With Molding Of Insulation Patents (Class 29/883)
  • Patent number: 8056226
    Abstract: A dual interface separable insulated connector comprising a faraday cage molded over a bus bar for use in an electric power system and a method of manufacturing the same are provided. The faraday cage can be disposed within a semi-conductive shell. The configuration of the separable insulated connector can provide for easier bonding between the faraday cage and insulating material. Additionally, the configuration can eliminate or reduce the need to coat the bus bar with an adhesive agent and to smooth the metal bus bar to remove burrs, other irregularities, and sharp corners from the bar. Manufacturing the dual interface separable insulated connector can include molding a semi-conductive rubber faraday cage over a conductive bus bar, inserting the faraday cage into a shell, and injecting insulating material between the faraday cage and shell.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: November 15, 2011
    Assignee: Cooper Technologies Company
    Inventors: David Charles Hughes, Mark Clifford Kadow, Michael John Gebhard, Sr.
  • Publication number: 20110252643
    Abstract: An apparatus includes a pair of connectors, two or more conductive paths formed in each connector in the pair of connectors, and a shroud encompassing at least a portion of the pair of connectors. The pair of connectors includes a first connector and a second connector. The first connector is substantially more flexible than the second connector, and each connector in the pair of connectors includes a bulkhead. Each of the two or more conductive paths in each connector in the pair of connectors is electrically isolated from all other conductive elements in the pair of connectors. The shroud is located between the bulkheads and disposed about the pair of connectors when the pair of connectors are coupled together electrically.
    Type: Application
    Filed: June 21, 2011
    Publication date: October 20, 2011
    Applicants: Greene, Tweed of Delaware, Inc., Halliburton Energy Services, Inc.
    Inventors: Michael Dewayne Finke, Jesse Kevin Hensarling, Randal Thomas Beste, Charles Pence Burke, James Neal Spence
  • Patent number: 8029295
    Abstract: According to one embodiment, a connector for a composite structure includes at least one conducting element that is coupled to a node of an electrical circuit embedded in a composite structure. The composite structure has two opposing surfaces in which the conducting element is disposed essentially between the surfaces of the composite structure.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 4, 2011
    Assignee: Raytheon Company
    Inventor: William C. Strauss
  • Patent number: 8021198
    Abstract: A low-profile power adapter is disclosed. In one embodiment, a low profile power adapter is facilitated by improved approaches to construct and assembly of a power adapter plug for the power adapter. According to one aspect, a base for a power adapter plug of a power adapter can include a metal base connected to a blade (or prong) of the power adapter plug. The metal base can provide mechanical support to the blade as well as electrical connectivity to an internal terminal for the power adapter plug. According to another aspect, internal terminals used by a power adapter plug of a power adapter can be flexibly positioned on the power adapter plug, thereby facilitating interconnection with electrical components used by the power adapter. A molded base can be formed around the metal base leaving the blade and terminals exposed.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: September 20, 2011
    Assignee: Apple Inc.
    Inventors: Way Chet Lim, Cameron Frazier, Kevin Walsh
  • Publication number: 20110195612
    Abstract: Apparatus, systems, and methods for assembling a plug with a low profile for use with an electronic device are provided. In some embodiments, a 4-pin plug may include a diameter similar to the diameter of a 3-pin plug. In some embodiments, the fourth pin may be coupled to the plug such that a portion of the fourth pin may be coupled to any suitable device on an internal surface of the plug. In some embodiments, the fourth pin may dive into the plug at the same depth as one of the other three pins of the plug. The pins within the plug may be coupled (e.g., soldered) at the ends that may emerge underneath an overmold to any other suitable device to form electrical connections. The plug may be used to transmit audio or transfer data to a user of the electronic device.
    Type: Application
    Filed: April 22, 2011
    Publication date: August 11, 2011
    Applicant: APPLE INC.
    Inventor: Kurt Stiehl
  • Publication number: 20110195585
    Abstract: A connecting device that connects to at least one external electrical conductor of a photovoltaic solar module. The connecting device includes a plurality of busbars, a support element, a housing, a diode and a contact. The plurality of busbars are arranged next to one another, while the support element is attached to the plurality of busbars and includes a bottom face to be positioned on the solar module. The housing is positioned over the support element and the plurality of busbars and includes an edge surrounding the support element and the plurality of busbars when the overhousing is positioned on the solar module. The diode fits onto the plurality of busbars and includes diode leads that fit onto one of the plurality of busbars, such that the plurality of busbars are connected together through the diode.
    Type: Application
    Filed: April 19, 2011
    Publication date: August 11, 2011
    Inventors: Guenter Feldmeier, Norbert Geister, Manfred Schaarschmidt, Heinz Peter Scherer, Andreas Woeber
  • Patent number: 7980895
    Abstract: A method for manufacturing an electrical contact module is provided. First, a lead-frame of electrical conductors is formed, wherein at least one supporting strip is formed in the lead-frame of electrical conductors in such a way as to maintain the electrical conductors in a predetermined position with respect to each other. Then, the lead-frame of electrical conductors is over-molded with a first dielectric material, thereby obtaining a first over-molded lead-frame. At least one aperture is formed in the first over-molded lead-frame so that the at least one supporting strip is accessible. The at least one supporting strip in the first over-molded lead-frame is removed after completion of the over-molding step. A second dielectric material is then over-molded with the first over-molded lead-frame in such manner as to fill the at least one aperture and a space left between the electrical conductors after removal of the at least one supporting strip.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: July 19, 2011
    Assignee: Tyco Electronics Nederland BV
    Inventors: Luc Berens, Fred Scheefhals, Ton Van Der Bruggen, Randy Van Hoof
  • Patent number: 7973634
    Abstract: Disclosed is an electronic component, especially a coil with a coil core, in which the turns of the coil winding are spaced apart from each other at least at one point in the longitudinal direction of the coil. A plastic retaining element which overlaps both the coil core and at least the two adjacent turns of the coil winding in a longitudinal direction is sprayed on in the area of said point, whereby a connection between the coil core and the coil winding is created at the same time. The retaining element can be sprayed around a closed circumference of the coil while covering only a portion of the coil in the longitudinal direction thereof. Preferably, the retaining element is placed approximately in the center relative to the longitudinal extension of the coil.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: July 5, 2011
    Assignee: Wuerth Elektronik Ibe GmbH
    Inventor: Rupert Aumueller
  • Patent number: 7913383
    Abstract: A method of manufacturing gel containing wire connectors with a silicone gel that remains in an unseparated state wherein the temperature of the gel precursors are elevated before being mixed and dispensed into the cavity of a wire connector where the mixed gel precursors are allowed to cool and cure without the necessity of additional heating of either the mixed gel precursors or the wire connector.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: March 29, 2011
    Assignee: The Patent Store LLC
    Inventors: James C. Keeven, Lloyd Herbert King, Jr.
  • Patent number: 7877869
    Abstract: A medical electrical lead includes a lead body and a connector terminal. A conductor extends from the lead body to the connector terminal along a helical path through a transition zone.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: February 1, 2011
    Assignee: Medtronic, Inc.
    Inventors: Bruce R. Mehdizadeh, Sandra F. Viktora, Catherine A. Lundberg, Dina L. Williams
  • Patent number: 7861407
    Abstract: A method of producing a busbar structure includes a busbar arranging step for arranging a plurality of the busbars at predetermined positions in a cavity which is formed between a fixed mold and a movable mold which can be clamped and opened with respect to the fixed mold, and clamping the two molds, a resin filling step for filling molten resin into the cavity in which the busbars have been arranged, and a busbar fixing step for hardening the molten resin which has been filled thereby to fix the busbars at predetermined positions with the hardened resin, and opening the two molds. Interposed pins to be interposed between the busbars which are arranged in close proximity to each other are detachably disposed in an engaged part of the movable mold, and removed from a molded product when the two molds are opened.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: January 4, 2011
    Assignee: JTEKT Corporation
    Inventor: Takatoshi Sakata
  • Publication number: 20100330837
    Abstract: A device and method for reinforcing a connector and a portion of cable adjacent to the connector is herein disclosed and claimed. The device of the present invention is comprised of a body that grips and secures a connector and a portion of cable adjacent to the connector. The body has a longitudinal passage therethrough, the passage having a first section and a second section. The first section is dimensioned to receive the connector and the second section is dimensioned to receive the portion of cable. The body may be comprised of two corresponding clam shell halves which can be fastened together using common fasteners, joined with an adhesive, or otherwise frictionally or chemically joined. The body may also be injection molded around the connector and cable.
    Type: Application
    Filed: September 7, 2010
    Publication date: December 30, 2010
    Inventor: David Wegener
  • Publication number: 20100285697
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: July 21, 2010
    Publication date: November 11, 2010
    Applicant: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 7823280
    Abstract: The present invention relates to a connector of an electromagnetic clutch for a compressor and a manufacturing method thereof. The method includes the steps of arranging a leading end of a lead wire 62 or 72 of at least one discharge device 60 or remaining magnetic field removing device 70, which configures a surge absorbing circuit, to a terminal 50 installed in a connector 30 configuring a field coil assembly and having a coupling slot 56 formed in one side thereof; plastically deforming at least one slot bridge 57 to fix the lead wire 62 or 72 to the coupling slot 56; and making the connector 30 in a state where the terminal 50 is fixed to an assembly of at least the discharge device 60 or remaining magnetic field removing device 70 by injection molding.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: November 2, 2010
    Assignee: Halla Climate Control Corp.
    Inventors: Suk-Jae Chung, Sung-Taeg Oh, Dae-Yong Park, Hwa-Yeop Shin
  • Patent number: 7788803
    Abstract: A twist-on wire connector containing a mass of a cohering gel in a gel state therein for forming a protective covering over a wire connection in the twist-on wire connector with the gel thereon removal from the twist-on wire connector and peelable from the wire connection to enable one to quickly form a further wire connection without having to wipe off the wire connection.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: September 7, 2010
    Inventors: Lloyd Herbert King, Jr., Michael Belgeri, James Keeven, William Hiner
  • Patent number: 7784178
    Abstract: Techniques associated with higher performance barrier materials for containers to contain one or more environmentally sensitive devices associated with semiconductor manufacture are generally described. In one example, an apparatus includes an enclosure to contain one or more environmentally sensitive devices associated with semiconductor manufacture, the enclosure comprising a liquid crystal polymer (LCP) to provide a barrier against at least water and oxygen and to reduce purging requirements, and a door coupled with the enclosure.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: August 31, 2010
    Assignee: Intel Corporation
    Inventor: Peter Davison
  • Publication number: 20100178794
    Abstract: This invention is about the electric connector and its processing technique. More specifically, it involves terminals with puncture structure, electric connector and their processing technique. The processing technique herein includes stamping terminal processing, winding displacement processing, injection upper cover, injecting lower cover, piercing processing, removal of material ribbon, front glue chip assembly, assembly of outer metal shell. Among them, the upper cover and lower cover are injected and molded in the middle and rear of the corresponding terminals in array. The processing technique has tackled the problems as unstable contact, poor contact, high electric resistance and micromation which cannot be solved by the current existing electric connector. There should be at least two tusks whose tips are intertwined molded in the electric connector of piercing terminal. The tusks are the pyramid shape with a cambered surface in the inner side; it reduces the electric resistance of electric connector.
    Type: Application
    Filed: July 27, 2009
    Publication date: July 15, 2010
    Inventor: CHING-JEN HSU
  • Patent number: 7752753
    Abstract: A method being applied to manufacture a water-proof electronic device (200, 200a) is disclosed in the present invention. In the method, at least one inner component is assembled into at least one water-proof shell to form at least one sub-assembly, which has a first water-proof portion and a water-permeable portion; a injection molding die is fitted around the water-permeable portion; and an injection molding treatment is executed for the injection molding die with the water-permeable portion therein to form a second water-proof portion; and then the injection molding die is removed after a cooling process, so as to manufacture the water-proof electronic device with the first water-proof portion and the second water-proof portion.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: July 13, 2010
    Assignee: ACA Digital Corporation
    Inventor: Chun-Chung Pai
  • Patent number: 7748117
    Abstract: A method for producing electric contact parts includes the following stages: a) stamping a strip of electric conducting parts connected together in the longitudinal direction (X-X) by a continuous strip; b) inserting said strip inside a mould; c) over-moulding the conducting parts with insulating material depending on the final form envisaged for the electric contact part; d) cutting the continuous strip in the region of the flat pins; e) extracting the finished parts.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: July 6, 2010
    Assignee: Morsettitalia, S.p.A.
    Inventor: Giordano Pizzi
  • Publication number: 20100112867
    Abstract: A method for manufacturing an electrical contact module is provided. First, a lead-frame of electrical conductors is formed, wherein at least one supporting strip is formed in the lead-frame of electrical conductors in such a way as to maintain the electrical conductors in a predetermined position with respect to each other. Then, the lead-frame of electrical conductors is over-molded with a first dielectric material, thereby obtaining a first over-molded lead-frame. At least one aperture is formed in the first over-molded lead-frame so that the at least one supporting strip is accessible. The at least one supporting strip in the first over-molded lead-frame is removed after completion of the over-molding step. A second dielectric material is then over-molded with the first over-molded lead-frame in such manner as to fill the at least one aperture and a space left between the electrical conductors after removal of the at least one supporting strip.
    Type: Application
    Filed: October 26, 2009
    Publication date: May 6, 2010
    Inventors: Luc BERENS, Fred SCHEEFHALS, Ton VAN DERBRUGGEN, Randy VAN HOOF
  • Patent number: 7707719
    Abstract: A method for protecting contacts within a receptacle housing of a connector assembly from becoming contaminated. An example method includes inserting a connector insert into the receptacle housing, the connector insert includes a body portion having an exterior configured to correspond to at least a portion of the interior of the receptacle housing of the connector assembly. The body portion of the insert includes an opening which extends into the body portion to receive the contacts and protect the contacts from the exterior environment surrounding the receptacle housing when at least a portion of the body portion is received within the receptacle housing.
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: May 4, 2010
    Assignee: Scientific-Atlanta, Inc.
    Inventors: Douglas L. Meister, Ray D. Sturbaum
  • Patent number: 7699672
    Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: April 20, 2010
    Assignee: Molex Incorporated
    Inventors: Victor Zaderej, David L. Brunker, Phillip J. Dambach
  • Patent number: 7694407
    Abstract: A miniature surface-mount electronic component which can ensure sufficient impact resistance and vibration resistance especially in an application to a severe use environment such as a vehicle-mounted coil, by putting some contrivance into a method for fixing a coil in a molding process and a method for holding a core and terminals. A miniature surface-mount electronic component including a bar-shaped core 2 on which a winding wire 3 is wound, and metal plates 5, with an outer casing 7 made of an insulating resin molded, includes flanges 2b substantially quadrangular in section at both ends of the bar-shaped core 2, and vertical grooves a and b are provided on side surfaces of the flanges 2b of the bar-shaped core 2 as fixing portions for preventing positional displacement occurring when the outer casing 7 is molded.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: April 13, 2010
    Assignee: Toko Inc.
    Inventors: Masayoshi Yagi, Shingo Shimizu, Shin Murakami
  • Publication number: 20100084160
    Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 8, 2010
    Inventors: David J. Braun, Mark G. Clark, John R. Dangler, Matthew S. Doyle, Thomas D. Kidd, Jason T. Stoll
  • Patent number: 7690934
    Abstract: An electrical distribution harness assembly configured for coupling with a modular wall panel includes at least one electrical connector including a body and an elastic clip bracket configured for snap-fitting to the modular wall panel, the body forming an overmolded connection with the elastic clip bracket.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: April 6, 2010
    Assignee: Group Dekko, Inc.
    Inventor: Ray H. Riner
  • Patent number: 7658002
    Abstract: The invention is directed to an electrical distribution harness assembly and a method of manufacturing the electrical distribution harness assembly. The electrical distribution harness assembly is configured for coupling with a modular wall panel. The electrical distribution harness assembly includes at least one electrical connector including an elastic clip bracket configured for snap-fitting to the modular wall panel. The method of manufacturing the electrical distribution harness assembly includes the steps of forming an elastic clip bracket configured for snap-fitting to the modular wall panel and encapsulating at least a portion of the elastic clip bracket in an electrical connector.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: February 9, 2010
    Assignee: Group Dekko, Inc.
    Inventor: Ray H. Riner
  • Publication number: 20090325398
    Abstract: An LGA socket assembly comprising individual sockets cells, the methods of fabricating and assembling the socket cells into a socket assembly. In an embodiment of the invention, each socket cell comprises an insulative body and a wire. The insulative body is formed around the wire. A first portion of the wire extends from the top surface of the insulative body to form contact tip. A second portion of the wire extends from the bottom surface of the insulative body to form contact paddle. Socket cells are aligned to form a socket assembly.
    Type: Application
    Filed: June 25, 2008
    Publication date: December 31, 2009
    Inventors: Xiaoqing Ma, Tieyu Zheng
  • Patent number: 7632153
    Abstract: An electrical connector includes a dielectric housing and a plurality of electrical terminals integrated with the dielectric housing. A top of the dielectric housing defines a plurality of locating slots. A bottom of each locating slot defines a manufacturing hole. Each electrical terminal has a plate-shaped fixing portion embedded in the dielectric housing. A connecting end extends from one end of the fixing portion and out of the dielectric housing. A bending portion is bent upward from the other end of the fixing portion, and a contact portion obliquely extends from a top end of the bending portion. The fixing portion defines a fixing hole therein with respect to the contact portion. The fixing hole is located corresponding to and communicating with the manufacturing hole. The contact portion is received in the locating slot and covers the manufacturing hole.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: December 15, 2009
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ming-Chun Lai, Yu Li
  • Publication number: 20090305578
    Abstract: A low-profile power adapter is disclosed. In one embodiment, a low profile power adapter is facilitated by improved approaches to construct and assembly of a power adapter plug for the power adapter. According to one aspect, a base for a power adapter plug of a power adapter can include a metal base connected to a blade (or prong) of the power adapter plug. The metal base can provide mechanical support to the blade as well as electrical connectivity to an internal terminal for the power adapter plug. According to another aspect, internal terminals used by a power adapter plug of a power adapter can be flexibly positioned on the power adapter plug, thereby facilitating interconnection with electrical components used by the power adapter.
    Type: Application
    Filed: June 6, 2008
    Publication date: December 10, 2009
    Inventors: Way Chet Lim, Cameron Frazier, Kevin Walsh
  • Patent number: 7603770
    Abstract: An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: October 20, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Scott D. Brandenburg, David A. Laudick
  • Publication number: 20090246984
    Abstract: A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.
    Type: Application
    Filed: March 13, 2009
    Publication date: October 1, 2009
    Inventor: Deepak Pai
  • Publication number: 20090211089
    Abstract: A dual interface separable insulated connector comprising a faraday cage molded over a bus bar for use in an electric power system and a method of manufacturing the same are provided. The faraday cage can be disposed within a semi-conductive shell. The configuration of the separable insulated connector can provide for easier bonding between the faraday cage and insulating material. Additionally, the configuration can eliminate or reduce the need to coat the bus bar with an adhesive agent and to smooth the metal bus bar to remove burrs, other irregularities, and sharp corners from the bar. Manufacturing the dual interface separable insulated connector can include molding a semi-conductive rubber faraday cage over a conductive bus bar, inserting the faraday cage into a shell, and injecting insulating material between the faraday cage and shell.
    Type: Application
    Filed: February 25, 2008
    Publication date: August 27, 2009
    Applicant: Cooper Technologies Company
    Inventors: David Charles Hughes, Mark Clifford Kadow, Michael John Gebhard, SR.
  • Publication number: 20090211808
    Abstract: A conductor leadthrough for a field device is for connecting two electrical conductors. The conductor leadthrough comprises an external conductor and a sealing apparatus. The sealing apparatus is divided into a first separation device and a second separation device. The external conductor comprises a hollow internal region that extends along a longitudinal axis of the external conductor. The first separation device and the second separation device are arranged along the longitudinal axis of the external conductor so as to be spaced apart so that they can separate a section of the hollow internal region of the external conductor. A pourable-sealing device is filled into the separated section of the hollow internal region of the external conductor so that the sealing apparatus can provide a leakage rate whose value is below a predeterminable value of a leakage rate. A signal of a predeterminable frequency can be transmitted along the longitudinal axis.
    Type: Application
    Filed: February 17, 2009
    Publication date: August 27, 2009
    Inventors: Johannes Falk, Daniel Schultheiss, Juergen Motzer
  • Publication number: 20090197479
    Abstract: An electrical terminal including a first connection section; and a second connection section. The second connection section includes at least two cantilevered deflectable contact arms configured to contact a mating electrical terminal. A front end of each of the arms is outwardly flared including opposite sides of each front end being outwardly flared in general opposite directions relative to each other. The front ends combine to form a general tulip shaped entrance into the electrical terminal for the mating electrical terminal.
    Type: Application
    Filed: January 8, 2009
    Publication date: August 6, 2009
    Inventors: Michael S. Glick, Willie R. Lyons, Cecil Brown
  • Publication number: 20090186506
    Abstract: In a waterproof connector and a method for the same, the waterproof connector includes a plurality of electrically conductive terminals, an electrically insulating base, an electrical wire, a hollow cylinder and a cladding. The electrically insulating base has a receiving section. The electrical wire has a plurality of cores. Each core is connected to one end of each electrically conductive terminal. The hollow cylinder is connected to the receiving section and located to one side of the electrical wire. The cladding is used to cover the receiving section, the hollow cylinder, the core and one end of electrically conductive terminal. Further, the present invention provides a method for manufacturing the waterproof connector so as to enhance the yield rate and prevent the penetration of moisture.
    Type: Application
    Filed: June 5, 2008
    Publication date: July 23, 2009
    Inventors: Chang-Nan CHEN, Teng-Sheng Hung
  • Patent number: 7524194
    Abstract: Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: April 28, 2009
    Assignee: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, Stuart W. Wenzel
  • Patent number: 7503112
    Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules are disclosed. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. Each of the conductors can then be secured in a fixed position with respect to each other. A casing having a first part and a second part can then be molded about the conductors such that each of the conductors forms an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The conductors can be bent into any desired position to allow the electrical contacts to be connected to the optical sub assembly and the contact points to be connected to the printed circuit board.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: March 17, 2009
    Assignee: Finisar Corporation
    Inventors: Donald A. Ice, Darin James Douma
  • Patent number: 7497011
    Abstract: A hoop molding method comprises forming, in the frame portions, connection portions that link, to the frame portions, at least one molded portion of the at least one bent molded portion or at least another molded portion other than the at least one bent molded portion such that it is displaceable in a direction toward another molded portion along the width direction of the parent material, and displacing the at least one molded portion of the at least one bent molded portion or the at least another molded portion other than the at least one bent molded portion toward the another molded portion after the bending.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: March 3, 2009
    Assignee: Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
    Inventors: Koji Suzuki, Fusatomo Miyake
  • Publication number: 20090029596
    Abstract: A molded lamp socket. The molded lamp socket includes a lamp base body molded from a first plastic material providing a socket cavity with an opening for receiving a lamp bulb. The molded lamp socket also includes a lead extending from a first contact portion disposed in the socket cavity to a second contact portion spaced from the socket cavity. The molded lamp socket also includes a mounting body molded from a second plastic material providing a plug cavity encircling the second contact portion. The mounting body is overmolded with respect to the lamp base body.
    Type: Application
    Filed: October 1, 2008
    Publication date: January 29, 2009
    Applicant: FEDERAL-MOGUL IGNITION COMPANY
    Inventors: Robert H. Owen, SR., John A. Forish
  • Publication number: 20090023338
    Abstract: An electrical connector (1) includes a contact module (2). The contact module (2) includes a plurality of contacts (213) and a contact base (22) insert molding around the contacts (213). A metal shield (3) encloses the contact module (2). Wherein the contact base (22) is formed with a base portion (221) and a tongue (222) extending from the base portion (221) forwardly. The tongue (222) has a front face (2220) and a plurality of passageways (225) to position the contacts (213). The passageways (225) extend through the front face (2220) of the tongue (222).
    Type: Application
    Filed: July 21, 2008
    Publication date: January 22, 2009
    Inventors: Jia-Yong He, Qi-Sheng Zheng
  • Publication number: 20090017698
    Abstract: A connector and a method of manufacturing the same one are provided. The connector includes an insulating casing and a plurality of terminals. The insulating casing has a joining surface and a plurality of terminal holes. The terminal holes are arranged to pass through the joining surface in a manner to slant relative to the insulating casing. Each terminal hole has a pair of opposite inner walls. The insulating casing further has a plurality of positioning parts adjacent to at least one of the respective inner walls of the respective terminal holes. The terminals are located within the respective terminal holes. With the use of the positioning parts, when the terminal holes of the insulating casing is formed, the pins do not tend to break and then the slant terminal holes are smoothly formed.
    Type: Application
    Filed: June 13, 2008
    Publication date: January 15, 2009
    Inventor: Ted Ju
  • Publication number: 20090011641
    Abstract: An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips.
    Type: Application
    Filed: December 18, 2007
    Publication date: January 8, 2009
    Applicant: Amphenol Corporation
    Inventors: THOMAS S. COHEN, Brian Kirk, Marc B. Cartier, JR.
  • Publication number: 20080307640
    Abstract: The present invention discloses a method for reinforcing the connection between a wire formed on a substrate and a flat cable member with a reinforcing material. The method includes the step of supplying fluid and the step of hardening the fluid to form the reinforcing material. The step of supplying the fluid includes the step of bringing the substrate connecting to the flat cable member close to a jig and then supplying the fluid to a region in which the reinforcing material is to be formed while preventing the outflow of the fluid with the jig.
    Type: Application
    Filed: August 18, 2008
    Publication date: December 18, 2008
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Koji Hirano
  • Publication number: 20080301937
    Abstract: In one aspect, an electrical connector assembly can be removably coupled to a second electrical connector assembly. The electrical connector assembly includes an elastomeric insulative layer and a rigid conductive sleeve disposed within the insulative layer. One or both of the rigid conductive sleeve and the insulative layer have interior surfaces that define an opening. A conductive contact is disposed within the opening and a conductive or semi-conductive exterior layer at least partially covers the insulative layer. The rigid conductive sleeve is configured to act as a voltage shield and the conductive or semi-conductive exterior layer is configured to act as a ground shield.
    Type: Application
    Filed: August 13, 2008
    Publication date: December 11, 2008
    Applicant: Cooper Technologies Company
    Inventors: David Charles Hughes, Allen LeRoy Johnson, Brian Todd Steinbrecher
  • Publication number: 20080295330
    Abstract: A method of manufacturing a terminal block for a telecommunication cable comprising the steps of providing a preformed substrate member comprising a podium member, at least one electrical connector and at least one insulated electrical wire attached to an electrical contact positioned within the at least one electrical connector; placing the preformed substrate member in a mold; and injecting a dielectric material into the mold containing the podium member to form an overmolded terminal block, wherein the dielectric material covers the at least one insulated electrical wire and a portion of the electrical contact positioned within the at least one electrical connector.
    Type: Application
    Filed: May 29, 2007
    Publication date: December 4, 2008
    Applicant: Channell Commercial Corporation
    Inventor: Gerald L. Shimirak
  • Patent number: 7437819
    Abstract: A method for sealing an electrical connector having a transition end and a cable. A protective coating is applied to the transition end of the connector. The connector, transition end and cable are positioned within halves of a mold. An annular resilient seal is positioned about the transition end within the mold. When the mold is filed with castable material the annular resilient seal compresses against the connector, preventing leakage of the castable material along the connector. The mold can then be separated leaving a waterproof boot formed on the transition end of the connector. The invention also provides a mold and sealing means for this process.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: October 21, 2008
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Rudolph B. Escobedo
  • Publication number: 20080244903
    Abstract: A medical electrical lead includes a lead body and a connector terminal. A conductor extends from the lead body to the connector terminal along a helical path through a transition zone.
    Type: Application
    Filed: May 21, 2008
    Publication date: October 9, 2008
    Inventors: BRUCE R. MEHDIZADEH, Sandra F. Viktora, Catherine A. Lundberg, Dina L. Williams
  • Patent number: 7430801
    Abstract: This connector assembly comprises a header 1 to which a plurality of coaxial cables 3 are connectable and a socket 2 configured to be mounted on a printed board 4. The header 1 can be detachably coupled to the socket 2. The header 1 has a first terminal array 12 to which the coaxial cables 3 are electrically connectable. The socket 2 has a second terminal array 21 which makes contact with the first terminal array 12 when the header 1 is coupled to the socket 2. The first terminal array has a plurality of first terminals each having a wire terminal 120 for connection with each conductive wire of the cables and a contact 122 for contact with the second terminal array. The feature of the present invention resides in that the wire terminals 120 are arranged in a line, and the contacts 122 of the first terminal array are arranged in two rows in a staggered configuration, and a pitch of the contacts 122 of each row is larger than a pitch of the wire terminals 120.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: October 7, 2008
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Mitsuru Iida, Hirohisa Tanaka, Kenji Jounen, Kousuke Yoshioka
  • Publication number: 20080184560
    Abstract: A method for producing electric contact parts includes the following stages: a) stamping a strip of electric conducting parts connected together in the longitudinal direction (X-X) by a continuous strip; b) inserting said strip inside a mould; c) over-moulding the conducting parts with insulating material depending on the final form envisaged for the electric contact part; d) cutting the continuous strip in the region of the flat pins; e) extracting the finished parts.
    Type: Application
    Filed: February 5, 2008
    Publication date: August 7, 2008
    Inventor: Giordano Pizzi
  • Patent number: 7396265
    Abstract: A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: July 8, 2008
    Assignee: Cochlear Limited
    Inventors: Derek Ian Darley, Desmond Andrew McCusker, Dusan Milojevic, John Parker