Abstract: Semiconductor devices, and more particularly arrangements of fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices are disclosed. Arrangements include conformal coatings or layers of fluorinated polymers that cover a semiconductor die on a package substrate of a semiconductor device. Such fluorinated polymer arrangements may also conformally coat various electrical connections for the semiconductor die, including wire bonds. Fluorinated polymers with low dielectric constants and low moisture permeability may thereby provide reduced moisture ingress in semiconductor devices while also reducing the impact of associated dielectric loss.

Abstract: An inductor device, a filter device, and a steering system. The inductor device includes first to third cores and first and second wires. The first core, a portion of the first wire passing through the first core, and a portion of the second wire passing through the first core are provided as a first inductor. The second core and another portion of the first wire passing through the second core are provided as a second inductor. The third core and another portion of the second wire passing through the third core are provided as a third inductor.

Abstract: A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

Abstract: An opening such as a small-diameter via is formed in a semiconductor substrate such as a monocrystalline silicon chip or wafer by a high etch rate process which leaves the opening with a rough interior surface. A smoothing layer such as a polysilicon layer is applied over the interior surfaces of the openings. The smoothing layer presents a surface smoother than the original interior surface. An insulating layer is formed over the smoothing layer or formed from the smoothing layer, and a conductive element such as a metal is formed in the opening. In a variant, a glass-forming material such as BPSG is applied in the opening. The glass-forming material is reflowed to form a glassy insulating layer which presents a smooth surface. The interface between the metal conductive element and the insulating or glassy layer is smooth, which improves mechanical and electrical properties.

Abstract: A power triad of an umbilical may be rotated during multiple transition lengths to position each power cable of the power triad equally at radial orientation over the length of the umbilical. A first portion of the umbilical includes the triad in a first radial orientation, a second portion of the umbilical includes the triad in a second radial orientation, and a third portion of the umbilical includes the triad in a third radial orientation. The triad is rotated a first one hundred twenty degrees from the first radial orientation to the second radial orientation during a first transition length. The triad is rotated a second one hundred twenty degrees from the second radial orientation to the third radial orientation during a second transition length. The use of three radial orientations along the length of the umbilical may reduce imbalances between the power cables of the triad.

Abstract: Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.

Abstract: Guidewire assembly methods and apparatus are described for incorporating one or more pressure sensors with one or more electrodes within or along the body of the guidewire. Guidewires may incorporate a number of different sensors within or along the body of the guidewire. To achieve the combination of the pressure sensor and one or more electrodes, various assembly methods and apparatus may be utilized as described in further detail herein.

Abstract: A dual orientation plug connector having a tab portion with first and second opposing exterior surfaces that are substantially identical, parallel and opposite each other. Each exterior surface may have a plurality of electrical contacts. A substantially u-shaped metallic band surrounds a portion of the periphery of the plug connector. A contact assembly having an upper contact carrier, intermediate conductive plate and lower contact carrier may be disposed within the tab portion of the plug connector. A circuit assembly may be disposed within a body portion of the plug connector and electrically coupled to the plurality of electrical contacts.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: Methods and systems for use in releasing tubing sleeves coupled to one or more bandoliers are disclosed. In one example, an apparatus for use in releasing tubing sleeves coupled to a bandolier includes a feed system and a dislodge system. The feed system is configured to engage a bandolier and selectively position the bandolier in the apparatus. The dislodge system is configured to dislodge tubing sleeves from an initial position on a bandolier propelled by the feed system.

Abstract: The present disclosure relates to an electronic control apparatus for a vehicle using waterproof housing sealing and a manufacturing method thereof, and the electronic control apparatus includes: an electronic control element configured to electrically control each part of the vehicle; a connector electrically connected with the electronic control element; a housing having an opened one side surface, the connector connected with the electronic control element being inserted from the one side surface in the slot type to be accommodated in the housing; and a connector cover coupled with the connector to cover the opened one side surface of the housing, in which a flange extended by a predetermined length toward the outside is formed on the opened one side surface of the housing along a side surface of the housing, and a potting layer is formed inside the flange on the connector cover.

Abstract: Methods of making an implantable pulse generator are disclosed herein. The implantable pulse generator can include a body defining an internal volume and a plurality of wires extending from out of the internal volume of the body. Some of these wires can be connected, either directly or indirectly to a lead via a welded joint. The welded joint can be created by first resistance welding and then laser welding some of the wires to a connector.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another.

Abstract: A plug-in overhead light is shown with an overhead female type, twist lock, electrical plug. The plug-in overhead light has a male type, twist lock, electrical plug. Upon plugging in the overhead light and twisting to lock, additional structural support for the overhead light is provided. Other than just the twist lock, electrical plug, the junction box is anchored to a ceiling joist and supports the overhead light projecting there below. A decorative cover extends over the junction box and may be used to hold the light globe in position. The male type, twist lock, electrical plug has a bulb socket on the end opposite the electrical plug.

Abstract: A terminal box includes a terminal box main body (M), a terminal plate (3) to which a lead wire (2) introduced in the terminal box main body (M) is coupled, and a fixed portion (4) that secures at least the terminal plate (3) to the terminal box main body (M). The terminal box includes a filler (7) that seals a peripheral area of the terminal plate (3). The terminal plate (3) includes an opening portion (3b) that serves as a filler supply port and an air vent port.

Abstract: A method for manufacturing a printed wiring board includes forming on a support board a first resin insulation layer, forming a second resin insulation layer on the first resin insulation layer, forming in the second resin insulation layer an opening portion in which an electronic component having an electrode is mounted, accommodating the electronic component in the opening portion of the second resin insulation layer such that the electrode of the electronic component faces an opposite side of the first resin insulation layer, forming on the first surface of the second resin insulation layer and the electronic component an interlayer resin insulation layer, and forming in the interlayer resin insulation layer a via conductor reaching to the electrode of the electronic component.

Abstract: A hermetic interconnect for medical devices is disclosed. In one embodiment, the interconnect includes platinum leads co-fired between alumina substrates to form a monolithic composite that is subsequently bonded into a titanium alloy flange. Both methodology for forming these interconnects as well as specific geometries and compositions are disclosed. Interconnects formed in this fashion enable significant reductions in overall size of the interconnect relative to the number of feedthrough leads as well as substantial improvements in robustness versus currently available technology.

Abstract: A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in the dielectric layer. These channels are filled with an electrically conductive material to form the capture pad.

Abstract: A method is disclosed for moisture tight covering a connection point between an electrical conductor. The method includes exposing the conductor at its end by removing the insulation and subsequently electrically conductively connecting the end of the conductor, from which the insulation has been removed, to the contact element. After the connection point is finished, a foil of insulation material is positioned underneath the connection point, where the foil rests against the insulation of the conductor and at least partially against the contact element. Subsequently, a sealing material capable of hardening is applied from above onto the conductor, wherein the sealing material is flowable during its application and subsequently changes over by hardening into a mechanically stable state which extends beyond the insulation of the conductor and beyond the contact element and is connected tightly to the foil.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

Abstract: A method for coupling ends of two insulated conductors includes coupling an end portion of a core of a first insulated conductor to an end portion of a core of a second insulated conductor. At least a part of the end portions of the cores are at least partially exposed. Electrically insulating material is placed over the exposed portions of the cores. An inner sleeve is placed over end portions of the two insulated conductors to be coupled. An outer sleeve is placed over the inner sleeve. There is an open volume between the inner sleeve and the outer sleeve. The inner sleeve and the outer sleeve are coupled to jackets of the insulated conductors. A pressurized fluid is provided into the open volume between the inner sleeve and the outer sleeve to compress the inner sleeve into the electrically insulating material and compact the electrically insulating material.

Abstract: A fitting for coupling ends of cores of three insulated conductors includes an end termination placed over end portions of the three insulated conductors. The end termination includes three separate openings that pass through the end termination longitudinally. Each of the insulated conductors passes through one of the openings with end portions of the insulated conductors protruding from one side of the end termination. Exposed cores of the end portions of the insulated conductors protrude from the end termination. A cylinder is coupled to the side of the end termination from which the end portions of the insulated conductors protrude. An electrical bus is coupled to the exposed portion of the cores. Electrically insulating material fills the cylinder such that the cores are substantially enclosed in the electrically insulating material. An end cap is coupled to the cylinder to seal off the interior of the cylinder.

Abstract: A method for enhancing the dielectric properties of at least one in-service electrical cable section having a central stranded conductor encased in a polymeric insulation jacket and having an interstitial void volume in the region of the conductor. The method includes filling the interstitial void volume with at least one dielectric property-enhancing fluid and then confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the cable section and being below the elastic limit of the insulation jacket. The cable section is heated by imposing a potential of no more than about 500 volts across the conductor during at least a portion of the time required to complete the other described steps.

Abstract: An iron core includes an electromagnetic steel plate having a first region on the surface of which an insulating film is formed and a second region which is not covered with the insulating film and exposed, and a coating member which coats at least the second region. The second region is formed by removing the insulating film by machining.

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: An igniter includes, a sleeve receptive to combustible medium, a resistor in operable communication with the combustible medium, and at least one lead in electrical communication with the resistor and the sleeve the electrical communication with the sleeve is maintained by interference fit between the sleeve and the at least one lead.

Abstract: A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.

Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.

Abstract: An acoustic wave device includes: a substrate; an input terminal that is located on a first surface of the substrate, and to which a high-frequency signal is input; a resonator that is connected to the input terminal, and to which a high-frequency signal input to the input terminal is input; and an insulating layer that is located between the input terminal and the substrate, and has a permittivity smaller than that of the substrate.

Abstract: An LED lamp assembly, including a generally cylindrical socket housing and a socket insert receivable into the socket housing and keyed to the socket housing to be receivable into the housing in a selected orientation. A two conductor wire having two insulated conductors surrounded by insulation is engaged over the socket insert on two sides and a top of the socket insert and interposed between the socket insert and an interior of the socket housing and extends out of a bottom of the socket housing. An LED lamp including a base, a lens and two wire piercing conductors is positioned in the socket housing such that each of the two wire piercing conductors pierce the insulation and engage one of the two insulated conductors.

Abstract: An actuator manufacturing method includes alternately stacking a plurality of dielectric elastomer layers and a plurality of conductive rubber layers along the direction of thickness to form a sheet, and wrapping the sheet formed about a core to form a rolled sheet. When the sheet formed in the step of alternately stacking is wrapped about the core, the sheet is formed by the dielectric elastomer layers and the conductive rubber layers. Therefore, even if the dielectric elastomer layers in the sheet are made to be thin, the thickness of the entire sheet is prevented from being excessively thin.

Abstract: Disclosed herein, among other things, is a stator winding temperature sensor. According to an embodiment, the sensor includes at least one sensing wire coil adapted to be connected to a stator. The sensor also includes a body, including a core material surrounding at least a portion of the sensing wire coil, and a laminate material over the core material. The body has a thickness adapted to protect the sensing wire coil. The sensor includes a lead wire adapted to connect to an external monitoring device. The sensing wire coil is electrically connected to the lead wire at a lead step portion of the sensor. In addition, the sensor includes a tab extending from the lead wire and encompassing the lead step. The tab protects the lead step and the sensing wire coil in a region where the sensor extends over an end of the stator.

Abstract: A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.

Abstract: An electronic device module as described herein includes an electronic device package having device contacts. The electronic device module can be manufactured by providing an electrically conductive ground plane having a device opening for an electronic device package, and having an antenna ground section. The manufacturing method continues by embedding the ground plane and the electronic device package in encapsulating material such that device contacts of the electronic device package and a first side of the ground plane reside at a device mounting surface. Thereafter, an antenna circuit structure is formed overlying the device mounting surface. The antenna circuit structure includes an antenna signal element that cooperates with the antenna ground section to form an integrated antenna for the electronic device module.

Abstract: An electronic device package 100 comprising a lead frame 105 having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead.

Abstract: A method for manufacturing a light set with surface mounted light emitting components is disclosed. A rod having a predetermined length and a winding control architecture with corresponding driving spindles are prepared first. The rod is driven to rotate by a winding machine via driving spindles to wind conducting wires. The insulating layer of each conducting wire is then ground along an axial direction of the rod to expose the conductor of each conducting wire to form contact-pad area. A conductive paste is applied to each contact-pad area, and the surface mounted light emitting components are straddled thereon. Each lead of the surface mounted light emitting components is respectively positioned corresponding to the contact-pad areas, and is electrically connected to the conductors by the conductive paste. The contact-pad areas and the surface mounted light emitting component are then covered with a package.

Abstract: A method for manufacturing a multilayer polymeric actuator includes the following steps: arranging a rotating winding core; winding a dielectric film of polymeric material around the winding core; during winding, applying a conductive material on the dielectric film exposed face, in which the application occurs intermittently according to a pre-established sequence, and according to a first and a second geometrical application pattern mutually alternated at each winding turn, so as to form a roll; radially cutting the roll at the ends of a circumferentially localized zone; and connecting a conductive material layers having the first geometrical application pattern one to the other and the conductive material layers having the second geometrical application pattern one to the other.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and an electrically insulating material disposed between an externally-facing filter array side and an internally-facing feedthrough side. In some examples, the feedthrough includes at least one feedthrough conductive pathway extending between an internally-facing feedthrough side and an externally-facing feedthrough side. In some examples, the capacitive filter array includes at least one filter array conductive pathway extending between an internally-facing filter array side and an externally-facing filter array side. In some examples, at least one of the ferrule, the feedthrough, or the capacitive filter array defines an underfill access channel through which the electrically insulating material is introduced.

Abstract: The embodiments disclose a method for creating a silicone encased flexible cable using manufacturing machinery including automatically arranging plural individual conduits, into custom grouped arrangements including electrical wiring, pneumatic tubing and fluid tubing, inserting the custom grouped arrangements including connectors and flexible silicone junction devices into a shaped silicone encasement extrusion apparatus, depositing a mixture of silicone and additives to the custom grouped arrangements encasement using the extrusion apparatus, customizing the mixture of silicone and additives to create differing characteristics of the custom grouped arrangements, using the extrusion apparatus to create a singular encasement and to cure the singular encasement to a desired shape of the custom grouped arrangements and integrating one or more encased flexible junction box to the custom grouped arrangements, wherein the one or more flexible junction box contains at least one incoming and two outgoing conduit con

Abstract: A surgical navigation system for navigating a region of a patient includes a non-invasive dynamic reference frame and/or fiducial marker, sensor tipped instruments, and isolator circuits. The dynamic reference frame may be repeatably placed on the patient in a precise location for guiding the instruments. The instruments may be precisely guided by positioning sensors near moveable portions of the instruments. Electrical sources may be electrically isolated from the patient.

Abstract: A fabrication method of a semiconductor package structure includes: patterning a metal plate having first and second surfaces; forming a dielectric layer on the metal plate; forming a metal layer on the first surface and the dielectric layer; forming metal pads on the second surface, the metal layer having a die pad and traces each having a bond pad; mounting a semiconductor chip on the die pad, followed by connecting electrically the semiconductor chip to the bond pads through bonding wires; forming an encapsulant to cover the semiconductor chip and the metal layer; removing portions of the metal plate not covered by the metal pads so as to form metal pillars; and performing a singulation process. The fabrication method is characterized by disposing traces with bond pads close to the die pad to shorten the bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging.

Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.

Abstract: A method of manufacturing a module is provided that can alleviate a decrease in cutting yield. This method includes: a step of mounting, on a wiring board having a plurality of mounting regions enclosed by cutting lines on its upper surface, an electronic component in each of the mounting regions; a step of cutting the wiring board along the cutting lines; a step of forming a sealing resin layer so as to seal the electronic component to cover at least part of upper and side surfaces of the cut wiring board; and a step of cutting the sealing resin layer along cut portions (cutting lines) of the cut wiring board.

Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.

Abstract: An implantable medical electrical lead includes a plurality of conductors that extend continuously, without any intermediary junctions, between a plurality of electrodes and a corresponding plurality of contact members of an in-line connector terminal. A junction between each conductor and the corresponding contact member is preferably formed by first fitting a conductive sleeve, which is coupled to a proximal portion of the conductor, into an eyelet feature of the contact member, which is mounted on a strut member, and then welding the sleeve to the contact member at a pre-formed slot of the contact member, which extends along an external recessed surface thereof. The assembly of the connector terminal preferably completes the construction of the lead, wherein the proximal portion of each conductor is positioned in a helical path, which extends between an elongate body of the lead and the connector terminal, and along which a grip zone is formed.

Abstract: A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; spraying a conformal coating onto the lead; crimping the terminal onto the cable while the conformal coating is still wet to displace the conformal coating from between the lead and the abutting contact surfaces of the terminal and to cover and seal remaining portions of the lead not in direct contact with the terminal with the conformal coating and curing the conformal coating over the remaining portions of the lead.

Abstract: In one aspect, a method to repair a cable jacket includes disposing a shrink tube on a damaged area of a cable jacket of a cable. The shrink tube includes a first end portion and a second end portion. The method also includes heating the shrink tube to seal the damaged area and tapering the first end portion of the shrink tube by cutting the shrink tube. Another aspect includes a device to taper end portions of a cable jacket shrink tube repair. A further aspect includes a device to dispose a tube on a cable.

Abstract: A tubular elastomer actuator with a shape in a cross-sectional view which shape exposes at most one single axis of symmetry of a specific length, e.g., an oval shape. The actuator could be made from a sheet made from a plurality of plate shaped elements which are laminated together and rolled. Each plate shaped element may have a corrugation that gives the element an anisotropic structure, and contains an electrode on only one surface. The actuator displacement is the result of shrinkage displacement of the plate shaped elements upon the application of electrical field across their thickness.

Abstract: A deep brain stimulation lead includes a distal end portion having a length of greater than 5 millimeters and a largest outer diametric dimension of 1 millimeter or less. One or more electrodes are disposed at the distal end portion. The lead also includes a proximal end portion having one or more contacts electrically coupled to the one or more electrodes. The lead further includes a mid portion between the proximal end portion and the distal end portion. The mid portion has an outer diametric dimension of greater than 1 millimeter and is configured and positioned to be located in proximity to a burr hole of a skull of patient when the distal end portion is positioned in the brain of the patient at a location to deliver a signal to a target region.