Abstract: Embodiments herein relate to systems, apparatuses, or processes for coupling or decoupling two substrates by heating pins on one of the substrates and either inserting or withdrawing the heated pins from solder elements on a BGA. In particular, by heating a plurality of pins on a first side of a first substrate, where the plurality of pins are substantially perpendicular to a plane of the substrate, inserting the heated plurality of pins into BGA attached to a second substrate where the BGA includes a plurality of solder elements aligned with the plurality of pins and where the heated plurality of pins melt the plurality of solder elements upon insertion. The inserted plurality of pins physically and/or electrically couple the first substrate and the second substrate.

Abstract: A test board unit may include a test board, a thermal tank and a heat-dissipating plate. The test board may be configured to provide a semiconductor chip with a test current. The thermal tank may be configured to dissipate heat generated in the semiconductor chip. The heat-dissipating plate may be coupled between the test board and the thermal tank and may be configured to transfer the heat from the semiconductor chip to the thermal tank.

Abstract: The embodiment of the present invention discloses a method for detecting the bright point in the liquid crystal display panel. The method comprises applying a cutoff voltage to a gate, remaining a thin film transistor TFT switch turning-off, applying a voltage higher than the voltage of a common electrode to a data line, and detecting a bright point under a black image based on the voltages applied to the gate and the data line. The present invention realizes the bright point detecting under a black image.

Abstract: The present invention relates to systems and methods for preventing over pressurization in a fluid management system used in an integrated circuit (IC) device tester. The prevention of the over pressurization in the fluid management system is based on the use of a pressure relief valve coupled to the fluid management system.

Abstract: A method and apparatus for ultrasound diagnosis that reduces interference and restores missed signals, is provided. The method of ultrasound diagnosis includes operations of receiving a Doppler signal having at least one gap; respectively obtaining model parameter sets of first and second Doppler signals by using Doppler signal periods before and after a start of the at least one gap; synthesizing first and second Doppler information by respectively using the model parameter sets of the first and second Doppler signals; and generating Doppler information for the at least one gap by cross-fading the synthesized first and second Doppler information. The apparatus includes a transformer for transforming received I and Q signals into stereo audio signals using a Hilbert transform; and a source separator which removes interference from the stereo audio signals by performing source separation on the stereo audio signals.

Abstract: An apparatus includes an electrically insulating thermally conductive carrier for supporting a device under test (DUT), one or more thermo-electric devices arranged with the carrier, and one or more conductive vias in the carrier to make electrical connection to the DUT for coupling to an external test apparatus. A method of testing a device under test (DUT) includes supporting the DUT on an electrically insulating thermally conductive carrier, arranging one or more thermo-electric devices coupled to the carrier to control the temperature of the DUT, connecting the DUT electrically to an external test apparatus through one or more conductive vias in the carrier, connecting the one or more thermo-electric devices to the external test apparatus, and characterizing with the external apparatus the DUT on the basis of the temperature of the DUT.

Abstract: Production test of integrated circuit face thermal management challenges with higher power devices. Current production handlers do not have adequate thermal management characteristics. This invention employs thermal diodes on each device under test and a closed loop microprocessor controlled feedback system for thermal control during production test. The feedback system controls the open/close state of a valve supplying cooling fluid to bathe the integrated circuit based upon the difference between a temperature indicated by at least one thermal diode and a set point temperature.

Abstract: A probe card including a multi-layered substrate, a plurality of needles, and a temperature controlling unit may be provided. The multi-layered substrate may include a test pattern through which a test current passes. The needles may be provided on the multi-layered substrate. The needles may be electrically connected to the test pattern and may be configured to contact an object so that the test current may be supplied to the object. The temperature controlling unit may provide the multi-layered substrate with at least one of a first temperature and a second temperature, the first temperature being higher than the second temperature. Thus, a time for setting a test temperature may be shortened. As a result, thermal deformation of the probe card and/or the object may be reduced or suppressed, and thus reliability of test result may be improved.

Abstract: The present invention relates generally to a system and a method for thermal control. More particularly, the invention encompasses an apparatus for thermal control and management of at least one device under test (DUT). The inventive thermal control and management apparatus also allows for the management of a plurality of devices under test, and with each device under test having its own testing regimen. The thermal control and management of the device under test (DUT) is managed using at least one thermoelectric element or cooler (TEC), which can be used to either heat or cool the corresponding device under test (DUT).

Abstract: A wafer inspection interface 18 includes a probe card 20 having multiple probes 25 at a surface of the probe card 20 facing a wafer W, the probes 25 being arranged to correspond to electrodes of multiple semiconductor devices formed on the wafer W; a pogo frame 40 that is in contact with a surface of the probe card 20 opposite to the surface of the probe card 20 facing the wafer W and supports the probe card 20; and a sheath heater 44 provided in the pogo frame 40. The sheath heater 44 is provided along respective sides of through holes 43 formed in the pogo frame 40 in a grid pattern.

Abstract: Independent assemblies are compliantly mounted to a force transfer mechanism to optically align and thermally couple a device under test (DUT) to a test apparatus. A first assembly includes an optical connector. The first assembly has an alignment feature and a first compliant interface. A second assembly includes a thermal control member and force transfer members coupled to a structure. A passage permits a portion of the arm of the first assembly to extend through the structure. The force transfer members provide respective seats for an additional compliant interface. The alignment feature engages a corresponding feature to align the optical connector with the DUT before the compliant interfaces compress under an external force. Compliant mounting of the assemblies accommodates manufacturing tolerances in the DUT so that contact forces on the DUT are relatively consistent and thereby enable consistent optical and thermal coupling between the test apparatus and the DUT.

Abstract: Semiconductor devices with self-heating structures, methods of manufacture thereof, and testing methods are disclosed. In one embodiment, a semiconductor device includes a workpiece, an active electrical structure disposed over the workpiece, and at least one self-heating structure disposed proximate the active electrical structure.

Abstract: In techniques for testing and calibrating an ablator, a tissue probe emulator is connectable to a tissue ablator being tested. The emulator includes a temperature sensor, a thermoelectric unit operative to vary a temperature sensed by the temperature sensor, an adjustable electrical load, electrical control circuitry connected to the thermoelectric unit and the electrical load and operative to independently adjust the electrical load and an output of the thermoelectric unit. The emulator conveys signals emitted by the temperature sensor to the tissue ablator and conveys an ablation energy output of the tissue ablator to the electrical load.

Abstract: An embodiment of a probe card comprising: a probe base plate including a ceramic base plate and a plurality of conductive paths; and a plurality of contacts disposed on one face of the probe base plate and electrically connected to the conductive paths. The ceramic base plate may be provided with: a plurality of first layers having a heating element which generates heat by electric power and disposed at intervals in the thickness direction of the ceramic base plate; second layers each interposed between adjoining first layers; and a power supply path for supplying electric power for heating to the heating element.

Abstract: The invention relates to a method for monitoring an electrical heating apparatus and to a corresponding apparatus. The electrical heating apparatus has at least one heating element. A measured value, which is dependent on the resistance and/or the inductance of the electrical heating element, is measured, the measurement being carried out by means of the measured value being sampled. Owing to the use of sampled values, the measurement process can be shortened.

Abstract: An apparatus for testing an electrical property of a semiconductor device includes a substrate support unit, a tester head above the substrate support unit, the tester head including a base, a probe card connected to the base of the tester head, and a temperature control unit within the base of the tester head, the temperature control unit being configured to control temperature of the probe card by heat transfer with the probe card.