Abstract: An impedance measuring apparatus includes a plurality of RF (radio frequency) probes; a plurality of rotation mechanisms coupled to the plurality of RF probes, respectively; a processing unit, and a mechanical controller. The mechanical controller controls the plurality of rotation mechanisms and the plurality of RF probes to measure package RF signals between terminals formed on a package substrate. The processing unit measures calibration RF signals between terminals formed on at least one calibration substrate; determines RF impedances of the package substrate from the package RF signals and phase differences corresponding to a thickness of the package substrate and distances between the terminals on the package substrate from the calibration RF signals, and calibrates the RF impedances based on the phase differences.

Abstract: Methods and apparatuses to repair defects in a circuit, such as during or subsequent to the manufacture of the circuit. Defects may be detected through, for example, optical processing of an acquired image of the circuit or by measuring the strength of a signal emitted across a pair of conductor plates. If defects are detected, conductive particles may be applied to the circuit to correct the detected defects.

Abstract: Provided is an apparatus for concurrently detecting a defect occurring in a heat exchanger tube and a geometric transition of the heat exchanger tube. The apparatus for detecting the state of a heat exchanger tube, including: the first detection unit detecting a defect of the heat exchanger tube; and the second detection unit detecting a geometric transition of the heat exchanger tube, in which the first detection unit and the second detection unit are disposed at the same circumferential position of a cylindrical body separately, installed to have a certain distance in the lengthwise direction of the cylindrical body, and inserted inside the heat exchanger tube. According to the present invention, not only a defect but also the type of geometric transition, which may accelerate the initiation and growth of a defect, is identified and the size of the geometric transition is concurrently measured, thereby improving the reliability in early detection of a defect.

Abstract: A measurement mark (3) for determining the relative positional accuracy of a progressive projection onto a wafer (5), the projection being performed with two masks (3, 4), comprising two structure elements (10, 20) formed on a respective one of the masks (1, 2). The structure elements (10, 20) overlap with regard to their position on the masks so that, during the projection of the second structure element (20), an electrically conductive structure (30) formed on the basis of the first structure element on the wafer (5) is overformed by removal of a portion (31). In an electrical line width measurement, the reduced width (CD, CD30a) of the structure (30) is measured and compared either with the original width (62) or with that width (CD30b) of a further partial element (30b) produced by the overforming.

Abstract: Instrumentation for monitoring crack growth using a change in electric potential across a starter crack as the crack propagates is disclosed. The instrumentation includes a specimen of a material to be analyzed for crack growth propagation having a surface with a starter crack formed therein, a plurality of current leads to pass electric current through the specimen, a layer of insulating material disposed on each of opposite sides of the crack, a layer of conductive material disposed on each layer of insulating material, where a portion of each layer of conductive material is in electrical contact with the first specimen surface, and a pair of sensing leads, one sensing lead attached to each layer of conductive material. A method for using the instrumentation to monitor crack growth by measuring is also disclosed.

Abstract: A method for inspecting an electronic circuit formed on a board with a peripheral circuit includes steps of providing a terminal for inputting and outputting an electronic signal, providing an impedance increase means for increasing an impedance of an electrical connection between the electronic circuit and the peripheral circuit and providing an inspection means for inspecting the electronic circuit. The impedance of the electronic circuit is increased to prevent influence of the peripheral circuit before and during inspection of the electronic circuit, and the increase of the impedance is removed after the inspection.

Abstract: A component which is known to have particular degradation characteristics is instrumented to provide an electrical potential across a section in which a degradation is likely to occur. The potential drop across the component is then monitored to determine when, and the degree to which, the degradation occurs. Predetermined limits are established such that when the degradation level reaches a limit, the component is repaired or replaced.

Abstract: An apparatus for measuring electrical parameters for an electrical system measures a first and second parameters of the electrical system between connections to the electrical system. A processor determines a third electrical parameter of the electrical system as a function of the first parameter and the second parameter.

Abstract: Provided is an apparatus for detecting a defect of a circuit pattern which includes a resonator, a first power supply unit connected to one end of the resonator to apply power to the resonator, a probe connected to the other end of the resonator to contact one end of the circuit pattern, a second power supply unit connected to the other end of the circuit pattern to apply a voltage thereto, and a detection portion connected between the resonator and the probe to measure a voltage generated from the circuit pattern and generate a measurement voltage, and determine presence of a defect in the circuit pattern from the measurement voltage.

Abstract: A system and method for measuring a voltage differential in a current-carrying pipe using a propulsion vehicle. The system may be adapted for use with a pipeline pig or other propulsion device, which is configured to determine the electric current in a pipeline with nominal noise while the apparatus is moving. One aspect of the present invention is a pig which is outfitted with electrical contacts. These electrical contacts may optionally consist of rotating steel brushes and/or rotating steel knives. The pig includes data logging capabilities which may record location and voltage data. A pig according to the present invention optionally may include electromechanical devices which reduce electrical noise.

Abstract: In order to create a device for testing a membrane electrode assembly, by means of which fabricated membrane electrode assemblies can be tested in a non-destructive manner, a first contact device is provided for bringing a first electrode side of the test object into electrical contact, a second contact device is provided for bringing a second electrode side of the test object into electrical contact, the first and second contact devices being electrically conductive at least in the contact area, and the first contact device and/or the second contact device having a plurality of electrically conductive contact segments spaced from one another, and a conductivity measuring device is provided for measuring the conductivity of the test object segmentwise in a location-resolved manner.

Abstract: A method for locating leaks in nonmetallic pipes on the principal of measuring and graphing the intensity of electric fields. Leaks are located by creating a closed circuit with a negatively charged metallic electrode submersed in water inside a manhole connected to the nonmetallic pipe and several positively charged metallic electrodes placed in several reference holes in the ground above the nonmetallic pipe. A leak is determined by finding segments of nonmetallic pipe that corresponds with greater electric field intensity measurements.

Abstract: A method and apparatus for determining spatial locations of defects in a material are described. The method includes providing a plurality of electrodes in contact with a material, applying a sinusoidal voltage to a select number of the electrodes at a predetermined frequency, determining gain and phase angle measurements at other of the electrodes in response to applying the sinusoidal voltage to the select number of electrodes, determining impedance values from the gain and phase angle measurements, computing an impedance spectrum for an area of the material from the determined impedance values, and comparing the computed impedance spectrum with a known impedance spectrum to identify spatial locations of defects in the material.

Abstract: A field device includes circuitry to successively measure a parameter related to current drawn by electronics of the field device. The measurements are provided to a prediction engine which calculates a diagnostic output based upon the plurality of current-related measurements. The diagnostic prediction provided by the prediction engine can provide an estimate of viable life remaining for the device electronics. The diagnostic feature provides on-line status of the overall status of the field transmitter.

Abstract: An apparatus for inspecting a turbine blade of an aircraft engine may include a shaft having a proximate end and a distal end, an attachment device coupled to the distal end of the shaft and capable of being attached to a strut of the aircraft engine and an engagement device, coupled to the attachment device, capable of moving away from the attachment device and attaching to a trailing edge of the turbine blade. The apparatus may also include a probe moveably coupled to the engagement device and capable of moving along a leading edge of the turbine blade to detect a surface anomaly of the turbine blade and a control device for controlling the movement of the probe along the leading edge of the turbine engine in response to user manipulation.

Abstract: A pin configured to be disposed within a probe is provided. The probe may be configured to measure a property of a conductive layer. The pin may include a contact surface which may be substantially planar. The pin may also include a first portion extending from the contact surface. A cross-sectional area of the first portion, in a direction substantially parallel to the contact surface, may be substantially equal to a surface area of the contact surface across a length of the first portion. A system configured to measure a property of a conductive layer is also provided. The system may include a mounting device and at least two probes coupled to the mounting device. The probes may be configured to measure the property of a conductive layer. In addition, the mounting device may be configured such that one of the probes may contact the conductive layer during measurement.

Abstract: A manufacturing method for manufacturing a solar panel including a solar cell and an outer housing and an inspection method for inspecting a solar panel generating system, include a step of performing one of a withstand voltage test and an insulation resistance test between a live electrical section electrically connected to the solar cell and a conductor section of the outer housing, and thereafter a step of applying a voltage between the live electrical section and the conductor section. In this way, a residual charge left subsequent to the withstand voltage test or the insulation resistance test is reliably removed within a short period of time.

Abstract: A valve seating (23) is made from a fluoridated polymer, for example, solid glass-coated PTFE or reinforced PFA. At least one electrode (24) is attached to or integral with the valve seating and made of conductive material, such as graphite-TEFLON®, that is compatible with the valve seating. The valve seating is especially for use in conjunction with a device for verifying the integrity of an enamel coating of the “enamel-test” type. The valve seating is then used on the waste valve (11) of the container to be checked and two electrodes (24) are disposed so as to be in contact with the contents (8).

Abstract: Apparatus and method for sensing the state of electrodes during baking to obtain an indication of the internal condition of the electrodes where changes of phase are being produced. The apparatus includes a conductor disposed within the electode material during baking, an external, low power, variable frequency electric generator connected to the conductor, and means for analyzing a response signal, especially impedance of the response signal upon changing the frequency of the electric current, to determine the condition of the electrode along its height.

Abstract: In one aspect, the invention includes an apparatus having a semiconductor substrate receiving device with at least one extension configured to hold a semiconductor substrate within a liquid bath. The device is configured to have at least a portion of the extension at least periodically placed within the liquid bath. The extension includes a conductive material at least partially coated with an insulative protective material. The insulative protective material is configured to protect the portion of the conductive material which is in the bath from physically contacting the liquid of the bath. The apparatus also includes an electrode within the bath, and an electrical connection between the electrode and the conductive material of the extension. Additionally, the apparatus has a monitor configured to monitor a current flow state of a circuit that includes the electrode, conductive material of the extension, and liquid bath to determine if the circuit is in a closed state or in an open state.

Abstract: A cased well in the earth is electrically energized with A.C. current. Voltages are measured from three voltage measurement electrodes in electrical contact with the interior of the casing while the casing is electrically energized. In a measurement mode, A.C. current is conducted from a first current carrying electrode within the cased well to a remote second current carrying electrode located on the surface of the earth. In a calibration mode, current is passed from the first current carrying electrode to a third current carrying electrode located vertically at a different position within the cased well, where the three voltage measurement electrodes are located vertically in between the first and third current carrying electrodes. Voltages along the casing and resistances along the casing are measured to determine wall thickness and the location of any casing collars present so as to electrically inspect the casing.

Abstract: The present invention provides a defect detecting system and a container therefor. The container has a chamber body for storing an electrically conductive fluid material. The container is produced from a unitary multilayer film and has an electrode with one end of the electrode exposed to the inside and the other end exposed to the outside of the chamber. The multiple layer film has a thermoplastic layer and an electrically conductive layer, and the thermoplastic layer and the electrode are adapted to contact the fluid material. The electrode is hermetically affixed to the container and electrically separated from the electrically conductive layer.

Abstract: A method and apparatus for monitoring crack inside piping suitable for high temperature environment including an electrode attachment process for attaching a pair of heat resistant current input-output electrodes to an outer circumferential surface of the piping such that the crack is positioned between electrodes. Measuring intra-crack potential difference by a pair of heat resistant potential difference measuring electrodes attached to outer circumferential surface of the piping and placed between the input output electrodes by supplying alternating current between the input-output electrodes. Crack length is calculated from the measured electric potential difference after correcting the intra-crack electric potential difference as a function pipe temperature and pressure by an intra-crack electrode potential difference correction process.

Abstract: A particular portion of a damaged layer within a semiconductor substrate, which is likely to affect the performance of resulting semiconductor devices, is distinguished from the other negligible portions thereof and the depth of that non-negligible portion is detected. An Si substrate is placed on a stage, and a mercury electrode, which forms a Schottky barrier with the Si substrate, is brought into contact with the surface of the Si substrate. When a constant current is supplied from a constant current source between the mercury electrode and the Si substrate, charges are trapped at the trap centers in the damaged layer within the Si substrate. As a result, a potential on the conduction band rises near the surface of the Si substrate. And if the voltage between the electrode and the substrate is increased along with the potential rise, a constant current flows.

Abstract: A field device includes circuitry to successively measure a parameter related to current drawn by electronics of the field device. The measurements are provided to a prediction engine which calculates a diagnostic output based upon the plurality of current-related measurements. The diagnostic prediction provided by the prediction engine can provide an estimate of viable life remaining for the device electronics. The diagnostic feature provides on-line status of the overall status of the field transmitter.

Abstract: In one aspect, the invention includes an apparatus comprising a semiconductor substrate receiving device with at least one extension configured to hold a semiconductor substrate within a liquid bath. The device is configured to have at least a portion of the extension at least periodically placed within the liquid bath. The extension comprises a conductive material at least partially coated with an insulative protective material. The insulative protective material is configured to protect the portion of the conductive material which is in the bath from physically contacting the liquid of the bath. The apparatus also comprises an electrode within the bath, and an electrical connection between the electrode and the conductive material of the extension. Additionally, the apparatus comprises a monitor configured to monitor a current flow state of a circuit comprising the electrode, conductive material of the extension, and liquid bath to determine if the circuit is in a closed state or in an open state.

Abstract: In one aspect, the invention includes an apparatus comprising a semiconductor substrate receiving device with at least one extension configured to hold a semiconductor substrate within a liquid bath. The device is configured to have at least a portion of the extension at least periodically placed within the liquid bath. The extension comprises a conductive material at least partially coated with an insulative protective material. The insulative protective material is configured to protect the portion of the conductive material which is in the bath from physically contacting the liquid of the bath. The apparatus also comprises an electrode within the bath, and an electrical connection between the electrode and the conductive material of the extension. Additionally, the apparatus comprises a monitor configured to monitor a current flow state of a circuit comprising the electrode, conductive material of the extension, and liquid bath to determine if the circuit is in a closed state or in an open state.

Abstract: In one aspect, the invention includes an apparatus comprising a semiconductor substrate receiving device with at least one extension configured to hold a semiconductor substrate within a liquid bath. The device is configured to have at least a portion of the extension at least periodically placed within the liquid bath. The extension comprises a conductive material at least partially coated with an insulative protective material. The insulative protective material is configured to protect the portion of the conductive material which is in the bath from physically contacting the liquid of the bath. The apparatus also comprises an electrode within the bath, and an electrical connection between the electrode and the conductive material of the extension. Additionally, the apparatus comprises a monitor configured to monitor a current flow state of a circuit comprising the electrode, conductive material of the extension, and liquid bath to determine if the circuit is in a closed state or in an open state.

Abstract: Apparatus 10 for condition monitoring the integrity of a rivet 12 joint holding together sheets 14 and 16 of a structure 18 includes a substantially fluid impervious pad 20 for covering the heads of the rivets 12 and an adjacent surface 24 of the structure 18. The pad 20 has a first surface 26 for placement over the rivets 12 and the surface 24. An inner portion of the surface 26 is formed or otherwise configured to define a fluid flow region 28 between the pad 20 and the rivets 12/surface 24 across which fluid can flow. The region 28 is coupled to a constant vacuum source 30 via a conduit 32 and a series coupled high fluid flow impedance 34. A transducer 38 and display 44 coupled in parallel across the impedance 34 provides an indication of change in differential pressure across the high impedance which in turn provides an indication of the presence or development of a flaw in the rivets joint.

Abstract: Apparatus and method for sensing the state of electrodes during baking to obtain an indication of the internal condition of the electrodes where changes of phase are being produced. The apparatus includes a conductor disposed within the electode material during baking, an external, low power, variable frequency electric generator connected to the conductor, and means for analyzing a response signal, especially impedance of the response signal upon changing the frequency of the electric current, to determine the condition of the electrode along its height.

Abstract: A reverse biasing apparatus is used to remove short-circuited portions in a solar battery module having multiple strings of solar cells each including a first electrode layer, a photovoltaic semiconductor layer and a second electrode layer formed on a glass substrate, by applying a reverse bias voltage between the electrodes of adjacent solar cells. The reverse biasing apparatus comprises probes to be in contact with the electrodes of adjacent three or more strings of solar cells, an actuator for actuating the probes up and down, and a relay switch for selecting, from the probes, a pair of probes for applying the reverse bias voltage between the electrodes of an arbitrary pair of adjacent solar cells. The use of the reverse biasing apparatus can ensure an efficient reverse biasing process on a solar battery module having integrated multiple strings of solar cells.

Abstract: Methods are provided for detecting and locating leaks in liners used as barriers in the construction of landfills, surface impoundments, water reservoirs, tanks, and the like. Electrodes are placed in the ground around the periphery of the facility, in the leak detection zone located between two liners if present, and/or within the containment facility. Electrical resistivity data is collected using these electrodes. This data is used to map the electrical resistivity distribution beneath the containment liner or between two liners in a double-lined facility. In an alternative embodiment, an electrode placed within the lined facility is driven to an electrical potential with respect to another electrode placed at a distance from the lined facility (mise-a-la-masse). Voltage differences are then measured between various combinations of additional electrodes placed in the soil on the periphery of the facility, the leak detection zone, or within the facility.

Abstract: An interconnection test structure for evaluating more accurately and reliably electromigration characteristics is provided. The test structure includes an elongated metal test conductor having a first end and a second end, small extension metal conductors connected to the first end and the second end of the test conductor, and a plurality of vias disposed in the small extension metal conductors adjacent the first end and the second end of the test conductor. As a result, the current density of the plurality of vias is made to be less than the current density of the test conductor.

Abstract: A method and apparatus for determining leaks in sewage pipes. The apparatus includes a measuring probe having several radially arranged measuring electrode segments, the measuring probe being positioned in the sewage pipe. With the probe sections and electrode segments being arranged in such radial manner, the electrical probe, once electrically powered, measures a leakage current emitted by the probe's central section with several probes sections at a same electrical potential, and divides the measured leakage currents of the probe's central section in a mathematical operation into two or more electrode segments to determine both an axial and radial location for defects within the sewage pipe. A higher leakage current in one segment indicates the location of a leak, and the amplitude of the leakage current indicates the volume of the leak.

Abstract: There is provided a method and system for evaluating a condition of a surface of a combustion vessel exposed to deposition thereon of a material released during a combustion of a fuel in the combustion vessel during a combustion process. The method preferably comprises the steps of imposing a current on an electrical network arranged relative to the combustion vessel and having at least one electrode and thereafter detecting at least one characteristic of the electrical network during the step of imposing a current on the electrical network. The method further includes the step of evaluating a condition of the deposition exposed surface based upon the at least one detected characteristic of the electrical network.

Abstract: The invention relates to a method for determining the loop resistance of a power supply network with a neutral conductor (called N), a phase or external conductor (called L1), a ground or protective earth conductor (called PE), and a fault current breaker (called FI) based on the differential quotient Ri=dU/dI≈(U1−U2)/(I1−I2); whereby U1 is the measured, unloaded network voltage, I1 is the zero current without load, U2 is the measured, loaded network voltage, and I2 is the calculated load current. According to one aspect of the invention, the following steps are provided: Loading of a L1-N loop and determining the resistance RL1 according to equation (1), loading of a N-PE loop with a measuring current IM under a measuring voltage UM which is small enough to avoid triggering of the fault current circuit breaker, and determining the resistance RPE according to the following equation (2): RPE=UM/IM  (2) and determining the loop resistance as RL1+RPE.

Abstract: A method and apparatus for measuring impedance of grounding system wherein a transient electric current is injected at the ground system under test while measuring the a transient ground potential difference, as well as the injected electric current. The ground potential difference is measured with respect to several points on the earth's surface at small distances from the test system. These measurements are processed by computer software which filters noise, corrects voltage and current transducer errors, and estimates the test system ground potential rise with respect to remote earth. Correction algorithms are used to remove irregularities in the frequency response of the voltage and current transducers and analog filters. The filtered and corrected measurements are used to estimate the ground impedance as a function of frequency. For this purpose, a parameter estimation procedure is used which takes into consideration the geometric arrangement of the voltage and current probes.

Abstract: An innovative multi-dimensional, low frequency, impedance measurement probe array, measurement system, and method are disclosed for detecting flaws in conductive articles. The device and method provide for contacting a conductive article with an multi-probe array of current and voltage probes, injecting current sequentially through a plurality of current probe pairs and measuring absolute or relative voltages with a plurality of voltage probes and voltage probe pairs across the surface of an article for each current flow condition. The device and method further provide for constructing a voltage profile across the surface of an article where disruptions in the voltage profile enable detection of the presence, location and orientation of flaws for flaw sizes as low as 20 um.

Abstract: The improved method for microscopic measurement of electrical characteristics comprises a standard atomic force microscope (AFM). The AFM includes a pointed, conductively coated tip attached to one end of a softly compliant cantilever arm, also capable of conducting electricity. The other end of the cantilever arm is attached to the top of a piezo-electric z-axis driver which will raise and lower the cantilever arm as the AFM tip is scanned across the surface of a sample. A piezo-electric X-Y scanstage controller may also be provided and connected to the bottom of the z-axis driver. The X-Y scanstage is preferably capable of scanning the movement of the entire system including the Z-axis driver, cantilever arm and AFM tip.

Abstract: A method for evaluating quality of a resistance weld is provided, in which a nugget generation state during a welding process is evaluated by observable numerical values based on physical phenomena, and which can afford a wide application range in welding material as well as a capability of accurate knowledge as to the nugget generation state of the weld. Based on that a specific resistance value of a metal material to be welded has a temperature dependency in a conduction state of AC or current-pulsated welding current, a rate of change of inter-chip dynamic resistance instantaneous value during a current changing period is determined, a changing state of the dynamic resistance instantaneous value is further calculated, and a heat-generating state of a weld zone, i.e., a nugget formation state is estimated. Thus, a quality evaluation of a weld is performed accurately.

Abstract: Disclosed is a combined "streak-detector" and "ink-lever flow detector" on opposite sides of a single printed circuit board; each detector comprising a pair of parallel printed circuit segments adapted to be "shorted" by interposition of conductive ink and coupled to register this event in an associated detect-logic stage.

Abstract: A cased well in the earth is electrically energized with A.C. current. Voltages are measured from three voltage measurement electrodes in electrical contact with the interior of the casing while the casing is electrically energized. In a measurement mode, A.C. current is conducted from a first current carrying electrode within the cased well to a remote second current carrying electrode located on the surface of the earth. In a calibration mode, current is passed from the first current carrying electrode to a third current carrying electrode located vertically at a different position within the cased well, where the three voltage measurement electrodes are located vertically in between the first and third current carrying electrodes. Voltages along the casing and resistances along the casing are measured to determine wall thickness and the location of any casing collars present so as to electrically inspect the casing.

Abstract: A device for detecting fractures or corrosion in a workpiece having a non-conductive outer surface. A thin film layer of metallic material comprising a plurality of separate crack detection wires is bonded to the non-conductive surface of the workpiece. A top coating of protective material is applied to the thin film layer to protect the detection wires from abrasion and corrosion. When an electrical current is transmitted through the detection wires, a predictable resistivity pattern is viewable on a monitor. As a fracture propagates through the workpiece causing the crack detection wires to break one-by-one, the change in resistivity of the wires can be monitored and the existence and extent of any fracture or corrosion to the wires determined.

Abstract: Any voids in the divider walls of multichamber packages, and in particular, multichamber tubes, can be detected by applying a potential difference across the divider walls of the package. If there is a void, there will be an arcing of current from one electrode to another with a measurable difference in the potential difference between the electrodes. There also may be a visual and/or audible indication. This change in potential difference can be used to determine the integrity of the divider walls of the package. In a preferred mode, the electrodes also are the mandrel mold sections that are used for the compression molding of the shoulder and nozzle onto the body of a tube package. In this embodiment the integrity of the divider walls can be determined prior to the forming of the shoulder and nozzle onto the tube body or after the shoulder and nozzle is formed onto the tube body.

Abstract: A protective grounding jumper cable tester is provided which includes a housing; a pair of jumper attachment terminals on the housing for attachment of a jumper cable therebetween; a dc voltage applying circuit disposed in the housing and connected to the pair of jumper attachment terminals for applying a direct current through a jumper cable attached between the jumper attachment terminals; and electronic means in the form of a PC board and microprocessor disposed in the housing and interconnected to the dc voltage circuit for applying a predetermined mathematical relationship to measure a resistance value of at least a portion of the jumper cable attached between the jumper attachment terminals. The electronic means in applying the predetermined mathematical relationship to measure the resistance value includes means for taking different voltage readings in accordance with Kelvin's measurement procedure and calculating the resistance value from the voltage readings in accordance with Kirchoff's current law.

Abstract: Disclosed is a combined "streak-detector" and "ink-lever flow detector" on opposite sides of a single printed circuit board; each detector comprising a pair of parallel printed circuit segments adapted to be "shorted" by interposition of conductive ink and coupled to register this event in an associated detect-logic stage.

Abstract: A method for making an acoustic wave device. The method has steps of providing a substrate suitable for acoustic wave devices and processing the substrate to provide a patterned metallization thereon. The patterned metallization includes an acoustic wave filter pattern. The method also has steps of measuring a sheet resistance associated with the acoustic wave filter pattern, determining a resistance of a test pattern associated with the acoustic wave filter pattern to provide a measured resistance and computing an estimated average linewidth for the acoustic wave filter pattern from the measured resistance and the sheet resistance.

Abstract: A probe for electrical contact with a metal layer of an integrated circuit wherein the probe features a polycrystalline diamond layer coating a fine conductive wire. The diamond coating has exposed pyramidal facets having a density of at least 2000 per square millimeter. The substrate has a radius exceeding one micrometer.

Abstract: Two electrical wires are connected to the surface of an electrically conductive solid body at two measurement points located on either side of a crack in the surface of the body. The two wires form a thermoelectric couple. A constant DC current is applied to the body. The two wires are connected to a device for measuring the extent of the crack and another device for measuring the temperature of the crack. By measuring the potential difference during application and interruption of the DC electric current to the body, it is possible to simultaneously obtain a measurement of the extent of the crack and a measurement of the temperature of the crack.

Abstract: A probe card tester for detecting defects occurring as a result of integrated circuit processing of a substrate having a plurality of space to conductors with a contact at each end of each conductor, includes: a probe card tester including a set of parallel resistors for connecting at least one in parallel with each conductor and a set of series resistors for connecting together the ends of the conductors to form a series resistance and a number of probe elements, one corresponding to each end of each conductor, for interconnecting the parallel and series resistors with the conductors for detecting defects bridging the conductors.