Abstract: The subject invention pertains to a method for determining the affinity between binding partners, or a property of one of the binding partners dependent on the affinity, comprising the steps of: (i) contacting the binding partners, one of which is immobilised on a surface; (ii) oscillating the surface at increasing amplitude; and (iii) detecting a dissociation event. An analogous method can be used to separate a target analyte from a composition. The subject invention also pertains to an apparatus for determining the affinity between binding partners, and comprises: a surface (10) having one binding partner (16) immobilised thereon; means for oscillating the surface at increasing amplitude; and means (14, 15) for detecting a dissociation event.

Abstract: A method for making a piezoelectric actuator comprises coating at least one of a first surface and a second surface of a piezoelectric element with a polyimide adhesive. The piezoelectric element is then heated to dry the adhesive. Afterwards, the piezoelectric element is inserted between a first metallic layer and a second metallic layer to form an assembly. The assembly is placed in a press. While the assembly is in the press, the polyimide adhesive is cured at a curing temperature which does not depole the piezoelectric element, thereby bonding the piezoelectric element between the first metallic layer and the second metallic layer.

Abstract: An o-ring sealing device, molded with an imbedded piezoelectric element, for use in vacuum systems. The imbedded element, of a circumferential length, has an oblong cross-sectional shape, the oblong shape having a pair of ends for externally connecting to a signal processor. The piezoelectric element is concentrically disposed and centrally placed within a mold cavity of a predetermined diameter. The cavity is filled with an elastic material fully encapsulating and insulating the piezoelectric element.

Abstract: A spraying device comprises a spraying plate, having a plurality of tiny holes, a vibrating element, set on a periphery of the spraying plate, and driving a vibrating movement thereof, a wrapping layer, made of soft material and tightly surrounding the vibrating element, sealing the vibrating element from the liquid, and a fastening cap, allowing for quick mounting and dismounting of the spraying device; wherein the vibrating movement of the spraying plate causes liquid adjacent to a lower side of the spraying plate to be periodically compressed and thereby to be pressed through the holes of the spraying plate, and wherein the wrapping layer prevents external interference with the vibrating movement, at the same time minimizing transmission losses of vibrational energy, enhancing effectivity of spraying.

Abstract: A surface acoustic wave die system and method are disclosed herein, including a surface acoustic wave sensor comprising one or more surface acoustic wave die disposed and hermetically sealed between a base and a cover. An adhesive is generally for securing one or more of the surface acoustic wave die to the base, which is configured with a pattern of cross hatches formed thereon in order to permit the adhesive to adhere to the base. The adhesive is placed under a location wherein surface acoustic wave die is to be located. The surface acoustic wave die is thereafter pressed into the adhesive, whereby upon a subsequent curing of the adhesive, the surface acoustic wave die is held securely in place, while remaining flexible as required by sensing applications associated with the surface acoustic save sensor.

Abstract: An acceleration insensitive piezo-microresonator provides substantially reduced acceleration sensitivity with a plano—plano piezo-microresonator, upper gap and lower gap embedded in a rigid structural supporting member holding major surfaces of the piezo-microresonator firm and steady. The piezo-microresonator has neither electrodes on its surfaces nor contacts with any electrodes. Electrodes are doped regions incorporated into the support member. The upper and lower gaps are adjacent to the major surfaces of the piezo-microresonator, permitting it to vibrate freely. The support member surrounds and supports the plano—plano piezo-microresonator plate, upper gap and lower gap, maintaining a constant upper gap height and lower gap height. The electrodes provide a thickness-directed electrical field exciting the piezo-microresonator. A method of desensitizing a resonant frequency of a piezo-microresonator to acceleration stresses is also provided.

Abstract: A surface mount quartz crystal oscillator comprises a package body having a recess, a quartz crystal blank having extending electrodes extending from the outer periphery of the crystal blank, an IC (integrated circuit) chip secured to an inner bottom surface of the recess and having at least an oscillator circuit connected to the crystal blank, and an insulator disposed on the IC chip. A pair of conduction terminals are disposed on an inner wall surface of the recess and electrically connected to the IC chip. The crystal blank is secured to the insulator with a conductive adhesive at positions from which the extending electrodes are extended, and the conductive adhesive electrically connects each extending electrode to one conduction terminal associated therewith.

Abstract: A surface acoustic wave device includes a ZnO dielectric thin film on a quartz substrate and an IDT electrode having strips between the ZnO thin film and the quartz substrate. The IDT electrode has at least one region where the strips are disposed at an interval defined by approximately a half-wavelength of the surface acoustic wave. The duty ratio of the IDT electrode is preferably more than about 0.5. Alternatively, a protrusion is formed via a slope in the region of the ZnO thin film where the IDT electrode is disposed, and the inclination angle ? of the slope is more than about 30°.

Abstract: A method of manufacturing a piezoelectric element structure having a supporting substrate and a piezoelectric film supported on the supporting substrate. A first layer, and a second layer having zirconium, each provided with a perovskite structure, are formed in that order on the supporting substrate. The two layers are formed to be in contact with each other or laminated through an intermediate layer. The temperature is set to 500° C. or more at the time of formation of the layers, and cooling is subsequently provided from the formation temperature at least to 450° C. with a cooling speed of 30° C./min or more.

Abstract: An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.

Abstract: A piezoelectric device is formed of a supporting substrate with first and second conductive traces on a first surface. A piezoelectric material layer is laminated to the supporting substrate with a first surface of the piezoelectric material layer electrically connected to the second conductive trace and a second surface of the piezoelectric material layer electrically conducted to the first conductive trace. A protective coating is applied over the piezoelectric material layer so that at least a portion of the first and second conductive traces are exposed.

Abstract: A SAW device includes a SAW element having an IDT and a conductive pad connected to the IDT provided on a piezoelectric substrate, and an external terminal. The SAW device also includes an insulating layer having an exciting portion protective opening defining a space for protecting a SAW-exciting portion including the IDT and a conductive opening. The external terminal is connected to the conductive pad through a wiring extending in the conductive opening.

Abstract: The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.

Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.

Abstract: A transducer having a ceramic element in which the ceramic is elevated above a polymer and a method of manufacturing the transducer. The transducer comprises a piezo-composite element comprising a ceramic element embedded in epoxy. In an array, the ceramic elements may be in the form of posts. The plurality of ceramic elements is slightly elevated above the polymer and in staggered arrangement with the polymer. The element is manufactured by first grinding the face of the composite and removing damaged ceramic by acid etching the ceramic. The epoxy is removed by plasma etching so that the ceramic is above the epoxy. The composite is sputter plated so that a maximum temperature that could damage the plating is not exceeded. The ceramic is then poled so that a maximum temperature that could damage the plating is not exceeded. Contacts are then attached to the plating adjacent the ceramic.

Abstract: A piezoelectric diaphragm has principal-surface electrodes formed on upper and lower principal surfaces of a multilayer ceramic body. An internal electrode is disposed in an interface between adjacent piezoelectric ceramic layers. The upper and lower principal surfaces of the multilayer ceramic body are substantially entirely covered with a resin layer. A first cutout is formed in a side-edge portion, along the first side surface electrode, of the upper resin layer such that the upper principal-surface electrode is partially exposed in the first cutout. A second cutout is formed in a side-edge portion, along the first side surface electrode, of the lower resin layer such that the lower principal-surface electrode is partially exposed in the second cutout. The locations of the first and second cutouts formed in the upper and lower resin layers, respectively, are selected such that they do not oppose each other.

Abstract: A method for preventing operational and manufacturing imperfections in piezoelectric micro-actuators by physically and electrically isolating conductive layers of the piezoelectric material. At least one layer of electrically-conductive material and at least one layer of electrically-insulative material are applied to an actuator finger. The conductive material and the insulative material are applied one layer upon another in an alternating manner. The layer of insulative material is larger in area than the layer of conductive material. An insulative layer, applied to the actuator finger and sandwiching a conductive layer between the insulative layer and the actuator finger, at least partially encloses and electrically isolates the conductive layer by covering the conductive material on at least three sides.

Abstract: A method of flip-chip mounting a circuit device to a substrate in a manner that avoids damage and impairment of a fragile or otherwise sensitive element on the device facing the substrate, and a circuit assembly produced thereby. The assembly includes a substrate having at least two sets of bonding sites spaced apart from each other to define an intermediate surface region therebetween. The device is attached to the bonding sites with solder connections, with the solder connections being present on a surface of the device that faces the substrate and on which the element is present so that the element overlies the intermediate surface region of the substrate. An underfill material is present between the device and the substrate and encapsulates the solder connections. The underfill material is separated from the intermediate surface region of the substrate so that the underfill material does not contact the element.

Abstract: An ultrasonic apparatus comprising a hand piece (1) within a handle region (2), a connection tube (3) for connecting to a supply tube, wherein rock salt solution and medical healing agents such as heparin, antibioticts and the like are fed through the feed channel (5) to the sonotrode (7) or ultrasonic treatment head. The ultrasound energy is fed to the hand piece (1) through the connection line to the ultrasonic generator (4) in a conventional way.

Abstract: The invention provides a piezoelectric device having a structure which resists impact from the exterior of the device, and stress applied to a piezoelectric resonator element, and which can enhance electrical conductance between an electrode side of a package base and the piezoelectric resonator element, and to provide a manufacturing method therefor. A piezoelectric device having a structure in which a piezoelectric resonator element is bonded to electrodes provided on a package base, includes mounting electrodes, which are provided on the package base, to which a driving voltage is carried, via conduction paths, and on which the piezoelectric resonator element is mounted; and anchor members, which are disposed on the surfaces of the mounting electrodes, and which are formed of a material having superior adhesion to the surfaces thereof, in which the piezoelectric resonator element is bonded to these conductive anchor members with silicone-based conductive adhesives provided therebetween.

Abstract: A single crystal piezo (SCP) apparatus and method of forming same. The apparatus is ideally suited for actuator and energy harvesting applications. The apparatus includes an SCP layer bonded to a surface of a flexible metal layer while the metal layer is held flattened within a press or other tool. Once the bonding process is complete, the metal layer imparts a compressive strain to the SCP layer bonded thereto. A layer of uniaxial graphite may also be bonded to the SCP layer to eliminate the poison's ratio tension that would otherwise be created in the SCP layer.

Abstract: A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin.

Abstract: A piezoelectric/electrostrictive device is provided, including a pair of mutually confronting thin plate portions, a fixing portion for supporting the pair of thin plate portions, movable portions provided at tip end portions of the pair of thin plate portions and having mutually confronting end surfaces, and piezoelectric/electrostrictive elements disposed on respective thin plate portions 12a and 12b. At least both side surfaces of the thin plate portions and the piezoelectric/electrostrictive elements are covered with coating films made of a material with a low thermal expansion coefficient.

Abstract: A method for making thin film piezoelectric elements including forming a flat-plate laminate by laminating a first electrode layer, a piezoelectric thin film, and a second electrode layer, on one surface of an element forming substrate, and forming on the one surface a plurality of thin film piezoelectric elements including connecting electrodes for electrically connecting the first electrode layer and the second electrode layer to external equipment, including forming the element holding layer including resin over the one surface of the substrate including the thin film piezoelectric elements; bonding the one surface of the substrate, opposed to a temporary fixing substrate and covered with the element holding layer, on the temporary fixing substrate by using a fixing resin; covering a peripheral area with a specified width; and removing the element forming substrate by etching in an area other than the area covered with the fixing resin, and separating the thin film piezoelectric elements held by the elemen

Abstract: An electromechanical functional module and associated process for production thereof, which includes at least one transducer, at least one upper fiber cover layer, which is nonconducting and is positioned over the at least one transducer having a first electrode and a second electrode, at least one lower fiber cover layer, which is nonconducting and is positioned below the at least one transducer, at least one fiber interlayer, which is nonconducting with at least one cut-out for accommodating the at least one transducer, at least one upper electric contact strip that is integrally connected to the at least one upper fiber cover layer and in contact with the first electrode of the at least one transducer, and at least one lower electric contact strip that is integrally connected to the at least one lower fiber cover layer and in contact with the second electrode of the at least one transducer, wherein the at least one upper fiber cover layer, the at least one lower fiber cover layer and the at least one trans

Abstract: A method is furnished for a treatment of septic wounds. A hand piece of a sonotrode is connected to a liquid storage. Access to a wound is furnished to the sonotrode. A liquid atomized by ultrasound is delivered to the wound through a sonotrode channel disposed in the sonotrode. Bacteria in the area of the wound are destroyed by the ultrasound emitted by the sonotrode. The method allows to remove a prosthesis not longer desired from a patient. The area left open by the removed prosthesis and/or a bone is filled with a liquid. The sonotrode is then entered into the liquid for propagating ultrasound through the liquid and thereby destroying bacteria present in the liquid.

Abstract: A surface acoustic wave device used in, for example, a mobile communications field as a filter or duplexer and the like to handle high frequencies of about several GHz is fabricated by flip-chip-connecting a surface of a piezoelectric substrate to a base board facing thereto, emitting particulate first sealing material from above a back face of the piezoelectric substrate to apply the first sealing material to the back face of the piezoelectric substrate and hang the first sealing material from edges of the piezoelectric substrate to the base board to form bridging, and forming second sealing material on the first sealing material. These operations provide a manufacturing method of a small-sized surface-mounting surface acoustic wave device appropriate for flip-chip connection.

Abstract: A surface acoustic wave device applied to a filter, an oscillator, a delay element, or the like has at least a surface acoustic wave element with metal electrodes formed on a piezoelectric substrate to excite surface acoustic waves, a plastic casing base to accommodate the surface acoustic wave element inside a casing, and a plastic cap to seal a hollow in the casing. If the plastic casing base and plastic cap have the same material color, there will be a high risk of misjudging the front and back faces of a plastic package. Providing the plastic casing base and plastic cap with different material colors may reduce inserting direction errors when inserting the surface acoustic wave device into, for example, a printed board.

Abstract: There is put forward a piezolectric element for converting pressure signals into electrical signals and vice versa, with a porous homogeneous ceramic body and with at least two electrodes attached to the ceramic body. The porous ceramic body comprises open pores and is preferably hermetically sealed on the whole surface with an elastic coating. Furthermore there is suggested an oscillation transducer with the piezolement which is accommodated in a housing. The piezolectric element is with one end face rigidly connected to the base of the housing. The other end face represents a surface which is sensitive to oscillations, which preferably is not covered by the housing. The volume of the housing is filled with a casting compound, wherein the piezolectric element is mechanically decoupled from the casting compound.

Abstract: A method of manufacturing a thin film piezoelectric element, wherein main electrode layer, piezoelectric thin film, and opposed electrode layer respectively having specified shapes are first formed on first substrate and second substrate, and after that, the opposed electrodes are opposed and bonded to each other, and insulating resin layer is formed over the peripheral portion thereof, and then the second substrate is removed, the insulating resin layer is etched, and connecting electrode pad is formed, and finally, the first substrate is removed to obtain a completely separated thin film piezoelectric element. By this method, it is possible to improve the reproducibility of shapes and to prevent trouble such as shorting between the electrodes which hold the piezoelectric thin film, thereby making it possible to provide a thin film piezoelectric element that may assure high yield without variation in piezoelectric characteristics, and its manufacturing method.

Abstract: An ultrasonic transducer system has at least one ultrasonic transducer. Each ultrasonic transducer includes a housing having a wall that is made at least in part of an organic structural material that is substantially impervious to water; and an ultrasonic sensor element located at least in part within the housing and positioned to transceive ultrasonic signals. The wall is preferably cylindrical in shape and made of polyvinylchloride plastic. An electrically grounded shield is within the housing and adjacent to an interior wall surface. The ultrasonic sensor element may be a piezoelectric copolymer film ultrasonic sensor element.

Abstract: At least two electric elements (203) such as semiconductor chips or surface acoustic wave devices are mounted on wiring patterns (201), and the electric elements (203) are sealed with a thermosetting resin composition (204). An upper surface of the at least two electric elements (203) and an upper surface of the thermosetting resin composition (204) are abraded at the same time, thereby forming surfaces substantially flush with each other. Since they are abraded while being sealed with the thermosetting resin composition (204), it is possible to reduce the thickness without damaging the electric elements (203). Also, the electric elements (203) and the wiring patterns (201) can be prevented from being contaminated by an abrasive liquid. In this manner, it is possible to obtain an electric element built-in module whose thickness can be reduced while maintaining its mechanical strength.

Abstract: A compound electro-acoustic transducer for producing acoustic signals has a plurality of elements. Each element has a piezoelectric disk with electrically conductive plates fixed on the top and bottom sides of the piezoelectric disk. A stud is joined to an outer face of each plate. Conductors can be joined to each stud. The elements can be assembled on a resilient structure to form an array. Elements can be used in the array or individually accessed.

Abstract: An electronic component includes a case substrate. Substrate electrodes having a substantially spherical outer surface are disposed on at least a first principal surface of the case substrate. A piezoelectric resonator is mounted on the case substrate such that the piezoelectric resonator is bonded to the outer surfaces of the substrate electrodes by a conductive bonding material and is supported by the substrate electrodes in a point-contact manner. Also, the formula, Lk−2We<Lp<Lk−We, is satisfied where Lp is the length of the piezoelectric resonator, Lk is the length of the case substrate, and We is the length of the substrate electrode.

Abstract: A modular actuator assembly includes one or more plates or elements of electro-active material bonded to an electroded sheet, preferably by a structural polymer to form a card. The card is sealed, and may itself constitute a practical device, such as a vane, shaker, stirrer, lever, pusher or sonicator for direct contact with a solid or immersion in a fluid, or may be bonded by a stiff adhesive to make a surface-to-surface mechanical coupling with a solid workpiece, device, substrate machine or sample. The structural polymer provides a bending stiffness such that the thin plate does not deform to its breaking point, and a mechanical stiffness such that shear forces are efficiently coupled from the plate to the workpiece. In further embodiments, the card may include active circuit elements for switching, powering or processing signals, and/or passive circuit elements for filtering, matching or damping signals, so that few or no connections to outside circuitry are required.

Abstract: In a component having vibration-damping properties, a mixture for manufacturing the component, and a method of manufacturing such a component, the component has granular and/or grain- and/or flake-shaped piezoelectric particles which are embedded in a polymer matrix in a proportion of at least 10 volume %. In order to improve the damping effect, at least some of the piezoelectric particles have a polarization which is different from zero.

Abstract: A piezoelectric flexural transducer having an elongated support body (2) which on at least one longitudinal side is provided with a piezoelectric unit (5). The piezoelectric unit (5) has one or more piezoelectric material layers (12) and electrodes (13a and 13b) associated with same. Furthermore, the piezoelectric unit (5) includes an electrically insulating coating surrounding the body (8) right round it, the section (26) of the coatings lying between the piezoelectric body (8) and the support body (2) being provided with one or more electrically conductive vias (27a and 27b). The latter provide the necessary electrical connection between the electrodes (13a and 13b) and the support body (2).

Abstract: A piezoelectric resonator includes a piezoelectric resonating element, and a first exterior substrate and a second exterior substrate, laminated over and under, respectively, the piezoelectric resonating element. In the piezoelectric resonator, the first exterior substrate and the second exterior substrate each include a multilayer substrate having at least one layer of an internal electrode.

Abstract: A pulse detection device has a base plate having a first main surface disposable against a part of a living body during use of the pulse detection device, a second main surface disposed opposite the first main surface, and a channel formed in the second main surface. A first piezoelectric element is disposed in the channel of the base plate for transmitting an ultrasonic signal toward an artery in the living body. A second piezoelectric element is disposed in the channel of the base plate for receiving the ultrasonic signal transmitted by the first piezoelectric element and reflected by the artery.

Abstract: PZT crystals are peripherally coated in manufacture by cutting a series of intersecting first kerfs in a wafer comprising a plurality of PZT crystal precursors, filling the kerfs with a coating resin, and cutting a second, narrower kerf in the locus of the first kerfs to separate the crystals while providing them a peripheral coating of the coating resin.

Abstract: A fiber composite component has a piezoelectric actuator or sensor integrated therein. Electric feed lines for the actuator or sensor are constructed in the form of electrically insulated thin wires which exit the fiber composite almost perpendicularly to the laminate layers, so that the fibers of the fiber composite component are not severed by the leading-out of the feed lines, but are slightly pushed apart.

Abstract: The resonator according to the invention, which is intended to be mounted in a case, includes a tuning fork shaped part (42) with two parallel arms (44, 46) connected to each other by a base (48) and carrying electrodes (52, 54) to make them vibrate, these electrodes being connected to connection pads (60, 62) intended to be electrically connected to the exterior of the case. In accordance with the invention, the resonator (40) also includes a central arm (50) attached to the base (48) and located between the arms (44, 46) of the tuning fork shaped part (42), substantially equidistant from them, this central arm (50) having a greater mass than that of the arms of the tuning fork shaped part and the connection pads (60, 62) are carried by this central arm. This resonator (40) is mounted in a case of parallelepiped shape by fixing its central arm (50) to at least one support secured to the bottom of the case.

Abstract: The invention relates to a piezoelectric actuator, in particular for actuating control valves or injection valves in motor vehicles, having an actuator body in the form of a multilayered laminate made up of stacked layers of piezoelectric material with intervening metallic or electrically conductive layers that function as electrodes, and the end faces of this actuator body are respectively contacted by a top plate oriented toward the valve having an axially protruding valve tappet and a bottom plate at the opposite end, wherein the actuator rests in an axial bore of a valve housing and is prestressed at the ends in the axial direction between the top plate and the bottom plate by means of a spring element.

Abstract: The invention concerns a piezoelectric resonator piece of a piezoelectric resonator having electrode patterns for forming exciting electrodes each of which is composed of an under a metal layer. Each of the electrode patterns for forming conduction electrodes is composed of the under metal layer except the curved or bent portions of the sides of the piezoelectric resonator piece and each of the electrode patterns in these portions are composed of the under metal layer and a gold electrode layer. It is thus possible to provide a piezoelectric resonator in which, even when noble metal layers are partially removed for increasing adhesion of surface protecting films, exciting electrodes are not brought into an open state between the upper side and the lower side of a piezoelectric resonator piece.

Abstract: A piezoelectric type electric acoustic converter achieves large improvement in shatter resistance strength, increased operating efficiency and reduced size, and includes piezoelectric ceramic layers which are laminated to form a laminate. Main surface electrodes are disposed on the front and back main surfaces of the laminate, and an internal electrode is disposed between respective ceramic layers. A side electrode which connects the main surface electrodes, and a side electrode which is conducted to the internal electrode are formed on the side surface of the laminate. All the ceramic layers are polarized in the same direction, and by applying an alternating signal between the main surface electrodes and the internal electrode, bending vibration of the laminate occurs. The front and back surfaces of the laminate is almost entirely covered with resin-layers.

Abstract: An electronic component includes a case substrate. Substrate electrodes having a substantially spherical outer surface are disposed on at least a first principal surface of the case substrate. A piezoelectric resonator is mounted on the case substrate such that the piezoelectric resonator is bonded to the outer surfaces of the substrate electrodes by a conductive bonding material and is supported by the substrate electrodes in a point-contact manner. Also, the formula, Lk−2We<Lp<Lk−We, is satisfied where Lp is the length of the piezoelectric resonator, Lk is the length of the case substrate, and We is the length of the substrate electrode.

Abstract: A method for manufacturing a flexural plate wave sensor includes the steps of depositing an etch-stop layer over a substrate, depositing a membrane layer over the etch stop layer, depositing a piezoelectric layer over the membrane layer, forming a first transducer on the piezoelectric layer and forming a second transducer on the piezoelectric layer, spaced from the first transducer. The method further includes the steps of etching a cavity through the substrate, the cavity having substantially parallel interior walls, removing the portion of the etch stop layer between the cavity and the membrane layer to expose a portion of the membrane layer, and depositing an absorptive coating on the exposed portion of the membrane layer.

Abstract: The invention relates to methods, kits and systems for determining an analyte in a liquid sample as well as the use thereof for concentration analysis and screening purposes. In one method, a specific binding partner to the analyte is permitted to compete with a conjugate containing the analyte or an analyte analogue for the binding to free analyte. The conjugate also contains a component that specifically binds to a solid support so that reacted and unreacted conjugate are bound thereto when the reaction solution is contacted with the solid support. The amount of analyte is then determined by measuring by a label-free mass-detection technique, such as surface plasmon resonance, the amount of binding partner immobilized on the solid support via the reacted conjugate. This is made possible by the binding partner having a considerably greater mass than the conjugate. Variants of this method are also disclosed.

Abstract: The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.

Abstract: The invention relates to a piezoelectric actuator, in particular for actuating control valves or injection valves in internal combustion engines in motor vehicles, having a piezoelectric actuator body, in particular in the form of a multilayer laminate of layered plies of piezoelectric material and intervening metal or electrically conductive layers acting as electrodes, in which one of the face ends of the actuator body is fixed on an actuator base, and the actuator body is surrounded by a module wall so as to define an interstice there between, and the interstice is filled with an elastic or plastic electrically insulating material of good thermal conductivity, which is solid at least in the temperature range below the operating temperature of the actuator.