Abstract: A test board is provided. The test board comprises a first region which includes a first upper surface with first test sockets aligned thereon, and a first lower surface opposite to the first upper surface, a second region which includes a second upper surface with second test sockets aligned thereon, and a second lower surface opposite to the second upper surface, a hinge portion between the first region and the second region, and configured to connect the first region and the second region such that the first region and the second region are folded or unfolded, a first connector at one end of the first region opposite to the hinge portion and a second connector at one end of the second region opposite to the hinge portion.

Abstract: An axial locking mechanism includes a lock and a rod. The lock includes a lock aperture and an axis passing through the lock aperture. The rod is receivable by the lock aperture along the axis. In a first rotational orientation about the axis, the rod is movable within the lock aperture along the axis and relative to the lock. In a second rotational orientation about the axis, the rod is fixed within the lock aperture along the axis and relative to the lock.

Abstract: A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.

Abstract: A sensor test system having excellent throughput is provided. The sensor test system 1 includes a test apparatus group 20 including a plurality of sensor test apparatuses 30A to 30D coupled to each other so that the sensor 90 can be transferred, and each of the sensor test apparatuses 30A to 30D includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electrically connected, and a pressure chamber 43 which applies a pressure to the sensor 90, a test unit 35 which tests the sensor 90 via the socket 445, and a conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

Abstract: There is provided a chuck top for use in an inspection apparatus which inspects a plurality of inspection target devices formed on a wafer. The chuck top is configured to be held by a frame during an inspection of the plurality of inspection target devices while holding the wafer, the chuck top being configured to be attachable to and detachable from an aligner. The chuck top includes a main body, and a drop prevention mechanism provided in the main body and including a movable drop prevention hook configured to prevent the chuck top from being dropped when the chuck top is detached from the frame.

Abstract: An apparatus may include an upper transparent plate to hold a wafer of bottom-emitting or bottom-detecting optical devices, wherein the upper transparent plate comprises a set of holes in an area of the upper transparent plate for holding the wafer. The apparatus may include a lower transparent plate and a structure supporting the upper transparent plate and the lower transparent plate to form a cavity bounded by the upper transparent plate, the lower transparent plate, and the structure, wherein the structure comprises an opening in fluid communication with the cavity, wherein applying suction through the opening, via the cavity and the set of holes, holds the wafer flat on the upper transparent plate, and wherein an optical path, between a bottom-emitting or bottom-detecting optical device of the bottom-emitting or bottom-detecting optical devices of the wafer and a testing device, passes through the upper transparent plate, the cavity, and the lower transparent plate.

Abstract: Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems. The calibration chucks include a calibration chuck body that defines a calibration chuck support surface. The calibration chucks also include at least one optical calibration structure that is supported by the calibration chuck body. The at least one optical calibration structure includes a horizontal viewing structure. The horizontal viewing structure is configured to facilitate viewing of a horizontally viewed region from a horizontal viewing direction that is at least substantially parallel to the calibration chuck support surface. The horizontal viewing structure also is configured to facilitate viewing of the horizontally viewed region via an imaging device of the optical probe system that is positioned vertically above the calibration chuck support surface.

Abstract: Provided is an electric connecting apparatus 10 including a plurality of probes 20, a probe substrate 16 connected to base end portions 20b of the probes 20, and a probe support body 18, when tip end portions 20a of the probes 20 are pressed by a device under test, preventing the adjacent probes 20 from interfering. The probe support body 18 includes a plate-like guide portion 30 including guide holes through which the probes 20 pass. The guide portion 30 includes an upper guide portion 31, a lower guide portion 32, and a middle guide portion 33. The probes pass through the guide holes of the upper guide portion 31, the middle guide portion 33, and the lower guide portion 32 to be guided toward the device under test. The middle guide portion 33 is provided to be movable in a perpendicular direction X perpendicular to a thickness direction Y.

Abstract: A testing device for bottom-emitting or bottom-detecting optical devices may comprise a support structure to support a lower transparent chuck and an upper transparent chuck that includes a set of vacuum holes. In some implementations, a vacuum may be formed in a space between the lower transparent chuck and the upper transparent chuck when a vacuum pump is applied to an opening in a sidewall of the support structure. For example, the vacuum may create suction to cause an optical device under test to be mechanically secured on a top surface of the upper transparent chuck. The testing device may further comprise a photodetector disposed below the lower transparent chuck to detect light that travels through the upper transparent chuck and the lower transparent chuck when one or more probes complete an electrical path that causes the optical device under test to emit the light.

Abstract: An assembly includes a wafer having a top wafer surface and a wafer circumference and a device arrangement structure. The device arrangement structure includes a first surface having a perimeter, the perimeter being encircled by the wafer circumference in a plan view. The device arrangement structure also includes an array of devices, each device of the array of devices having an electrical contact on the first surface. The assembly has an adhesive element that affixes the device arrangement structure in a stationary position relative to the wafer.

Abstract: The present disclosure provides a light-on detection device and a light-on detection method. The light-on detection device includes a substrate, and a probe block provided with probes and connected to the substrate. The light-on detection device further includes a flattening element configured to apply a force onto a surface of the display panel so as to change the surface of the display panel from a first shape having a first height difference to a second shape having a second height difference less than the first height difference, thereby to enable the probes to perform the light-on detection on the display panel with the second shape.

Abstract: A test machine includes a base, a testing platform, a probe platform, a control lever, a temporary positioning mechanism and a damper. The testing platform connects with the base and carries a device under test. The probe platform connects with the base and moves along a longitudinal direction. The probe platform connects with a probe. The control lever connects with the base and the probe platform which is driven by the control lever to move along the longitudinal direction. The temporary positioning mechanism connects with the control lever and temporarily holds the probe platform and the control lever at a specific position. The damper connects with the base. When a distance between the probe and the DUT is shorter than a buffering distance, the damper abuts against the control lever or the probe platform to reduce a velocity of the probe moving towards the DUT.

Abstract: A probe device, for performing an electrical test of a semiconductor device formed on a semiconductor wafer, includes a mounting table on which the semiconductor wafer is mounted, a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table, and a temperature control mechanism configured to control a temperature of the mounting table. The mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode. The first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and are locked to be movable in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction.

Abstract: A wafer inspection interface 40 includes a probe card 43 including probes 43b provided on a surface facing a wafer W; a pogo frame 42 that supports a surface of the probe card 43 opposite to the surface on which the probes 43b are provided; a table-shaped chuck member 45 facing the probe card 43 with the wafer W therebetween; a cylindrical bellows 46, configured to seal a space between the chuck member 45 and the pogo frame 42, having one end fastened to the pogo frame 42 and a lower flange 46b at the other end to be contacted with the chuck member 45; a length adjusting device that adjusts a length of the bellows 46; a guide member 47 that guides a movement of the bellows 46; and a decompression path 51 that decompresses the space between the chuck member 45 and the pogo frame 42.

Abstract: A semiconductor chip testing apparatus is disclosed. The semiconductor chip testing apparatus includes: an upper socket unit which is formed therein with a receiving space receiving an upper semiconductor chip, holds a lower semiconductor chip using a suction airflow passing around the upper semiconductor chip in the receiving space, and electrically connects the lower semiconductor chip to the upper semiconductor chip; a blade block coupled to the upper socket unit to deliver a vacuum pressure for generating the suction airflow in the receiving space; and a lower socket unit on which the lower semiconductor chip held by the upper socket unit is seated, and which is electrically connected to the seated lower semiconductor chip.

Abstract: Manufacturing of magnetometer units employs a test socket having a substantially rigid body with a cavity therein holding an untested unit in a predetermined position proximate electrical connection thereto, wherein one or more magnetic field sources fixed in the body provide known magnetic fields at the position so that the response of each unit is measured and compared to stored expected values. Based thereon, each unit can be calibrated or trimmed by feeding corrective electrical signals back to the unit through the test socket until the actual and expected responses match or the unit is discarded as uncorrectable. In a preferred embodiment, the magnetic field sources are substantially orthogonal coil pairs arranged so that their centerlines coincide at a common point within the predetermined position. Because the test-socket is especially rugged and compact, other functions (e.g., accelerometers) included in the unit can also be easily tested and trimmed.

Abstract: A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

Abstract: Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment post, wherein the post aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

Abstract: Multi-stage in circuit test of a circuit board has support to reduce strain placed on the circuit board during each test stage. A shuttle plate is disposed between a load plate that supports a circuit board under test and a probe plate that directs test probes towards the circuit board. The shuttle board slides between different positions with each position establishing the distance between the circuit board and the test probes. For instance, in a first position, the shuttle plate aligns intermediary members to rest between the load plate and shuttle plate to keep the probes spaced by a first distance from the circuit board so that only some test probes contact the circuit board. In a second position, the shuttle plate aligns the intermediary members with blind vias to bring the shuttle plate and load plate proximate each other so that all test probes contact the circuit board.

Abstract: Embodiments of the invention may provide a testing apparatus that is used to test solar cells or other electronic devices. The testing apparatus may comprise a substantially flat support that is configured to support a substrate or other device that is to be electrically tested and a plurality of testing probes. The support comprises a plurality of through holes, each suitable for the insertion of a corresponding testing probe, to allow each probe to make contact with a testing area formed on the substrate. The testing apparatus may comprise a suction device that is associated or associable with the support, and is able to exert a holding force on the substrate that counteracts the thrusting force exerted by the testing probes.

Abstract: A test apparatus features an upper RF impermeable hood and lower RF impermeable hood, wherein each of the hoods have internal dividers. When in a closed position, the hoods and dividers create two or more RF impermeable chambers. The hoods are configured to enclose or sandwich a pallet supporting two or more printed circuit boards. One of the printed circuit boards is disposed in each chamber formed by the hoods and dividers.

Abstract: A wafer inspection interface IF comprises a probe card, an adsorption unit configured to adsorb a wafer to the probe card, a wafer adsorption sealing member to which the probe card is adsorbed, and a fixing ring configured to fix the wafer adsorption sealing member to a card holder. The adsorption unit includes an air exhaustion unit, a first air duct whose right end portion is opened in the hermetically closed space and the left end portion is opened at a side of the fixing ring, a second air duct whose right end portion is opened to face an opening of the left end portion of the first air duct and the left end portion is opened to be connected with the air exhaustion unit, and a hole by which the first air duct is in communication with the second air duct.

Abstract: An apparatus comprises a cavity coupled to a pneumatic controller configured to control pressure in the cavity; a piston configured to be pulled into the cavity when pressure in the cavity is below atmospheric pressure and to be pushed outward when pressure in the cavity is greater than atmospheric pressure; and a gripper arm mechanically coupled to the piston. The gripper arm may be configured to support a device under test. The gripper arm may be coupled to the piston through a pusher bar. The apparatus may further comprise a pneumatic control port; and a pneumatic bleed port. The pneumatic control port is coupled to the cavity, and the pneumatic bleed port is configured to bleed pneumatic pressure to atmosphere if the piston over-travels a predetermined position.

Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.

Abstract: A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter ? and pitch p) that satisfies the condition of ?<p?2?. For example, the diameter ? is about 0.25 mm, and the pitch p is about 0.5 mm.

Abstract: Systems and methods for simultaneous optical testing of a plurality of devices under test. These systems and methods may include the use of an optical probe assembly that includes a power supply structure that is configured to provide an electric current to a plurality of devices under test (DUTs) and an optical collection structure that is configured to simultaneously collect electromagnetic radiation that may be produced by the plurality of DUTs and to provide the collected electromagnetic radiation to one or more optical detection devices. The systems and methods also may include the use of the optical probe assembly in an optical probe system to evaluate one or more performance parameters of each of the plurality of DUTs.

Abstract: A conduction check apparatus including an inspection part (4) having a main body (22) having a surface (23a), inspection pins (21) protruded from the surface (23a), a guide pin (8) provided on the surface (23a); and a protection board 6 sliding along the guide pin (8) from a first position to a second position and having a plurality of holes (28). At the first position, the protection board (6) covers a tip of each of the inspection pins (21) and, at the second position, each of the inspection pins (21) jut out from the respective one of the holes (28). The conduction check apparatus includes a connector setting part (3) relatively moving toward the inspection part (4). The protection board (6) moves between the first and the second position during the relative movement.

Abstract: In order to shorten testing time of a plurality of devices under test formed on a semiconductor wafer, a wafer tray used by a test apparatus performing the test is provided. The wafer tray includes a first flow passage for fixing the semiconductor wafer to the wafer tray using vacuum suction, a second flow passage for fixing the wafer tray to the test apparatus using vacuum suction, and a heater for heating a loading surface on which at least the semiconductor wafer is loaded. By using this wafer tray, the semiconductor wafer, which is the object being tested, can be smoothly attached to and detached from different test heads, and testing can be begun quickly after the semiconductor wafer is attached to a test head.

Abstract: The invention relates to a plunger that is used to feed and withdraw an electronic component, in particular integrated circuits, to and/or from a contact device that is connected to a test device. The plunger head can be secured to a base body by a quick locking system. The quick locking system can be placed in a rear-engagement position when the plunger head is rotated in relation to the base body, a position in which the plunger head is axially coupled to the base body.

Abstract: A wafer translator and a wafer, removably attached to each other, provides the electrical connection to electrical contacts on integrated circuits on a wafer in such a manner that the electrical contacts are substantially undamaged in the process of making such electrical connections. Various embodiments of the present invention provide a gasketless sealing means for facilitating the formation by vacuum attachment of the wafer/wafer translator pair. In this way, no gasket is required to be disposed between the wafer and the wafer translator. Air, or gas, is evacuated from between the wafer and wafer translator through one or more evacuation pathways in the gasketless sealing means.

Abstract: An electric device, in particular a mechatronic gear, motor, or brake control device in a motor vehicle, includes an electronic component having at least one electric contact surface for electrically contacting the component. A flexible circuit board with a conduction path structure includes at least one contact pad and conduction lines between two flexible, non-conducting films. A respective contact pad of the flexible circuit board is electrically connected, in particular by welding, to a respective contact surface of the component for creating at least one contact point. A sealing element is disposed on a side of the flexible circuit board opposite the component and an internal space is bounded by a wall. The sealing element is pressed against the flexible circuit board at an edge of the wall so that the edge surrounds at least one of the contact points.

Abstract: There is provided a testing apparatus including a plurality of test units, a storage that is shared by the plurality of test units, where the storage stores therein wafers under test to be tested by the plurality of test units, a transport mechanism that transports the wafers under test between the storage and each of the plurality of test units, a mainframe that specifies a test procedure for each of the plurality of test units, a power source that is shared by the plurality of test units, where the power source supplies power to each of the plurality of test units, and a pressure source that is shared by the plurality of test units, where the pressure source supplies a pressure to each of the plurality of test units.

Abstract: A measuring device for electrically measuring a measurement structure that can be electrically contacted at one measuring side, in particular an optoelectronic element, such as a solar cell, including at least two contacting units for electrically contacting the measurement structure and at least one support element for supporting the measurement structure with the measuring side on the support element. It is essential that the measuring device includes at least one suction line for the connection to the suction unit and at least one suction opening that is connected in a fluid-conducting manner to the suction line, wherein the suction opening is arranged in and/or on the support element such that the measurement structure can be pressed against the support element by suctioning via the suction opening. When the measurement structure rests on the support element, the contacting unit can be pressed against the measuring side of the measurement structure for the electrical contacting thereof.

Abstract: A testing device to test a plate for electronic circuits, comprising transport members able to transport the plate along an axis of feed (Y), at least from an entrance station to a testing station defining a testing plane (P?), and testing members, disposed in correspondence with the testing station. The testing device also comprises an alignment station defining an alignment plane (P), disposed upstream of the testing station, and alignment members, disposed in correspondence with the alignment station, able to dispose the plate in an aligned position, in which the plate is disposed symmetrical both with respect to the axis of feed (Y) and also with respect to a first axis (X) substantially transverse and co-planar to the axis of feed (Y).