Abstract: A semiconductor package and a manufacturing method are provided. The manufacturing method includes: forming a through via structure and a dipole structure over a carrier, wherein the through via structure and the dipole structure respectively include an insulating core and a conductive layer covering the insulating core; attaching a semiconductor die onto the carrier, wherein the through via structure and the dipole structure are located aside the semiconductor die; laterally encapsulating the though via structure, the dipole structure and the semiconductor die with an encapsulant; and removing the carrier.

Abstract: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

Abstract: A method of manufacturing a fan-out semiconductor package includes forming a frame having a through-hole and including one or more wiring layers; forming a semiconductor chip in the through-hole of the frame; forming an encapsulant covering an upper surface of each of the frame and the semiconductor chip, and filling a space between a wall surface of the through-hole of the frame and a side surface of the semiconductor chip; forming a connection structure below each of the frame and the semiconductor chip; forming a first metal pattern layer on an upper surface of the encapsulant; forming an insulating material on the upper surface of the encapsulant and covering the first metal pattern layer; and forming a second metal pattern layer on the insulating material, a first metal via passing through the insulating material, and a second metal via passing through the insulating material and the encapsulant.

Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.

Abstract: Provided are a light emitting diode, a display substrate and a transfer method. The transfer method includes: preparing a transfer substrate and the display substrate respectively, wherein the transfer substrate includes a plurality of light emitting diodes arranged in a matrix; aligning the transfer substrate with the display substrate, wherein first magnetic layers of the light emitting diodes on the transfer substrate correspond to second magnetic layers of the sub-pixels on the display substrate one by one; and driving the transfer substrate to approach the display substrate, so that the light emitting diodes on the transfer substrate are positioned to fall onto the sub-pixels of the display substrate by action of magnetic attraction forces generated by the first magnetic layers and the second magnetic layers.

Abstract: A connector including a plurality of electrically conducting contacts and fitted to another connector, the connector includes: a fixing insulator having a frame shape; a plurality of metal fittings that are disposed at both ends of the fixing insulator in a contact array direction in which the contacts are arrayed, and that are provided inside the fixing insulator; and a movable insulator that is disposed inside the fixing insulator, that is connected to the fixing insulator through elastic deformation portions of the contacts, and that is movable at least in a direction perpendicular to a fitting direction of the fitting with the other connector by elastic deformation of the elastic deformation portions, both ends of the movable insulator in the contact array direction facing the respective metal fittings.

Abstract: An electronic component device includes a first lead frame having a first connection terminal and an electronic component. The first connection terminal includes a first metal electrode, a first pad part formed on an upper surface of the first metal electrode and formed by a metal plated layer, and a first metal oxide layer formed on an upper surface of the first metal electrode in a surrounding region of the first pad part so as to surround an outer periphery of the first pad part. The electronic component has a first terminal part provided on its lower surface. The first terminal part of the electronic component is connected to the first pad part of the first connection terminal via a metal joining material.

Abstract: An interface, an electronic device and a test method, adapted to connect with at least two types of signal connectors to establish signal connection, the interface includes a connecting portion and a socket portion located at an end of the connecting portion; wherein the socket portion includes at least two types of portions of different identifiers respectively, and the identifiers respectively correspond to the signal connectors adapted to be plugged into the interface to establish signal connection.

Abstract: An electronic component unit of a wire harness includes a substrate on which an electronic component is mounted, a connector electrically connected to the substrate, and a connector fixing structure. The connector fixing structure includes a pair of notches that are provided facing each other on the substrate in a facing direction; a pair of press fitting plates that are provided on the connector and press-fitted into the respective notches; a positioning rib formed projecting from each of the press fitting plates toward the inside in the facing direction, having a width smaller than the width of the press fitting plates, and brought into contact with the substrate while the press fitting plates are press-fitted into the respective notches; and a deformation acceptable space provided adjacent to the outside of the press fitting plates that are press-fitted into the respective notches, in the facing direction.

Abstract: A wire harness includes a plurality of bendable electric wires, a first connection member that is electrically connected to the plurality of electric wires and is a connection target that is provided at a first end of the plurality of electric wires and is shared by the plurality of electric wires, and a second connection member that is electrically connected to the plurality of electric wires and is a connection target that is provided at a second end of the plurality of electric wires and is shared by the plurality of electric wires.

Abstract: An electrical connector includes a metallic frame, an insulative housing and two rows of contacts. The metallic frame made by metal injection molding and includes a main part and a first plat section. Two rows of contacts are respectively located by two sides of the first plate section in the vertical direction. The housing is secured to both the contacts and the frame and forms a mating tongue enclosing the first plate section. Thickened portions are formed on a front edge and two opposite side edges of the first plate section, and exposed upon a front edge and two opposite side edges of the mating tongue.

Abstract: A sensor having at least one sensor element (1), at least one signal processing element (2), and a housing (7) which has at least one fastening means. An electrical interface is provided for electrically connecting the sensor. The sensor has an electrically and mechanically connecting carrier means (4) on which the at least one sensor element (1) and the signal processing element (2) are arranged and are electrically connected to the carrier means. The carrier means (4) is also at least electrically connected to the electrical interface.

Abstract: The present invention provides an implantable medical device having at least two electrodes coupled to the device housing. The electrodes may be configured for sensing physiological signals such as cardiac signals and alternatively for providing an electrical stimulation therapy such as a pacing or defibrillation therapy. In accordance with aspects of the disclosure, the device housing provides a hermetic enclosure that includes a battery case hermetically coupled to a circuit assembly case. At least one of the at least two electrodes is coupled to an exterior surface of the battery case. The battery case is electrically insulated from the cathode and anode of the battery.

Abstract: A method, and apparatus resulting from the method, for fabricating a circuit board suitable for mounting electronic components. The method includes drilling a plurality of through-holes in a plurality of dielectric sheets, forming a conductive film on at least one side of each of the plurality of dielectric sheets, and substantially filling each of the plurality of through holes with a conductive material. The conductive material is both electrically and thermally uninterrupted from a first face to a second face of each of the plurality of dielectric sheets. The plurality of dielectric sheets are then sequentially mounted, one atop another, to form the circuit board. The sequential mounting step is performed after the steps of drilling the plurality of through-holes, forming the conductive layer, and substantially filling the plurality of through-holes.

Abstract: A wire harness is manufactured by: forming a standard harness by integrally forming exterior components with a standard electric wire at predetermined positions by a forming machine provided on upstream in a conveying direction of a conveying device for conveying a plurality of wiring boards in the conveying direction; wiring the standard harness on the wiring boards, and wiring a plurality of electric wires along the standard harness; and then bundling the standard harness and the plurality of electric wires.

Abstract: A method for environmentally protecting a terminal block includes providing a sealing device including: a base substrate having an anchoring surface; and a gel sealant body having an engagement surface. The gel sealant body is secured to the anchoring surface and extends forwardly from the anchoring surface to the engagement surface. The method further includes: applying the sealing device to the terminal block such that the gel sealant body is interposed between the terminal block and the base substrate and the engagement surface engages the terminal block; and wrapping a retainer member around the terminal block and securing the sealing device to the terminal block using the retainer member.

Abstract: A lead assembly includes a ring component having mechanical coupling features, and at least one polymer component mechanically coupled with the mechanical coupling features of the ring component. Elongate tubing is disposed over the polymer component and is secured with the polymer component.

Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

Abstract: A semiconductor device comprises an aluminum alloy lead-frame with a passivation layer covering an exposed portion of the aluminum alloy lead-frame. Since aluminum alloy is a low-cost material, and its hardness and flexibility are suitable for deformation process, such as punching, bending, molding and the like, aluminum alloy lead frame is suitable for mass production; furthermore, since its weight is much lower than copper or iron-nickel material, aluminum alloy lead frame is very convenient for the production of semiconductor devices.

Abstract: A seal includes a housing with an exterior surface. The housing forms a cavity extending from the exterior surface into the housing and defines at least one slanted interior surface. The at least one slanted interior surface extends from the exterior surface of the housing and is in a substantially non-perpendicular and angled relation to the exterior surface of the housing. The seal also includes at least one electrical lead that extends through the housing and has a portion exposed across the cavity therein. The at least one electrical lead extends from the housing and is configured to be in electrical contact with at least one electrical component encased within the electronic control housing. The seal also includes an adhesive material that substantially fills the cavity and surrounds the exposed portion of the at least one electrical lead exposed across the cavity.

Abstract: A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.

Abstract: A method for fabricating a laminated structure includes (i) preparing a first substrate having electroconductivity, (ii) forming a first electroconductive film having a prescribed hardness on the first substrate by an electroforming, (iii) forming a second electroconductive film having a hardness that is lower than the prescribed hardness on the first electroconductive film by an electroforming, (iv) patterning the first electroconductive film and the second electroconductive film to a prescribed pattern to form a plurality of electroconductive film patterns, and (v) subjecting the first substrate and a second substrate repeatedly to pressure contact and release to transfer sequentially the plurality of electroconductive film patterns on the first substrate onto the second substrate.

Abstract: A method for manufacturing a distal portion of a mapping and/or ablation device with fewer components and manufacturing steps than are required for presently known devices. The method generally includes aligning one or more electrodes and electrode wires within a housing mold, overmolding a biocompatible material over the one or more wires and a portion of each of the one or more electrodes, creating a housing component that integrates a dome component and an insulation component. Alternatively, the method generally includes aligning one or more wires within a housing mold so that at least a portion of each wire protrudes from the mold, overmolding a biocompatible material over the one or more wires, thus creating a housing component that integrates a dome component and insulation component. The protruding wire portions are cleaved off and at least a portion of the housing component is coated with a layer of conductive material.

Abstract: The application relates to a process for preparing a crosslinked cable, including: —applying one or more layers including a polymer composition on a conductor, wherein at least one layer includes one or more free radical generating agents, —crosslinking by radical reaction said at least one layer including said free radical generating agent(s), —cooling the obtained crosslinked cable in pressurized conditions, and —reducing or removing the content of volatile decomposition products(s), which are originating from optionally in elevated temperature, from the crosslinked cable obtained from cooling and recovery step.

Abstract: A fitting for coupling ends of cores of three insulated conductors includes an end termination placed over end portions of the three insulated conductors. The end termination includes three separate openings that pass through the end termination longitudinally. Each of the insulated conductors passes through one of the openings with end portions of the insulated conductors protruding from one side of the end termination. Exposed cores of the end portions of the insulated conductors protrude from the end termination. A cylinder is coupled to the side of the end termination from which the end portions of the insulated conductors protrude. An electrical bus is coupled to the exposed portion of the cores. Electrically insulating material fills the cylinder such that the cores are substantially enclosed in the electrically insulating material. An end cap is coupled to the cylinder to seal off the interior of the cylinder.

Abstract: A method of making an electronic ceramic component. The method includes steps of terminating a ceramic body with a metalized terminal and encompassing a portion of the ceramic body by an insulating resin. The step of encompassing further comprises steps of preparing a liquid resin precursor, applying the liquid resin precursor to a surface of the ceramic body, thereby wetting the surface of the ceramic body while not wetting the metalized terminal, and curing the liquid resin precursor applied to the wetted surface of the ceramic body to form a resin coating covering the surface of the ceramic body after removing extra quantity of the liquid resin precursor from the not wetted metalized terminal. The liquid resin precursor comprises an element selected from a group consisting of resin solution or resin emulsion that has a surface tension adjusted by changing a resin precursor concentration.

Abstract: A method of manufacturing a through electrode-attached glass substrate includes: forming an effective unit cell by drilling a plurality of through holes in a unit cell with a minimum area acquired by cutting out and dividing plate-shaped glass being configured as the unit cell and distributing dummy unit cells in which the through hole is not formed in an area in which the effective unit cell is formed; inserting electrode members into the through holes; welding the plate-shaped glass and the electrode members by heating the plate-shaped glass at a temperature that is higher than a softening point thereof; and grinding both sides of the plate-shaped glass together with the electrode members so as to expose a plurality of the electrode members to both sides of the plate-shaped glass and configure the plurality of the electrode members as a plurality of through electrodes that are electrically separated from each other.

Abstract: A method for producing a number of chip cards includes a step for preparing a supporting film comprising a number of locations each of which constituting a card support and being provided with a cavity capable of receiving an integrated circuit, a step for processing this supporting film carried out, in part, by a multi-head tool, one of the heads of this tool being provided for carrying out an operation on a location of the film essentially at the same time as another head of this tool carries out the same operation on another location of this film, and a step for separating the locations after the processing step.

Abstract: A method of repairing a used electrode device is disclosed wherein a used electrode assembly has an inner conductor with an integral electrode tip; the inner conductor is encapsulated in an insulator body having an outer conductor and an outer electrode tip; and an outer sleeve is attached to the insulator body, the sleeve being filled with a particle suspended fluid and the sleeve being retained by a metal ring at the location of attachment to the insulator body prior to removing the inner conductor from the insulator body; the electrode assembly is placed in a fixture with a collet holding the metal ring in place; the sleeve is pushed upon to release the ring; and the inner conductor is pressed with the integral electrode tip while holding or restraining the insulator body to apply a force sufficient to disengage the inner conductor from the insulator body.

Abstract: Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.

Abstract: A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced.

Abstract: An IS-4 terminal connector assembly includes three terminal electrodes positioned over an inner tubular member such that they are radially offset from one another. Each of the terminal ring electrodes are configured such that they can withstand both tensile and cyclical bending loads with minimal compromise in their outer geometry. Additionally, each of the terminal electrodes is configured such that they have both an inner and outer geometry that facilitates adequate insulation between a select terminal electrode and an adjacent conductor. Additionally, each of the terminal ring electrodes is configured such that they facilitate an external approach to staking a cable conductor.

Abstract: The invention relates to a wind turbine rotor blade having a blade root, a blade tip, two interconnected rotor blade half shells, which include a fiber-reinforced plastics material, and an electrical heating element, which is arranged on an outer side of the rotor blade and has a blade root end and a blade tip end, wherein the blade tip end is connected via an electrical line leading to the blade root and at least a first segment of the electrical line, which is arranged on an inner side of one of the rotor blade half shells, is made of a carbon fiber material. Further, the present invention relates to a method for making a wind turbine rotor blade having an electrical heating element.

Abstract: A lead assembly includes a lead with a distal end and a proximal end. The lead includes a plurality of electrodes disposed at the distal end and a plurality of terminals disposed at the proximal end. The lead also defines at least one central lumen and a plurality of outer lumens. The central and outer lumens extend from the proximal end to the distal end such that the plurality of outer lumens extend laterally from the at least one central lumen. The lead further includes a plurality of conductive wires. Each conductive wire couples at least one of the plurality of electrodes electrically to at least one of the plurality of terminals. At least two conductive wires are disposed in each of the plurality of outer lumens.

Abstract: A rotation detecting unit is adapted for a rotatable body. The rotation detecting unit includes a rotation detecting part, a signal transmission member, and a main body part. The rotation detecting part detects a rotational state of the rotatable body and outputs a rotation detection signal. The signal transmission member is electrically connected to the rotation detecting part to transmit the rotation detection signal to an external device. The main body part holds at least a part of the signal transmission member and the rotation detecting part. The main body part is integrally molded from thermosetting resin including a joined part obtained as a result of joining together a terminal of the rotation detecting part and the signal transmission member, the part of the signal transmission member, and the rotation detecting part. The main body part includes a recess at a region corresponding to the rotation detecting part.

Abstract: A heat sink installing device includes a base, a pair of guiding poles, a slidable cover, a pair of latches and a number of auxiliary wings. The pair of guiding poles is perpendicularly mounted on the base and separated from each other. The slidable cover is slidably fitted on the pair of guiding poles and defines a pair of through holes running through two opposite side surfaces of the slidable cover. Each of the latches is mounted on the slidable cover and latched on one of the guiding poles correspondingly. The plurality of auxiliary wings are correspondingly attached on a side surface of the slidable cover around the through hole and inclined towards the center of the through hole by a distal end thereof away from the slidable cover.

Abstract: The embodiments disclose a method for creating a silicone encased flexible cable using manufacturing machinery including automatically arranging plural individual conduits, into custom grouped arrangements including electrical wiring, pneumatic tubing and fluid tubing, inserting the custom grouped arrangements including connectors and flexible silicone junction devices into a shaped silicone encasement extrusion apparatus, depositing a mixture of silicone and additives to the custom grouped arrangements encasement using the extrusion apparatus, customizing the mixture of silicone and additives to create differing characteristics of the custom grouped arrangements, using the extrusion apparatus to create a singular encasement and to cure the singular encasement to a desired shape of the custom grouped arrangements and integrating one or more encased flexible junction box to the custom grouped arrangements, wherein the one or more flexible junction box contains at least one incoming and two outgoing conduit con

Abstract: An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.

Abstract: A fabrication method of a semiconductor package structure includes: patterning a metal plate having first and second surfaces; forming a dielectric layer on the metal plate; forming a metal layer on the first surface and the dielectric layer; forming metal pads on the second surface, the metal layer having a die pad and traces each having a bond pad; mounting a semiconductor chip on the die pad, followed by connecting electrically the semiconductor chip to the bond pads through bonding wires; forming an encapsulant to cover the semiconductor chip and the metal layer; removing portions of the metal plate not covered by the metal pads so as to form metal pillars; and performing a singulation process. The fabrication method is characterized by disposing traces with bond pads close to the die pad to shorten the bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging.

Abstract: A packaging method for assembling a captive screw to a printed circuit board (PCB) includes the steps of providing a captive screw having a screw head, a threaded shank and a sleeve; pressing a fixture toward the screw head for a part of the threaded shank to exposed from a distal end of the sleeve, and then clamping the fixture on the sleeve; providing a PCB having through holes and a layer of solder provided thereon; using a tool to pick up the fixture and the captive screw and align the threaded shank with one through hole on the PCB; releasing the fixture and the captive screw from the tool for a flange at the distal end of the sleeve to extend into the through hole; heating, melting and then cooling to harden the solder layer, so that the sleeve is fixedly held to the PCB; and removing the fixture.

Abstract: An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.

Abstract: In one embodiment, a process, for fabricating a medical lead for stimulation of tissue of a patient, comprises: providing a plurality of wires; increasing an exterior surface area of each wire of the plurality of wires; arranging the plurality of wires angularly around a longitudinal axis; extruding polymer material of the plurality of wires; forming a lead body with a proximal end and a distal end after performing the extruding; and forming a plurality of terminals at a proximal end of the lead body; forming a plurality of segmented electrodes at a distal end of the lead body.

Abstract: A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

Abstract: The torque sensor includes a plurality of coil units having a substantially cylindrical shape, the coil units including a plurality of detection coils arranged to face a magnetic characteristic change portion formed on a rotary shaft. The coil units include a first coil unit and a second coil unit, and the first coil unit and the second coil unit are disposed in the axial direction of the shaft. The first coil unit and the second coil unit are fixed in an integrally molded resin. Thereby, there is provided a torque sensor having a high productivity and an easy configuration and a method of manufacturing the torque sensor.

Abstract: A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.

Abstract: In a method of producing a honeycomb structure molding die composed of feed holes through which molding material is fed and slit grooves communicated with the feed holes for the use of molding a honeycomb structure body, the slit grooves are formed on one surface of a metal material in a lattice arrangement by repeatedly moving a thin circular grindstone blade which is rotating in a straight-line direction or a line direction approximating a straight line in order to cut the surface of the metal material. In particular, the method removes fine metal powder, generated by cutting the surface of the metal material, using polishing grooves formed in a dressing grindstone disposed in front of the metal material every cutting of the metal material during the slit groove formation.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: The present invention is a method for manufacturing an electrical connector comprising an insulative housing with a base side and an opposed side and lateral sides interposed between said base side and said opposed side and at least one conductive contact including a first leg that extends from the base side of the insulative housing, the at least one conductive contact further including a second leg extending laterally adjacent the top side of the housing. In this method there is provided a mold comprising a first die and an opposed second die all defining an interior cavity and an exterior area. A molding compound input port extends between the exterior area and the interior cavity. The conductive contact is then positioned in the interior cavity such that the second leg extends adjacent the second die along an entirety of a length of the second die between first and second bent ends.

Abstract: Leads having directional electrodes thereon. Also provided are leads having directional electrodes as well as retention ledges to secure the electrodes to the leads. Also provided are leads with directional electrodes where all the electrodes have the same surface area. Methods of manufacturing leads and methods of treating conditions and selectively stimulating regions of the nervous system are also provided.

Abstract: A control device has a base plate, a cover plate coupled to the base plate, a cavity formed between the base plate and the cover plate, a circuit carrier disposed in the cavity, and a conducting track carrier electrically coupled to the circuit carrier. The base plate has a continuous recess that is configured and arranged for feeding a casting compound into the cavity between the base plate and the cover plate. The casting compound is embodied to at least partly enclose the circuit carrier and/or the conducting track carrier in a vibration-damping manner.