Abstract: A probe card device includes a wiring board provided with a plurality of contacts, a probe head having a probe holder and a plurality of conductive probes arranged on the probe holder, respectively, and a circuit protection assembly including an insulation plate, a plurality of through holes and a plurality of self-resetting fusing elements. The insulation plate is sandwiched between the wiring board and the probe head. The through holes are respectively formed on the insulation plate and arranged in an array form. The self-resetting fusing elements are respectively disposed within the through holes. Each of the self-resetting fusing elements is electrically connected to one of the contacts and one of the conductive probes for reversibly breaking down electric currents from the wiring board to the conductive probe.

Abstract: A system for accessing a plurality of instruments embedded in a semiconductor device includes a hardware interface and a test controller for testing the semiconductor device or generating test patterns for the semiconductor device, wherein the test controller comprises an instrument connectivity language and a procedural description language configuration for operating the instruments. The test controller is configured to perform the steps of: testing at least one functionality of each of the plurality of instruments, thereby receiving a fault status of each of the plurality of instruments; and based on the fault status of the plurality of instruments, configuring a test block in the semiconductor device such that valid test patterns for the semiconductor device can be generated without updating the instrument connectivity language and procedural description language configuration.

Abstract: The present disclosure provides an small-sized fast cold and hot shock test device. The device includes a host, a test head used for cold and hot shock to a component under test by temperature control and output of compressed air, and an adjustment device for adjusting a position of the test head. The host includes a control device at least used to send temperature control data to the test head. The test head includes an eddy current mechanism for cooling or heating the compressed air, a heater including an air inlet end and an air outlet end, and a nozzle. The eddy current mechanism includes an air inlet, a cold air outlet, and a hot air outlet. The air inlet is connected with an air supply system through an intake air line unit. The cool air outlet is connected with the air inlet end of the heater. The nozzle is connected with the air outlet end of the heater.

Abstract: A safety container for high-power, electronic device testing, the safety container including a first shell and first and second ports in the first shell. The first shell is configured to substantially surround a testing chamber sized to accommodate a device-under-test (DUT). The first shell is substantially rigid. The first port is configured to allow a fluid into the testing chamber, the second port configured to allow the fluid to exit the testing chamber.

Abstract: A mechanical arm includes a body and an operating arm. The operating arm includes a connector connected to the body, as well as a first adapting part and a second adapting part which are connected to the connector. The first adapting part is configured to mount a first operating mechanism for opening and closing the socket. The second adapting part is configured to mount a second operating mechanism for grabbing and releasing a semiconductor device. After the first adapting part drives the first operating mechanism to open the socket, the second adapting part is able to drive the second operating mechanism to put the semiconductor device into the socket or take the semiconductor device out from the socket.

Abstract: The present disclosure is directed to a system having a first loading component and a second loading component for applying load to a device during a test of the device, the first loading component is configured to be moveable with respect to the second loading component. The system includes a seal member arranged between the first loading component and the second loading component, the seal member is adapted to engage the device during testing so as to apply a load against the device during testing and provide sealing around a cavity positioned below the first loading component and above the device.

Abstract: A pull out-assisting linkage device for load board of semiconductor automatic test equipment. One end of the handle is rotatably connected to the test equipment by a rotating member. The middle of the handle is bolted to the linkage. The two rotating plates are fixedly connected to the linkage and are located at the two ends of the linkage. Each rotating plate is rotatably connected to the test equipment. Both the first pull out-assisting rod and the second pull out-assisting rod are fixedly connected to each rotating plate by a universal connecting rod. The first pull out-assisting rod and the second pull out-assisting rod are slidingly connected to the test equipment. The first pull out-assisting rod has a first pull out-assisting slot in the side wall, and the second pull out-assisting rod has a second pull out-assisting slot in the side wall, with the first pull out-assisting slot and the second pull out-assisting slot set in reverse.

Abstract: A testing device for electronic dies includes a first support part and a second support part configured to be removably assembled with each other. The first and second support parts together define at least one housing where at least one electronic die can be arranged to be tested. The electronic die has a first surface with contacting elements. The at least one housing includes a first portion. This at least one housing is arranged to enable the at least one electronic die to occupy a first position in the housing where the first surface is spaced apart from the first portion, and is further arrange to enable the at least one electronic die to occupy a second position in the housing where the first surface bears against the first portion.

Abstract: A test system that is compatible with multiple specifications while maintaining a footprint is provided. The test system includes a plurality of test chambers, each test chamber of the plurality of test chambers including a test head used when a substrate on a stage is tested, and a heating medium supply configured to supply a heating medium to the stage. The heating medium supply is disposed in an area lower than a test area in which the plurality of test chambers are disposed.

Abstract: An advanced temperature control system and method are described for a wafer carrier in a plasma processing chamber. In one example a heat exchanger provides a temperature controlled thermal fluid to a fluid channel of a workpiece carrier and receives the thermal fluid from the fluid channel. A proportional valve is between the heat exchanger and the fluid channel to control the rate of flow of thermal fluid from the heat exchanger to the fluid channel. A pneumatic valve is also between the heat exchanger and the fluid channel also to control the rate of flow of thermal fluid from the heat exchanger and the fluid channel. A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve and the pneumatic valve in response to the measured temperature to adjust the rate of flow of the thermal fluid.

Abstract: During the semiconductor testing process, in order to decrease a temperature difference between a predetermined temperature and a measured temperature, the present disclosure provides a wafer probing testing apparatus and a final testing apparatus for semiconductor testing. The wafer probing testing apparatus comprises a printed circuit board, a probe head, a heater, a thermal sensor and a thermal controller. The final testing apparatus comprises a printed circuit board, a socket, a heater, a thermal sensor and a thermal controller. Due to the arrangement of the thermal sensor, the heater and the thermal controller, the temperature difference of the predetermined temperature may be decreased, and the cost during the semiconductor testing can also be reduced.

Abstract: A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

Abstract: A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.

Abstract: Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.

Abstract: A test carrier that accommodates a device under test (DUT) and has a through-hole facing the DUT, including: a movable valve that: opens by suction through the through hole such that the DUT is sucked through the through hole.

Abstract: Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.

Abstract: A mounting table is provided. The mounting table includes a base having a first flow path, a recess, and a second flow path connected to the recess, and a variable control mechanism configured to variably control a contact area between a target object disposed on the base and a mounting surface for mounting thereon the target object by filling and discharging fluid into and from the recess through the second flow path.

Abstract: An apparatus for testing a semiconductor device is described. The apparatus includes a test chamber in which a test process for a plurality of semiconductor devices is performed, a first storage disposed in the test chamber with a first semiconductor device located therein, a second storage spaced apart in a first direction from the first storage with a second semiconductor device located therein, a first nozzle extending in the first direction on a first sides of the first and second storages and including a plurality of first air outlets configured to discharge air, a second nozzle extending in the first direction on and including a plurality of second air outlets configured to discharge air, and a controller controlling temperatures of the first and second semiconductor devices within a predefined temperature range by controlling the air discharged by the first and second nozzles.

Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

Abstract: Methods and systems for operating a lighting device are provided. In one example, a method of operating a lighting device including an array of light-emitting elements, an array of heat sinks, and an array of cooling fans, wherein each of the heat sinks corresponds to one of the light-emitting elements, and each of the cooling fans corresponds to one of the heat sinks, includes conductively coupling each of the heat sinks to the corresponding light-emitting element, directing air flow from each of the cooling fans to the corresponding heat sink, measuring heat sink temperatures corresponding to each of the heat sinks with a temperature sensor positioned at the heat sinks, adjusting a speed of each of the cooling fans to reduce a deviation of the corresponding heat sink temperature from a target temperature, and adjusting the target temperature based on an aggregate characteristic of the cooling fan speeds.

Abstract: A method for testing a device under test, the device under test being a measuring instrument to measure a physical parameter of a fluid, includes: performing a plurality of valid test runs, wherein a valid test run includes: exposing the device under test and a reference measuring instrument to the fluid under a set of influences, the set of influences being defined by influence parameters; monitoring the influence parameters; obtaining a reference value for the physical parameter from the reference measuring instrument; and obtaining a test value for the physical parameter from the device under test, wherein a test run is invalidated if influence parameters do not meet specified test requirements for the influence parameters; and then evaluating a plurality of test values originating from the plurality of valid test runs with respect to at least one of accuracy, repeatability and reproducibility.

Abstract: A contacting unit (30) for a test handler (100) for carrying out functional tests on semiconductor elements having a surface, in particular on ICs (200), has a contacting module (60).

Abstract: A system-level testing apparatus and a system-level testing system are provided. The system-level testing apparatus includes an apparatus body, a chip carrying device, and a control device. A holding structure in the apparatus body is configured to hold a system circuit board. The chip carrying device includes a carrying circuit board, and a plurality of electrical connection sockets and a plurality of connection structures are disposed on the carrying circuit board. The electrical connection structures are electrically connected to the connection structures. When the electrical connection sockets carry a plurality of chips under test, the carrying circuit board is disposed on the system circuit board, and the connection structures are connected to a plurality of system connection structures of the system circuit board, the control device can transmit a test signal to perform a system-level test operation to the system circuit board and the chips under test.

Abstract: The present disclosure provides a testing fixture for holding a device under test (DUT). The testing fixture includes a base, a frame, a recessed portion, a plurality of sets of electrical contacts and a plurality of electrical lines. The frame extends upward along an outer perimeter of an upper surface of the base. The recessed portion is surrounded by the frame and the upper surface of the base, and the DUT is received in the recessed portion. The plurality of sets of electrical contacts are disposed on the recessed portion and arranged in a rotationally symmetrical manner, wherein a plurality of plated through holes of the DUT are in contact with one set of the electrical contacts after the DUT is assembled with the testing fixture.

Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.

Abstract: An electronic component handler including a first holding section and a second holding section holding an electronic component by adsorption, a suction section giving the first holding section and the second holding section an adsorption force to adsorb the electronic component, a suction flow path, a first branch flow path, a second branch flow path, a first opening/closing section opening and closing the first branch flow path, a second opening/closing section opening and closing the second branch flow path, a first pressure measurement section measuring first pressure inside the first branch flow path, a second pressure measurement section measuring second pressure inside the second branch flow path, and a control section, in which the control section opens the first branch flow path by the first opening/closing section and causes the first holding section to adsorb the electronic component, and checks whether or not the first pressure is lower than preset pressure when the second branch flow path is opene

Abstract: An apparatus and a method provide a high temperature test and a low temperature test. The apparatus mainly includes a depressing head and a test base, wherein the depressing head includes a cooling module, a heating module, and a heat dissipation module therein, the heat dissipation module includes a finned heat sink and a heat conduction member, and the heat conduction member is thermally coupled to the heating module and the finned heat sink. When the low temperature test is performed, an electronic component is cooled by filling liquid nitrogen into the cooling module of the depressing head. When the high temperature test is performed, the electronic component is heated by the heating module. If the temperature of the electronic device is higher than a predetermined high temperature, the electronic device is cooled by the heat dissipation module.

Abstract: A system utilized for freezing parts of electronic mobile devices comprises a freezing machine incorporating internet communication hardware and software, molds and vacuum bags and a central computer server hosting and operating a web-centric and/or mobile app software application which connects to, updates and operates the freezing machine via the Internet. The freezing machine comprises a housing, an engine with cylindrical cooling head, an adjustable cooling head ring fixture and metal plate attached to the adjustable cooling head ring fixture. The freezing machine further comprises an encapsulation chamber, a lid, a power inlet, a LCD/OLED display and a PCB with processor capable of operating the freezing machine.

Abstract: The present disclosure relates to a method of depositing a fluid onto a substrate. In some embodiments, the method may be performed by mounting a substrate to a micro-fluidic probe card, so that the substrate abuts a cavity within the micro-fluidic probe card that is in communication with a fluid inlet and a fluid outlet. A first fluidic chemical is selectively introduced into the cavity via the fluid inlet of the micro-fluidic probe card.

Abstract: Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.

Abstract: A semiconductor test system has a film frame including a tape portion with one or more openings through the tape portion. The opening is disposed in a center region of the tape portion of the film frame. The film frame may have conductive traces formed on or through the tape portion. A thin semiconductor wafer includes a conductive layer formed over a surface of the semiconductor wafer. The semiconductor wafer is mounted over the opening in the tape portion of the film frame. A wafer probe chuck includes a lower surface and raised surface. The film frame is mounted to the wafer probe chuck with the raised surface extending through the opening in the tape portion to contact the conductive layer of the semiconductor wafer. The semiconductor wafer is probe tested through the opening in the tape portion of the film frame.

Abstract: A test fixture for inspecting joints of fuse assemblies may bend a fuse assembly at a target angle for inspection. The test fixture may include a base and a guide. The base may feature surfaces angled at the target angle. The guide at least partially overhangs the base to form a channel. The guide may include structures to align on the base and inspect the fuse assembly.

Abstract: The present invention provides a prober and a transfer unit being capable of improving throughput at each of the measurement units. The prober includes a transfer object housing that houses a plurality of transfer objects, the plurality of measurement units, the transfer unit that moves between the transfer object housing for housing the plurality of transfer objects and the plurality of measurement units to transfer the transfer objects into the transfer object housing or each of the measurement units, and a moving device. The transfer unit includes environment controller configured to control an environment in a casing, and air curtain formation means for causing the casing to be in a sealed or a substantially sealed state.

Abstract: The present invention provides a prober and a transfer unit being capable of improving throughput at each of the measurement units. The prober includes a transfer object housing that houses a plurality of transfer objects, the plurality of measurement units, the transfer unit that moves between the transfer object housing for housing the plurality of transfer objects and the plurality of measurement units to transfer the transfer objects into the transfer object housing or each of the measurement units, and a moving device. The transfer unit includes environment controller configured to control an environment in a casing, and air curtain formation means for causing the casing to be in a sealed or a substantially sealed state.

Abstract: The present invention provides a prober and a transfer unit being capable of improving throughput at each of the measurement units. The prober includes a transfer object housing that houses a plurality of transfer objects, the plurality of measurement units, the transfer unit that moves between the transfer object housing for housing the plurality of transfer objects and the plurality of measurement units to transfer the transfer objects into the transfer object housing or each of the measurement units, and a moving device. The transfer unit includes environment controller configured to control an environment in a casing, and air curtain formation means for causing the casing to be in a sealed or a substantially sealed state.

Abstract: A chip package assembly testing system and method for testing a chip package assembly are provided herein. In one example, an IC test system is provide that includes a robot, an input queuing station, an output queuing station, and a test station. The test station includes a first and second test interfaces. The first test interface is configurable to receive and communicatively connect with a first chip package assembly having one arrangement of solder ball connections. The second test interface is configurable to receive and communicatively connect with a second chip package assembly having a different arrangement of solder ball connections. The test station also includes a first test processor configured to test the chip package assembly connected through the first interface utilizing a predetermined first test routine and a second test processor configured to test the chip package assembly connected through the second interface utilizing a predetermined second test routine.

Abstract: The present invention provides a prober and a transfer unit being capable of improving throughput at each of the measurement units. The prober includes a transfer object housing that houses a plurality of transfer objects, the plurality of measurement units, the transfer unit that moves between the transfer object housing for housing the plurality of transfer objects and the plurality of measurement units to transfer the transfer objects into the transfer object housing or each of the measurement units, and a moving device. The transfer unit includes environment controller configured to control an environment in a casing, and air curtain formation means for causing the casing to be in a sealed or a substantially sealed state.

Abstract: A dual bellows system and method that includes a main bellows which interacts with a thermally compensating bellows, whereby interaction of the main bellows with the thermally compensating bellows results in a transfer of force and/or displacement that is insensitive to temperature changes.

Abstract: An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.

Abstract: An example test system includes: a test slot to hold a device under test (DUT); a temperature control system comprising a phase-change material, with the temperature control system for maintaining a temperature of the phase-change material in a steady-state condition, with the phase-change material changing phase during a transient condition to affect a temperature of a thermally-conductive structure, and with the steady-state condition being longer in duration than the transient condition; and an air mover to direct air over the thermally-conductive structure and towards the DUT in the test slot in order to affect a temperature of the DUT.

Abstract: Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.

Abstract: Provided is a prober capable of maintaining parallelism between a probe card and a wafer as well as performing wafer-level inspection with high accuracy. A test head is held by a test head holding part, and the test head and a probe card are sucked and fixed to a pogo frame attached to a head stage. A wafer chuck is moved toward a probe card while being fixed to a Z-axis movement-rotation unit in a detachable manner, and the wafer chuck is drawn toward the probe card by reducing pressure in an air-tight space formed between the wafer chuck and the probe card using a pressure reducing unit. Then, an electrical inspection of a wafer is performed while the test head, the pogo frame, the probe card, and the wafer chuck are integrated with respect to the head stage.

Abstract: A massively parallel wafer-level reliability system to test a reliability of wafers includes: a test platform; stations disposed on the test platform, wherein an individual test station receives a wafer and includes: a chuck disposed on the test platform; a probe including contactors that electrically contact the wafer; and a temperature controller to control a temperature of the wafer; a control platform disposed among the test stations; and a system controller to independently control the test stations and that is in electrical communication with the temperature controller, wherein the reliability of the wafers is tested in parallel by the test stations.

Abstract: A system for qualifying a process in a facility. The system includes a validation system and a portable computer device. The validation system includes a storage device, a processing device, and one or more sensor input modules each connected to one or more sensors. The portable computer device includes a storage device and a processing device. The storage device of the portable computer device includes a database comprising configuration file for configuring the validation system to perform a qualification of the asset. The processing device of the portable computer device is configured to transmit the configuration file to the validation system for storage in the storage device thereof. The processing device of the validation system is configured to load the configuration file stored in the storage device thereof and to perform the qualification of the asset based on the loaded configuration file.

Abstract: Determining an in-plane thermal conductivity of anisotropic materials, such as display stacks, printed circuit boards (PCBs), and composite housings, includes heating a first region of an anisotropic sample, cooling a second region of the sample, and measuring temperature at a first location between the first region and the second region and a second location between the first region and the second region. The in-plane thermal conductivity of the sample is computed based at least in part on the temperature at the first location, the temperature at the second location, the distance from the first region to the second region, a thickness of the substantially planar anisotropic substrate, and an amount of heat applied to the first region.

Abstract: A temperature controlling equipment includes a connection head of a fluid output device, an isolation hood, a drying chamber and a dry air source. The connection head of the fluid output device has an output nozzle and a first fluid output pipe. The isolation hood has a hood body and a second fluid output pipe. The hood body defines a working space. The output nozzle is communicated with the working space. The second fluid output pipe is communicated with the working space and the first fluid output pipe. The first fluid output pipe and the second fluid output pipe have a connection interface in between. The connection interface is at least partially located in the drying chamber. The dry air source is communicated with the drying chamber and is configured to provide a dry air to the drying chamber.

Abstract: A probe having a sliding rail is provided and includes a probe head, a probe tail, an elastic element made of an elastic material and connected between the probe head and the probe tail, and a sliding rail assembly. The sliding rail assembly includes a slide rail and a position limit protrusion. The slide rail has a fixed end and a free end. The fixed end is fixedly connected to the probe tail, and the free end extends to the probe head. The position limit protrusion is fixedly connected to the probe head, and has a sliding slot formed thereon through which the slide rail can pass. The sliding rail assembly is made of a conductive material, and a cross-section area of the slide rail is greater than a cross-section area of the elastic material of the elastic element.

Abstract: An object of the present invention is to provide an EMC design technique of a device including an electronic device mounted therein for implementing noise amount analysis of a system in which individual electronic devices are combined. A housing model is acquired, component models are selected and acquire, the acquired component models are connected using a wire, the acquired component models are arranged in the acquired housing model, the arranged component models connected using the wire is driven to generate electromagnetic noise from the component models and the wire, the generated electromagnetic noise is propagated in the housing model to calculate a noise amount, and an output process of outputting data of the calculated noise amount is performed. Thus, even in the system in which a plurality of electronic devices are combined, electromagnetic noise analysis of the system can be easily performed, and a noise reduction design can be supported.

Abstract: A testing environment may have at least one controller connected to at least first and second testing slots positioned in a housing. The first testing slot can be configured with a first thermal range capability and the second testing slot may be configured with a second thermal range capability that differs from the first thermal range capability.

Abstract: A test instrument for use with a sample having a plurality of electrically conducting contact pads, the instrument including: a controllable, variable force linear actuator; a probe assembly operated by the linear actuator, the probe assembly having a probe head at one end with a surface for contacting the sample; a movable contactor assembly including a plurality of contacts for electrically contacting the plurality of contact pads on the sample; a housing on which the linear actuator and contactor assembly are mounted, the housing having an identified area for holding the sample during testing; a position sensor assembly for measuring changes in the position of the probe; and a sensor for measuring a force applied to the sample by the probe head.