Abstract: The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts are made along specified scored lines that form a lattice-like pattern by introducing thermally induced stresses by means of a laser beam, and in which, after making the break-off cuts along a first working direction, the resultant plate strips are spaced out at intervals in that a framed stretch film to which the plane-parallel plate is bonded is stretched by means of a vacuum device. The invention also relates to a device with a special clamping table for use in carrying out the method.

Abstract: An electric parts mounting apparatus includes rotary type multi-nozzle mounting heads. Each of the mounting heads has a plurality of suction nozzles disposed in a radial manner on a rotor mechanism, which rotates around a rotation shaft. A parts mount mechanism is configured such that the axial direction of the rotation shaft coincides with an arrangement direction of tape feeders. A shaft-to-shaft distance of the suction nozzles is set to be plural times as large as a pitch of the feeder arrangement. In a pick up process, a plurality of electronic parts can be simultaneously picked up from the tape feeders. In a parts mounting process, while one of the mounting heads mounts the part, the other mounting head can complete a nozzle changeover operation such that the suction nozzle holding an electronic part to be mounted next is moved to an operation position.

Abstract: When a component (X) is fed to a pickup position (53) but no suction action is carried out due to a variety of reasons, a reverse feeding action is carried out to return the component (X), which has been fed to the pickup position (53), to a position upstream of the pickup position (53) in the tape feeding direction. The same component (X) is thus not wasted but is resupplied to the pickup position (53) in the following pickup action, whereby the amount of waste of components is reduced.

Abstract: A processing speed of each mechanisms in a cutting section is controlled such that all polarizing films housed in a container in advance are used in a joining process and simultaneously a new container with polarizing films housed therein that are cut by a size of a liquid crystal panel is loaded from the cutting section. Here, a fracture included in the polarizing film is cut and removed in the cutting section while a delayed time due to this process is shortened by controlling at least a processing speed in a processing mechanism in a cutting mechanism among mechanisms provided in the cutting section and the joining section.

Abstract: An apparatus (1) for fixing a planar object, in particular a substrate (2), on a working area (4) by means of vacuum is provided with an at least partly transparent bearing plate (5), one side of which forms the working area and which has a rear side arranged at a distance from the working area with a radiation-reflecting structure (7). The bearing plate additionally has vacuum channels which can be connected to a vacuum line and which open into the working area. In order to illuminate the substrate as homogeneously as possible by means of transmitted light, at least one light source (10) is provided, the radiation of which can be fed into the bearing plate. In addition, the working area is preferably operatively connected to a heating apparatus (11), so that the substrate (2) can be heated.

Abstract: In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.

Abstract: An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.

Abstract: A method and a component placement device are provided for adjusting at least one optional setting of a process characteristic of the component placement device, which component placement device has at least one standard setting. The optional setting may be activated by way of an electronic key supplied to the component placement device. The optional setting may be temporarily activated by feeding the electronic key to the component placement device. Further, the standard setting may be reactivated after the expiration of a predetermined period of operation of the electronic key.

Abstract: A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

Abstract: A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element.

Abstract: A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape and a die ejector comprising an ejector shaft including an ejector pin. The ejector pin is movable parallel to the pick-up axis to raise the die from the adhesive tape to facilitate pick-up of the die by the pick-and-place tool. At least one movable table to which the ejector shaft is operatively coupled is actuable by at least one piezoelectric actuator which is connected to the movable table via a flexure. Actuation by the piezoelectric actuator forces the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis.

Abstract: A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A robotic tool for assembling a portion of a disk drive includes a movable end effector that includes a first portion and a second portion that is movable relative to the first portion. The first portion may be configured to engage the actuator assembly and the second portion may be configured to engage the flex circuit connector. A controller may be provided to control the movable end effector, causing the end effector to pick up the head stack assembly in a first configuration, move the second portion of the end effector relative to the first portion thereof so as to articulate the head stack assembly into a second configuration that is different than the first configuration, and place the head stack assembly into the base.

Abstract: An apparatus tool for filling vias in a product greensheet and/or repairing vias in a product greensheet. The apparatus tool utilizes a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The apparatus tool employs position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the repair or fill method. The product greensheet is held by a vacuum plate.

Abstract: The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.

Abstract: A nozzle unit includes a rotating body and a driving source. The rotating body includes a plurality of nozzles for holding a component using a negative pressure and rotates the plurality of nozzles. The driving source drives the rotating body in a non-contact state.

Abstract: Stock having printed circuits thereon is conveyed in a transport plane by a conveying device, and electronic components carried by a transfer belt are transferred to the stock under pressure exerted by the belt. The electronic components are transferred to the belt by a feed device individually in such a way that the electronic components are accurately positioned on the stock by the transfer device.

Abstract: A vacuum bonding tool method for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: A method controls a component mounter which includes a mobile unit for mounting a component onto a circuit board, and judges on which side of the component mounter as user, who issues an instruction to the component mounter, is present. Additionally, the method performs position control by shifting the mobile unit to a position which allows a maintenance task to be performed on the component mounter from the side on which the user is judged to be present.

Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.

Abstract: A method and an apparatus which can be used for separating a dummy disc from a substrate in a process for manufacturing multi-layer optical storage discs are provided.

Abstract: A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor.

Abstract: A tool for changing first and second parts of a connector from a pre-assembly relationship into an assembled relationship. The tool is portable and has a frame with an operating mechanism thereon. The operating mechanism has a plunger that is movable to thereby change the relationship of the connector parts. The operating mechanism is operable by a pressurized fluid within a container that is connected to the frame.

Abstract: An operating time reducing method in which a processing procedure of a component mounting order determination method can be changed depending on the type of an operation loss that affects a component mounting time for mounting components onto the board is an operating time reducing method for a component mounter, wherein the method includes: an operation loss identifying step of identifying an operation loss to be resolved in the component mounter; a processing procedure selecting step of selecting, based on the identified operation loss, a processing procedure for reducing an operating time of the component mounter; and a processing procedure executing step of executing the selected processing procedure.

Abstract: A suction-and-holding face for a component in a suction nozzle is formed from a semiconductor ceramic so that the suction-and-holding face to be brought into direct contact with the component in suction and holding has the characteristics of a semiconductor. Thus, detrimental effects due to static electricity on the suction nozzle as well as detrimental effects due to electrical conduction between the suction nozzle and the component can be prevented from occurring.

Abstract: A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.

Abstract: Embodiments in accordance with the present invention relate to the design and manufacturing of inexpensive photovoltaic or thermal receivers for cost-effective solar energy conversion of concentrated light. Particular embodiments in accordance with the present invention disclose the design of a photovoltaic receiver and a low-pressure, low-flow-rate liquid cooler. Embodiment of the present invention also disclose a preferred low-cost and scalable manufacturing approach.

Abstract: An electronic component mounting apparatus includes a component feeding device that supplies an electronic component to a pickup position, a suction nozzle that picks up the electronic component supplied to the pickup position and mounts the picked up electronic component on a printed board, a height level detection device that measures height levels of the printed board positioned in a mounting position, a monitor graphically that displays a warping state of a sample printed board positioned in the mounting position based on height level measurements by the height level detection device on predetermined positions of the sample printed board, a setting device that sets measurement positions for actual mounting operations using the monitor, a converting device that converts the set measurement positions into coordinates on the printed board, and a memory that stores the converted coordinates of the set measurement position.

Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.

Abstract: In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.

Abstract: In the case of a position-correction device for correcting the position of a component holder of a handling apparatus for electronic components, in particular ICs, a base plate and a centering frame which can be displaced in relation to the base plate are provided in the region of a contact unit. A drive device is also provided and is operatively connected to the centering frame in order to displace the centering frame and thus the component holder inserted into the centering frame as a function of correction values which are calculated by a computation device on the basis of measured values which are obtained by a position-detection device for detecting the actual position of the component which is to be tested and is held in the component holder.

Abstract: Provided is a PCB assembly machine including a board handling system configured to transport a PCB through the PCB assembly machine, wherein the PCB assembly machine further includes a pick and place system configured to pick and place electrical components onto the PCB. The PCB assembly machine also includes a feeder system configured to supply the electrical components, wherein the board handling system mounts directly to the feeder system.

Abstract: The present invention provides a system and method for providing a improved device for dismounting integrated circuits for rework tools in the fabrication and manufacture of hard disk drives. Embodiments of the present invention include a vacuum cap with suction capabilities for dismounting the integrated circuits. The vacuum cap includes a cylindrical portion with a vacuum path for holding a rod-like vacuum cylinder which when pressurized causes the integrated circuit to dismount. Embodiments of the present invention further include a light weight aluminum heat-shield that is disposed around the vacuum cap to protect the vacuum cap from excessive heat and to preserve the suction capabilities of the vacuum cap. In one embodiment the heat shield acts as a stopper to prevent the vacuum cap from moving upwards and helps the vacuum cap from absorbing multiple mechanical stress in order to protect the vacuum cylinder from being damaged.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.

Abstract: The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.

Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

Abstract: An electronic component mounting method of thermo-compressing and mounting electronic components onto a plurality of unit boards segmented in a multi-piece board which avoids the occurrence of adverse thermal influences on the thermosetting bonding material which is placed on the unit boards before mounting the electronic components. The thermo-compression tool used in the method is removably fitted on a thermo-compression head in an electronic component mounting apparatus; the thermo-compression tool includes a base member and a suck-up member which is smaller than a lower surface of the base member and which is fixed on the lower surface of the base member at a position displaced from a center thereof.

Abstract: The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.

Abstract: An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.

Abstract: A component placement device includes: (a) an elongated transport device by means of which substrates to be provided with components can be moved in a transport direction parallel to the transport device; (b) at least one component feeder that is located along a longitudinal side of the transport device; (c) at least one component pick-and-place unit by means of which in operation a component can be picked-up from the component feeder and placed on a substrate; and (d) a substrate support, which is located along a longitudinal side of the transport opposite to the component feeder.

Abstract: Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gasses to more readily exit the container prior to sealing thereof. Getters can be used to mitigate undesirable gases within the sealed container. One or more bolometers can be used to determine if the sealed container is leaking. A vacuum positioning fixture can be used to assemble the components of the infrared detector assembly and to place the infrared detector assemblies into a vacuum chamber. The cost of manufacturing such infrared detector assemblies may be reduced and the reliability thereof enhanced.

Abstract: For purposes of assembling contact pins (12) disposed in a row onto a circuit board (16), the pins (12) are grasped via a force fit in an insulating body (20) at their ends facing away from the circuit board (16)and are supported to prevent tilting. The body (20) has a suction surface (26) for an automated assembly device. After insertion of the pins (12) into the circuit board (16) and after the soldering process, the body (20) is pulled off the pins (12), so that they sit freely in the circuit board (16).

Abstract: A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.

Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.

Abstract: A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor.

Abstract: A vacuum-mounted clamp for clamping a first component to a second component. The clamp includes a substantially rigid body having an application face, a back face opposite the application face, a side, and a vacuum port extending between the application face and the back face. The application face has a step adjacent the side for engaging the first component. The clamp includes a flexible seal connected to the rigid body adjacent the application face. The seal has a vacuum port in fluid communication with the vacuum port in the primary body and a periphery for contacting the second component to create a vacuum area between the clamp and the second component. The vacuum port of the body and the seal are in fluid communication with a vacuum generator for generating a vacuum in the vacuum area.

Abstract: An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.

Abstract: AN SMT nozzle is provided for picking up an SMD. The nozzle includes a suction portion and a supporting arm extending from a side of the suction portion. The suction portion forms an engaging end configured for abutting against the SMD, and defines a suction passage with an opening in the engaging end. The supporting arm form at least one supporting end spaced from the engaging end of the suction portion and configured for abutting against the SMD.