Abstract: Provided are an acoustic wave device and a method for manufacturing the same, the acoustic wave device being effectively prevented from expanding and contracting due to temperature change and having a small frequency shift. The acoustic wave device of the present invention has a piezoelectric substrate (1) having an IDT (2) formed on one principal surface of the piezoelectric substrate (1), and a thermal spray film (3) formed on an opposite principal surface (1b) of the piezoelectric substrate (1), the thermal spray film being of a material having a smaller linear thermal expansion coefficient than the piezoelectric substrate (1) and having grain boundaries and pores (4), at least a part of which is filled with a filling material (5).

Abstract: This disclosure provides implementations of electromechanical systems resonator structures, devices, apparatus, systems, and related processes. In one aspect, a sacrificial layer is deposited on an insulating substrate. A lower electrode layer is formed proximate the sacrificial layer. A piezoelectric layer is deposited on the lower electrode layer. An upper electrode layer is formed on the piezoelectric layer. At least a portion of the sacrificial layer is removed to define a cavity such that at least a portion of the lower electrode layer is spaced apart from the insulating substrate.

Abstract: A bulk acoustic wave resonator structure that isolates the core resonator from both environmental effects and aging effects. The structure has a piezoelectric layer at least partially disposed between two electrodes. The structure is protected against contamination, package leaks, and changes to the piezoelectric material due to external effects while still providing inertial resistance. The structure has one or more protective elements that limit aging effects to at or below a specified threshold. The resonator behavior is stabilized across the entire bandwidth of the resonance, not just at the series resonance. Examples of protective elements include a collar of material around the core resonator so that perimeter and edge-related environmental and aging phenomena are kept away from the core resonator, a Bragg reflector formed above or below the piezoelectric layer and a cap formed over the piezoelectric layer.

Abstract: A method for fabricating a small and low-profile surface acoustic wave device which can be formed collectively by a wafer process without causing deterioration in characteristics is provided. The surface acoustic wave device has a piezoelectric substrate 1, an IDT 2 formed on one major surface of the piezoelectric substrate 1 and having at least one comb-shaped electrode, and a protective cover 6 forming a hollow containing space 7 with the one major surface by covering the IDT 2 above the one major surface. The protective cover 6 is provide with a through hole 15 and composed, at least partially, of a photocurable material containing an acid generator which contains fluorine.

Abstract: A liquid ejecting head includes a flow passage substrate having a pressure generation chamber in communication with a nozzle opening. A piezoelectric element includes first and second electrode and a piezoelectric substance layer and is positioned over one surface of the flow passage substrate. The piezoelectric element is deformed to form a convex toward the pressure generation chamber when the piezoelectric element is driven. A protection film formed from an inorganic material covers the piezoelectric element and has an opening through which an upper surface of the second electrode is exposed. An end of the opening in the protection film viewed in a direction of the length of the pressure generation chamber is located closer to the center than is an area at which the center of curvature of a curve of the piezoelectric element that forms near a wall around the pressure generation chamber during deformation operation.

Abstract: A piezoelectric thin film structure includes a substrate, a silicon oxide film disposed on the substrate, a first aluminum oxide film disposed on the silicon oxide film, a lower electrode layer disposed on the first aluminum oxide film, a piezoelectric film layer disposed on the lower electrode layer, and an upper electrode layer disposed on the piezoelectric film layer.

Abstract: The present invention discloses a method for assembling a 3D microelectrode structure. Firstly, 2D microelectrode arrays are stacked to form a 3D microelectrode array via an auxiliary tool. Then, the 3D microelectrode array is assembled to a carrier chip to form a 3D microelectrode structure. The present invention uses an identical auxiliary tool to assemble various types of 2D microelectrode arrays having different shapes of probes to the same carrier chip. Therefore, the method of the present invention increases the design flexibility of probes. The present invention also discloses a 3D microelectrode structure, which is fabricated according to the method of the present invention and used to perform 3D measurement of biological tissues.

Abstract: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

Abstract: A oscillator include: a vibrator that vibrates in a thickness shear vibration mode; a first adsorption film formed in a first region in a first surface of the vibrator; a second adsorption film formed in a second region in a second surface of the vibrator opposing to the first surface; and a substrate with a surface on which the vibrator is erected, wherein the vibrator contacts the substrate in a third surface that is different from the first surface and the second surface.

Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric frame that supports and surrounds a tuning-fork type piezoelectric vibrating piece having a pair of vibrating arms. The device also includes a lid and a package base that are siloxane-bonded to the frame. The lid defines at least one frequency-adjustment hole extending through the thickness dimension of the lid from an inner major surface thereof (facing the frame) to an outer major surface of the lid. The package base defines at least one through-hole electrode passing via a respective electrode through-hole through the thickness of the base from an inner major surface thereof (facing the frame) to the outer major surface thereof. The electrode is connected to the piezoelectric vibrating piece. The lid and base include external electrodes, made of an electrically conductive material, that cover the through-holes and frequency-adjustment hole(s).

Abstract: A transducer array assembly includes a support structure having a plurality of predetermined openings therein for accommodating transducer components. Flexible circuits are embedded in the support structure. Each flexible circuit has first ends being positioned in the support structure predetermined openings. Terminal blocks are joined to the second ends. Transducer elements are positioned in the support structure predetermined openings and placed in electrical communication with the flexible circuit first ends. A polymer material is provided surrounding the transducer elements, said support structure, and said flexible circuit first ends. There is also provided a method for manufacturing the transducer array.

Abstract: A bulk acoustic wave resonator structure that isolates the core resonator from both environmental effects and aging effects. The structure has a piezoelectric layer at least partially disposed between two electrodes. The structure is protected against contamination, package leaks, and changes to the piezoelectric material due to external effects while still providing inertial resistance. The structure has one or more protective elements that limit aging effects to at or below a specified threshold. The resonator behavior is stabilized across the entire bandwidth of the resonance, not just at the series resonance. Examples of protective elements include a collar of material around the core resonator so that perimeter and edge-related environmental and aging phenomena are kept away from the core resonator, a Bragg reflector formed above or below the piezoelectric layer and a cap formed over the piezoelectric layer.

Abstract: An method of manufacturing a piezoelectric element easily and surely forms polymer coatings on peripheral end faces of the piezoelectric element without deteriorating a yield of the piezoelectric element. The method includes steps of cutting a piezoelectric element out from a base piezoelectric material plate so that peripheral end faces are formed to define a peripheral shape of the piezoelectric element, and forming polymer coatings on at least objective areas of the peripheral end faces of the piezoelectric element by vapor deposition polymerization, respectively.

Abstract: An improved process for producing a piezoelectric ceramic device is disclosed, wherein the process includes the following steps: securing a metal plate in a mold cavity body by maintaining a binding area on a top surface of the metal plate, and that the top surface other than the binding area is enveloped, confined and secured; coating a metal paste on the binding area; placing a piezoelectric ceramic powder on the metal paste; pressing a pressing pillar on the piezoelectric ceramic powder; securing the pressing pillar in position; heating the mold cavity body so as to sinter the piezoelectric ceramic powder as a sintered body, and heating the mold cavity body so as to treat the sintered body to become a not-yet polarized piezoelectric ceramic sheet. Therefore, the same mold is employed for the piezoelectric ceramic powder sintering, the heat treatment, and the positioning and binding to the metal plate.

Abstract: An actuator module including a piezoactuator, for example for a piezoinjector for metering fuel in an internal combustion engine, is proposed. The piezoactuator has piezoelements stacked one above another between an actuator head and an actuator foot and is provided with at least one elastomer layer enclosing the piezoelements. The elastomer layer is enveloped by a corrugated bellows or by telescopic tubes, composed of a material that is diffusion-impermeable with respect to a fuel to be metered by the piezoinjector. The corrugated bellows or the telescopic tubes have on their periphery grooves which can absorb expansions of the elastomer layer or of the piezoactuator.

Abstract: A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 ?m or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 ?m or less. The metal particles defining the lower plating films may be Cu particles.

Abstract: A method includes applying a lip, comprised of a first material, along at least a portion of an actuator of an electronic device, and applying a coating, comprised of an elastic material, to cover a part of the actuator, the coating disposed to facilitate actuation of the actuator.

Abstract: A surface acoustic wave device includes a piezoelectric element, an IDT electrode formed on the piezoelectric element for exciting a principal wave, a reflection film formed on the piezoelectric element having a higher reflectivity than the reflectivity of the piezoelectric element in a visible light wavelength region, and a light permeable dielectric layer formed on the piezoelectric element, at least a part of the IDT electrode, and the reflection film. Accordingly, when measuring the film thickness of the light permeable dielectric layer by light interference method, the reflected light from the reflection film having a higher reflectivity than the reflectivity of the piezoelectric element in a visible light wavelength region can be utilized, so that the film thickness can be measured more accurately.

Abstract: A biosensor for detecting particular substances biosensor comprises a piezoelectric material, an input transducer supported by the piezoelectric material to receive an input signal and propagate a corresponding acoustic wave within the piezoelectric material and an output transducer supported by the piezoelectric material to receive the acoustic wave. At least two chemically orthogonal or semi-orthogonal biolayers are supported by the piezoelectric material to receive substances to be tested and cause corresponding changes in the acoustic wave. The output transducer can transmit a corresponding output signal embodying separate channel data indicative of the substances received.

Abstract: An apparatus and methods for binding an analyte of interest in a sample are provided. The apparatus comprises a substrate with an exposed surface with an compound, that is electrostatically charged or capable of forming hydrogen bonds, provided bound to the solid substrate. A recombinant single chain antibody (scFv) molecule specific for the analyte of interest, having one or more amino acids with charged or hydrogen-bond forming sidechains in a linker polypeptide portion, is bound to the layer on the solid substrate. When the analyte of interest is present in the sample the scFv binds the analyte to the solid substrate. The apparatus can be used with an immunoglobulin layer to detect Fc receptors, so as to detect microorganisms such as Staphylococcus aureus having protein A or protein G.

Abstract: A piezoelectric/electrostrictive actuator, including a piezoelectric/electrostrictive element that includes at least one laminate including one piezoelectric/electrostrictive layer and one pair of electrodes disposed respectively on both sides of said piezoelectric/electrostrictive layer and has a moving part corresponding to a portion where said piezoelectric/electrostrictive layer is sandwiched by one pair of said electrodes and a non-moving part corresponding to a portion where said piezoelectric/electrostrictive layer is not sandwiched by one pair of said electrodes, and a moisture proof membrane disposed to cover at least the proximity of the boundary between said moving part and said non-moving part and consisting of silicone-based organic insulation material with storage elastic modulus of 100 kPa or less obtained by dynamic viscoelastic measurement using a parallel cone with diameter of 25 mm under a condition with strain of 0.1%, frequency of 1 Hz, gap of 0.5 mm and temperature of 22° C.

Abstract: A method and system for packaging and mounting a sensor to a flex plate for use in sensing, for example, torque. In some instances, a SAW sense die can be adhesively bonded to a metal disc that includes at least one locating feature formed in the metal disc. An insulator having lead pins can be adhesively bonded to the metal disc, and may surrounds at least part of a periphery of the sense die in a particular orientation. In some instances, a cap may be bonded over the insulator. The metal disc, along with the SAW sense die, can be aligned to the flex plate by, for example, matching the at least one locating feature formed in the metal disc with at least one corresponding locating feature of a cutout in the flex plate. The aligned metal disc and the flex plate can be bonded together by, for example, laser welding.

Abstract: The microacoustic component has a substrate that has at least one layer (composed of a dielectric or piezoelectric material, and a metallic strip structure. The layer is composed of a dielectric or piezoelectric material and/or the metallic strip structure have/has been produced or can be produced by the atomic layer deposition method.

Abstract: The present invention provides the multifunctional biological and biochemical sensor technology based on the integration of ZnO nanotips with bulk acoustic wave (BAW) devices, particularly, quartz crystal microbalance (QCM) and thin film bulk acoustic wave resonator (TFBAR). ZnO nanotips provide giant effective surface area and strong bonding sites. Furthermore, the controllable wettability of ZnO nanostructured surface dramatically reduces the liquid consumption and enhances the sensitivity of the biosensor device.

Abstract: An acoustic wave device includes an acoustic wave element including an IDT electrode provided on a substrate, and a protective film arranged to cover the acoustic wave element so as to stabilize characteristics. The protective film is a silicon nitride film composed of silicon and nitrogen as main components and when a composition ratio of the silicon to the nitrogen is represented by 1:X, X is about 1.15 or less.

Abstract: A spindle motor component of hard disk with composite coating layer and a composite coating method hereof. The spindle motor component of hard disk includes a motor component base (1) and the composite coating layer which is coated on the base (1). The composite coating layer consists of an electrodepositing coating layer (2) and a spraying coating layer (3). The composite coating method includes a step of coating the electrodepositing coating layer (2) on the surface of the motor component base (1) and coating the spraying coating layer (3) on the electrodepositing coating layer (2), wherein the weight ratio of tin in the electrodepositing coating layer (2) is between 60 ppm to 300 ppm and the weight ratio of tin in the spraying coating layer (3) is no more than 50 ppm.

Abstract: A groove is formed on a handling member, on a face to be fixed to an element, the groove making up a portion of a channel that externally communicates in the state of being fixed to the element. In the fixing process of the substrate and then handling member, the handling member is fixed so that the edge direction of the vibrating membrane supporting portion and the edge direction of the groove of the handling member intersect. Thus, the probability that a membrane will break during handling or processing of the substrate is reduced, and the handling member can be quickly removed from the substrate.

Abstract: A piezoelectric/electrostrictive element with improved moisture resistance while having less degradation in its piezoelectric/electrostrictive properties and a method of manufacturing such a piezoelectric/electrostrictive element are provided. A laminated vibrator of a piezoelectric/electrostrictive element has a structure in which an electrode film, a piezoelectric/electrostrictive film, another electrode film, another piezoelectric/electrostrictive film, and another electrode film are laminated one above the other. In the manufacture of the piezoelectric/electrostrictive element, the laminated vibrator and a counter electrode are immersed in an electrodeposition coating fluid containing a coating component so that the electrodeposition coating fluid is brought into contact with the surfaces of the laminated vibrator and the counter electrode.

Abstract: A piezoelectric resonator includes: a package having a cavity; a plurality of electrode pads formed within the cavity; a first bonding section and a second bonding section that include silicone base conductive adhesive and are formed on the plurality of the electrode pads, respectively; and a piezoelectric vibrating element having one end supported by the first bonding section and the second bonding section, wherein the piezoelectric vibrating element has a piezoelectric substrate having mutually opposing first face and second face, a first electrode that is formed on the first face and electrically connected to the first bonding section, and a second electrode that is formed on the second face and electrically connected to the second bonding section, wherein an area of the piezoelectric vibrating element supported by the first bonding section and the second bonding section defines a supported region and an area of the piezoelectric vibrating element that is not supported by the first bonding section or the s

Abstract: Providing a piezoelectric vibrating reed which has low disconnection possibility and ensures reliability for stable operation without requiring strict exposure position accuracy.

Abstract: A groove is formed on a handling member, on a face to be fixed to an element, the groove making up a portion of a channel that externally communicates in the state of being fixed to the element. The handling member is fixed so that the cleavage direction of the vibrating membrane and the edge direction of the groove of the handling member intersect. Thus, the probability that a membrane will break during handling or processing of the substrate is reduced, and the handling member can be quickly removed from the substrate.

Abstract: A handling member is prepared that provides a channel that can withstand subsequent back face processing as to a substrate having elements made up of a substrate and a membrane, and the handling member is fixed to the substrate so that at least a portion within the elements are supported by the handling member. This provides a manufacturing method wherein the physical strength of an element at the time of manufacturing an electromechanical transducing apparatus is strengthened, and the handling member is easily detached in a short time after processing of the element.

Abstract: An acoustic wave device has: a piezoelectric body; an interdigital electrode that is arranged on the piezoelectric body and excites an acoustic wave; and a dielectric layer that is arranged on the piezoelectric body so as to cover the interdigital electrode. The dielectric layer includes a composition changing portion made up of a medium where propagation velocity of a transverse wave continuously increases upward. With this configuration, it is possible to shift a spurious radiation by a high-order mode that propagates inside the dielectric layer to a higher frequency, so as to reduce an influence of the spurious radiation by the high-order mode.

Abstract: Provided are free-standing ductile composites and methods of making free-standing ductile composites. The method of making a free-standing ductile composite can include providing a substrate and releasably bonding one or more piezoelectric elements to the substrate. The method can also include kerfing the piezoelectric elements in a predetermined pattern to form a kerfed pattern, filling the kerfed pattern with a polymer to form a polymer-piezoelectric composite, and lapping the polymer-piezoelectric composite. The method can further include releasing the polymer-piezoelectric composite from the substrate.

Abstract: An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.

Abstract: There is provided a surface mount oscillator of a junction type in which the size of an IC chip is increased while maintaining high performance thereof, and the outer dimension of the oscillator in plan view are small.

Abstract: A piezoelectric device includes a piezoelectric substrate, a conductive pattern which is provided on one main surface of the piezoelectric substrate and which includes an IDT electrode, a supporting layer which is arranged on the one main surface of the piezoelectric substrate so as to surround the periphery of an IDT-forming region in which the IDT electrode is provided and which has a thickness greater than that of the IDT electrode, and a cover layer which is arranged on the supporting layer and which covers the IDT-forming region. The supporting layer includes removed sections provided at a plurality of positions at least in a region close to the IDT-forming region, the removed sections being obtained by partially removing a portion of the supporting layer to be bonded to the one main surface of the piezoelectric substrate.

Abstract: A casing for encapsulation of an electrical component, for example a piezoelectric actuator, comprising an outer layer of a semipermeable material and an inner layer comprising a chemically active, hydrophilic substance that chemically combines with water to form a compound.

Abstract: A SAW device having metal electrodes on a surface of the piezoelectric substrate includes a dielectric layer deposited on the surface. Depositing the layer results in seams extending upward from the electrodes extending above the surface of the substrate. An additional seam results from one seam extending from one electrode joining a second seam extending from an adjacent electrode within the dielectric layer and is generally formed above the height of the electrodes. The additional seam is removed through planarization or the like. The dielectric layer may be further planarized for providing a thickness of the dielectric layer above the electrodes as desired.

Abstract: The piezoelectric element includes a first electrode disposed on a substrate, a piezoelectric material layer disposed on the first electrode, a second electrode disposed on the piezoelectric material layer, and a protective film covering at least a side surface of the piezoelectric material layer. The side surface of the piezoelectric material layer has a plurality of grooves extending along the direction from the second electrode toward the first electrode.

Abstract: A piezoelectric actuator (2) comprising a stack of one or more piezoelectric elements (4) defining an external surface, and passivation means (20) applied to the external surface of the stack, wherein the passivation means (20) includes a self-supporting polyimide material (20b) (e.g. in the form of a layer, film or membrane).

Abstract: A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ?100° C. to ?160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.

Abstract: An SH wave type surface acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and constituted of Al or an alloy mainly containing Al and that uses a SH wave as an excitation wave. The piezoelectric substrate is a crystal plate in which a cut angle ? of a rotary Y cut quartz substrate is set in a range of ?64.0°<?<?49.3° in a counter-clockwise direction from a crystal axis Z and in which a surface acoustic wave propagation direction is set at 90°±5° with respect to a crystal axis X. An electrode film thickness H/? standardized by a wavelength of the IDT electrode is 0.04<H/?<0.12, where ? is a wavelength of the surface acoustic wave to be excited, and a main surface of the piezoelectric substrate is etched by a thickness of 0.002 ?m or more.

Abstract: A surface acoustic wave device excellent in reliability and a method of manufacturing the same are provided. The surface acoustic wave device comprises a piezoelectric substrate (1) for propagating an surface acoustic wave thereon, an IDT (2) formed on a first main surface of the piezoelectric substrate (1) and a protective cover (6) formed of a photocurable material and covering a formation region of the IDT (2), thereby forming a hollow containing space (7) together with the first main surface, which has an acid generating portion containing an acid-generating agent in a region at its lower end.

Abstract: A surface acoustic wave element includes: a diamond layer; an alumina nitride layer provided on the diamond layer; a silicon oxide layer provided on the alumina nitride layer; and a pair of electrodes provided between the alumina nitride layer and the silicon oxide layer, the electrodes applying a voltage to the alumina nitride layer. If a thickness of the alumina nitride layer is represented by H1, a thickness of the silicon oxide layer is represented by H2, a wavelength of a surface acoustic wave is represented by ?, x is defined as x=2?H1/?, and y is defined as y=2?H2/?, (x, y) meets all of the following formulas 1 to 4 below. That is, the formula 1 is y?0.750×x+0.325; the formula 2 is y??0.300×x+1.690; the formula 3 is y??0.500×x+0.950; and the formula 4 is y?0.700×x?0.610.

Abstract: A micro-electromechanical systems (MEMS) ultrasonic transducer device includes a substrate defining an opening and an active transducer having multiple of active layers stacked over the opening of the substrate. The active transducer is completely encapsulated by multiple passivation layers.

Abstract: An acoustic boundary wave device includes a piezoelectric body, an IDT layer formed on the piezoelectric body, a pad electrode layer formed on the piezoelectric body and connected to the IDT layer, a first dielectric layer formed on the piezoelectric body and covering at least a part of the IDT electrode layer, and a second dielectric layer formed on the piezoelectric body, covering the first dielectric layer, and having an opening through which at least a part of a top face of the pad electrode layer is exposed. The metal forming lateral faces of the pad electrode layer diffuses more readily into the first dielectric layer than into the second dielectric layer. The second dielectric layer covers the lateral faces of the pad electrode layer and prevents the first dielectric layer from touching the lateral faces of the pad electrode layer.

Abstract: An arrangement is proposed for forming a piezoelectric actuator, which has at least one piezoelectric element that in each case consists of a multi-layer structure of piezoelectric-layers, wherein internal electrodes arranged between the piezoelectric-layers in the direction of the build-up of the layers of the piezoelectric element, have an electrical voltage of different polarity alternately applied to them. Around the piezoelectric element, or in the case of multiple piezoelectric elements positioned in series in the activation direction, around the piezoelectric elements, and at least partially around the actuator head and the actuator foot there is arranged a covering system made from at least one layer of an insulating material. The at least one layer encloses the joints between the piezoelectric element or elements and the actuator head and the actuator foot, forming a seal.

Abstract: A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. In the first embodiment, a cavity is hollowed out in the cover to house the Application Specific Integrated Circuit oscillator and the resonator. In a second embodiment, the cavity is formed in the base member with a plurality of pedestal shelves to hold the resonator above and out of contact with the electrical circuitry for the oscillator and thermal controls.

Abstract: An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.