Abstract: An apparatus and method for evaluating the integrity of each contact pin of an electronic component having multiple contact pins. In one embodiment, the apparatus includes a test device and a measuring instrument. The test device comprises a component fixture configured to hold an electronic component under test and opposing contact plates for establishing electrical communication between the contact pins of the electronic component and the measuring instrument. The test device may include separate linear positioners associated with each opposing contact plate configured to move the contact plates relative to the component fixture and electronic component under test. The measuring instrument measures at least one electrical characteristic of a pin contact. In another embodiment, the apparatus further includes a system controller in communication with the measuring instrument and configured to control functioning of the measuring instrument.

Abstract: An exemplary automatic hi-pot test apparatus (20) includes a high voltage supply (21), a transmission device configured for transmitting an electronic device (26) to be tested, a connecting device electrically connected to the high voltage supply and configured for moving and electrically connecting with or electrically disconnecting from the electronic device, a controller (28) for controlling the connecting device and the transmission device, and a detector (27) for detecting the presence of the electronic device. When the detector detects the presence of the electronic device, the detector sends a corresponding detecting signal to the controller, such that the controller stops the electronic device and drives the connecting device to electrically connect with the electronic device whereby a hi-pot test can be performed.

Abstract: A read module includes: a light source that applies light to an original to read an image; a photoelectric conversion section that converts reflected light from the original into an image signal of the image; and a connector to be electrically connected to a controller connector in a controller. The connector has a plurality of terminals placed side by side in a predetermined direction. The plurality of terminals includes an image signal output terminal section that outputs the image signal to the controller and a power terminal section that inputs electric power for lighting the light source supplied from the controller to the read module. The power terminal section is placed in the proximity of one end of the plurality of terminals in the predetermined direction thereof. The image signal output terminal section is placed in the proximity of an opposite end in the predetermined direction thereof.

Abstract: An arrangement monitors a bolt connection, formed with a first component and a second component that are connected with one another by being held between the two retainer elements of the bolt connection. The arrangement has an insulator with two electrical contacts and a spring arrangement located between one of the retainer elements of the bolt connection on one side and the first or second component that is closer thereto on the other side. The spring arrangement is arranged between the two electrical contacts such that the two contacts are electrically separated by its predetermined spring force given a loose bolt connection and such that, given a firm bolt connection, the two contacts are electrically in contact with one another due to overcoming the spring tension. The two contacts are connected with an electronic monitoring circuit that indicates a firm bolt connection as long as the electrical contact exists.

Abstract: A relay connector connects a terminal of a connector to be inspected provided on a board for inspection to a measuring instrument. The relay connector includes: a pin block; a floating guide, arranged so as to approach and separate with respect to the pin block and resiliently urged in a separating direction, the floating guide formed with a guide hole; a plurality of probes, each of which is provided in the pin block so as to be opposed to the terminal of the connector to be inspected having been inserted into the guide hole; and a pressure operating member, adapted to be operated between an open state in which the connector to be inspected is allowed to be inserted into the guide hole in the floating guide, and a pressed state in which the connector to be inspected having been inserted into the floating guide is pressed toward the pin block.

Abstract: An electrical continuity tester adaptor for attaching to a conventional continuity tester comprising first, second and third members. The first member is operably configured to engage a female F-type connector. The second member is operably configured to engage a female RJ series type connector. The third member includes a plurality of electrical connections and a printed circuit board to facilitate the electrical connectivity between the first and second members.

Abstract: A connector housing (10) has a front surface with projecting walls that form a groove (31). A front mask (60) is mountable at a mount position on the front surface of the housing (10). The front mask (60) has a fittable portion (62) that fits the groove (31) when the front mask (60) is at the mount position. Latches (35) are formed on the inner surfaces of the projecting walls facing the groove (31), and engaging projections (77) are provided on side surfaces of the fittable portion (62) facing the inner surfaces of the projecting walls. The engaging projections (77) and the latches (35) resiliently engage to hold the front mask (60) at the mount position. Engaged areas of the engaging portions (77) and the latches (35) face the front ends of the projecting walls.

Abstract: A circuit arrangement for a line test and for feeding a corrosion protection current into a two-wire line comprises a controllable ramp generator for producing a ramp voltage, at least one first test impedance to be connected to a first line of a two-wire line, at least one second test impedance to be connected to a second line of the two-wire line, at least one first and second controllable switches for connecting the ramp voltage to the first and second test impedances, and a programmable control device for controlling the ramp generator and the first and second controllable switches in such a way so that the ramp voltage is coupled to the two-wire line in order to produce a corrosion protection current. The control device switches at least one of the first and second test impedances to the respective of the first and second lines for a line test.

Abstract: A method and apparatus for detecting open defects on non-probed node under test of an electrical device using capacitive lead frame technology is presented. In accordance with the method of the invention, a probed node neighboring the non-probed node under test is stimulated with a known source signal. A sensor of a capacitive sensing probe is capacitively coupled to at least the probed node and non-probed node under test of the electrical device, and a measuring device coupled to the capacitive sensing probe measures a capacitively coupled signal present between the sensor of the probe and at least the probed and non-probed node of the electrical device. Based on the value of the capacitively sensed signal, a known expected “defect-free” capacitively sensed signal measurement and/or a known expected “open” capacitively sensed signal measurement, a determination is made of whether an open defect exists on the non-probed node under test of the electrical device.

Abstract: A system for detecting, at a remote location, a deterioration in an electrical connection, such as an electrical meter socket connection, includes at least one deterioration sensing device that includes an apparatus for detecting, at a remote location, a deterioration in an electrical connection; at least one fixed or portable receiving communication device, each configured to receive temperature information from the at least one deterioration sensing device and to transmit the temperature information via a communication network; and a back end connected to the communication network and configured to receive temperature information from the at least one fixed or portable sensing communication device. Upon exceeding a predetermined condition, the back-end may forward an alarm warning to a utility.

Abstract: A connecting sleeve generally used for a bus bar connection is produced from an insulating elastic material, often an elastomer material, having insulating properties which are deteriorated by partial discharges and decrease over the operating time of the switchboard system. According to the invention, so-called partial discharge measuring methods must be carried out, inter alia also in the UHF range (UHF: ultra high frequency), in order to identify damaging effects on the insulating material in time. For the reliable and simple detection of the measuring signals, the connecting sleeve (M) has an outer, electroconductive surface (OA) which is earthed, and an inner, electroconductive surface (OI) to which the voltage potential of the bus bar (S) is applied, in addition to a coupling electrode (KE) which is integrated into the insulating material (I).

Abstract: In a first aspect, a first method of testing a link between a first chip and a second chip is provided. The first method includes the steps of, while operating in a test mode, (1) transmitting test data of sufficient length to enable exercising of worst case transitions from the first chip to the second chip via the link; and (2) performing cyclic redundancy checking (CRC) on the test data to test the link. Numerous other aspects are provided.

Abstract: An electrified wall panel in a modular furniture environment includes a plurality of multi-port electrical distribution blocks diversely located throughout the panel. Certain ones of the multi-port electrical distribution blocks are fixed to wall panel frame members and other ones of the multi-port electrical distribution blocks are free of the wall panel. A plurality of jumper cables, each having connectors at opposite cable ends are adapted to mate with any one of the multi-port electrical distribution block ports. The cables electrically interconnect the distribution blocks to form one complete circuit. There are a plurality of electrical receptacles, each having an electrical connector near one end which are electrically coupled to a port of a corresponding multi-port electrical distribution block. The system is assembled by fixing a jumper mounting bracket to a jumper cable near one end of the jumper cable. The jumper mounting bracket is attached to a support member.

Abstract: A network test instrument provides maximum compensation of FEXT by use of mutual inductance between one or more signals. The inductance is suitably formed as a PCB trace component, or as discrete components.

Abstract: A commutator for power supply testing includes a printed circuit board (PCB), a plurality of connectors soldered on the PCB and coupling a power supply with an electronic load, a plurality of indicator light showing whether the power supply coupled to the commutator is working, and a switch circuit. The connectors are used to couple a power supply with an electronic load. The switch circuit controls a flow of current from the power supply to the electronic load.

Abstract: The inventions relate to methods for trimming integrated circuits. Various embodiments include providing a method to trim an integrated circuit wherein trim data is stored in an on-board memory and then sent off of the circuit to be operated on by an external device. Corresponding trim data is then sent back to the integrated circuit in order to potentially modify the function of one or more analog devices along the circuit. Other embodiments include methods for trimming integrated circuits wherein trim data is stored in an on-board memory and retrieved using an on-board sequencer. The retrieved data is used to modify a function of one or more analog devices on the integrated circuit.

Abstract: Non-contact connectivity testing of joints connecting circuit junctions are improved through knowledge of characteristics of semiconductor junctions connected to component nodes of components of a device under test (DUT) to allow detection of high-impedance joints.

Abstract: An apparatus and associated method are disclosed for facilitating the testing of device connections, including functional shock and vibration testing of peripheral card slots or any other desired connector interface. In part, a power supply located on the peripheral device, or some other external power source, is used to power fault detection circuitry. In this way, faults can be identified, such as through visual fault indicators, without the necessity of powering the system. In addition, simulated peripheral cards are provided that include adjustable weights so that the weight distribution of an actual card can be simulated without the necessity of having a functional peripheral in hand.

Abstract: An electronic device has a first signal path, a first power supply path, and a connector that transmits to an external device the input signal on which the voltage has been superposed. The device also has a first power supply switch inserted into the first power supply path and an amplitude detector that detects at the connector an amplitude of the input signal, a control section that determines, based on a detection output from the amplitude detector, which a connection condition of the external device to the connector is a first condition in which the external device is not connected to the connector or a second condition in which the external device is connected to the connector. Based on the connection condition, the control section turns on or off the first power supply switch.

Abstract: An apparatus for detection of a USB host or a USB OTG device being attached to Vbus connector terminal of a USB device includes an attach detection pull down resistor isolated from the Vbus connector terminal. This attach detection feature guarantees USB attach detection and complies with current limits of both USB 1.1 and USB 2.0 OTG specifications.

Abstract: The present invention provides a system for, and method of, adaptable testing of backplane interconnections. In one embodiment, the system includes a board detector configured to determine a relative arrangement of a plurality of hardware boards populating positions associated with the backplane interconnections. Additionally, the system also includes a test coordinator coupled to the board detector and configured to adaptively backplane test at least a pair of the plurality of hardware boards based on the relative arrangement.

Abstract: A configurable buss element for an electricity meter includes a conductive piece of metal formed into a series of contact connectors and a network of elongate conductors extending between and among the series of contact connectors. Each of the plurality of contact connectors is configured to contact a circuit element of an electricity meter. The network of elongate conductors is operable to provide connectivity between the contact connectors and select portions of the conductive piece of metal in one of a plurality of connectivity configurations, each of the connectivity configurations corresponding to an electricity meter configuration, the select one of the plurality of connectivity configurations defined by a predetermined set of discontinuities introduced in the network of elongate conductors.

Abstract: A female connector (F) has a housing (10) with a front end and cavities (11) extend to the front end. Terminal fittings (40) are mounted in the cavities (11). A front wall (50) is mounted on the front end of the housing (10) and is formed with tab insertion holes (51) that can communicate with cavities (11). An operable surface (59A) is exposed at an end surface of the front wall (50). The front wall (50) can be moved from a full locking position to a partial locking position along the front end of the housing (10) by pushing this operable surface (59A). Portions of the end surface of the front wall (50) other than the operable surface (59A) are covered at least partly by an wall (26) of the housing (10) to limit movement of the front wall (50).

Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: The present invention provides a connector test device. The device includes a test jig which has a conductive test pin to detect whether a conductive pin of a connector is appropriately connected to the conductive test pin or not, and a moving pin and a test terminal to detect whether a waterproof pin of the connector is appropriately installed in the connector or not. The device simultaneously displays the electricity conduction states between the conductive pin and the conductive test pin and between the moving pin and the test terminal. The device easily and accurately measures the installed states of both the conductive pin and the waterproof pin provided in the connector.

Abstract: A device for holding one or more connectors and inserting the connectors into one or more receptacles of a unit for testing. The device comprises a base movable toward the receptacles, a connector holder holding the connectors that is movable with the base and movable relative to the base, and a biasing mechanism disposed relative to the connector holder to bias the connector holder toward the receptacles.

Abstract: There is provided a test apparatus including a PLL circuit for generating a strobe signal of which the timing is shifted according to a given delay control voltage, a variable delay circuit being provided divergently from a path connecting the PLL circuit and the timing comparator and delaying the strobe signal according to the predetermined phase difference of the strobe signal for the output signal, and a first phase comparing unit for comparing a phase of the strobe signal output from the variable delay circuit and a phase of the output signal output from the device under test and supplying the delay control voltage according to the phase difference to the PLL circuit.

Abstract: A connector device includes a common jack connected to a first information-handling apparatus and a plug connected to a second information-handling apparatus. The plug is adapted for insertion into the common jack and contains a first conductive surface and a ground contact. A first jack contact is formed on the common jack for receiving communication signals when engaging with the first conductive surface of the plug. A memory buffer is used for receiving the communication signals through the first jack contact and for sending out the communication signals to the first information-handling apparatus when the memory buffer is not empty. A control monitors a status of the memory buffer. When the memory buffer is not empty, the control circuit determines that the plug is inserted into the common jack, and when the memory buffer is empty, the control circuit determines that the plug is removed from the common jack.

Abstract: The invention relates to a method for analysing connection conditions between an integrated circuit package and a circuit board, wherein said integrated circuit package is electrically coupled to said circuit board by coupling elements, and therein said integrated circuit package is mechanically connected with said circuit board by support elements. To allow easy failure analysis, it is proposed that physical values are picked-off from said support elements, and said physical values are evaluated to determine the condition of said connection between said integrated circuit package and said circuit board.

Abstract: A probe apparatus disclosed for use in a separable connector includes an insulating body and spaced apart first and second electrical conductors in contact with the insulating body. The first and second electrical conductors have adjacent surfaces configured such that when an electrical potential is applied between the conductors, an electric field is formed between the conductors. The insulating body has an opening positioned between the conductors and adapted to receive a sensor such that a portion of the sensor is subjected to the electric field. A separable electrical connector system is described including the probe apparatus, as is a voltage sensing system including the probe apparatus and a voltage sensor positioned within the opening of the insulating body.

Abstract: A patch panel system including a patch panel having a first outlet including a first conductive tab and a device having a second outlet including a second conductive tab. A patch cord has a first plug having a first screen for contacting the first tab and a second plug having a second screen for contacting the second tab. The patch cord includes a conductor electrically connecting the first screen and the second screen. An analyzer is electrically connected to the first tab and detects a connection between the first tab and the second tab along the conductor.

Abstract: Electrically conductive movable elements 15 which are moved from a waiting position to a conduction position by an insertion operation of corresponding male terminals 7 are disposed in all female terminals 9 into which the male terminals are to be respectively inserted in a correct connection condition. Only when the male terminals 7 are correctly inserted into the female terminals 9, the movable elements 15 are moved to the conduction positions to be in contact with conductive portions 17 of a conduction test device 16, respectively, thereby establishing a conductive condition.

Abstract: Disclosed are systems and methods for determining when a heat sink is installed. In one embodiment, a system comprises an electrically-conductive heat sink retainer clip that is adapted to maintain contact between a heat sink and a heat-producing component, the retainer clip further being adapted to electrically connect to ground, and a heat sink detection circuit adapted to provide voltage to the retainer clip, the heat sink detection circuit being configured to provide a logic value that indicates one of presence or absence of a heat sink.

Abstract: In one embodiment, a method for testing continuity of electrical paths through a circuit assembly includes: 1) mating a test-facilitating circuit package to a connector of the circuit assembly; the circuit package having a plurality of contacts for mating to a plurality of contacts of the connector; the circuit package containing incomplete or no mission circuitry for the circuit assembly, but containing a plurality of passive circuit components coupled in parallel between the package's plurality of contacts and a test sensor port of the circuit package; 2) stimulating one or more nodes of the circuit assembly; 3) measuring an electrical characteristic of the circuit package; and 4) comparing the measured electrical characteristic to at least one threshold to assess continuities of at least two electrical paths through the circuit assembly. Other embodiments are also disclosed.

Abstract: A cable includes a first connector half holding a conductor terminal, a second connector half holding a conductor terminal, an electric cord electrically connecting the conductor terminal of the first connector half to the conductor terminal of the second connector half, and a waveform shaping circuit performing waveform shaping of a signal passing through the electric cord, and the first and second connector halves are structured to allow attachment to and detachment from each other.

Abstract: A communications connector tester for quickly and accurately analyzing communications connectors at production to determine whether the connectors are fit for use in certain communications applications is disclosed. Test signals at several discrete frequencies are sequentially inputted into pairs of conductors in the communications connector under test, and output signals are detected for the pairs under test. The output signals are compared to acceptable ranges for certain applications of the communications connector and the connector is passed or failed for certain applications based on the output signal values. Near-end crosstalk, far-end crosstalk, return loss, insertion loss, and other communications connector qualities may be measured using the present invention.

Abstract: A line tone adapter, including a housing, first and second cable connectors and a line tone generator input port, is employed to interface between a tone generator, having an output connector of a first type, and a cable to be tested, with the cable to be tested having attached thereto a connector of either a second or third type that cannot mate with the output connector of the first type. The line tone generator input port is designed to mate with the output connector of the first type, while the first and second connectors are designed to mate with connectors of the second and third types respectively. Preferably the connector of the first type is an RJ11 plug, with the connectors of the second and third types being male and female coaxial cable connectors.

Abstract: An electrical inspection apparatus performs highly accurate electrical inspection using an inspection probe on any type of printed board without changing an instrument therefor. It comprises a reference position regulating member for positioning the printed board precisely at a predetermined reference position and a pressing member for pressing the printed board oppositely to the reference position regulating member. An inspected portion (e.g., a contact) of the printed board is fixed under tension and is precisely located at the reference position in planar condition by being contacted and positioned by the reference position regulating member, whereby it is subjected to electrical inspection using the inspection probe accompanied with the reference position regulating member and/or the pressing member. Thus, it is possible to prevent the inspection probe from being unexpectedly damaged or destroyed by excessive force that is produced due to inaccurate positioning therefor.

Abstract: Described are methods and circuits for identifying defective device layers and localizing defects. Production PLD tests extract statistically significant data relating failed interconnect resources to the associated conductive metal layer. Failure data thus collected is then analyzed periodically to identify layer-specific problems. Test circuits in accordance with some embodiments employ interconnect resources heavily weighted in favor of specific conductive layers to provide improved layer-specific failure data. Some such test circuits are designed to identify open defects, while others are designed to identify short defects.

Abstract: A system for detecting connector compatibility with a time domain reflectometry (TDR) circuit on a peripheral device. A cable connects the peripheral device and a second peripheral device. A first connector is for mating to a second connector on the second peripheral device. The time domain reflectometry can be used to detect electrical compatibility of the first and second connectors. The first connector can be an RJ11 connector. The second connector can be an RJ45 connector. The first connector can be a plug, and the second connector can be a socket. The number of pins of the first and second connectors can be different. The first connector can be a telco connector, and the second connector can be an Ethernet connector. The TDR circuit can be part of the peripheral device diagnostics.

Abstract: An instrumentation system including a plurality of sensors attached to a test piece, each of the sensors provided with an electrical signal generating device and an electrical signal measurement device. Each sensor is located remotely from its electrical signal measurement device, and connected thereto by connectors. A method of testing connectivity of the instrumentation system including: inducing an electrical signal in a first sensor; and checking that the electric signal is received in the corresponding signal measurement device.

Abstract: A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a non-contact connector test probe for a testing a connector of the circuit assembly. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, connector pins of a connector on the circuit assembly are capacitively coupled to a non-contact connector test probe, and an electrical characteristic is measured by a tester coupled to the non-contact connector test probe to determine continuity of electrical paths through the circuit assembly.

Abstract: A broad-band technique for reducing the distributed inductance of a four-conductor Kelvin cable is disclosed. A special inductance-canceling cable section is connected in tandem with the cable section contacting the cell/battery. Connections between the two cable sections are transposed such that conductors in each conductor pair of the canceling section connect to current-carrying and voltage-sensing conductors from different conductor pairs in the contacting section. The canceling section thereby exhibits a distributed negative mutual inductance between its current-carrying and voltage-sensing conductors that can effectively cancel the distributed positive mutual inductance introduced by the contacting section. In one embodiment, conductor pairs comprise pairs of insulated wires which may be twisted together. In other disclosed embodiments, conductor pairs comprise shielded coaxial cables.

Abstract: A fixture for radio frequency (“RF”) testing of an assembled wireless device, the wireless device having a removable casing concealing one or more RF spring connectors, the fixture comprising: a retainer for receiving the wireless device with the removable casing removed; a coaxial connector mounted through the retainer, the coaxial connector having a center contact and a shield contact, the coaxial connector for communicating RF test signals through a coaxial cable with external test equipment; a circuit board mounted on an inner side of the retainer and having one or more pads each for receiving one of the center and shield contacts; and, one or more probes mounted on ones of the pads for contacting ones of the RF spring connectors to distribute the RF test signals.

Abstract: A device for testing for a wiring fault condition is disclosed. The device includes an electrical connector, a first signal generator, a second signal generator, and a user interface. The electrical connector includes first and second contacts that are configured to establish an electrical connection to the wiring. The first signal generator is in signal communication with the electrical connector, and is configured to generate a signal on the wiring and to receive a reflected signal therefrom. The second signal generator is in signal communication with the electrical connector, and is configured to generate a radio frequency signal on the wiring. The user interface is in signal communication with either or both of the first and second signal generators.

Abstract: A multi-jack detector for detecting states of a plurality of jacks. Each jack comprises a first switch having a first normally closed terminal and a first output terminal. The multi-jack detector comprises a plurality of bias resistors each coupled to one of the first output terminals, respectively; a control unit for determining the states of the plurality of jacks; wherein the first normally closed terminals are commonly coupled to a first node and the control unit determines the states of the plurality of jacks according to a voltage at the first node. Because the voltage at the first node is different for each state of the jacks, the detector can detects the states of the jacks using a single I/O pin.

Abstract: A communications connector tester for quickly and accurately analyzing communications connectors at production to determine whether the connectors are fit for use in certain communications applications is disclosed. Test signals at several discrete frequencies are sequentially inputted into pairs of conductors in the communications connector under test, and output signals are detected for the pairs under test. The output signals are compared to acceptable ranges for certain applications of the communications connector and the connector is passed or failed for certain applications based on the output signal values. Near-end crosstalk, far-end crosstalk, return loss, insertion loss, and other communications connector qualities may be measured using the present invention.

Abstract: A method and apparatus for pre-qualifying lines with respect to estimating the insertion loss of the line is presented. End-to-end insertion loss at high frequencies is estimated from measurements made at low frequencies through the voice switch at the central office of a telephone company. An AC voltage waveform is applied to the telephone line being tested. Real and imaginary components of the resultant waveform are measured. These measurements are captured and used to estimate the insertion loss of the telephone line at frequencies in the range of 40 kHz to 300 kHz.

Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

Abstract: A logic circuit test apparatus for testing a logic circuit having a plurality of input terminals and a plurality of output terminals, the logic circuit test apparatus including: a common test signal generating circuit which groups the input terminals of the logic circuit on the basis of logic states of original test signals to be applied to the respective input terminals of the logic circuit and outputs common test signals from common test signal output terminals thereof smaller in number than the input terminals of the logic circuit; and an input connection switching circuit which switches connections of the common test signal output terminals of the common test signal generating circuit with the input terminals of the logic circuit so as to convert the common test signals into the original test signals and apply the original test signals to the respective input terminals of the logic circuit.