion of a conductor against the inner conductive surface for electrical contact therewith. The outer surface of the core may be deformed by a compressive force of the conductor portion having been forced against the inner surface of the ring. Such a conductor junction may be formed by pushing the ring over the core to capture the conductor portion between the ring and the core and thereby displace a layer of insulation surrounding the conductor portion. The inner surface of the ring preferably has a diameter at one, or both terminal ends that is greater than a diameter of the inner surface between the ends.

Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like foil by a constant lenght toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

Abstract: The invention refers to a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, a precision alignment device, as well as a mechanism for loading a socket and/or adapter device with a corresponding semi-conductor component, whereby the mechanism comprises a device, especially a mechanical device for aligning the mechanism in relation to the socket and/or adapter device.

Abstract: The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to adapt to components with a wide variety of contact spacings and interconnection requirements, the use of releasable attachment means allows component placement to be modified as needed, the system identifies the contacts and the components to facilitate specifying the inter-component connections, and the system provides signal conditioning and retiming to minimize issues with signal integrity and signal skew.

Abstract: Provided is a PCB assembly machine including a board handling system configured to transport a PCB through the PCB assembly machine, wherein the PCB assembly machine further includes a pick and place system configured to pick and place electrical components onto the PCB. The PCB assembly machine also includes a feeder system configured to supply the electrical components, wherein the board handling system mounts directly to the feeder system.

Abstract: A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48.

Abstract: An electronic multi-component package is assembled by placing multiple electronic components within multiple openings of a package substrate, then depositing and curing adhesive filler in gaps between the components and the inner peripheries of the openings. Circuit features, including conductive interconnects, are formed by thin-film photolithography over both front and back surfaces of the package substrate. Preformed conductive vias through the package substrate provide electrical connection between circuit features on opposite substrate surfaces. Additional electronic components may be attached to conductive lands on at least one side of the package. The circuit features also include contact pads for external package connections, such as in a ball-grid-array or equivalent structure.

Abstract: A connector insertion and removal tool for an electrical system including a circuit board and at least one electrical connector therefor includes a first portion configured for coupling to a first surface of the circuit board, and a second portion configured for coupling to the first portion. At least one of the first portion and the second portion comprises an actuator adapted for movement toward and away from the circuit board to contact at least a portion of the connector.

Abstract: A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.

Abstract: The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander formed on an elongated rod slidably mounted within a vertical tubular housing. An SMD chip may be safely fetched by pressing the rod on the top of the SMD with a continuous depressing motion until the fingers clasp the SMD chip safely therebetween. A soldering unit with a bifurcate soldering head located juxtaposed to the fingers is operative to solder the SMD chip to the printed circuit board while the SMD chip is safely held in place.

Abstract: An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved. There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height.

Abstract: A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method can include the steps of depositing solder on one or more chip modules, placing and interconnecting low-cost components on the chip modules, and storing the preprocessed chip modules in pallets or in a tape and reel. Later these chip carriers may then be mounted on a circuit board, possibly over; for example, low and/or high cost components and then populated with low and/or high cost components. The apparatus includes a unique stackable chip module pallet and print fixture pedestal.

Abstract: A contact member is supported on the support shaft. A force sensor is coupled to the support shaft. A movable member is coupled to the force sensor. The pressure apparatus allows the movable member to cause the axial movement of the support shaft. A first guide serves to guide the axial movement of the support shaft. The first guide is supported on the support member. The support member stands still during the movement of the movable member. Accordingly, the movement of the movable member is restrained in the axial direction. The contact member is thus prevented from suffering from a swinging movement around the force sensor. Servo control of a higher frequency bandwidth can be applied to the movement of the contact member. The contact member moves at a higher velocity. Occurrence of resonance is still avoided in the contact member. The tact time can be shortened.

Abstract: A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three dimensional array of chips. The system includes a chip carrier pallet that holds and moves the chip carriers for the automatic assembly of a circuit board. The system also may include a print fixture pedestal that works in combination with the chip carrier pallet to position chip carriers for automatic deposition of solder on a multitude of carriers at once, and then position them for addition to a circuit board.

Abstract: A mounting apparatus includes an X-Y table for holding a board onto which components are to be mounted, and drive units for moving a mounting section by which the components are to be mounted, and also moving individual sections. When an effective torque calculated by an effective torque detecting section is decided by an effective torque deciding section as having exceeded a specified upper-limit value, rotational speed of a corresponding one of the drive units is decreased.

Abstract: An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.

Abstract: An apparatus for manufacturing semiconductor devices having a roughly rectangular parallelepiped box-shape includes an internal insertion space for semiconductor packages, first guide grooves and arranged along the longitudinal direction in both side surfaces facing the insertion space and second guide grooves and arranged parallel to the first guide grooves and respectively. Edge portions of an upper semiconductor package (a semiconductor component) are loosely fitted into the second guide grooves so that the movement of the upper semiconductor package in the left and right direction is restricted. Further, edge portions of a lower semiconductor package (a substrate for mounting semiconductor components) are loosely fitted into the first guide grooves so that the movement of the lower semiconductor package in the left and right direction is restricted.

Abstract: Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component mounter includes: a base frame; a rotary housing rotatably mounted on the base frame and having spindle receiving holes vertically formed at regular intervals at the same radius from a center thereof; a plurality of nozzle spindles having lower ends to which nozzles for picking up electronic components are coupled, and received in the spindle receiving holes such that the plurality of nozzle spindles rotate on the same axis when the rotary housing rotates; a housing rotating mechanism rotating the rotary housing; and a nozzle lifting mechanism including a nozzle lift driving unit, and a clutch part that moves according to the operation of the nozzle lift driving unit and can simultaneously press down and lower the plurality of nozzle spindles.

Abstract: An origin detection method for a component placement head includes setting an axial origin for each elevation nut section, of the component placement head, by detecting a rotational angle of a drive section corresponding to the elevation nut section. The elevation nut sections are then individually moved down from the axial origin so that light emitted from a light-projecting section is received by a light-receiving section without being interrupted. Then, it is confirmed that the axial origin of each elevation nut section is an origin of elevation by detecting interruption of light, emitted from the light-projecting section, by the elevation nut section at a position corresponding to the elevation nut section having been lowered from the axial origin by a prescribed light interruption dimension.

Abstract: A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p1 prevailing in the first pressure chamber and the pressure p2 prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper.

Abstract: A seal-feeding station includes a seal receiver (21) for receiving a waterproof seal (20) fed through a seal feeding tube (16) and a seal keeper (23) for keeping the waterproof seal (20) transferred from the seal receiver (21) in an electric-wire insertion position. The seal receiver (21) includes a slider board (27) which is supported slidably between a standby position and a transfer position and includes an acceptance hole (27b) in which the waterproof seal (20) is fit in when the slider board (27) is in the standby position, and a push pin (38) which is movable forward and backward, is located so as to face the acceptance hole (27b) of the slider board (27) when the slider board (27) is in the transfer position, and moves forward to push the waterproof seal (20) fit in the acceptance hole (27b) and transfer the waterproof seal (20) to the seal keeper (23).

Abstract: A component placement device includes at least two component pick and place units, which are connected to a movable frame, and at least two component feeding devices. The component placement device is suitable for simultaneously picking-up components supplied, by means of the component feeding devices, by means of the component pick and place units. At least one component pick and place unit can be moved relative to the frame, which permits adjustment of the positions of the component pick and place units relative to one another.

Abstract: A component-mounted substrate moved to a specified substrate position by a substrate holding-and-moving device is delivered from a top of the substrate holding-and-moving device to a substrate discharge holder, and then while the substrate discharge holder is not moved, the substrate holding-and-moving device is moved to another substrate position, where a new substrate is received. Consequently, a later-executed movement operation for moving the new substrate to a substrate mounting region by the substrate holding-and-moving device, and a transfer operation for transferring the component-mounted substrate to an unloader unit by the substrate discharge holder, may be performed in parallel with each other without being influenced by each other's operation.

Abstract: An apparatus for positioning and press-fitting press-fit portions of roughly L-shaped legs of contacts arranged in multiple rows in a connector into a substrate includes a press-fitting head and an alignment plate. The press-fitting head is rotatable between a rest position and a press-fitting position and has vertical grooves for receiving the contacts in the press-fitting position. The alignment plate is arranged proximate the press-fitting head when the press-fitting head is in the press-fitting position and aligns the press-fit portions of the contacts with press-fitting apertures in the substrate. The alignment plate is retracted from the press-fitting head when the press-fitting head press-fits the press-fit portions into the substrate.

Abstract: A tape guide for guiding a carrier tape in a component mounting machine, a tape magazine for receiving the tape guide, and a system including the tape guide and the tape magazine. The carrier tape carries components that are positioned in sequence on the carrier tape and are covered by a cover tape. The tape guide includes an exposure mechanism for exposing the components at a picking position, wherein the exposure mechanism includes a separator for separating and lifting a lateral portion of the cover from the carrier tape, leaving the remaining portion of the cover at least partially attached to the carrier tape, and for bringing the lifted portion of the cover aside. The tape guide also includes a lock for enabling ready and quick attachment and detachment of the tape guide to and from the component mounting machine, a guiding for guiding the carrier tape towards a picking position, and a retainer for preventing accidental displacement of the carrier tape along the tape guide.

Abstract: A connector press provides for learning a specified connector pressed position, adjusting a force based threshold, and simultaneously pressing multiple connector types into a circuit board. The force based threshold may be adjusted via a slider bar on a user interface. The specified pressed position may be learned by measuring and storing a position or force value, upon the user causing the press to press the connector into a circuit board. A total force based threshold may be determined in order to simultaneously press multiple connector types. The total force based threshold may be based upon quantities and pressing forces of each of the connectors types. Further, the press may provide near capacity pressing force, even with an asymmetrical load, by including linear guides.

Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.

Abstract: A system for transferring electrical components. The system may comprise a plurality of electrical components. Each of the components may include leads and a physically asymmetric fiducial marker that structurally alters a physical appearance of the components. The system may also comprise a nest having a nest surface that defines a recess shaped to receive any one of the plurality of components only when the component is oriented such that the component's fiducial marker is received by a corresponding asymmetric portion of the nest surface. In addition, the system may comprise a component feed assembly for feeding the plurality of components to the nest, a component alignment detector, and a pick and place machine having a movable pick head. The movable pick head may have access to the component feed assembly and the recess of the nest.

Abstract: A method and system for maximizing process capability in a progressive forming operation. The method compensates for deviations introduced by unformed components, and uses closed loop feedback to compensate for deviations introduced by forming tools. Fiducial features are detected on an incoming component, and a first compensation value is calculated from displacement of the fiducial features from an ideal forming location on the component. Component position with respect to a theoretical forming position is adjusted according to the first compensation value. Placement of a feature formed on the component at the adjusted position is detected and compared to the ideal forming location to obtain a difference value. A second compensation value is derived from a plurality of difference values. Forming positions for subsequent incoming components are adjusted with respect to the theoretical forming position according to first and second compensation values.

Abstract: A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation of the component from a normal suction status is determined on the basis of component recognition information obtained from this recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding placement of the component is controlled on basis of a magnitude of the deviation. By this control, the accuracy and rate of placement of components onto the circuit-formed member can be improved.

Abstract: By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a frame part and a tie bar part from the lead frame which was attached to the first printed circuit board, the lead part is separated, and forming is applied to the lead part so as for its tip to be extended over the first printed board. After the lead part which is expanded upward is inserted into a through-hole which was opened in a second printed circuit board, by soldering the lead part and the through-hole, the first printed circuit board and the second printed circuit board are electrically connected.

Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: In a component pressing head which holds a component with a component holding tool provided at one end of a shaft member, rotates the component around an axis of the shaft member and presses the component in an axial direction of the axis, a first voice coil motor and a second voice coil motor are disposed between a upper plate and a lower plate so as to sandwich the shaft member from opposite sides thereof, so that a load is transmitted to the shaft member from the lower plate that is coupled to movable magnet holding portions of these two voice coil motors.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: An electrically operated chucking apparatus including (a) an electrically operated chuck including at least two movable members movable toward and away from each other, and at least two drive devices which include respective electrically operated actuators operable to move the at least two movable members, respectively, toward and away from each other, and (b) a control device operable to control the at least two drive devices, and wherein the control device includes: a drive control portion operable to control the at least two drive devices such that each of at least one of an actual position and an actual speed of movement of the at least two movable members changes toward a predetermined target value; and a load detecting portion operable to detect a load acting on the at least two movable members during operation of the drive control portion to control the at least two drive device.

Abstract: A micro device using assembly system for feeding, programming, and placing micro devices on circuit boards includes a robotic handling system capable of picking up and placing the micro devices on the circuit boards on a conveyor system. A control system controls the conveyor system and the robotic handling system. An input feeder provides the micro devices and a programming system is capable of programming a plurality of micro devices in sockets which are in line parallel with the input feeder. The input feeder responds to communication with the control system to feed the unprogrammed micro devices while the programming system programs the micro devices and communicates to the control system. The robotic handling system responds to communication of the programming system with the control system to pickup and places the programmed micro devices on the circuit boards at high speed.

Abstract: When mounting semiconductor chips, the semiconductor chips are presented on a wafer table where they are picked one after the other by a pick and place system, transported and placed onto a substrate that rests on a supporting surface of a substrate table. The wafer table is aligned diagonally to the supporting surface of the substrate table whereby part of the wafer table is located under the substrate table. The pick and place system comprises a shuttle with a swivel arm carrying a bondhead. The swivel arm is swivelled back and forth between two predetermined swivel positions whereby in the first swivel position a longitudinal axis of the swivel arm embraces the angle ? with the perpendicular to the supporting surface of the substrate table and whereby in the second swivel position the longitudinal axis of the swivel arm runs orthogonally to the supporting surface of the substrate table.

Abstract: A press-fitting device in which a terminal of a connector having a staggered arrangement section of the terminal of the connector is press-fitted into an insertion hole is provided. In the press-fitting device, a first terminal restricting member on which a guide section for restricting a vertical displacement of the terminals between the terminals along the lateral direction of the connector housing and a second terminal restricting member on which a guide section for restricting the lateral displacement of the terminals between the terminals along the vertical direction of the connector housing in an upper or lower part of the first terminal restricting member are provided. A guide groove to which terminals on an interior side of the connector housing are introduced is provided at a tip end portion of the guide portion positioned at the staggered arrangement section of the terminals.

Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.