Means To Apply Vacuum Directly To Position Or Hold Work Part Patents (Class 29/743)
  • Patent number: 11109520
    Abstract: In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: August 31, 2021
    Assignee: FUJI CORPORATION
    Inventors: Hiroyoshi Sugita, Hidetoshi Ito
  • Patent number: 10935150
    Abstract: A rotary head, on which are arranged in a circumferential direction multiple nozzle holders each holding a suction nozzle, is provided with, separately to first negative pressure supply unit that supplies negative pressure to the suction openings of all the suction nozzles, second negative pressure supply unit that supplies negative pressure to the suction nozzle held by the nozzle holder that is lowerable when that nozzle holder is lowered. Accordingly, when performing pickup operation and mounting operation using the suction nozzle, the state of the suction nozzle is not affected by the state of the other suction nozzles.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: March 2, 2021
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Ito
  • Patent number: 10937681
    Abstract: A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a support surface for supporting the wafer, and the bottom plate has a maximum diameter being larger than the maximum diameter of the top plate so that the bottom plate forms a repository for the dicing frame. The dicing frame has a plate-like shape defining a center hole, wherein the minimum diameter of the center hole is larger than the maximum diameter of the top plate so that the dicing frame sinks below the upper surface of the wafer and/or the support surface. Further, a wafer support device, a wafer support system and a mask aligner are provided.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: March 2, 2021
    Inventors: Yasuaki Amano, Sven Hansen, Lennert Schwart
  • Patent number: 10916458
    Abstract: A transfer head for transferring micro elements includes a cavity with a plurality of vacuum paths; a suite having a plurality of suction nozzles and vacuum path components. The suction nozzles are connected to the vacuum path components respectively, and the vacuum path components are formed to connect to vacuum paths in the cavity respectively. The suction nozzles absorb or release the micro elements through vacuum pressure, which is transmitted by vacuum path components and vacuum paths of each path. When the suite is mounted in the cavity, the upper surface of the suite is arranged with optical switching components for controlling the switch of the vacuum path components and vacuum paths of each path so that the suction nozzles can absorb or release required micro element through vacuum pressure.
    Type: Grant
    Filed: December 31, 2017
    Date of Patent: February 9, 2021
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chen-Ke Hsu, Jiansen Zheng, Xiaojuan Shao, Kechuang Lin
  • Patent number: 10897841
    Abstract: A rotary head of a surface mounter includes a rotating body, an N-shaft servo motor configured to rotate and drive the rotating body and a plurality of suction nozzles attached to the rotating body in such a manner as to be movable in a direction of a rotation axis. The plurality of suction nozzles are arranged on a virtual circle with the rotation axis as the center, and the plurality of suction nozzles are configured to hold and release a component. The rotary head of a surface mounter further includes a Z-axis drive device including a Z-axis linear motor. The Z-axis drive device is configured to use the Z-axis linear motor to move, in the direction of the rotation axis, the suction nozzle that has moved to a predetermined drive position on the virtual circle.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: January 19, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kenji Tsuri, Tomoyoshi Utsumi
  • Patent number: 10667449
    Abstract: In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: May 26, 2020
    Assignee: FUJI CORPORATION
    Inventors: Hiroyoshi Sugita, Hidetoshi Ito
  • Patent number: 10638650
    Abstract: Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded. The component loading apparatus further includes: an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head; and a tray analyzer configured to inspect loading positions of the components on the tray.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: April 28, 2020
    Assignee: Hanwha Precision Machinery Co., Ltd.
    Inventors: Toshiro Hirakawa, Yoichiro Sugimoto, Kazuhiro Takeshita, Kenji Ishiyama
  • Patent number: 10624250
    Abstract: A mounting device is provided with a first raising and lowering drive section configured to raise and lower an entire syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section that raises and lowers the suction nozzle only of the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component and information of the height of a board. With the mounting device, it is possible to move the entire syringe member to which the suction nozzle is attached to a position closer to the board in accordance with the height of the board and the thickness of the component.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: April 14, 2020
    Assignee: FUJI CORPORATION
    Inventors: Koji Kawaguchi, Junichi Narita, Mitsuru Sanji, Kenzo Ishikawa
  • Patent number: 10617050
    Abstract: In a component mounter, a gap between adjacent circular plate sections of nozzles is large enough such that a pressing roller is able to pass through in a vertical direction. Therefore, the size of a circular plate section can be made relatively small, and a rotary head can be made small. A horizontal protrusion overlaps with one or both of adjacent ring-shaped protrusions of the nozzle when viewed from above in a case in which the pressing roller is positioned between adjacent circular plate sections of nozzles. In a state with the pressing roller positioned above the gap between adjacent circular plate sections of nozzles, even if power to a Z-axis linear actuator is cut such that the raising and lowering member suddenly loses support and falls, the horizontal protrusion of the raising and lowering member engages with and stops the ring-shaped protrusion of the nozzle.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: April 7, 2020
    Assignee: FUJI CORPORATION
    Inventor: Koji Kawaguchi
  • Patent number: 10617051
    Abstract: An interference-prevention Q-axis rotation height position is set as a height position at an intermediate point of raising operation of suction nozzle, and a height position at which the component does not interfere with central protruding member on the lower surface of rotary head. Performed is control of large component interference prevention mode, in which, after picking up the component using suction nozzle at a component pickup height position that is the lower limit height position of lowering operation, the direction of the component is corrected by raising the suction nozzle to the interference-prevention Q-axis rotation height position that is a height position at an intermediate point of raising operation of suction nozzle and then rotating the component held by suction nozzle by Q-axis driving operation, and subsequently raising suction nozzle to a maximum height position of the raising operation, and then moving rotary head in the XY direction.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: April 7, 2020
    Assignee: FUJI CORPORATION
    Inventor: Satoru Nishiyama
  • Patent number: 10440868
    Abstract: A rotary head includes a rotating body on which a plurality of suction nozzles that suck a component at a tip end are disposed in a circumferential direction, and revolves the plurality of suction nozzles by rotation of the rotating body, in which a wall portion with a wall surface along an axial direction of a rotary axis of the rotating body, is provided on a lower surface of the rotating body, and the wall portion is provided in the vicinity of an inner circumferential side of the plurality of suction nozzles such that a reduction in pressure on the inner circumferential side of the plurality of suction nozzles caused by the revolving of the suction nozzles is suppressed.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: October 8, 2019
    Assignee: FUJI CORPORATION
    Inventors: Masataka Iwasaki, Takeshi Fujishiro, Shuhei Yamada
  • Patent number: 10420269
    Abstract: A mounting inspection device includes a missing component inspection device and a foreign object inspection device. The missing component inspection device is for performing missing component inspection of components mounted on a printed circuit board. The foreign object inspection device is for performing foreign object inspection in which foreign objects on a printed circuit board are inspected with regard to the printed circuit board on which a missing component is detected, based on results of the missing component inspection carried out by the missing component inspection device.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: September 17, 2019
    Assignee: FUJI CORPORATION
    Inventors: Mikio Nakajima, Mitsutaka Inagaki
  • Patent number: 10319089
    Abstract: A component mounter includes a side imaging camera that is provided to be integral with the placing head having a plurality of suction nozzles, that moves relatively with respect to the plurality of suction nozzles, and thereby that images, from a side, peripheral regions of front ends of the plurality of suction nozzles, respectively, in order. Incidentally, a component presence/absence determiner (determiner) determines the presence or absence of a component sucked on the front end of the suction nozzle, based on primary image data obtained by the side imaging camera and the calculator calculates a thickness of the component sucked on the front end of the suction nozzle, based on secondary image data obtained by the side imaging camera.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: June 11, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD
    Inventors: Yasuichi Okada, Eyri Watari
  • Patent number: 10172269
    Abstract: A chuck device includes a plurality of types of chuck pawls clamping a component, a chuck pawl switching mechanism switching the chuck pawls in use among the plurality of types of chuck pawls in accordance with the type of the component to be clamped, and a driving mechanism allowing the chuck pawl switched by the chuck pawl switching mechanism to be put into a clamping operation. The chuck pawl switching mechanism is configured to use a cylindrical cam, the plurality of types of chuck pawls are placed at predetermined intervals around the cylindrical cam, a cam follower disposed in each of the chuck pawls is fitted into a cam groove in an outer peripheral surface of the cylindrical cam, and the respective chuck pawls are moved upward and downward independently of each other by the cylindrical cam being rotated.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: January 1, 2019
    Assignee: FUJI CORPORATION
    Inventor: Junichi Yamamuro
  • Patent number: 10065326
    Abstract: Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: September 4, 2018
    Assignee: NIKE, Inc.
    Inventors: John Matthew Farren, Dragan Jurkovic, Patrick Conall Regan, Howard Fu, Chih-Chi Chang, Kuo-Hung Lee, Chang-Chu Liao, Harsha Prahlad
  • Patent number: 9962848
    Abstract: The present invention concerns the field of graphic apparatuses and in particular its object is an apparatus and a relative method for the so-called “weeding” of plastic or paper films having or more self-adhesive, double sided adhesive or electrostatic layers coupled with a support liner treated with a non-stick agent. The apparatus comprises analysis and cutting means adapted to map and execute weeding assisting cuts.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: May 8, 2018
    Assignee: ESANASTRI S.R.L.
    Inventors: Roberto Posarelli, Giuliano Vegni, Cesare Stefanini, Federico Carnasciali, Giorgio Dinelli, Andrea Di Lupo
  • Patent number: 9913417
    Abstract: Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded. The component loading apparatus further includes: an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head; and a tray analyzer configured to inspect loading positions of the components on the tray.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: March 6, 2018
    Assignee: HANWHA TECHWIN CO., LTD.
    Inventors: Toshiro Hirakawa, Yoichiro Sugimoto, Kazuhiro Takeshita, Kenji Ishiyama
  • Patent number: 9896892
    Abstract: A system and method for moving directional drill pipe with vacuum power. The system is used with a vacuum beam mounted on a boom. It has a vacuum pad that is pivotally attached at one end by a hinge to the vacuum beam. The other end of the vacuum pad is attached to the vacuum beam via a hydraulic cylinder. Operation of the hydraulic cylinder causes the vacuum pad to rotate about the hinge and change the angle of the vacuum pad relative to the vacuum beam. Lateral movement of the vacuum pad relative to the vacuum beam is provided by one or more pinned connections located adjacent to the hinge. Vacuum pressure from the vacuum pad is used to grasp and release drill pipe.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: February 20, 2018
    Assignee: Vacuworx Global, LLC
    Inventors: William Solomon, Justin Hendricks
  • Patent number: 9896277
    Abstract: A component supply device is arranged adjacent to a mounter which mounts components on a board and supplies components to the mounter. This component supply device includes a replenishment section provided with a magazine which houses a component carrying member on which multiple components are arranged on a base material, and a conveyance section which conveys a component carrying member housed in the magazine and which is equipped with side surface number one to which the replenishment section is attached and side surface number two which is arranged adjacent to the mounter. The replenishment section is slidably attached with respect to side surface number one of the conveyance section.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: February 20, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Toshinori Shimizu, Hiroyasu Ohashi, Toshihiko Yamasaki, Masaki Murai
  • Patent number: 9894819
    Abstract: A suction nozzle, including a suction assistance section provided within an intake passage and connecting a side downstream of a pin and a side upstream of the pin, is provided. A cross section (the area of a cross section cut in a direction perpendicular to the direction in which the intake passage extends) of the intake passage is narrowed by the pin. Air bypasses the pin by flowing through the suction assistance section.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: February 13, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Chikashi Teshima, Kenzo Ishikawa
  • Patent number: 9814144
    Abstract: A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: November 7, 2017
    Assignee: Assembléon B.V.
    Inventors: Roy Brewel, Richard Adrianus Johannes Van der Burg, Petrus Adrianus Antonius Van Hoogstraten
  • Patent number: 9802326
    Abstract: The present invention provides a sheet glass alignment system.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: October 31, 2017
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventor: Yawei Liu
  • Patent number: 9788470
    Abstract: The component supply device includes a table on which a wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table. The pickup head includes multiple component supply side suction nozzles, and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which the tip of the multiple component supply side suction nozzles faces down and a transfer position at which the tip of the multiple component supply side suction nozzles faces up. The arrangement of the multiple component supply side suction nozzles corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: October 10, 2017
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Toshinori Shimizu, Hiroyasu Ohashi, Toshihiko Yamasaki, Masaki Murai
  • Patent number: 9701025
    Abstract: Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: July 11, 2017
    Assignee: NIKE, Inc.
    Inventors: John Matthew Farren, Dragan Jurkovic, Patrick Conall Regan, Howard Fu, Chih-Chi Chang, Kuo-Hung Lee, Chang-Chu Liao, Harsha Prahlad
  • Patent number: 9523570
    Abstract: Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: December 20, 2016
    Assignee: NIKE, Inc.
    Inventors: Patrick Conall Regan, John Matthew Farren, Howard Fu, Dragan Jurkovic, Chih-Chi Chang, Kuo-Hung Lee, Chang-Chu Liao, Harsha Prahlad
  • Patent number: 9511455
    Abstract: A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: December 6, 2016
    Assignee: CKD Corporation
    Inventors: Manabu Okuda, Tsuyoshi Ohyama, Norihiko Sakaida
  • Patent number: 9452897
    Abstract: A component mounter which exchangeably holds rotary head in head holding unit is provided with Z-axis driving mechanism that engages lever engaging piece of the nozzle holder, which performs component pickup and mounting operations, among multiple nozzle holders held on rotary head, from above and below with pushing down roller and Z-axis lever in order to lower and raise the nozzle holder. The interval between lever engaging piece of first holder that performs component pickup and mounting operation first and lever engaging piece of last holder that performs component pickup and mounting operation last is set at a wide interval at which engagement with Z-axis lever is released, and the wide interval between lever engaging piece of first holder and lever engaging piece of last holder is used as a passage through which Z-axis lever passes in an up/down direction when rotary head is attached/removed to/from head holding unit.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: September 27, 2016
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventor: Satoru Nishiyama
  • Patent number: 9435685
    Abstract: There is provided a part holding head assembly of a part mounting device including: a rotary head; a spindle configured to rotate in a first direction T with respect to a central axis of the spindle and configured to move in a second direction Z substantially parallel with an extending direction of the central axis of the spindle; a nozzle provided at a first end of the spindle; a raising part configured to move the spindle to in the second direction Z; and a contact detecting sensor configured to sense the nozzle contacting a part or the part held by the nozzle contacting a substrate and configured to generate a contact sensing signal according to the sensing.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: September 6, 2016
    Assignee: Hanwha Techwin Co., Ltd.
    Inventors: Masaki Noriyuki, Takuya Tsutsumi, Tanijaki Masahiro, Susumu Kitada, Osamu Sugio, Hidemasa Koreeda, Tetsuo Fujihara
  • Patent number: 9354628
    Abstract: A mounting turn that is going to be performed from now on and the identifiers of the feeders that are the supply sources of the components for the mounting turn are read out from a mounting program, and it is determined whether there is a non-supply feeder which does not supply a component to the component supply position 13p in the feeders corresponding to the identifiers that are read out, based on the output from the component detecting sensors provided in the feeders corresponding to the identifiers that are read out. As a result, when there is not a non-supply feeder, the mounting turn that is read out is performed, and when there is a non-supply feeder, the performing of the mounting turn that is read out is suspended and another mounting turn is read out.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: May 31, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Toshihide Otsuka
  • Patent number: 9123915
    Abstract: A donor film tray that supplies a donor film includes: a tray main body disposed in correspondence with an edge of the donor film, and including an opening that exposes a center area of the donor film; and a clamp disposed in an area of the tray main body for clamping the edge of the donor film, and for pulling the edge of the donor film in a direction away from the tray main body using the repulsive force of a magnet.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: September 1, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventor: Yong-Hyun Jin
  • Patent number: 9038264
    Abstract: A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: May 26, 2015
    Assignees: SanDisk Semiconductor (Shanghai) Co., Ltd., SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Pradeep Kumar Rai, Kim Lee Bock, Li Wang, JinXiang Huang, EnYong Tai, JianHua Wang, King Hoo Ong
  • Patent number: 9032612
    Abstract: A mounting head 16 includes shaft members 23 respectively provided with suction nozzles 22, rotation driving motors 24 for individually conducting rotary movements of the shaft members 23, and vertical movement driving motors 25 which are arranged in a staggered arrangement in an opposite direction to a staggered arrangement of the shaft members 23, and adapted to individually conduct vertical movements of the shaft members 23. The rotation driving motors 24 directly drive the shaft members 23, and the vertical movement driving motors 25 move the shaft members 23 up and down, together with the rotation driving motors 24.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 19, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinji Yamamoto, Yutaka Kinoshita, Nobuhiro Nakai, Hiroyuki Fujiwara
  • Patent number: 9003644
    Abstract: A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: April 14, 2015
    Assignee: STMicroelectronics Pte Ltd
    Inventors: Hk Looi, Cheng-hai Cheh, HaiKin Toh
  • Patent number: 8925175
    Abstract: Embodiments provide a slide assembly device having a static tooling base which is statically and solidly affixed to a base such as a table and a moveable tooling arm that is rotatable about a hinge connected to the static tooling base, so that moveable tooling arm rotates about the hinge in a manner similar to a book cover opening and closing. The embodiments further provide an upper slide chuck that is removably attachable to the moveable tooling arm and a lower slide receiver that is removably attachable to the static tooling base. The upper slide chuck is configured to hold an experimental slide via a vacuum mechanism to engagedly hold the experimental slide to the upper slide chuck while the moveable tooling arm is rotated about the hinge from an open-book position to a closed-book position.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: January 6, 2015
    Assignee: SomaLogic, Inc.
    Inventors: Jeff Aldred, Tracy R Keeney, Jonathan Vaught, Chris Bock, Stephan Kraemer, Alexis Stuart Foreman
  • Patent number: 8925188
    Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: January 6, 2015
    Assignee: Fujitsu Limited
    Inventors: Toru Nishino, Kazuyuki Ikura
  • Patent number: 8904629
    Abstract: A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: December 9, 2014
    Assignees: LG CNS Co. Ltd., Robostar Co., Ltd.
    Inventors: In Hwan Ryu, Hak Pyo Lee, Il Chan Yang, Ho Joong Lee
  • Patent number: 8893378
    Abstract: This invention relates to a method for securing a carrier by gas pressurization to inhibit warpage of the carrier. The method includes following steps: provide a carrier with an upper surface and a lower surface which are opposite to each other; providing an evacuable jig with an apertured surface on which a plurality of apertures are provided; placing and securing one of the upper and lower surfaces of the carrier on the apertured surface in a manner of facing the apertured surface, wherein the surface of the carrier faced to the apertured surface is defined as a first surface, and the other surface opposed to the first surface is defined as a second surface; and gas pressurizing a chamber and evacuating the jig positioned in the chamber, to form a pressure difference between the first surface and the second surface of the carrier, whereby the carrier is pressed on the jig, wherein the chamber is pressurized to a predetermined pressure greater than a standard atmospheric pressure.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: November 25, 2014
    Assignee: Ableprint Technology Co., Ltd.
    Inventor: Chih-Horng Horng
  • Patent number: 8881380
    Abstract: There is provided a component mounting apparatus, which includes: a nozzle which sucks a component; a nozzle supporting member, on which the nozzle is installed, which moves in a vertical direction with respect to an upper surface of a substrate on which the component sucked at the nozzle is mounted; an optical system which captures an image of a leading edge portion of the nozzle where the component is sucked in a component mounting operation, from a side direction, such that an optical axis of the optical system is inclined at a predetermined angle with respect to a sucking surface of the nozzle; and an analyzer which analyzes the image of the leading edge portion to determine whether a sucking state of the component sucked by the nozzle is normal or abnormal.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: November 11, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Hatase Takayuki
  • Patent number: 8875383
    Abstract: A component supplying apparatus includes a motor, a rotating body, a transmitting mechanism, and a predicting section. The rotating body engages with a carrier tape in which a plurality of components to be mounted on a circuit board by a component mounting apparatus are accommodated at predetermined pitches and pays out the carrier tape at the predetermined pitches for supplying the plurality of components. The transmitting mechanism transmits a driving force of the motor to the rotating body. The predicting section predicts a deviation amount of a supplying position of each of the plurality of components based on a model formula expressing a periodical fluctuation of the supplying position of each of the plurality of components that is due to the transmitting mechanism and caused at a time the carrier tape is paid out by the rotating body.
    Type: Grant
    Filed: May 19, 2010
    Date of Patent: November 4, 2014
    Assignee: Juki Automation Systems Corporation
    Inventors: Katsuhiko Ohno, Koki Maekawa
  • Patent number: 8869386
    Abstract: A device includes a vacuum nozzle, a driver, a light source, a measuring unit, and a controller. The vacuum in the nozzle picks up and holds a light receiver. The driver drives the nozzle to press the light receiver onto a substrate such that the light receiver is electrically connected to the substrate. A light source in the nozzle illuminates the light receiver causing the generation of a first electrical signal. The measuring unit measures a second electrical signal that is a part of the first electrical signal, and the driver is controlled drive the nozzle to press harder until the second electrical signal stops increasing, the degree of conductivity between the light receiver and the substrate being then at the maximum.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: October 28, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Chen Lai
  • Publication number: 20140237812
    Abstract: The present invention relates to a high load and high precision polygonal guide, and to a picker actuator using same, wherein the polygonal guide includes: an integrated ball cage designed and formed in a polygon and having a plurality of ball receiving holes formed on each side of the polygonal ball cage for receiving balls; a housing having a polygonal through hole for rolling motion such that, after the balls are inserted into the ball receiving holes formed on each side of the polygonal ball cage, the balls cannot escape from the ball receiving holes; and a guide post inserted and fitted inside the polygonal ball cage into which the balls are inserted and fitted, whereby the guide post or the housing reciprocates in a straight line by the rolling motion of the balls.
    Type: Application
    Filed: January 5, 2012
    Publication date: August 28, 2014
    Inventors: Moon-young Jin, Choong-rae Cho, Min-seok Hong
  • Patent number: 8813350
    Abstract: A ball grid array presentment apparatus and associated method are provided. The apparatus has a stationary guard defining a first passage. A core is mounted adjacent to the stationary guard, the core being operably moveable between an unload position and a second position. The core defines a second passage and supports a workpiece fixture operably retaining the ball grid array. The unload position of the core operably aligns the second passage to the first passage, the aligned passages being sized to permit access to unload the ball grid array from the workpiece fixture. The second position of the core operably misaligns the second passage from the first passage whereat the core and the stationary guard cooperatively form an enclosure around the workpiece fixture containing a supply of balls that are not retained in the ball grid array.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: August 26, 2014
    Assignee: Seagate Technology LLC
    Inventors: Niandong Liu, William A. Nelson, James O. Anderson
  • Publication number: 20140215814
    Abstract: A device includes a vacuum nozzle, a driver, a light source, a measuring unit, and a controller. The vacuum in the nozzle picks up and holds a light receiver. The driver drives the nozzle to press the light receiver onto a substrate such that the light receiver is electrically connected to the substrate. A light source in the nozzle illuminates the light receiver causing the generation of a first electrical signal. The measuring unit measures a second electrical signal that is a part of the first electrical signal, and the driver is controlled drive the nozzle to press harder until the second electrical signal stops increasing, the degree of conductivity between the light receiver and the substrate being then at the maximum.
    Type: Application
    Filed: June 28, 2013
    Publication date: August 7, 2014
    Inventor: CHIH-CHEN LAI
  • Publication number: 20140215813
    Abstract: A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.
    Type: Application
    Filed: February 5, 2014
    Publication date: August 7, 2014
    Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Youhei KISHIMOTO
  • Patent number: 8797046
    Abstract: A method of sharing a test resource at a plurality of test sites executes respective test flows at the plurality of test sites with an offset in time, the respective test flows accessing the test resource at a predetermined position in the test flow.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: August 5, 2014
    Assignee: Advantest (Singapore) Pte Ltd
    Inventors: Jochen Rivoir, Markus Rottacker
  • Patent number: 8782875
    Abstract: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate (13) is carried in from the substrate distributing unit (M3B) into conveyors (10A, 10D) which are closest to the component supplying units (20A, 20B) among the conveyors (10A, 10B, 10C, 10D).
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: July 22, 2014
    Assignee: Panasonic Corporation
    Inventors: Takeyuki Kawase, Yoshiyuki Kitagawa, Shuzo Yagi
  • Patent number: 8782879
    Abstract: A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: July 22, 2014
    Assignee: TDK Corporation
    Inventors: Toru Mizuno, Osamu Shindo, Hitoshi Nakayama
  • Patent number: 8773159
    Abstract: A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: July 8, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Kousuke Murakami, Yoshihiro Toyoda
  • Patent number: 8752283
    Abstract: A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: June 17, 2014
    Assignee: International Business Machines Corporation
    Inventors: Tymon Barwicz, Bing Dang
  • Publication number: 20140130340
    Abstract: A die-positioning device includes a roller body, a plurality of die-suction portions, and at least one gas control device. The roller body includes a plurality of chambers therein, and the chambers are separated from each other. The die-suction portions are located on the surface of the roller body in columns. The die-suction portions for each column correspond to one of the chambers, and each of the die-suction portions has a die suction region and a gas channel that passes through the die suction region. The gas control device is connected to the chambers and disposed on the roller body. The gas control device selectively sucks the air from a specific chamber, such that each of the die-suction portions on the specific chamber sucks an LED die by the corresponding gas channel.
    Type: Application
    Filed: September 30, 2013
    Publication date: May 15, 2014
    Applicant: Lextar Electronics Corporation
    Inventors: Zong-Han Li, Liang-Ta Lin