Abstract: A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.

Abstract: A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.

Abstract: A die-positioning device includes a roller body, a plurality of die-suction portions, and at least one gas control device. The roller body includes a plurality of chambers therein, and the chambers are separated from each other. The die-suction portions are located on the surface of the roller body in columns. The die-suction portions for each column correspond to one of the chambers, and each of the die-suction portions has a die suction region and a gas channel that passes through the die suction region. The gas control device is connected to the chambers and disposed on the roller body. The gas control device selectively sucks the air from a specific chamber, such that each of the die-suction portions on the specific chamber sucks an LED die by the corresponding gas channel.

Abstract: A secondary battery, a jig suitable for fabrication of the secondary battery, and a method for producing a secondary battery constructed with a case accommodating the electrode assembly. The case includes a front portion terminated along opposite edges by a first wing portion and a second wing portion, and a back portion positioned opposite to the front portion, with insulating film bent along a length of a junction between the front portion and each of the first wing portion and the second wing portion, a pair of holes in the insulating film are held in parallel alignment with respect to the length of the junction, with the insulating film adhering to and covering the front portion and a corresponding one of the first wing portion and the second wing portion, in order to prevent leakage of electrolyte, and resulting corrosion of the electrically conducting metal components of the secondary battery.

Abstract: The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage.

Abstract: An electric screwdriver is coupled to an automatic screw feeding adaptor defining a screw path having a proximal end, a middle region and a distal end. A first screw is received within the screw feeding adaptor and held at a driving position near the distal end of the screw path by applying a distal partial vacuum within the screw feeding adaptor. The first screw is driven, and a torque applied to the first screw is detected. The torque is compared to a minimum torque threshold, and a second screw is moved along the screw path based at least in part upon the comparison.

Abstract: Embodiments described herein take the form of fixtures to be used in a manufacturing process. In particular, a manufacturing fixture may be sized to accept one or more electronic components, such as a printed circuit board (PCB) having various electrical elements. The PCB may be placed on the fixture in a predetermined area. The PCB may be placed in a depression or aperture sized to accept the PCB. When the PCB is placed within the fixture, a cover may be lowered or otherwise placed across the PCB in order to hold the PCB in place. The cover contacts the PCB and is pliable or malleable to conform to those portions of the PCB it contacts. When the cover is closed, a negative pressure may be induced in the fixture beneath the cover. When the PCB is held in position, the manufacturing fixture may operate on the PCB.

Abstract: A vacuum nozzle control apparatus includes a nozzle module having a vacuum hole, a vacuum providing module configured to provide a vacuum to the vacuum hole through a vacuum line, and a vacuum control module configured to selectively form the vacuum in the vacuum hole through the vacuum line, or release the vacuum formed in the vacuum hole through a release line branched off from the vacuum line to expose the vacuum hole to air.

Abstract: A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing a working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing the working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.

Abstract: A vacuum thermally bonding apparatus is provided, in which while air is being prevented in vacuum from entering a bonding layer, an element is thermally bonded to a substrate under vacuum by forming the bonding layer. A lower end portion of an upper frame member is gas-tightly slidably sealed to a peripheral portion of the lower plate member to form a vacuum partition wall therein, and a pressurizing release film is contacted with an upper face of the element, and thermally softened in the atmospheric pressure. A vacuum chamber is evacuated to vacuum, and the lower plate member and an intermediate member are relatively moved in an approaching direction, so that an outer peripheral portion of the pressurizing release film is gas-tightly held between the upper face of the substrate-placing table of the lower plate member and a lower face of an inner frame body.

Abstract: An improved lead foil formation operation procedure for photovoltaic module manufacture is disclosed. The procedure includes lifting a lead foil to form a loop, pulling the loop through a hole in a plate, cutting the loop to form two ends, separating the ends, and folding the ends onto the plate.

Abstract: A panel carrying vacuum holder includes an attachment part, a frame supporting the attachment part, and a printed circuit board (“PCB”) holder. The attachment part is configured to attach to the panel to fix the panel. The board holder includes a supporting part connected to the frame, and a pressing part. The supporting part supports a PCB connected to the panel. The pressing part is configured to press the PCB and to fix the PCB.

Abstract: Some embodiments include a connection device for electrically coupling an electrical device to a test system. The connection device can include at least one suction cup configured to be coupled to the electrical device, spring loaded connector pins configured to electrically couple the electrical device to the test system, and a support frame coupled to the at least one suction cup and the spring loaded connector pins. The at least one suction cup can include three suction cups including a first suction cup, a second suction cup, and a third suction cup, and the support frame can include a first end coupled to the first suction cup, a second end opposite the first end and coupled to the second suction cup, and a third end between the first and second ends and coupled to the third suction cup. Other embodiments of related devices and methods are also described herein.

Abstract: A vacuum nozzle for a pick and place machine that includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of wood. The tip may also be made of a material that is at least one of polar and porous. Further, a method of picking up and placing a light emitting diode includes providing a pick and place machine having a vacuum nozzle, wherein the vacuum nozzle includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of a material that is at least one of polar and porous. The method includes picking up the light emitting diode and placing the light emitting diode on an electronic assembly.

Abstract: Machine and insolation method for panels for turning a panel and successively insolating its first and second faces. According to the invention, this machine comprises at least one first insolation station (10), and a panel turner (30), having a first face and a second face, the latter comprising a prehension device (53, 54), configured to grip a panel (90), a displacement device, configured to displace the prehension device at least between the first and second insolation stations (10, 20), and a pivoting device, configured to pivot the prehension device (53, 54) and in this way have the panel (90) pivot about a pivoting axis (A) parallel to said panel (90), the turner (30) being configured so that it can grip the panel (90) by any one of its faces and release the panel (90) also by any one of its faces.

Abstract: An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate.

Abstract: An adsorption head for a surface mounting device, including: a main body; a shaft which moves in a direction of a longitudinal axis of the shaft and rotates around the longitudinal axis mounted on the main body, and the shaft includes a lower shaft and an upper shaft. The lower shaft is detachably attached to the upper shaft; and an adsorption nozzle which adsorbs electronic parts mounted on a lower end of the shaft, wherein an air passage connected to the adsorption nozzle is provided in the lower shaft.

Abstract: A component mounting apparatus includes: two heads equipped with plural nozzles for suctioning and mounting a component; a memory holding at least one of information on maximum speed and maximum acceleration; an operation determining unit determining whether an operation after a suctioning operation of any one of heads is a suctioning operation or not; a speed/acceleration calculating unit calculating at least one of speed and acceleration at the time of axial movement by using at least one of the maximum speed and the maximum acceleration for the suction, if it is determined that the operation after the suctioning operation is the suctioning operation; a control signal generating unit generating a control signal; and a driving unit performing movement from the suction operation to a component suction position of the subsequent nozzle in accordance with the control signal when the suctioning operation by the subsequent nozzle is performed.

Abstract: An exemplary surface mount machine nozzle includes a mounting element, a pneumatic suction nozzle and a fixing pin. The mounting element defines one of a pivot hole and an elongated perforation in a sidewall thereof. The pneumatic suction nozzle defines another one of the pivot hole and the elongated perforation therein. The fixing pin horizontally extends through the pivot hole and the perforation for connecting the mounting element and the pneumatic suction nozzle together. The fixing pin is slidable along the elongated perforation such that the pneumatic suction nozzle is telescopically slidable relative to the mounting element.

Abstract: An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected to an end portion of the index rail and supplying the lead frame to the index rail, a frame driving portion connected to the opposite end portion of the end portion of the index rail and rotating the lead frame around a normal to the first surface, and a die attach portion attaching a semiconductor chip on the lead frame supplied to the index rail.

Abstract: Embodiments of the invention may provide a system for the production of photovoltaic modules that comprises at least a first work line having a plurality of positioning stations in which a series of first processing operations are performed and a second work line consisting of at least a positioning station in which at least a second processing operation is performed. The process sequence may include, for example, printing a layer material used to form one or more electric contacts on a base layer, and then positioning photovoltaic cells and various layers of insulating material in a desired orientation over the base layer to form a photovoltaic module.

Abstract: A method of assembling a matrix of photovoltaic cells includes positioning photovoltaic cells in a desired orientation, aligning the row of photovoltaic cells relative to each other, and enabling a homogeneous downward pressure on the row of photovoltaic cells to facilitate electrical and mechanical connectivity between the photovoltaic cells.

Abstract: A component assembly (10) used for picking and placing the component assembly includes a component (14-30) having a geometry incapable of being picked and placed or having a geometry that is unstable when placed through a reflow oven. The assembly includes a support member such as a detachable clip (11) having a pick and placeable surface such as a top flat surface (12). The clip attaches to the component to modify a center of gravity to form a stable component assembly once attached to the support member. The component assembly can further include conductive elements (such as a center conductor (17) of a coaxial cable (16) and at least one ground conductor (15)) used for registration with apertures or other surface locations on a substrate (19).

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: A mounting method for mounting an electronic component on a printed circuit board, the mounting method includes fixing a lower surface of a magnet panel to a magnetic body included in the electronic component by a magnetic force, seizing the electronic component by attracting a part of an upper surface of the magnet panel to an attaching unit, determining a position of the attracting unit to place the electronic component at a predetermined position with respect to the printed circuit board and releasing the attracting unit from the upper surface of the magnet panel.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. A global measuring system is provided for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate. The local measuring system is located closer to the substrate carrier than the global measuring system.

Abstract: An assembly tool is provided. The assembly tool comprises a body, a first vacuum channel defined within the body, and a first locating pin attached to the body. The first locating pin has a shaft portion arranged within a surrounding portion of the body. The first locating pin is configured to engage a first alignment feature of a hard drive component at a first contact area to align the hard drive component with the assembly tool. The body is configured to couple the first vacuum channel to a vacuum source and to facilitate particle evacuation from the first contact area via the first vacuum channel when a vacuum is applied by the vacuum source.

Abstract: An input/output shuttle plate includes a metal plate having a plurality of pockets. The plurality of pockets have a bottom, a sidewall portion and a pocket depth. A first seating surface at a first pocket depth (d3) is for supporting a first packaged semiconductor device having a first package size, and at least a second seating surface at a second pocket depth (d4) is for supporting a second packaged semiconductor device having a second package size. The first pocket depth is less than the second pocket depth (d3<d4), and the first package size is larger than the second package size. The shuttle plate is adapted to be fit on a test handler, such as by shuttle plate clips.

Abstract: Provided are a semiconductor chip attaching apparatus and a semiconductor chip attaching method. The semiconductor chip attaching apparatus includes a collet body comprising a pick-up pad and a pad support and a collet plate on the collet body, the collet plate having a central portion. A lower surface of the edge portion contacts an upper surface of the pad support. An edge portion of the lower surface is spaced apart from the upper surface of the pad support. The apparatus further includes a first pipe extending through the collet plate and the collet body. The collet plate includes a second pipe in the edge portion.

Abstract: A suction nozzle sucking a first electronic component that is mounted on a substrate and has first and second electrodes includes a first sucking area with an opening formed in an area corresponding to the first electrode and a second sucking area with an opening formed in an area corresponding to the second electrode.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing the loading head. In a loading head having two rows of nozzles (L1 and L2) including a plurality of nozzle shafts arranged in rows and at a predetermined nozzle arrangement pitch, a ? rotary drive mechanism that rotates the nozzle shafts around their axes is configured so as to include driven pulleys (28) coupled to the respective nozzle shafts; a plurality of idlers (30) interposed between the two rows of nozzles (L1 and L2); and endless drive belts (29A and 29B) that transmit rotation of the ?-axis motors (27A and 27B) to the driven pulleys (28).

Abstract: A component mounting apparatus includes two board transfer devices, a component supply unit, a component placing device, a setting unit, and a controller. Until production of the urgent boards is instructed, the two board transfer devices and the component placing device mount components on the regular boards in accordance with a first mounting program stored by the controller. When production of the urgent boards is instructed, a regular board is unloaded from the other board transfer device, which has been set by the setting unit to transfer urgent boards, the transfer way width of the other board transfer device is adjusted to the width of the urgent boards, and the other board transfer device and the component placing device are controlled so that component mountings on the urgent boards are performed on the other board transfer device in accordance with a second mounting program stored by the controller.

Abstract: A handling tool for electronic components includes a holding opening, to which a vacuum pressure may be applied and at which components to be handled are able to be held via vacuum pressure. At least one counter support, which outwardly projects beyond the opening plane in an operating position, is situated inside the holding opening. The component held by vacuum pressure is supported in the region of its surface acted upon by vacuum pressure, in such a way that this same surface bends concavely when viewed from the side of the vacuum pressure.

Abstract: An apparatus for removal of a disk in a disk stack. The apparatus includes a shaft. The shaft has an end portion insertable into a disk remover tool. The shaft has a positioning portion at an end of the shaft opposite the insertable end portion. The positioning portion includes a surface de-tensionizer. The surface de-tensionizer provides disengagement of surface tension between the disk and a disk spacer during a disk removal process performed thereon.

Abstract: A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape and a die ejector comprising an ejector shaft including an ejector pin. The ejector pin is movable parallel to the pick-up axis to raise the die from the adhesive tape to facilitate pick-up of the die by the pick-and-place tool. At least one movable table to which the ejector shaft is operatively coupled is actuable by at least one piezoelectric actuator which is connected to the movable table via a flexure. Actuation by the piezoelectric actuator forces the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis.

Abstract: An apparatus for attaching first and second substrates of a flat display panel together includes a frame; an upper chamber fixed to an upper part of the frame and to which a first substrate can be attached and a lower chamber disposed under the upper chamber and to which a second substrate can be attached. A lifter acts to lift the lower chamber while controlling a gap between the upper chamber and the lower chamber. A position control stage interposed between the lower chamber and the lifter is used to adjust a position of the lower chamber relative to the upper chamber.

Abstract: Provided is a method for manufacturing a thermally-assisted magnetic recording head including a light source unit with a light source and a slider with an optical system. The method comprises steps of: adhering by suction the light source unit with a back holding jig; moving the back holding jig, then aligning a light-emission center of the light source with a light-receiving end surface of the optical system in directions within a slider back surface of the slider; bringing the light source unit into contact with the slider back surface, with a suction surface of the back holding jig tilted from the normal to the slider back surface; applying a load to a load application surface of the unit substrate by a loading means to bring a joining surface of the light source unit into conformity with the slider back surface; and bonding the light source unit and the slider. This method can improve the conformity, thereby achieving adequately strong junction and adequately high accuracy in position.

Abstract: A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into the first hole and are jointly and also individually displaceable in a direction extending perpendicularly or in an oblique way in relation to the surface of the cover plate, and drive means in order to displace the plates. The drive means comprise a drive mechanism which comprises a motor and a pin which can be moved along a predetermined path and which is movable by the motor between two positions back and forth. Each of the plates comprises a path-like opening. The path-like opening is different from plate to plate in such a way that the plates are displaced in a predetermined sequence in the mentioned direction when the pin is moved along the path.

Abstract: In an electronic component mounting apparatus, nozzle mechanisms are formed slender by providing shaft-type linear motors vertically upward of nozzle units and providing linear encoders vertically upward of the shaft-type linear motors, respectively. Thus, it becomes possible to reduce the occupational area of the individual nozzle mechanisms in XY directions (horizontal direction), thereby allowing the pitch of neighboring nozzles to be narrowed. It also becomes achievable to keep up with increasingly narrow mounting pitches of electronic components on boards of increasingly smaller-size and higher-integration.

Abstract: A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

Abstract: Before a user starts the operation of an electronic component mounting apparatus, user's input representing as to whether the user is an operator, a programmer or a manager/maintenance person is accepted and further user level information representing degree of skill of the user as to the safety measures is accepted. The power supply of a mechanical portion operating a head portion is interrupted in accordance with the state of the apparatus including at least the user level information and the open/close state of a safety cover for covering the movable range of the head portion.

Abstract: The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component.

Abstract: A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.

Abstract: In a construction in which the intermediate stage 5 is interposed between the substrate positioning stage 4 and the electronic component supply stage 3; and in which it is possible to select either a mode of the bonding head 10A transferring to the substrate positioning stage 4 the electronic component P taken out of the electronic component supply stage 3 by the pickup head 6 and mounted on the intermediate stage 5 or a mode for transporting the electronic components, which has been taken directly out of the electronic component supply stage 3, to the substrate positioning stage 4 by means of the bonding head 10A, the pickup head moving mechanism 7 for moving the pickup head 6 is coupled in a suspended manner to the lower surface of the beam member 8b of the gantry 8 positioned at the end of the base 2, and a space S that allows entry of a portion of the electronic component supply stage 3 is assured at a position beneath the pickup head moving mechanism 7.

Abstract: A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).

Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.

Abstract: In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.

Abstract: A vacuum suction nozzle operable to reduce or eliminate electronic component blow off and electrostatic damage is disclosed. The vacuum suction nozzle comprises a ceramic body with a first surface at a side opposite to a second surface of the ceramic body. The ceramic body causes static electricity generated on the vacuum suction nozzle to be dissipated to an electronic component mounting device. Dissipation of the static electricity reduces or eliminates electrostatic damage to the electronic component and electrostatic repulsion induced blow off during suction by the vacuum suction nozzle.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.