With Molding Of Electrically Insulating Material Patents (Class 29/858)
  • Patent number: 8615873
    Abstract: A method of manufacturing a terminal block for a telecommunication cable comprising the steps of providing a preformed substrate member comprising a podium member, at least one electrical connector and at least one insulated electrical wire attached to an electrical contact positioned within the at least one electrical connector; placing the preformed substrate member in a mold; and injecting a dielectric material into the mold containing the podium member to form an overmolded terminal block, wherein the dielectric material covers the at least one insulated electrical wire and a portion of the electrical contact positioned within the at least one electrical connector.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: December 31, 2013
    Assignee: Channell Commercial Corporation
    Inventor: Gerald L. Shimirak
  • Patent number: 8607449
    Abstract: A method of waterproofing a crimping part of a crimp terminal where a wire is crimped includes a step of forming a waterproof structure. The waterproofing structure seals a crimping region containing the crimping part with an adhesive tape. The adhesive tape has waterproofing performance and has a thickness no more than a predetermined value.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: December 17, 2013
    Assignee: Yazaki Corporation
    Inventors: Hironori Kitagawa, Yuichi Ito, Naoki Ito
  • Patent number: 8590148
    Abstract: A method of assembling a conduit assembly that includes seating a ferrule on a distal end portion of an elongate conduit body; mounting the end portion of the conduit body on a small diameter section of a tubular body insert, the body insert has a hollow body defining a passage through the insert along a symmetrical axis and a large diameter section attached to the small diameter section via a shoulder, such that the shoulder contacts a distal end portion of the ferrule interposed axially between the large diameter section of the body insert and the distal end of the conduit body to inhibit axial contact between the distal end portion of the conduit body and the large diameter section of the body insert; radially compressing a portion of the conduit body between the body insert and the ferrule; and deploying one or more transmission lines into the conduit body.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: November 26, 2013
    Assignee: Amphenol Nelson-Dunn Technologies
    Inventors: David Dodwell, Kevin B. Dunn, Eva Yard
  • Patent number: 8586867
    Abstract: A fitting for coupling ends of cores of three insulated conductors includes an end termination placed over end portions of the three insulated conductors. The end termination includes three separate openings that pass through the end termination longitudinally. Each of the insulated conductors passes through one of the openings with end portions of the insulated conductors protruding from one side of the end termination. Exposed cores of the end portions of the insulated conductors protrude from the end termination. A cylinder is coupled to the side of the end termination from which the end portions of the insulated conductors protrude. An electrical bus is coupled to the exposed portion of the cores. Electrically insulating material fills the cylinder such that the cores are substantially enclosed in the electrically insulating material. An end cap is coupled to the cylinder to seal off the interior of the cylinder.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: November 19, 2013
    Assignee: Shell Oil Company
    Inventors: John Matthew Coles, III, Francis Marion Stone, Jr., Patrick Silas Harmason, Charles D'Angelo, III, David Booth Burns
  • Patent number: 8578602
    Abstract: A method of connecting two high voltage DC cables in a flexible cable joint. Each high voltage DC cable can include, from the inside to the outside, a central conductor, an adjacent circumferential cable inner semicon layer, an adjacent circumferential cable insulation layer, and an adjacent circumferential cable outer semicon layer.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: November 12, 2013
    Assignee: ABB Research Ltd
    Inventor: Thomas Christen
  • Patent number: 8572842
    Abstract: A method for enhancing the dielectric properties of at least one in-service electrical cable section having a central stranded conductor encased in a polymeric insulation jacket and having an interstitial void volume in the region of the conductor. The method includes filling the interstitial void volume with at least one dielectric property-enhancing fluid and then confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the cable section and being below the elastic limit of the insulation jacket. The cable section is heated by imposing a potential of no more than about 500 volts across the conductor during at least a portion of the time required to complete the other described steps.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: November 5, 2013
    Assignee: Novinium, Inc.
    Inventors: Glen J. Bertini, Norman E. Keitges
  • Patent number: 8555498
    Abstract: A method for hermetically sealing electronic circuitry within a housing of an implantable medical device is provided. The method comprises assembling the housing having an interior cavity, joining a feed-through assembly to the housing, and joining a back-fill member to the feed-through housing. The back fill member has an opening there through communicating with the interior cavity of the housing. The housing is back-filled with an inert gas through the opening in the back-fill member, and the interior cavity is hermetically sealed by closing the opening through the back-fill member with a sealing element. The sealing element and back-fill member are formed of different first and second materials, respectively.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: October 15, 2013
    Assignee: Pacesetter, Inc.
    Inventors: Jian Xie, Kavous Sahabi
  • Patent number: 8549737
    Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: October 8, 2013
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventor: Deepak K. Pai
  • Patent number: 8544171
    Abstract: A method for terminating a fiber optic cable includes removing an end portion of an outer jacket of a fiber optic cable to expose a strength member and at least one optical fiber. A binder material of the strength member of the fiber optic cable is heated using a heat source to expose strength elements of the strength member. The strength elements are secured to a fiber optic connector assembly using an adhesive.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: October 1, 2013
    Assignee: ADC Telecommunications, Inc.
    Inventors: Yu Lu, Thomas Marcouiller, Nicholas Torman, Scott Carlson, Paul Suek
  • Patent number: 8539671
    Abstract: A method of repairing a used electrode device is disclosed wherein a used electrode assembly has an inner conductor with an integral electrode tip; the inner conductor is encapsulated in an insulator body having an outer conductor and an outer electrode tip; and an outer sleeve is attached to the insulator body, the sleeve being filled with a particle suspended fluid and the sleeve being retained by a metal ring at the location of attachment to the insulator body prior to removing the inner conductor from the insulator body; the electrode assembly is placed in a fixture with a collet holding the metal ring in place; the sleeve is pushed upon to release the ring; and the inner conductor is pressed with the integral electrode tip while holding or restraining the insulator body to apply a force sufficient to disengage the inner conductor from the insulator body.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: September 24, 2013
    Assignee: HealthTronics, Inc.
    Inventor: Earnest Pringle
  • Patent number: 8528202
    Abstract: A molding pin for a metal die is prevented from breaking, solder is surely deposited, and thus, a circuit pitch can be reduced to the limit. On the front plane of a circuit board, prescribed circuit patterns made of a conductive material are formed, and on the rear plane, prescribed circuit patterns are also formed. On the circuit board, a through hole is formed to carry electricity between the circuit patterns on both planes. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns and wide in a circuit extending direction.
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: September 10, 2013
    Assignee: Sankyo Kasei Co., Ltd.
    Inventor: Tetsuo Yumoto
  • Publication number: 20130227839
    Abstract: An electrical power connector preparation method for making electrical power connectors by: employing a cold drawing technique with a series of dies to repeatedly draw a metal round rod into a thin thickness conducting contact bar, processing one end of the thin thickness conducting contact bar into a mating contact portion, stamping a part of the thin thickness conducting contact to form a mounting portion, repeating the aforesaid steps to obtain a large amount of metal contacts, using one or multiple contact material strips to hold multiple metal contacts in multiple sets, electroplating the metal contacts, using an insert molding technique to mold an electrically insulative terminal block on each set of metal contacts, and then assembling each set of metal contacts and the associating electrically insulative terminal block with one respective electrically insulative housing so that multiple electrical power connectors are obtained after removal of the contact material strips.
    Type: Application
    Filed: February 25, 2013
    Publication date: September 5, 2013
    Applicant: RIIDEA INTERNATIONAL CORP.
    Inventor: Lung-Hsi LEE
  • Patent number: 8510936
    Abstract: A manufacturing method of package carrier is provided. A first copper foil layer, a second copper foil layer on the first foil layer, a third copper foil layer and a fourth foil layer on the third foil layer are provided. The second copper foil layer is partially bonded the fourth copper foil layer by an adhesive gel so as to form a substrate of which the peripheral region is glued and the effective region is not glued. Therefore, the thinner substrate can be used in the following steps, such as patterning process or plating process. In addition, the substrate can be extended be the package carrier structure with odd-numbered layer or even-numbered layer.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: August 20, 2013
    Assignee: Subtron Technology Co., Ltd.
    Inventors: Chih-Hong Chuang, Tzu-Wei Huang
  • Publication number: 20130210286
    Abstract: The present invention relates generally to connectors such as audio connectors and in particular to flexible audio connectors that can be used in place of standard audio connectors currently used. A portion or all of the plug connector may comprise a flexible material that allows the connector to bend with respect to an insertion axis and prevent the connector from breaking when inserted or extracted improperly. A method of assembly is provided and may be used for assembling embodiments of the plug connector. The connector is configured to mate with a corresponding receptacle connector along an insertion axis.
    Type: Application
    Filed: June 9, 2011
    Publication date: August 15, 2013
    Inventor: Albert J. Golko
  • Publication number: 20130199036
    Abstract: An electrical power connector fabrication method includes employing a cold drawing technique by using a series of dies to repeatedly draw a metal round rod into a thin thickness conducting contact bar, processing one end of the thin thickness conducting contact bar into a mating contact portion, stamping a part of the thin thickness conducting contact to form a mounting portion, cutting off the thin thickness conducting contact bar to obtain a finished metal contact formed of the mounting portion and the mating contact portion, repeating the aforesaid steps to obtain a large amount of metal contacts, attaching individual metal contacts to respective locating notches of a contact material strip, using an injection molding technique to mold electrically insulative housings on the metal contacts to form a number of electrical power connectors at a time, and then removing the contact material strip from the metal contacts.
    Type: Application
    Filed: December 19, 2012
    Publication date: August 8, 2013
    Applicant: RIIDEA INTERNATIONAL CORP.
    Inventor: RIIDEA International Corp.
  • Publication number: 20130197616
    Abstract: An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 1, 2013
    Applicant: MEDTRONIC, INC.
    Inventor: MEDTRONIC, INC.
  • Publication number: 20130174418
    Abstract: An object of the present invention is to provide a cable assembly manufacturing method of manufacturing a cable assembly which has the water cutoff property and of which insertion holes can be attached to small housings. A method of manufacturing a cable assembly includes: a bundling process of bundling a plurality of cables; a molding step of providing a pair of seal caps on outer peripheral surfaces of the plurality of bundled cables by way of insertion molding; an inserting step of inserting a portion of the plurality of cables between the seal caps in a water-proof tube having a stretching property; a covering step of covering the seal caps by the both ends of the water-proof tube water-tight; and a connecting step of connecting connectors to the both ends of the plurality of cables.
    Type: Application
    Filed: March 1, 2013
    Publication date: July 11, 2013
    Applicant: FUJIKURA LTD.
    Inventor: FUJIKURA LTD.
  • Publication number: 20130167372
    Abstract: An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead as well as a method of manufacturing the same. At least the stimulation/sensing portion is unitized through partially surrounding and supporting insulation and conductive element(s) of the stimulation/sensing portion with a fused matrix of material having mechanical properties consistent with a body of the lead.
    Type: Application
    Filed: September 14, 2012
    Publication date: July 4, 2013
    Inventors: Damon Ray Black, Terry Daglow, John Erickson, Robert Earl Jones, B. Reno Lauro
  • Patent number: 8468689
    Abstract: A plurality of individual elements are imparted with reverse axial twist and collectively twisted into a multi-element assembly. Each individual element has an axial twist direction in an opposite direction from the axial twist direction of the collective multi-element assembly. The reverse axial torsion in the assembly tightly binds the plurality elements in the assembly to resist separation.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: June 25, 2013
    Assignee: Southwire Company
    Inventors: Stephen L. Spruell, Wilber F. Powers, Scott Robertson
  • Patent number: 8458889
    Abstract: An actuator manufacturing method includes alternately stacking a plurality of dielectric elastomer layers and a plurality of conductive rubber layers along the direction of thickness to form a sheet, and wrapping the sheet formed about a core to form a rolled sheet. When the sheet formed in the step of alternately stacking is wrapped about the core, the sheet is formed by the dielectric elastomer layers and the conductive rubber layers. Therefore, even if the dielectric elastomer layers in the sheet are made to be thin, the thickness of the entire sheet is prevented from being excessively thin.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: June 11, 2013
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Yutaka Tsuchikawa, Takashi Maeno, Naoto Kuriyama, Takanori Nakai, Hiromitsu Takeuchi, Yoji Kimura
  • Publication number: 20130124093
    Abstract: A wellbore measurement instrument includes a housing configured to move along an interior of a wellbore. At least one sensor is configured to measure a wellbore parameter. A controller is disposed in the housing. The controller includes at least one of a data storage device and a device to control operation of the at least one sensor. A communications port is disposed in an aperture in the housing. The port includes an industry standard connector matable with an industry standard terminated cable for connection to a surface device when the instrument is at the Earth's surface.
    Type: Application
    Filed: June 3, 2010
    Publication date: May 16, 2013
    Applicant: Schlumberger Technology Corporation
    Inventors: Jonathan Yeboah, Sebastine Ujereh, JR., Laurent Villegas, Christopher S. (Chris) Del Campo
  • Patent number: 8438718
    Abstract: A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: May 14, 2013
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takanori Aono, Kengo Suzuki, Akira Koide, Masahide Hayashi
  • Patent number: 8424187
    Abstract: Provided is system and method for terminating stator windings to provide a fast, reliable, and convenient connection system. A U-shaped intermediary connection piece comprising individual pieces with cable exits is provided. Stator windings are attached to the individual pieces and the stator and connection piece are encapsulated with resin. The individual pieces are eliminated, thereby electrically isolating the cable exits.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: April 23, 2013
    Assignee: Infranor Holding SA
    Inventors: Ramon Bote Salla, Giampiero Tassinario
  • Publication number: 20130065438
    Abstract: An electrical connector having a generally tubular housing connects the conductors of an electrically-shielded cable with an electrical component, including a injection-molded electrically-conductive synthetic plastic bridge arrangement connecting the cable shield layer at a stripped end of the cable with a connector shield member arranged on the connector housing into one end of which the conductors are introduced. An injection-molded annular carrier layer of insulating synthetic plastic material is molded concentrically about the conductor ends, one end of the carrier layer extending within the conductive bridging layer, and the other end extending within the bore of the connector housing into which the conductor ends extend. Consequently, the connector is structurally reinforced to resist the forces and stresses of vibration and shock.
    Type: Application
    Filed: June 1, 2011
    Publication date: March 14, 2013
    Applicant: WEIDMUELLER INTERFACE GMBH & CO. KG
    Inventor: Marcell Nickol
  • Publication number: 20130050972
    Abstract: An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.
    Type: Application
    Filed: August 23, 2011
    Publication date: February 28, 2013
    Applicant: TESSERA, INC.
    Inventors: Ilyas Mohammed, Belgacem Haba
  • Publication number: 20130031976
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cable harness assembly for connection with a sensor assembly may include a cable cover having a first end and a second end, a cable extending through an opening in the first end of the of the cable cover, and a crimp ring configured to engage the cable at a position within the cable cover, such that the attached crimp ring may not fit through the opening. The second end of the cable cover may be configured to connect to a housing of an electrical connector. Further, the cable may have wires that may be configured to electrically connect to electrical terminals of the electrical connector. In some instances, the electrical connector may be electrically connected to a sensor.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Todd Eckhardt, Pavan R. Kashyap, Jim Machir, Palani Thanigachalam
  • Patent number: 8316537
    Abstract: An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead as well as a method of manufacturing the same. At least the stimulation/sensing portion is unitized through partially surrounding and supporting insulation and conductive element(s) of the stimulation/sensing portion with a fused matrix of material having mechanical properties consistent with a body of the lead.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: November 27, 2012
    Assignee: Advanced Neuromodulation Systems, Inc.
    Inventors: Damon Ray Black, Terry Daglow, John Erickson, Robert Earl Jones, B. Reno Lauro
  • Patent number: 8302285
    Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: November 6, 2012
    Assignees: Headway Technologies, Inc., SAE Magnetics (H.K.) Ltd.
    Inventors: Yoshitaka Sasaki, Tatsushi Shimizu, Takehiro Horinaka, Kazuo Ishizaki, Shigeki Tanemura
  • Publication number: 20120237074
    Abstract: Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.
    Type: Application
    Filed: September 30, 2011
    Publication date: September 20, 2012
    Applicant: APPLE INC.
    Inventor: Jonathan Aase
  • Patent number: 8266798
    Abstract: A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; spraying a conformal coating onto the lead; crimping the terminal onto the cable while the conformal coating is still wet to displace the conformal coating from between the lead and the abutting contact surfaces of the terminal and to cover and seal remaining portions of the lead not in direct contact with the terminal with the conformal coating and curing the conformal coating over the remaining portions of the lead.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: September 18, 2012
    Assignee: Delphi Technologies, Inc.
    Inventor: Francis D. Martauz
  • Patent number: 8250732
    Abstract: A tubular elastomer actuator with a shape in a cross-sectional view which shape exposes at most one single axis of symmetry of a specific length, e.g., an oval shape. The actuator could be made from a sheet made from a plurality of plate shaped elements which are laminated together and rolled. Each plate shaped element may have a corrugation that gives the element an anisotropic structure, and contains an electrode on only one surface. The actuator displacement is the result of shrinkage displacement of the plate shaped elements upon the application of electrical field across their thickness.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: August 28, 2012
    Assignee: Danfoss A/S
    Inventors: Mohamed Yahia Benslimane, Peter Gravesen
  • Patent number: 8230577
    Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: July 31, 2012
    Assignees: Headway Technologies, Inc., SAE Magnetics (H.K.) Ltd.
    Inventors: Yoshitaka Sasaki, Tatsushi Shimizu, Takehiro Horinaka, Kazuo Ishizaki, Shigeki Tanemura
  • Patent number: 8225483
    Abstract: The torque sensor includes a plurality of coil units having a substantially cylindrical shape, the coil units including a plurality of detection coils arranged to face a magnetic characteristic change portion formed on a rotary shaft. The coil units include a first coil unit and a second coil unit, and the first coil unit and the second coil unit are disposed in the axial direction of the shaft. The first coil unit and the second coil unit are fixed in an integrally molded resin. Thereby, there is provided a torque sensor having a high productivity and an easy configuration and a method of manufacturing the torque sensor.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: July 24, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Katsuji Watanabe, Yasuo Shimizu, Atsuhiko Yoneda, Tsunehiko Fukatsu
  • Publication number: 20120171887
    Abstract: In an electrical connector for an electric vehicle, the spring latch is not sealed; instead, the connector body has holes allowing water entering the spring latch mechanism to drain harmlessly out of the connector. A forward-facing LED or other light source acts as a flashlight. Once the connector is connected, the forward-facing LED is switched off, and a rear-facing LED or other light source is switched on to confirm that the connector is connected and capable of charging the vehicle. The connector is produced by overmolding in a three-layer configuration, where each layer is formed of a material having advantageous materials for that layer's position in the connector.
    Type: Application
    Filed: August 17, 2011
    Publication date: July 5, 2012
    Applicant: General Cable Technologies Corporation
    Inventors: Damien T. SEBALD, Brian D. Smith
  • Patent number: 8202130
    Abstract: A data cable including an electrical line with a plurality of line leads, an electrical shield, a molded piece including first counterpart form-locking elements and a housing enclosing the molded piece, wherein the housing has a central opening. The data cable further including a plug connector disposed on an end of the data cable, wherein the plug connector is electrically connected to the shield, wherein the plug connector includes a bush that is enclosed by the molded piece. The bush includes a deep-drawn tube and a bead with second form-locking elements which with the counterpart form-locking elements form a first form-locking connection, wherein an outer contour of the molded piece and an inner contour of the central opening of the housing form a second form-locking connection.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: June 19, 2012
    Assignee: MD Electronik GmbH
    Inventors: Norbert Friese, Martin Huber
  • Patent number: 8181343
    Abstract: Methods of making a sealed crimp connection attaching a terminal to a wire conductor are provided. A layer of fluid conformal coating is applied to overlie a terminal and underlie at least a lead of the wire conductor upon at least the lead being received into the terminal. The terminal, the fluid layer, and at least the lead of the wire conductor are crimped to form the crimp connection. Fluid conformal coating is displaced where an abutting surface of the terminal makes contact with at least the lead of the wire conductor. The fluid conformal coating is cured to a non-fluid state. The fluid conformal coating may be formed of an acrylated urethane material that may provide an increased pull force and a low crimp resistance in the crimp connection. The crimp connection may be constructed using a manufacturing process on an automated assembly line.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: May 22, 2012
    Assignee: Delphi Technologies, Inc.
    Inventors: Francis D. Martauz, Kurt P. Seifert
  • Publication number: 20120097445
    Abstract: An electrical connection device is described comprising: a cable gland body defining an inner housing and at least an electric cable arranged in said housing and comprising an electrical wire and a coating insulating sheath. The electric cable has an exposed length of the electric wire without said sheath and internally arranged in the housing. Furthermore, the connection device comprises an impervious-type and electrically insulating filling material of the housing, which encloses said at least one electric cable and the exposed length by interposing itself between the electric wire and an inner face of the cable gland.
    Type: Application
    Filed: October 24, 2011
    Publication date: April 26, 2012
    Applicant: ALDABRA S.R.L.
    Inventor: Walter Gadda
  • Patent number: 8161640
    Abstract: A method for forming a protective jacket over a connection region includes connecting the leads of an electronic device to conductors such that the connections are in a connection region, placing the connection region in a mold, injecting molten protective material into the mold to cover the connection region, allowing the molten material to cool and harden and removing the connection area from the mold.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: April 24, 2012
    Assignee: The Sloan Company, Inc.
    Inventor: Thomas C. Sloan
  • Patent number: 8156634
    Abstract: A method of assembling an electronic component in accordance with the invention comprises providing an electronic component having a body and a core and applying a film over at least a portion of the body and core so that the film secures the body and core to one another.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: April 17, 2012
    Assignee: Coilcraft, Incorporated
    Inventors: David A. Gallup, Lawrence B. LeStarge
  • Patent number: 8146248
    Abstract: A Drain wire led out from the interior to the exterior of a shielded wire is covered with a heat shrinkable tube made of an insulating resin or with a rubber tube including silicon or EPDM (ethylene-propylene rubber). A water-stop agent is penetrated between the element wires of the drain wire in the heat shrinkable tube or the rubber tube. In addition, A boundary portion between a terminal connected to an end of the drain wire and the heat shrinkable tube is covered with a rubber stopper.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: April 3, 2012
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Naoya Nishimura, Toshio Kometani, Masahiro Hagi, Hirotaka Baba, Yoshiaki Yamano
  • Patent number: 8146247
    Abstract: A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.
    Type: Grant
    Filed: September 16, 2009
    Date of Patent: April 3, 2012
    Assignee: Lite-On Singapore Pte. Ltd.
    Inventors: Sin-Heng Lim, Amy Ge
  • Patent number: 8122592
    Abstract: The invention relates to a method for production of a low current switch module, comprising the following steps: precutting a fine conductor path of several conducting circuits connected by connector tracks in the same sheet, positioning the contact relay and other optional electronic components on the precut conductor path, electrically and mechanically connecting said contact relay and the optional electronic components on the conductor track, encapsulating the unit comprising the conductor path, contact relay, the optional components, the pins and electrical connectors thereof and cutting certain connector tracks such as to separate said circuits.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: February 28, 2012
    Assignee: Valeo Securite Habitacle
    Inventor: Fabrice Giacomin
  • Patent number: 8101034
    Abstract: An improved method for imparting excellent long-term dielectric performance to an in-service electrical cable section having a stranded conductor surrounded by a conductor shield encased in a polymeric insulation and having an interstitial void volume in the region of the conductor, the cable section having an average operating temperature T is disclosed. The method comprises injecting a dielectric enhancement fluid composition into the interstitial void volume.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: January 24, 2012
    Assignee: Novinium, Inc.
    Inventors: Glen J. Bertini, Gary A. Vincent
  • Patent number: 8091224
    Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: January 10, 2012
    Assignee: GE Intelligent Platforms Embedded Systems, Inc.
    Inventors: David S. Slaton, David L. McDonald, Shreenath S. Perlaguri
  • Publication number: 20110312219
    Abstract: This is directed to connector assemblies for electric cables, and methods of manufacturing the same, that may include a body molded about one or more connections made between one or more conductive leads of the electric cable and one or more electrical contacts of the connector assembly. The molded body may provide support to the connections and may maintain the relative positions of the traces for functionally aligning exposed portions of the traces with other connector assemblies.
    Type: Application
    Filed: May 12, 2011
    Publication date: December 22, 2011
    Applicant: APPLE INC.
    Inventors: Edward Siahaan, Cameron Frazier, John Ardisana, Al Golko
  • Patent number: 8061026
    Abstract: A method for forming a lead body includes contacting a proximal section of the lead body having a lumen and a first lead body characteristic to a distal section of the lead body having a lumen and a second lead body characteristic. The proximal and distal sections are contacted such that their lumens are axially aligned. A lap band is disposed about a portion of the proximal section and a portion of the distal section, and is thermally formed to the proximal and distal sections. Axially compressive pressure is applied to the lap band as the lead body is being thermally formed. The pressure applied is sufficient to result in the lead body having an outer diameter in regions proximally and distally adjacent to the lap band that are substantially the same to an outer diameter in a region formed by the lap band.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: November 22, 2011
    Assignee: Medtronic, Inc.
    Inventors: Carole A. Tronnes, Daniel J. Stetson, Brian T. Stolz
  • Patent number: 8056225
    Abstract: The present invention is a method for manufacturing an electrical connector comprising an insulative housing with a base side and an opposed side and lateral sides interposed between said base side and said opposed side and at least one conductive contact including a first leg that extends from the base side of the insulative housing, the at least one conductive contact further including a second leg extending laterally adjacent the top side of the housing. In this method there is provided a mold comprising a first die and an opposed second die all defining an interior cavity and an exterior area. A molding compound input port extends between the exterior area and the interior cavity. The conductive contact is then positioned in the interior cavity such that the second leg extends adjacent the second die along an entirety of a length of the second die between first and second bent ends.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: November 15, 2011
    Assignee: FCI Americas Technology, Inc.
    Inventor: Conway Francis Spykerman
  • Publication number: 20110270363
    Abstract: A header for use in implantable pulse generator devices. The header is cart, of electrical connector assembly having one or more openings designed to receive the terminal pin of an electrical lead wire or electrode. The header is designed to provide and sustain long-term electrical and mechanical lead wire connections between the electrodes of a terminal pin and the implantable pulse generator device.
    Type: Application
    Filed: April 25, 2011
    Publication date: November 3, 2011
    Applicant: DONATELLE PLASTICS, INC.
    Inventors: Dana E. Schramm, Matthew L. Iwen, Nick J. Miller, Matthew R. Call
  • Patent number: 8028408
    Abstract: A wiring module that can be installed in an electrical junction box and can receive a removable electrical outlet module, a removable electrical switch module, or other types of electrical functional modules. The wiring module and the removable electrical outlet and switch modules may include connectors having a mechanical portion and an electrical portion. The electrical connector portions may be configured so as not to be exposed to user contact when the mechanical connector portions are at least partially engaged.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: October 4, 2011
    Assignee: ProtectConnect
    Inventor: Michael P. Gorman
  • Patent number: 8020266
    Abstract: Methods of making an energy harvesting device are described. A case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: September 20, 2011
    Assignee: Robert Bosch Gmbh
    Inventors: Markus Ulm, Brian Stark, Matthias Metz