Encapsulated Or Coated Patents (Class 310/340)
  • Patent number: 10637481
    Abstract: An oscillator includes a case that has a base and a cap connected to the base; a first substrate accommodated in the case; a lead terminal electrically connected to the first substrate; and a resonator module electrically connected to the lead terminal and supported by the lead terminal with a gap with respect to the first substrate between the first substrate and the base.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 28, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Manabu Kondo, Kensaku Isohata, Kenji Hayashi
  • Patent number: 10629455
    Abstract: The present disclosure relates to a semiconductor package and a method for manufacturing the same. The semiconductor package includes a first substrate, a blocking dam, and a first contact pad. The first substrate includes a chip-mounting region and an outer connecting region outside the chip-mounting region. The blocking dam is disposed over the first substrate, wherein the blocking dam is disposed between the chip-mounting region and the outer connecting region, the blocking dam surrounds the chip-mounting region and includes a metal layer, and the blocking dam is of a wave shape as seen in a top view of the blocking dam. A first contact pad is disposed over the first substrate, and the first contact pad is within the outer connecting region.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: April 21, 2020
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Te-Yin Chen
  • Patent number: 10614842
    Abstract: A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed respectively in the lower side of the lower electrode film and the upper side of the upper electrode film, of the laminated structure part, so as to sandwich the laminated structure part. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.
    Type: Grant
    Filed: July 4, 2019
    Date of Patent: April 7, 2020
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Wei Xiong, Atsushi Iijima
  • Patent number: 10607641
    Abstract: A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed respectively in the lower side of the lower electrode film and the upper side of the upper electrode film, of the laminated structure part, so as to sandwich the laminated structure part.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: March 31, 2020
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Wei Xiong, Atsushi Iijima
  • Patent number: 10591993
    Abstract: Disclosed herein are structures, devices, methods and systems for providing haptic output on an electronic device. In some embodiments, the electronic device includes an actuator configured to move in a first direction. The electronic device also includes a substrate coupled to the actuator. When the actuator moves in the first direction, the substrate or a portion of the substrate, by virtue of being coupled to the actuator, moves in a second direction. In some implementations, the movement of the substrate is perpendicular to the movement of the actuator.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: March 17, 2020
    Assignee: APPLE INC.
    Inventors: Alex J. Lehmann, Juan Pu, Paul X. Wang, Qiliang Xu, Zheng Gao
  • Patent number: 10491050
    Abstract: Systems, methods, computer-readable storage mediums including computer-readable instructions and/or circuitry for control of transmission to a target device with communicating with one or more sensors in an ad-hoc sensor network may implement operations including, but not limited to: generating electrical power from at least one ambient source via at least one structurally integrated electromagnetic transducer; powering at least one transmitter via the electrical power to wirelessly transmit one or more sensor operation activation signals to one or more sensors; and at least one of powering one or more sensing operations of one or more sensors via the electrical power or charging one or more power storage devices electrically coupled to the one or more sensors via the electrical power.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: November 26, 2019
    Assignee: Elwha LLC
    Inventors: Jesse R. Cheatham, III, Matthew G. Dyor, Peter N. Glaskowsky, Kimberly D. A. Hallman, Roderick A. Hyde, Muriel Y. Ishikawa, Edward K. Y. Jung, Michael F. Koenig, Robert W. Lord, Richard T. Lord, Craig J. Mundie, Nathan P. Myhrvold, Robert C. Petroski, Desney S. Tan, Lowell L. Wood, Jr.
  • Patent number: 10446474
    Abstract: A packaging structure and a method for fabricating the packaging structure are provided. The packaging structure includes a base substrate including a solder pad body region and a trench region adjacent to and around the solder pad body region. The packaging structure also includes a passivation layer on a surface of the base substrate and exposing the solder pad body region and the trench region. In addition, the packaging structure includes a main body solder pad on the solder pad body region of the base substrate, and one or more trenches on the trench region of the base substrate and between the passivation layer and the main body solder pad. Further, the packaging structure includes a bonding conductive wire having one end connected to the main body solder pad.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: October 15, 2019
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Li Zhong Jin, Li Hui Lu, Chun Chao Fei, Po Yuan Chiang, Ya Ping Wang
  • Patent number: 10396754
    Abstract: A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, and a package base having a first principal surface and a second principal surface having an opposed surface relationship with each other, the quartz crystal resonator element is mounted on the first principal surface side, the thermistor is housed in a recessed section of the second principal surface side of the package base, a plurality of electrode terminals connected to the quartz crystal resonator element or the thermistor is disposed on the second principal surface side of the package base, and a distance in a first direction perpendicular to the first principal surface from a mounting surface of the electrode terminals to the thermistor is equal to or longer than 0.05 mm.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: August 27, 2019
    Assignee: Seiko Epson Corporation
    Inventor: Go Yamashita
  • Patent number: 10381978
    Abstract: A package includes a first layer on which a quartz crystal resonator element is mounted; a second layer that is joined to the first layer and on which a circuit element mounted; a third layer that is joined to a surface of the second layer that is opposite in direction to a surface of the second layer, on which the circuit element is mounted; a connection pad that is provided on the first layer; an external lateral surface terminal that is electrically connected to the connection pad; resonance element wiring that electrically connects the connection pad and the external lateral surface terminal to each other, in which the resonance element wiring is positioned between the third layer and the second layer, and includes terminal wiring that is connected to the external lateral surface terminal and interlayer wiring that connects the connection pad and the terminal wiring.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: August 13, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Shinya Aoki
  • Patent number: 10355665
    Abstract: An electronic component housing package includes a base having a first principal face provided with a mounting section for mounting an electronic component; a frame having a second principal face, the frame being disposed on the base so as to surround the mounting section; a frame-shaped metallized layer disposed on the second principal face of the frame; and a side-surface conductor disposed on an inner side surface of the frame, the side-surface conductor connecting the frame-shaped metallized layer and a relay conductor formed on the first principal face, the side-surface conductor being covered with an insulating film from one end to the other end in a width direction of the side-surface conductor.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: July 16, 2019
    Assignee: Kyocera Corporation
    Inventors: Takuo Kisaki, Masaki Suzuki
  • Patent number: 10311853
    Abstract: A piezoelectric sounding body includes: a piezoelectric vibrating plate; a case housing the piezoelectric vibrating plate; a first conductive terminal electrically connected to one electrode in the piezoelectric vibrating plate; and a second conductive terminal electrically connected to the other electrode in the piezoelectric vibrating plate. The case includes: a lower case where the first conductive terminal and the second conductive terminal are fixed; and an upper case configured to be fixed in a caulking manner to the lower case and to sandwich the piezoelectric vibrating plate between the upper case and the lower case.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: June 4, 2019
    Assignee: TDK CORPORATION
    Inventors: Akira Satoh, Kaoru Kijima
  • Patent number: 10193525
    Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering the a side surface of the terminal (15). The terminal (15) comprises, in a first region in the height direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: January 29, 2019
    Assignee: KYOCERA Corporation
    Inventors: Toru Fukano, Junya Nishii
  • Patent number: 10147867
    Abstract: A resonator element includes: a substrate; and an electrode that includes a first conductive layer provided on a surface of the substrate, and a second conductive layer, provided on the opposite side to the first conductive layer on the substrate side, which is disposed within an outer edge of the first conductive layer when seen in a plan view from a direction perpendicular to the surface.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: December 4, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Yoshitaka Fujihara, Kazuhisa Hatanaka, Matsutaro Naito
  • Patent number: 9985599
    Abstract: A method capable of manufacturing a quartz vibrator by disposing a metallic bonding material on one main surface of a ceramic plate having a quartz vibrating element mounted thereon. Thereafter, the bonding of a cap having a recess to the ceramic plate by disposing the cap on the one main surface of the ceramic plate so that an open side of the recess faces the ceramic plate, melting the bonding material, and then allowing the bonding material to set, is carried out.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: May 29, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshifumi Saito, Hiroaki Kaida, Manabu Ibayashi, Yuichiro Nagamine, Katsuma Moroishi, Takuya Kono, Kazuhiro Mimura
  • Patent number: 9981139
    Abstract: Among other things, in general, an acousto-mechanical transducer for the interconversion of electricity and acoustic waves is described. Methods are also described for the construction of such transducers.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: May 29, 2018
    Assignee: Dalhousie University
    Inventors: Robert B. A. Adamson, Jeffrey R. Leadbetter, Jeremy A. Brown, Manohar Bance
  • Patent number: 9962738
    Abstract: An ultrasonic transducer system includes at least one transducer element, a diaphragm, and at least one resonance body, the ultrasonic transducer system being configured for transmitting and/or receiving ultrasonic signals, the resonance body being coupled at an end face to the diaphragm and the at least one transducer element being coupled to a lateral surface of the resonance body so that the at least one transducer element and the resonance body have a shared interface. Also described is a method for the manufacture and to a motor vehicle having an ultrasonic transducer system of this type, the diaphragm of the ultrasonic transducer system being formed by an outer skin of a bumper, a side mirror, or a door section, and the transducer element(s) and resonance bodies being situated concealed behind the outer skin.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: May 8, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventor: Andre Gerlach
  • Patent number: 9905747
    Abstract: A crystal vibration device where a crystal unit is supported on a case substrate in a cantilever manner by first and second conductive adhesive layers. The crystal unit has a length direction and is formed using a rectangular-plate-shaped crystal substrate and A>4.30t+0.16, where A (mm) represents a shorter distance among distances between a central axis of the crystal substrate and end portions of the first and second conductive adhesive layers on a central axis side, and t (?m) represents a thickness of the crystal substrate.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: February 27, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroyuki Yamamoto, Masaru Asai
  • Patent number: 9897799
    Abstract: A piezoelectric element includes a first electrode having a film shape and provided on a base portion, a second electrode having a film shape and opposed to the first electrode on an opposite side of the first electrode from the base portion, a piezoelectric film interposed between the first electrode and the second electrode and partially covered with the second electrode, and an insulation film covering the second electrode and the piezoelectric film with extending over at least a part of an outer edge of the second electrode. The insulation film may cover a whole of the outer edge of the second electrode without covering an inner region of the second electrode. Accordingly, a withstand voltage of the piezoelectric film can be increased.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: February 20, 2018
    Assignee: DENSO CORPORATION
    Inventors: Akira Wada, Noriyuki Matsushita
  • Patent number: 9893265
    Abstract: A crystal resonation device that includes a base plate, a cap, a joining material, and a crystal resonator. The cap is provided on the base plate. The cap forms a sealed space with the base plate. The joining material joins the base plate and the cap. The joining material contains a cured material of thermosetting resin. The crystal resonator is provided on the base plate in the sealed space. The joining material is located in an outer side portion of a wall of the cap joined to the joining material.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: February 13, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshifumi Saito, Toshiyuki Yasugi
  • Patent number: 9780759
    Abstract: An elastic wave device propagating plate waves includes a stack of an acoustic reflection layer, a piezoelectric layer, and IDT electrode on a supporting substrate. The piezoelectric layer is thinner than a period of fingers of the IDT electrode. The acoustic reflection layer includes low-acoustic-impedance layers and high-acoustic-impedance layers. The low-acoustic-impedance layers are made of SiO2, and the high-acoustic-impedance layers are made of at least one material selected from the group consisting of W, LiTaO3, Al2O3, AlN, LiNbO3, SiN, and ZnO.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: October 3, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tetsuya Kimura, Takashi Ogami, Katsuya Daimon
  • Patent number: 9680445
    Abstract: A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an elastic layer formed on a second surface of the cavity package, opposite the first surface; and a molding compound formed on the substrate, encasing the cavity package and the elastic layer. The elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, for maintaining structural integrity of the cavity package and for preventing separation of the cavity package from the substrate.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: June 13, 2017
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Andrew Thomas Barfknecht, Klaus-Guenter Oppermann
  • Patent number: 9522536
    Abstract: A piezoelectric device comprising a substrate having two surface sides; a vibration plate on one of the two surface side, a piezoelectric element including a first electrode provided on the vibration plate, a piezoelectric body layer provided on the first electrode, the piezoelectric body layer having a groove section on a side surface, the groove section including a first surface facing to the vibration plate, and a second electrode provided on the piezoelectric body layer, and a stress application film having tensile stress and provided on an inner surface of the groove section.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: December 20, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Noboru Furuya, Masao Nakayama, Hideki Hahiro
  • Patent number: 9516773
    Abstract: A lid body includes: a first surface; a second surface having a top-bottom relation with the first surface; an outer peripheral surface connecting the first surface and the second surface; a groove provided in the first surface from the outer peripheral surface toward an interior of the first surface; and first and second marks arranged at positions that do not overlap with an outer peripheral edge of the second surface in a plan view.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: December 6, 2016
    Assignee: Seiko Epson Corporation
    Inventor: Juichiro Matsuzawa
  • Patent number: 9466780
    Abstract: The invention relates to an actuator unit, which comprises a piezoactuator (1) having a first end face (14?) and a second end face (13?). The actuator unit further comprises a sleeve (9) for accommodating the piezoactuator (1), wherein the sleeve (9) has a first end face (14) and a second end face (13). The actuator unit further comprises a potting compound (11) which surrounds the piezoactuator (1). The piezoactuator (1) and the potting compound (11) are introduced into the sleeve (9). The potting compound (11) extends no further than the first end face (14?) of the piezoactuator (1). The invention further relates to a method for manufacturing an actuator unit and a sleeve for accommodating a piezoactuator.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: October 11, 2016
    Assignee: EPCOS AG
    Inventors: Johann Kreiter, Siegfried Fellner
  • Patent number: 9428380
    Abstract: One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: August 30, 2016
    Assignee: STMicroelectronics S.r.l.
    Inventors: Fulvio Vittorio Fontana, Giovanni Graziosi, Alex Gritti
  • Patent number: 9332353
    Abstract: A plane-type speaker where, on one of the main surfaces of an exciter film, there are placed piezoelectric films which are expanded and contracted by sound-releasing driving signals applied thereto. An oscillation plate is secured to the excited film through frame members. The oscillation plate has a flat-plate shape and is secured to the exciter film while having a warped shape such that it is gradually spaced further away from the exciter film, with decreasing distance from the secured ends to a center area, when viewed at a side surface. This realizes a state where the exciter film is pulled outwardly with respect to the secured ends due to bending stresses therein. If sound-releasing driving signals are applied to the piezoelectric films in this state, the exciter film contracts and expands along with the expansion and contraction of the piezoelectric films, thereby causing the oscillation plate to oscillate.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: May 3, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masamichi Ando
  • Patent number: 9325292
    Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: April 26, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Katsuo Ishikawa, Akitoshi Hara
  • Patent number: 9257022
    Abstract: A system is provided that converts an input, such as audio data, into one or more haptic effects. The system applies a granular synthesis algorithm to the input in order to generate a haptic signal. The system subsequently outputs the one or more haptic effects based on the generated haptic signal. The system can also shift a frequency of the input, and also filter the input, before the system applies the granular synthesis algorithm to the input.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: February 9, 2016
    Assignee: Immersion Corporation
    Inventors: Juan Manuel Cruz-Hernandez, Ali Modarres, Liwen Wu, David Birnbaum
  • Patent number: 9257634
    Abstract: A piezoelectric element 300 includes a first electrode 60, a piezoelectric layer 70 which is provided on the first electrode, and a second electrode 80 which is provided on the piezoelectric layer, and the piezoelectric layer is made of a piezoelectric material expressed as a mixed crystal including a first component formed of a complex oxide containing Bi and Fe and having a rhombohedral perovskite structure and a complex oxide containing Ba and Ti and having a tetragonal perovskite structure, a second component formed of a complex oxide containing Bi, K, and Ti and having a tetragonal perovskite structure, and a third component formed of a complex oxide containing Bi, Mg, and Ti and having a rhombohedral perovskite structure.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: February 9, 2016
    Assignee: Seiko Epson Corporation
    Inventor: Xiaoxing Wang
  • Patent number: 9240769
    Abstract: A piezoelectric thin film resonator includes a substrate, a lower electrode provided on the substrate, a piezoelectric film provided on the lower electrode, and an upper electrode provided on the piezoelectric film. At least a portion of the upper electrode and that of the lower electrode oppose each other through the piezoelectric film, and at least a portion of the periphery of the upper electrode is reversely tapered.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: January 19, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takeshi Sakashita, Motoaki Hara, Masafumi Iwaki, Tsuyoshi Yokoyama, Shinji Taniguchi, Tokihiro Nishihara, Masanori Ueda
  • Patent number: 9060227
    Abstract: One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: June 16, 2015
    Assignee: STMicroelectronics S.r.l.
    Inventors: Fulvio Vittorio Fontana, Giovanni Graziosi, Alex Gritti
  • Patent number: 9000304
    Abstract: A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: April 7, 2015
    Assignee: Daishinku Corporation
    Inventor: Naoki Kohda
  • Patent number: 8975802
    Abstract: An acoustic wave device includes: a comb-like electrode provided on a piezoelectric substrate; and a first medium that covers the comb-like electrode and has at least a silicon oxide film in which an element is doped, wherein sonic speed in the silicon oxide film in which the element is doped is lower than sonic speed in an undoped silicon oxide film.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: March 10, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Satoru Matsuda, Takashi Matsuda, Michio Miura
  • Patent number: 8970090
    Abstract: An ultrasonic sensor is disclosed. The ultrasonic sensor includes a piezoelectric element and an acoustic matching member. The piezoelectric element is configured to detect ultrasonic wave transmitted from a transmitter and reflected by a detection target object located in a detection target space. The acoustic matching member is configured to conduct the received ultrasonic wave to the piezoelectric element. The piezo electric element is covered with the acoustic matching member including a principal oscillation portion and a supplement oscillation portion. Thickness of a part of the supplement oscillation portion, the part covering the piezoelectric element, is smaller than a predetermined thickness threshold.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: March 3, 2015
    Assignees: DENSO CORPORATION, Nippon Soken, Inc.
    Inventors: Keiko Akiyama, Mitsuyasu Matsuura, Toshiki Isogai, Makiko Sugiura
  • Publication number: 20150035412
    Abstract: A piezo-stack includes a plurality of lateral surfaces and a first passivation layer applied to a first lateral surface. The first passivation layer terminates flush with opposing lateral surfaces that adjoin the first lateral surface.
    Type: Application
    Filed: December 19, 2012
    Publication date: February 5, 2015
    Inventors: Thomas Richter, Harald Johannes Kastl, Claus Zumstrull
  • Patent number: 8904850
    Abstract: We have demonstrated that a surface acoustic wave (SAW) sensor coated with a nanoporous framework material (NFM) film can perform ultrasensitive water vapor detection at concentrations in air from 0.05 to 12,000 ppmv at 1 atmosphere pressure. The method is extendable to other MEMS-based sensors, such as microcantilevers, or to quartz crystal microbalance sensors. We identify a specific NFM that provides high sensitivity and selectivity to water vapor. However, our approach is generalizable to detection of other species using NFM to provide sensitivity and selectivity.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: December 9, 2014
    Assignee: Sandia Corporation
    Inventors: Mark D. Allendorf, Alex L. Robinson
  • Publication number: 20140333183
    Abstract: A resin is provided so as to cover four side faces of a piezoelectric multilayer body integrally and thus is effectively prevented from peeling from the piezoelectric multilayer body, whereby high adhesion is attained between the piezoelectric multilayer body and the resin. At the same time, the resin covers dicing surfaces in the side faces of the piezoelectric multilayer body, thereby effectively restraining the piezoelectric body and the electrodes from producing particles.
    Type: Application
    Filed: April 9, 2014
    Publication date: November 13, 2014
    Applicant: TDK CORPORATION
    Inventors: Ryuta MOTANI, Masahiro KITAJIMA, Nobuo KOBAYASHI
  • Publication number: 20140325808
    Abstract: An actuator assembly includes a housing and an actuator arranged within the housing, the actuator including a first part and a second part movable relative to the first part. An insulating material is disposed within the housing, the insulating material encapsulating at least the movable part of the actuator.
    Type: Application
    Filed: March 14, 2014
    Publication date: November 6, 2014
    Applicant: Parker-Hannifin Corporation
    Inventor: Yufeng Qi
  • Patent number: 8847471
    Abstract: A piezoelectric element includes a first electrode, a first multilayer composite disposed on the first electrode, a second multilayer composite disposed on the first electrode with a distance from the first multilayer composite, and a covering layer covering the side surfaces of the first and second multilayer composites and the surface of the first electrode between the first multilayer composite and the second multilayer composite. The first and second multilayer composites each include a piezoelectric layer and a second electrode over the piezoelectric layer. The first electrode contains a metal that can react with chlorine, and has at least one of a bump and a dip at the surface thereof between the first multilayer composite and the second multilayer composite.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: September 30, 2014
    Assignee: Seiko Epson Corporation
    Inventor: Hideki Hahiro
  • Patent number: 8841823
    Abstract: A wear cap including a flexible barrel and a rigid disc enables a high-frequency ultrasonic transducer to properly align to the surface of a material to be tested. The wear cap may be employed for any type of contact sensor that requires a protective wear cap and that needs to align to the surface of a material to be tested. An ultrasonic transducer assembly includes a wear cap and an ultrasonic transducer. The ultrasonic transducer is mounted in the wear cap and includes a transducer body with a cylindrical shape. A method of producing a wear cap for an ultrasonic transducer includes selecting a flexible material, forming a flexible barrel from the flexible material, selecting a rigid material, forming a rigid disc from the rigid material, and affixing the rigid disc to an end of the flexible barrel.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: September 23, 2014
    Assignee: Ascent Ventures, LLC
    Inventor: Todd Jackson
  • Publication number: 20140267506
    Abstract: An actuator element includes an electrode film; and an insulation film layered on the electrode film including a through hole for connecting a wiring which is formed on the insulation film to the electrode film. A shape of a rim of the through hole is either a closed curve free of corners or a polygon with vertex angles which are larger than 90 degrees.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: RICOH COMPANY, LTD.
    Inventors: Kouji Ohnishi, Takahiko KURODA, Manabu NISHIMURA, Kaichi UENO
  • Publication number: 20140267504
    Abstract: Provided is a piezoelectric element which includes a first electrode, a piezoelectric body layer provided on the first electrode, a second electrode provided on the piezoelectric body layer, and a protection film constituted by a silicon oxide layer that is formed using trimethoxysilane and a liquid-phase zirconia layer, in which the protection film is formed to extend from upper portions of the first electrode and the second electrode to boundary portions between the electrodes and the piezoelectric body layers.
    Type: Application
    Filed: February 5, 2014
    Publication date: September 18, 2014
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Koji OHASHI, Eiju HIRAI
  • Publication number: 20140239772
    Abstract: In an electronic component, when L0 is a dimension of an electronic component body in a first direction, L1 is a distance between a first outer electrode and a second outer electrode on a first surface in the first direction, and L2 is a dimension of each of the first and second outer electrodes on the first surface in the first direction, 0%<L1/L0<10% and 30%<L2/L0<50% are satisfied.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 28, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yutaka OTA, Masato KIMURA, Kota ZENZAI
  • Patent number: 8816570
    Abstract: A dual cantilever beam relaxor-based piezoelectric single crystal accelerometer is provided. A flexural sensing structure is provided that employs at least two piezoelectric cantilever beams having their longitudinal axes disposed in a substantially parallel arrangement with each beam containing at least one relaxor-based single crystal transduction element having its polarization axis substantially perpendicular to the longitudinal axis of the beam. One end is mounted to a rigid base and the other end can be mounted to a seismic proof-mass or can be free, wherein the base is subjected to dynamic excitation from either mechanical or acoustical origin. The flexible sensing structure can optionally be encapsulated in a viscoelastic material having a mechanical compliance and loss that is substantially greater than that of the flexible sensing structure.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: August 26, 2014
    Assignee: Applied Physical Sciences Corp.
    Inventor: James A. McConnell
  • Patent number: 8810104
    Abstract: A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001?, where the wavelength of an acoustic wave is ?.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: August 19, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shunsuke Kido, Takeshi Nakao, Yasuharu Nakai, Kenji Nishiyama, Michio Kadota
  • Patent number: 8776335
    Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: July 15, 2014
    Assignee: General Electric Company
    Inventor: Charles Edward Baumgartner
  • Publication number: 20140176646
    Abstract: A flow channel substrate has pressure chambers, and the pressure chambers communicate with nozzle openings for ejecting liquid. Each of piezoelectric elements on the flow channel substrate has a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to the electrodes. The wiring layer has an adhesion layer and a conductive layer on the adhesion layer. The adhesion layer contains at least one selected from nickel, chromium, titanium, and tungsten. The piezoelectric element has an insulating film at least between the wiring layer and the electrodes. The wiring layer and the electrodes of the piezoelectric element are coupled via contact holes created through the insulating film.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 26, 2014
    Applicant: Seiko Epson Corporation
    Inventors: Eiju HIRAI, Sayaka KIMURA
  • Patent number: 8756777
    Abstract: A method of manufacturing a ladder filter including first and second resonators includes: forming a piezoelectric film on an entire surface of a substrate that has respective lower electrodes of the first and second resonator formed thereon, an conductive film on the piezoelectric film, and a second film on the conductive film; forming a pattern of the second film in a prescribed region in the second area; forming a first film on an entire surface of the substrate; etching the first film, forming a pattern of the first film, the second film and the conductive film in the second area, and forming a pattern of the first film and the conductive film in the first area, to form respective upper electrodes from the conductor film; and thereafter, etching the piezoelectric film to form respective patterns of the piezoelectric film in the first and second areas, respectively.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: June 24, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Shinji Taniguchi, Tokihiro Nishihara, Tsuyoshi Yokoyama, Masafumi Iwaki, Go Endo, Yasuyuki Saitou, Hisanori Ehara, Masanori Ueda
  • Patent number: 8760231
    Abstract: A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: June 24, 2014
    Assignee: Seiko Epson Corporation
    Inventor: Kazuhiko Shimodaira
  • Patent number: 8736149
    Abstract: An electronic component includes: an element that is located on a substrate; a signal wiring that is located on the substrate and electrically connected to the element; a metal plate that is located so as to form a cavity on a functional part of the element and covers an upper surface of the cavity; a support post that is located on the substrate so as not to be located on the signal wiring, and supports the metal plate; and an insulating portion that covers the metal plate and the support post, and contacts a side surface of the cavity.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: May 27, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kazunori Inoue, Masafumi Iwaki, Tsutomu Miyashita, Kazuhiro Matsumoto