Abstract: A system for testing an electronic device comprises a first output, a second output, and a third output connected to a positive input, an identification input, and a negative input of the electronic device, respectively. The system further comprises a switch comprising at least two dynamic contacts, each of which is connected to a resistor for the use of identification.

Abstract: A circuit for detecting changes in resistance at a solder joint connecting a constant voltage source supplying a first voltage and a pin of an array package during operation of the array package includes: a test circuit for applying a second voltage different from the first voltage at a side of the solder joint opposite the constant voltage source; and a monitoring circuit for monitoring an output of the test circuit, wherein the test circuit is configured to output the first voltage when the resistance at the solder joint is below a threshold value, and to output a voltage other than the first voltage when the resistance at the solder joint is above the threshold value, and wherein the monitoring circuit is configured to indicate a failure of the solder joint connection when the voltage other than the first voltage is output by the test circuit.

Abstract: A testing device for testing surface-mounted (SM) memory connectors on a circuit board is provided. The testing device includes a main control circuit storing standard pin information of the SM memory connectors. A data collecting circuit is connected to the main control circuit and to at least one SM memory connector of the circuit board. A display unit is connected to the main control unit. The main control circuit directs the at least one data collecting circuit to read pin information of the SM memory connector and transmit the pin information to the main control circuit. The main control circuit manages the collected pin information in accordance with the standard pin information and shows the results on the display unit.

Abstract: The present invention enables connections of electronic components of an electronic apparatus to be inspected easily and reliably. To accomplish this, an electronic apparatus including a plurality of electronic components, includes a control circuit which controls input and output of an electric signal to and from the plurality of electronic components and a plurality of inspection circuits which inspect connections of the plurality of electronic components. The plurality of inspection circuits are connected in series, the control circuit is connected to an end of the series, inspection signals output from the plurality of inspection circuits are superimposed on one another in sequence into an signal and the signal is input into the control circuit, and determination is made at the control circuit as to whether each of the plurality of electronic components is connected properly or not.

Abstract: A testing device for a USB I/O board includes USB plugs connected to the USB I/O board, a connector connected to the USB I/O board, an indication module, and a testing module including data output terminals connected to the USB plugs, data reception terminals connected to the connector, and indication terminals connected to the indication module. The testing module sends a testing signal to the USB I/O board via the data output terminals, and receives the testing signal from the USB I/O board via the data reception terminals. The testing module compares the testing signal to a threshold signal stored in the testing module. If the testing signal and the threshold signal are not substantially the same, the testing module generates an alarm signal to drive the indication module via the indication terminal. The indication module indicates the USB I/O board is abnormal.

Abstract: An electrical device includes connectors for an electrical connection to a voltage source, a sampling device for determining a voltage applied to the connectors, a controllable load for changing an electrical power consumption of the device at the connectors, and a control device, which is configured for the purpose of determining a degradation of the electrical connection if voltages, which are applied to the connectors at different electrical power consumptions, differ from one another by more than a predetermined amount.

Abstract: A connector arrangement includes a single-piece plug nose body defining a cavity in which a storage device is held. A cover for the cavity is attached to the plug nose body by a living hinge. Example storage devices include an EEPROM on a printed circuit board. The storage device is electrically isolated from primary contacts of the connector arrangement.

Abstract: A contact according to the present invention comprises a plate-shaped first plunger contacting one member, a plate-shaped second plunger contacting the other member in a state of being overlapped with the first plunger and conducting electricity between the one member and the other member in cooperation with the first plunger, and a compression coil spring which is a member coupling the first plunger with the second plunger in a state where contact pieces thereof are in opposite directions from each other, covering outer circumferences of coupling portions of the first plunger and the second plunger, abutting on spring receiving portions of the respective plungers, and supporting the respective plungers to be relatively slidable. In an electrical connecting apparatus, the contacts are incorporated.

Abstract: A system for testing a matrix type connector includes a data collecting circuit, a control circuit, a storage unit, and a display unit. The data collecting circuit collects the connector pins' information, and transmits the collected pins' information to the control circuit. The storage unit is electrically coupled to the control circuit and stores a plurality of normal pins' information. The control circuit compares the collected pins' information with the plurality of stored normal pins' information, and outputs the comparison result to the display unit. The display unit receives the comparison result to indicate whether pins of the matrix type connector are normal.

Abstract: An apparatus comprises a sensor, a power supply and a measurer. The sensor is placed over the electronic component. The power supply can supply electric power to the printed circuit; thereby the printed circuit is powered on. The measurer can measure a sensing signal through the sensor when the printed circuit is powered on.

Abstract: The present invention relates to squib connectors for instance for airbag ignition systems, which allow the electrical or electronic monitoring of the correct coupling of a squib plug-connector with its corresponding counterpart. According to the invention, a squib connector has at least two terminals having corresponding signal lines. In order to allow an electrical monitoring of the correct coupling of the plug connector, the terminals are in electrical contact with each other in the uncoupled or incorrectly coupled condition of the plug connector. This electrical contact between the terminals is adapted for being separated upon correct coupling to a corresponding counter-connector either automatically or by an actuating action. The disconnecting of the terminals may then be monitored by any suitable monitoring means.

Abstract: A display circuit for a display panel is disclosed. The display circuit comprises a circuit board, a flexible printed circuit board (FPC), and a driver. The circuit board has at least one test pad. The flexible printed circuit board is electrically connected and disposed between the circuit board and the display panel. The driver is disposed on the flexible printed circuit board and has at least one test pin. The at least one test pin is electrically connected to the at least one test pad.

Abstract: A method and system for interoperability testing is provided. Various network communications messages are sent to a device under test (DUT) and a number of similar devices from different sources including different manufacturers. Responses to the test signals from the device under test and the similar devices are compared to expected responses in accordance with the standard, and adjustments are made in the device under test if deviations in responses are detected. The device under test may be a intelligent electronic device or IEC 61850 protocol client device.

Abstract: Aspects of the disclosure can provide an integrated circuit (IC) chip. The IC chip may adjust delays at its interface to compensate for outside transmission line delays. The interface of the IC chip can include a plurality of input/output (IO) modules coupled to a plurality of outside transmission lines, respectively. Each of the IO module can further include at least one variable delay element configured to delay transmission over the corresponding outside transmission line based on an actually measured transmission delay of the outside transmission line, in order to align signals transmitted by the plurality of outside transmission lines in a desired manner.

Abstract: Embodiments of the present invention provide a semiconductor device that includes a transistor device having a first, a second, and a third node; and an interconnect structure having at least one wire and the wire having a first and a second end with the first end of the wire being connected to one of the first, the second, and the third node of the transistor device. The wire is conductive and adapted to provide an operating current in a first direction during a normal operating mode, and adapted to provide a repairing current in a second direction opposite to the first direction during a repair mode of the semiconductor device. In one embodiment the transistor device is a bipolar transistor with the first, second, and third nodes being an emitter, a base, and a collector of the bipolar transistor. The wire is connected to one of the emitter and the collector. Method of operating the semiconductor device and current supplying circuit for the semiconductor device are also disclosed.

Abstract: Certain embodiments of the invention may include systems, methods, and apparatus for providing connection fault self-monitoring with DC bias current. According to an example embodiment of the invention, a method is provided for obtaining measurements and detecting connectivity faults associated with a voltage mode sensor. The method can include coupling a DC bias current into a circuit. The circuit includes a voltage mode sensor, and the voltage mode sensor can output a time varying signal. The method can also include setting a nominal level of the DC bias current, monitoring a voltage associated with the DC bias current, and determining circuit connectivity status based at least in part on monitoring the voltage.

Abstract: A method for adapting the signal transmission between two electronic devices (1, 2) that are connected to each other via a physical interface and that each have a transmitter (8a, 8b) and a receiver (7a, 7b), wherein analog signals are transmitted from the transmitter (8a, 8b) of one device (1, 2) along a transmission path (9a, 9b) to the receiver (7a, 7b) of the other device (1, 2). Known scattering parameters (10a, 10b, 10c, 11d) for describing the electromagnetic wave propagation in the transmission path (9a, 9b) between the receiver (7a, 7b) of the first device (1, 2) and the transmitter (8a, 8b) of the second device (1, 2) are retrieved by the first device (1, 2), transmitted to the second device (1, 2), and parameters of the transmitter (8a, 8b) in the second device (1, 2) are adapted with reference to a high-frequency description of the transmission path (9a, 9b) as a function of all of the scattering parameters (10a to 10d, 11a to 11d) known to the two devices.

Abstract: The present invention relates to an electrical connector with at least one electrical contact for electrically contacting a corresponding mating connector. In particular, the present invention deals with connectors having a plug detecting unit for detecting a mated state of the connector and the mating connector. The present invention further relates to a corresponding method for detecting a mated state. Said connector comprises a plug detecting unit for detecting a mated state of the connector and the mating connector, wherein said plug detecting unit is operable to check the mated state by means of an intermittent test signal. Alternatively or additionally, the surfaces of first and second electrical contacts are covered with materials having a different oxidation potential, wherein a positive voltage of the test signal is applied to the electrical contact having the higher oxidation potential compared to the other electrical contact.

Abstract: A connection apparatus for connecting a mobile peripheral component interconnect express module (MXM) interface to a test apparatus includes a circuit board, a golden finger connector, and a group of signal test contacts. The test contacts are connected to the golden finger connector and configured for connection to the testing apparatus. When the circuit board is inserted into a MXM interface, the test contacts connect to the MXM interface.

Abstract: An integrated circuit device comprising a semiconductor die contained in a package. The integrated circuit device includes one or more internal connection verification modules for asserting a poor connection signal for the test apparatus in response to a voltage difference between a voltage at a corresponding internal power supply node and a reference voltage, the voltage difference being indicative of a poor connection of power supply to one of power supply terminals on the package. The test apparatus can include an indicator or a sorting element for rejecting or accepting the integrated circuit device in response to logic signals indicative of the presence or absence of a defect accompanied by non-assertion of the poor connection signal, and for processing the integrated circuit device distinctively in response to assertion of the poor connection signal.

Abstract: A system for monitoring a connection to an active pin of an integrated circuit (IC) die, includes an input/output (I/O) cell of an IC die, where the I/O cell is bonded to a bonding pad on a ball grid array (BGA) substrate. The system includes a test point on a printed circuit board (PCB) coupled to the bonding pad which forms an electrical/conductive pathway between the test point and the I/O cell. The system includes a clock waveform injected through a resistor into the test point.

Abstract: Provided is a lens connector-testing device including a base, a circuit tester, a probe, and a positioning unit. The positioning unit includes a positioning housing, a lift block, an insulating plate, a press spring, a latch member and a supporting seat. The positioning housing has a lift-guiding groove. The insulating plate is fixedly connected to an upper end of the lift block. A lower end of the lift block is slidably received in the lift-guiding groove. A holding space is defined between the insulating plate and the positioning housing. The supporting seat is disposed on the positioning housing and has at least one electrical contact. The latch member has a fixing section, a hooking section, and a pressing section. The lift block has a projecting portion matched with the hooking section of the latch member. The press spring is located between the pressing section and the positioning housing.

Abstract: A method for monitoring a power coupler for a plug-in electric vehicle during a charging process, where the method may perform one of several alerts in the event that the vehicle stops receiving power. In an exemplary embodiment, the method performs a theft alert when the power coupler is physically unplugged or disconnected (this is intended to dissuade people from stealing the power coupler), and it performs a power loss alert when there is a loss of electrical power at the wall (this is intended to notify the vehicle owner when there is a power outage, a tripped circuit breaker, or any other condition that prevents the vehicle from being charged). By distinguishing between possible theft situations and simple power loss situations, the method can perform or issue an alert that is better tailored to the particular conditions that triggered it.

Abstract: A connection diagnostic apparatus for a ground fault detector including an oscillator connected via a coupling capacitor to an electric circuit with a first connection line and a second connection line, and a voltage detector for detecting a voltage value between the oscillator and the coupling capacitor is provided with a first relay and a second relay provided in the first connection line and the second connection line, and a programmable controller. The programmable controller determines a connected state of the ground fault detector based on a change amount of a voltage value detected by the voltage detector when the first relay is turned on or off and determines the connected state of the ground fault detector based on a change amount of a voltage value detected by the voltage detector when the second relay is turned on or off.

Abstract: A continuity testing device is provided which can reliably detect incomplete-fitting of the retainer of the connector. The continuity testing device includes a connector guide block into which the connector is inserted in a transverse direction and which is fixed above an opening formed on a cover plate of a case of the continuity testing device, a detection plate provided to the connector guide block and arranged above the connector so as to contact with the incompletely-fitted retainer of the connector when moved downward, a detection pin arranged at the detection plate, a continuity testing part arranged to move in the vertical direction toward the connector, a drive mechanism that operates the detection plate to move in the vertical direction in conjunction with the continuity testing part, and a switch that is activated by the detection pin when the detection pin is completely moved down to the switch.

Abstract: Certain embodiments of the invention may include systems, methods, and apparatus for providing connection fault self-monitoring with DC bias current. According to an example embodiment of the invention, a method is provided for obtaining measurements and detecting connectivity faults associated with a voltage mode sensor. The method can include coupling a DC bias current into a circuit. The circuit includes a voltage mode sensor, and the voltage mode sensor can output a time varying signal. The method can also include setting a nominal level of the DC bias current, monitoring a voltage associated with the DC bias current, and determining circuit connectivity status based at least in part on monitoring the voltage.

Abstract: A system for monitoring a die connection includes a die bonded to a substrate and a connection indicator circuit coupled to a monitor pad of the die. The connection indicator circuit is configured to detect a connection failure of the monitor pad. A signal corresponding to the monitor pad of the die is monitored, and an indication of a pad connection failure associated with the monitor pad is provided in response to a change in the monitored signal.

Abstract: A hand tool for terminating and checking comprising a body which defines a means of storage of a connector to be terminated; an electrical checking module may be housed in the body, and is configured to electrically check the terminated connector when a connector pusher element is inserted in the terminated connector in the close or final position.

Abstract: A system and method of detecting battery connection failures relies upon measuring battery cell body temperature and battery connector temperature at a measured current. The difference between these two temperatures is calculated using a software driven comparator. The comparator compares the difference as measured against a predetermined safe difference for the measured current. If the measured value exceeds the predetermined safe value an alarm is given. In one embodiment of the invention the difference between the two temperatures is compared to a predetermined safe difference independent of current measurements.

Abstract: This invention describes a device for testing a surface mounted connector using a test probe assembly that utilizes a vacuum to force the test wires and the test probe's wire array into intimate contact with the connector to be tested. The wires are directed through a wire module assembly and have a wide spacing at one end, and a narrow spacing corresponding to the spacing required for the specific units to be tested at the opposite end.

Abstract: A universal serial bus (USB) component tester for testing a USB component that has a plug and a USB port includes a connector, a USB port, and a first indicator. The connector includes a first power pin, a first data pin connected to the first power pin, a second data pin, and a first ground pin connected to the second data pin and also connected to the first data pin via a first resistor. The USB port includes a power terminal connected to a power supply, a first data terminal, a second data terminal, and a grounded ground terminal, and the first data terminal is connected to the second data terminal via a second resistor. The first indicator includes a first terminal connected to the first data terminal via the second resistor, and a second terminal connected to the second data terminal.

Abstract: A method for characterizing the lifetime, extrapolated to working conditions, of an interconnect structure representative of a technology in a given product uses modeling of an electromigration phenomenon by Black's equation, but applied separately to groups of test samples of the structure which are determined on the basis of the resistance increase value of the samples at the failure time. The more refined approach carried out in this way allows better characterization of the interconnect structure in relation to operational working conditions, corresponding to an application or a finished product, making it possible to check whether the expected lifetime can be guaranteed regardless of the failure mechanism at play in said structure.

Abstract: An anode driver chip and a cathode driver chip attached to an OLED device by means of anisotropic glue. The fine structure of the attachment means requires inspection to determine any resulting open and short conditions. The anode driver circuits comprise an output current detection that allows open circuit testing of the contact between the OLED device and the anode driver chip. The cathode driver circuits comprise a voltage detection circuit that allows both open and short circuit detection between cathode driver pads.

Abstract: To characterize an electrical cable that is deployed in a well, a voltage input is applied to the electrical cable at an earth surface location, where the well extends from the earth surface location. A current response resulting from the voltage input is measured at the earth surface location. At least one parameter of the electrical cable is computed according to the measured current response.

Abstract: Apparatus and methods provide built-in testing enhancements in integrated circuits. These testing enhancements permit, for example, continuity testing to pads and/or leakage current testing for more than one pad. The disclosed techniques may permit more thorough testing of integrated circuits at the die level, thereby reducing the number of defective devices that are further processed, saving both time and money. In one embodiment, a test signal is routed in real time through a built-in path that includes an input buffer for a pad under test. This permits testing of continuity between the pad and the input buffer. An output buffer can also be tested as applicable. In another embodiment, two or more pads of a die are electronically coupled together such that leakage current testing applied by a probe connected to one pad can be used to test another pad.

Abstract: In some embodiments, an HDMI connection interface is provided with a connection detection circuit utilizing power cycling or an otherwise intermittent supply at a pin for an HDMI device for determining if the device is connected to an appliance.

Abstract: An instrument (1) and a method for measuring pulses of partial electrical discharges in an electrical system comprise data processing means (5) operatively associated both with an input stage (2), able to receive an analogue signal (3) representing said pulses and to provide a digital representation of the entire wave form of the pulses, to receive said digital representation, extract the value of predetermined parameters relating to the wave form of the pulses and transfer to and output stage (4) a processed digital signal comprising said values, the processing means (5) being able to operate substantially in real time, i.e. with no need for a memory for the intermediate storage of the data.

Abstract: An access pad is used to provide access to a functional block of an integrated circuit (IC) device. The access pad is formed using dummy metal in an open space in a metallization level that is between a top metallization level and a base level on which the functional block is formed in the IC device. The access pad at the metallization level provides a contact to access an underlying circuit of the functional block so that the functional integrity of the functional block of the IC device can be verified during probing.

Abstract: A device and method for dynamically determining an impedance of a network is disclosed. The device includes at least a processing system for measuring a network voltage and network current when said network is determined to be in a first state, measuring a network voltage when said network is determined to be in a second state, estimating said impedance value dependent upon said measured voltages and current, adapting said estimated impedance based on at least one prior impedance value and storing at least said adapted impedance.

Abstract: A method of monitoring the voltage transmitted through a pair of electrical connector devices is provided. The pair of electrical connector devices include a source connector coupled to a power supply and a load connector coupled to a load, the source connector being coupled to the load connector. The method includes determining the voltage utilized by the load, determining the voltage generated by the power supply, and determining an electrical resistance of the pair of electrical connectors using the determined voltage utilized by the load and the voltage generated by the power supply. A connector monitoring circuit and a portable X-ray detector including the connector monitoring circuit is also provided.

Abstract: A method includes scanning a test socket after removal of a device under test to generate scan data. The scan data is compared to reference data. A presence of at least a portion of a pin in the test socket is identified based on the comparison. A test system includes a test socket, a scanner, and a control unit. The test socket is operable to receive devices under test. The scanner is operable to scan a test socket after removal of a device under test to generate scan data. The control unit is operable to compare the scan data to reference data and identify a presence of at least a portion of a pin in the test socket based on the comparison.

Abstract: An arrangement to detect a fault electrical connection in a wind turbine is provided. According to the arrangement, an ozone sensor is located close to a dedicated electrical connection within the wind turbine. A certain amount of ozone gas, which is generated by a corona due to a fault of the dedicated electrical connection, is detected by the ozone sensor.

Abstract: A slat disconnect sensor includes a base. First and second arms are spaced apart from one another and are operatively supported by the base. At least one of the first and second arms have an end mounted to the base and is rotatable relative thereto at a pivot between connect and disconnect conditions. A mechanical link includes first and second link portions respectively secured to the first and second arms. The link interconnects the first and second arms and includes a weakened area providing a frangible connection in the connect condition and is configured to break at the frangible connection in the disconnect condition. A fuse includes first and second fuse portions operatively mounted to the first and second arms. The fuse is interconnected between the first and second arms providing continuity in the connected condition, and continuity is broken between the first and second portions in the disconnect condition.

Abstract: A test system includes a serial advanced technology attachment (SATA) test apparatus, a number of test cables, and an oscillograph. Each test cable includes a soft sub-miniature-a wire and a sub-miniature-a connector. A first terminal of each sub-miniature-a wire is electrically fixed to an output of the SATA test apparatus. A second terminal of each sub-miniature-a wire is connected to the corresponding sub-miniature-a connector. Each sub-miniature-a connector is used to connect to an input of the oscillograph.

Abstract: A status detecting device that includes a first contact member, a second contact member, an applying component, a grounding component, a detecting component, and an executing component is provided. The applying component applies a predetermined voltage to the first contact member. The grounding component grounds the second contact member. The detecting component detects at least one of a potential between the applying component and the first contact member, or a potential between the second contact member and the grounding component. The executing component executes predetermined processing, based on a detection result from the detecting component.

Abstract: An electrical interconnection integrated device is described, comprising: a plurality of electrical terminals connectable to an integrated electronic circuit on a chip common to said interconnection device; at least an inside electrical device provided with a respective input connected to a first terminal of said plurality and a respective output; a fault detecting logic module having a first input connected to said output of the inner electrical device and provided with a detecting terminal for supplying a fault detecting signal.

Abstract: According to one aspect, embodiments of the invention provide a method of monitoring an electrical connection, the method comprising monitoring a temperature of the electrical connection, monitoring a level of current passing through the electrical connection, and determining, in response to monitoring temperature and current, whether the temperature of the electrical connection exceeds a temperature threshold associated with the level of current passing through the electrical connection.

Abstract: An integrated circuit and method of testing the integrity of the electrical connection of the integrated circuit to external equipment are provided. The integrated circuit comprises an output port including output contacts for coupling the integrated circuit to external equipment, via external connectors. The output port receives internal operational signals and routes the operational signals to the output contacts for connection of the operational signals to external equipment. A connection test signal store is dynamically loadable with test signals. Signals sent to the output port can be switched between the test signals and operational signals. External equipment monitors the integrity of an electrical connection between the output contacts and the external connectors by detecting expected transitions in the test signals.

Abstract: A test system including a package with switchable paths. The package may have conductive paths that are selected by switches. The electrically switchable conductive paths may yield increased data without significantly increasing the required testing hardware.

Abstract: An electrical connection defect detection device to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection device comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module and an electrode board comprising a detection surface and at least one array of through holes. The detection surface contacts a surface of the under-test device to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The through holes are placed along the edges of the electronic board and are electrically connected to a ground potential to perform a capacitive shielding.