Abstract: An inspection apparatus for a substrate, comprising: a placing member on which a substrate is placed; a holder configured to hold a probe card having probes; positioning members to be in contact with an upper surface of the placing member to define a height of the placing member with respect to the probes; an adjustment mechanism configured to adjust heights of the positioning members; a detection device; and a control. The controller is configured to execute: positioning the positioning member to a reference height at which an overdrive amount becomes zero, based on the detection results of the probes, the placing member, and the positioning member; and acquiring a height of the positioning member at which a desired overdrive amount is obtained, and raising the placing member while adjusting a driving amount of the adjustment mechanism until the placing member reaches the height.

Abstract: A semiconductor tester and a method for calibrating a probe card and a device under testing (DUT) are disclosed. The semiconductor tester includes: a support platform, including a support surface and configured to be able to move along a direction parallel to the support surface and rotate around a rotating shaft perpendicular to the support surface; a probe card including a plurality of probes stretching towards the support platform; and an alignment assembly, including: at least two first laser emitting apparatuses emitting a plurality of first laser beams; and a second laser emitting apparatus emitting a plurality of second laser beams. The first laser beams and the second laser beams are perpendicular to each other and are each arranged sequentially along a direction perpendicular to the support surface. The semiconductor tester aligns a probe card to a DUT with improved accuracy, thereby preventing the damage to the probe card.

Abstract: The present disclosure relates to a detection system including a control circuit, a power line network bridge circuit, a fixture device and a detection device. The control circuit is configured to generate a plurality of detection signals. The power line network bridge circuit receives detection signals through a power line. The fixture device is electrically connected to the power line through the power line network bridge, and is configured to receive the detection signals. The fixture device is configured to transmit the detection signals to a device under test, so that the device under test displays a plurality of media. The detection device is configured to capture the media and transmit the media to the control circuit. The control circuit is further configured to determine whether the media match with detection parameters.

Abstract: There is provided a control method of a test device, the test device comprising a chuck on which an object to be tested is mounted, a tester configured to supply electric power to the object to be tested to test the object to be tested, and a controller configured to control a temperature of the chuck. The control method comprises: when an actual temperature of the object to be tested cannot be fed back, estimating a temperature difference between the temperature of the chuck and the temperature of the object to be tested on the basis of a heat amount of the object to be tested; correcting a target temperature of the chuck on the basis of a target temperature of the object to be tested and the temperature difference; and controlling the temperature of the chuck on the basis of the corrected target temperature of the chuck and an actual temperature of the chuck.

Abstract: A system and method introduce a variable thermal resistance to test and burn in apparatus. The system and method provide an efficient design for more accurate temperature control of integrated circuits. A system for testing integrated circuit (IC) packages comprises a plurality of IC testing socket bases arranged on a testing board and configured to receive a plurality of IC packages. A plurality of IC testing socket lids are arranged to attach to the testing board. Each IC testing socket lid comprises a temperature sensor to thermally contact the IC package and measure a surface temperature of the IC package, a heat sink is placed into either proximity to or directly in contact with the IC package, and an electronic controller to receive signals from the temperature sensor.

Abstract: The present disclosure provides a probing apparatus for semiconductor devices using pressurized fluid to control the testing conditions. The probing apparatus includes a housing configured to define a testing chamber; a device holder positioned on the housing and configured to hold and support at least one device under test; a platen positioned on the housing and configured to retain at least one probe; a card holder positioned on the platen and configured to hold a probe card including the probe; and at least one flow line positioned in the card holder. The flow line is configured to flow a fluid therein to adjust the temperature of the device under test.

Abstract: A cutting apparatus includes a table including a support plate transparent in a visible region, a cutting unit, a first feeding mechanism that includes a first moving section for supporting the table and a first motor, a second feeding mechanism that includes a second moving section for supporting the cutting unit and a second motor, a first camera disposed on the side of a first surface of the support plate, a second camera disposed on the side of a second surface opposite to the first surface of the support plate, and a storage section that stores positional deviation amounts in the X-axis direction and the Y-axis direction between an imaging region at a reference position of the first camera and an imaging region at a reference position of the second camera.

Abstract: A system is provided for detecting a forcer misalignment, e.g., due to forcer loss of registration (FLR), in a wafer prober used for electrical testing of a semiconductor wafer. The system includes an optical sensor system including a transmitter and receiver affixed to the forcer or to a reference structure (e.g., the prober platen), and a reflector affixed to the other one of the forcer or reference structure. The transmitter emits radiation toward the reflector, which reflects the radiation toward the receiver. The receiver detects the reflected radiation, and generates an output signal indicating the quantity of received radiation. Alignment monitoring circuitry is configured to identify a misalignment of the forcer relative to the reference structure (e.g., platen) based on the output signal generated by the receiver, and in response, output an alert signal, e.g., to suspend operations of the prober and/or display an error notification to an operator.

Abstract: A semiconductor test apparatus according to the present disclosure includes: a stage on which a wafer is to be mounted; a pressurizing wall disposed on a surface of a probe card opposing the stage, extending toward the stage, and having an opening; a mark disposed on a lower surface of the pressurizing wall opposing the stage; a probe disposed in the opening; an air tube to force air into the opening; a detector to detect first spacing between a tip of the probe and the mark; and a controller to control second spacing between the wafer and the lower surface of the pressurizing wall based on the first spacing, wherein, when an electrical property of each of chips of the wafer is measured, the second spacing is controlled to be predetermined spacing by the controller, and the air is forced into the opening through the air tube.

Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board having a first surface, a second surface, and multiple conductive layers between the first and second surfaces. A metal layer is formed on the second surface and is electrically connected to one of the conductive layers that is grounded. A testing socket is disposed over the first surface. A conductive fastener secures the testing socket to the printed circuit board and is electrically connected to the metal layer. A cover is disposed over the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket. The cover has a conductive surface in contact with the integrated circuit package. A conductive element assembly is disposed between the cover and the testing socket and is electrically connected to the conductive surface and the conductive fastener.

Abstract: A hermetically RF-EMI shielded 3-axis and planarity adjustable combo link assembly for low loss connection between the coaxial RF connector of external instruments (impedance tuners) with 30- or 45-degrees wafer probes allows continuous, micro-positioner controlled independent horizontal and vertical probe movement. Flexible sealing O-rings and RF absorbing sheets and gaskets ensure airtight and RF-EMI shielded operation.

Abstract: The accuracy of an impedance tuner may be improved and the size may be reduced by using linear actuators instead of rotary motors. The linear actuator may be integrated with position sensors to allow very small size, and implemented with a servo system for best accuracy and speed. Spring loaded arms holding the mismatch probes allow the tuner to operate in any orientation to further fit into small spaces. The small size reduces losses by allowing direct connection to wafer probes for on-wafer measurement systems.

Abstract: A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.

Abstract: Provided is a testing method including: disposing a wafer on a working platform of a testing device; and moving a circuit board of the testing device relative to the working platform by a movement assembly of the testing device so as to allow at least two testing ports of the circuit board to test two chips of the wafer, respectively. Further, the two testing ports have different testing functions. Therefore, during the wafer testing process, a single testing device can perform multiple testing operations.

Abstract: A gantry-type positioning device includes first and second cross members. Two linear guides are disposed parallel to each other on a base and support the first and second cross members such that the cross members are movable in a first direction. A Y-carriage has a functional element and is supported on the first cross member such that the Y-carriage and the functional element are movable in a second direction. A position-measuring device is disposed on the second cross member and the Y-carriage such that a position of the Y-carriage relative to the second cross member is detectable. A Z-carriage supports the functional element such that the functional element is movable relative to the Y-carriage in a third direction. A further position-measuring device is disposed on the Y-carriage and the functional element such that a position of the functional element relative to the Y-carriage is detectable.

Abstract: An image processing system according to the present disclosure includes: a measurement image generator that generates a measurement image in which a plurality of rectangular unit images is arranged, each of the unit images being configured by arranging a plurality of gradation images in a first direction; a correction data generator that generates correction data used to correct display unevenness on the basis of a measured value that is acquired by measuring the measurement image generated by the measurement image generator by using a measuring instrument; and a display unevenness corrector that corrects an input gradation on the basis of the correction data generated by the correction data generator.

Abstract: Provided is a probe pin alignment device that can readily correct a positional deviation between a probe pin and an electrode pad in real time and can prevent damage to the probe pin or an electronic device. The probe pin alignment device includes a mirror to reflect a mirror image of the electrode pad while the probe pin is approaching a crystal oscillator, a camera to take a picture containing an image of the probe pin and the mirror image reflected on the mirror, a deviation measurer to measure a deviation between the position of the probe pin and the position of the electrode pad in the taken picture, a displacer to relatively displace a carrier and the probe pin, and a controller to cause the displacer to relatively displace the carrier and the probe pin such that the deviation is substantially zero.

Abstract: A scalable test platform can include one or more of a plurality of different device interface boards and a plurality of primitives. The different device interface boards can be configured to provide a uniform interface to couple different types of DUTs and or DUTs with different form factors to the plurality of primitives. The plurality of primitives can be configured to distribute power to the DUTs, and to perform system level testing of the respective DUTs. The plurality of primitives can be configurable by a user to perform any number of system level tests on a number of different types of DUTs and or DUTs with different form factors.

Abstract: A wafer inspection method was provided. A motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper limit position and a lower limit position in a displacement range. The wafer inspection method includes: determining a position of the control rod in the displacement range based on a measurement signal; determining a moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; and controlling, based on the control signal, the motorized chuck stage and a camera stage to be displaced the same distance.

Abstract: A portable test device with automatic robotic arm is provided to use a micro step motor as the power source for the reciprocating movement of the robotic arm. The dual adjustment slots design of the intermediate plate enables quick adjustment of the angle and height of the robotic arm. The intermediate plate is further mounted to a precision guide for precise operation of the robotic arm.

Abstract: A characteristic detection apparatus includes: a characteristic detector that detects an electrical characteristic of an electronic component placed on a substrate; and a pressing member that is provided separately from the characteristic detector, and generates a pressing force to press the characteristic detector to the substrate, causing the characteristic detector to be electrically connected to the electronic component.

Abstract: In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

Abstract: A method for aligning an inhomogeneous receiver with an anisotropic emitter on a wafer probing system, wherein a reference semiconductor die comprising a reference pad and an anisotropic emitter is formed on a semiconductor wafer, the reference pad is located at a reference-pad-and-anisotropic-emitter relative position corresponding to the anisotropic emitter, the method comprises following steps of: measuring a receiver center position of an inhomogeneous receiver configured on a wafer probing system by a profile sensor; measuring a reference tip position of a reference tip of a reference probe on a probe card by a measuring instrument; displacing the inhomogeneous receiver in an aligning displacement according to the reference-pad-and-anisotropic-emitter relative position, the reference tip position and the receiver center position; and aligning the reference tip with the reference pad by a probe-tip-and-pad aligning machine of the wafer probing system.

Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.

Abstract: Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.

Abstract: An evaluation apparatus includes an insulating plate, a plurality of probes fixed to the insulating plate, an insulating portion having a connection portion connected to the insulating plate in a detachable manner and a tip portion continuous with the connection portion, the tip portion being narrower than the connection portion, an insulator formed by combining the insulating portions to surround the plurality of probes in planar view, and an evaluation unit for passing currents through the plurality of probes to evaluate electrical characteristics of an object to be measured.

Abstract: A wafer inspection method improving inspection accuracy and operation efficiency. A method for performing electrical inspection by bringing into contact with pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads recognizing the positional shifts of the pads due to thermal expansion; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.

Abstract: In some embodiments, a semiconductor wafer testing system comprises a first plate configured to couple to a probe head, the first plate including a first alignment feature, a biasing member, a stopper, and pins. The system also comprises a second plate configured to fasten to the first plate and including a second alignment feature configured to engage with the first alignment feature. The first and second alignment features are configured to align the pins with a test wafer positioned between the first and second plates. The biasing member and the stopper are configured to cooperate to regulate a pressure with which the test wafer contacts the pins when the second plate is fastened to the first plate.

Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.

Abstract: A latch assembly that can lock and unlock a probe core with respect to a circuit board is provided. The latch assembly can engage with the probe core to align the probe core with respect to a circuit board, and press down the probe core against the circuit board by rotating to lock the probe core with the circuit board. An installation tool is provided to grip or release the probe core to/from a latch assembly or a probe core carrier. The installation tool can align with the probe core and/or the latch assembly to lock and unlock the probe core with respect to a circuit board.

Abstract: A probe card includes a wiring board, a top cover, a retractable structure and a probe. The top cover couples with the wiring board and has an air inlet. The retractable structure connects with the top cover and includes a first and a second rings. The first ring has vent holes. A top surface of the first ring and a first bottom surface of the top cover define a homogenized space communicating with the air inlet and the vent holes. The second ring couples with the first ring and has jet holes communicating with the vent holes. Outlets of the jet holes locate on a second bottom surface of the second ring. A first inner sidewall of the first ring and a second inner sidewall of the second ring define a pressure space. The probe connects with the wiring board and extends to the pressure space.

Abstract: A testing device is disclosed for testing a connection interface coupled onto an assembly line between first and second vehicle components. The testing device includes a tool configured to couple the connection interface, at least one test adapter for testing the coupling of the connection interface, and a sensor device for acquiring a force progression which acts during and/or after the coupling in the connection interface. The testing device also includes an evaluation device to evaluate the force progression.

Abstract: A flexible circuit board inspecting apparatus for conducting an inspection on a flexible circuit board includes a transport path and an inspection part mechanism. The transport path is configured to successively transport the flexible circuit board having a plurality of unit circuit boards arranged thereon. The inspection part mechanism is configured to bring and distance a jig for inspecting the flexible circuit board transported on the transport path close to and from the flexible circuit board. The transport path includes a longitudinal transport portion for transporting the flexible circuit board in a downward vertical direction. The inspection part mechanism moves the jig in a direction perpendicular to the flexible circuit board transported on the longitudinal transport portion to bring and distance the jig close to and from the flexible circuit board.

Abstract: A device under test, such as a point machine, which is screwed to two longitudinal supports, which can be individually moved horizontally and vertically is provided. Thus, a highly flexible solution is created, because even devices under test having unknown or asymmetric dimensions can be fittingly accommodated and positioned. Linear drives enable highly accurate positioning of the supports, in particular even if the supports are have high inherent weight or are already loaded with the device under test. According to one embodiment, the mechanical system is designed to grasp and/or to lift a mounting cart by means of the supports, on which mounting cart the device under test is fastened by screwing. This provides the advantage that the device under test can be tested while mounted directly to the mounting cart without separate transferring and screwing of the device under test being required.

Abstract: The ultrasonic sensor includes a wave transmitting and receiving device and a cover. The wave transmitting and receiving device has a front surface including a wave transmitting and receiving surface and is configured to transmit and receive an ultrasonic wave through the wave transmitting and receiving surface. The cover covers the wave transmitting and receiving device so as to expose the wave transmitting and receiving surface. The cover is constituted by multiple portions, and the multiple portions are individually made of multiple materials different from each other.

Abstract: A probe position inspection apparatus which incorporates a rotatable internal prism is attached to a supporting unit for supporting semiconductor device, thus making it possible to accurately inspect in-plane positions of tips of probes in a short time and also making it possible to adapt the probe position inspection apparatus to a double-sided prober.

Abstract: A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral slideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed.

Abstract: A semiconductor evaluation apparatus includes a jig for evaluation and a probe substrate. The jig for evaluation is provided such that a plurality of semiconductor devices can be placed thereon. The probe substrate is provided so as to face the jig for evaluation, and includes a contact probe. The jig for evaluation includes a plurality of housing portions divided by a frame portion such that the plurality of semiconductor devices can be separately placed on the plurality of housing portions, respectively. The semiconductor evaluation apparatus is configured such that the contact probe can be brought into contact with a plurality of elements in the state where a space is provided by bringing the frame portion and the probe substrate in proximity to each other. In this space, each of the plurality of semiconductor devices is placed between a corresponding one of the plurality of housing portions and the probe substrate.

Abstract: A probe apparatus includes a movable mounting table for holding a test object provided with a plurality of power devices including diodes; a probe card arranged above the mounting table with probes; a measuring unit for measuring electrical characteristics of the power devices by bringing the probes into electrical contact with the test object in a state that a conductive film electrode formed on at least a mounting surface of the mounting table is electrically connected to a conductive layer formed on a rear surface of the test object; and a conduction member for electrically interconnecting the conductive film electrode and the measuring unit when measuring the electrical characteristics. The conduction member is interposed between an outer peripheral portion of the probe card and an outer peripheral portion of the mounting table.

Abstract: A compact device allows individual or combined correction of wafer probe planarity and orientation misalignment. The device is made as a metallic block or as a strong plastic block and contains three sections, which are held together by a steel blade or by a steel blade and a rotation pin; the sections are split apart for “Phi”—orientation alignment or rotated against each-other for “Theta” planarity alignment. The steel blade provides secure and anti-backlash flexibility both in lateral (“Phi”) and perpendicular (“Theta”) direction. Alternatively the “Theta” alignment can use a rotation shaft or a small part of the original block left over as a bridge joining both sections. The device is inserted between the fixed probe support and the probe itself.

Abstract: The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and/or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard.

Abstract: In one aspect, a cradle system for supporting a load, the cradle system comprising a first arm with a first carriage assembly axially adjustable therealong and a second arm, opposite the first arm, with a second carriage assembly axially adjustable therealong. An actuator is associated with the first and second carriage assemblies and configured such that actuation of the actuator causes the first and second carriage assemblies to move axially in opposite directions. In another aspect, a cable support system comprising a support column and one or more tethers supported by the support column and configurable so that at least one tether is configured to move its supported cable in the same or opposite direction as the test head moves at a rate that is a constant multiplied by the test heads rate of motion where the constant may be greater than, equal to, or less than one.

Abstract: A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT.

Abstract: A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.

Abstract: An integrated transport device for a wafer carrier includes: an evacuatable chamber for accommodating therein a wafer carrier having a front opening with a cover; a rotatable platform for placing the wafer carrier thereon in the chamber; and an opening/closing device for opening and closing the cover of the wafer carrier placed on the platform at a first position, wherein the platform rotates to set the wafer carrier at the first position and a second position for transporting a wafer to a wafer-handling chamber.

Abstract: The present invention extends to methods, systems, apparatus, and computer program products related to a cable-based measuring system. The cable-based measuring system includes a cable, comprising an inner cable member configured to move linearly within an outer cable housing. The measuring system also includes a measuring device configured to generate measurement information regarding movement of the inner cable member relative to the outer cable housing using one or more encoders. A computer system receives the measurement information from the measuring device. The measurement information indicates length as a function of time, and represents three orthogonal dimensional measurements of a three-dimensional object. Based on the measurement information, the computer system identifies a length of each dimensional measurement, including a length, a width, and a height of the three-dimensional object.

Abstract: A prober includes: a wafer chuck having a conductive support surface; a movement rotation mechanism which moves and rotates the wafer chuck; a head stage which holds a probe holding portion; a stage member which has a conductive stage surface that is formed in parallel to the support surface and electrically connected with the support surface, and can move integrally with the wafer chuck; and a contactor which is fixed to a position facing the stage member and whose tip can electrically come into contact with the stage surface, wherein the stage member is separated from the wafer chuck as a separate body, and the stage surface and the support surface are electrically connected through a wiring member; and a back-surface electrode of a chip is electrically connected with a tester through the wafer chuck, a wiring, the stage member and the contactor.

Abstract: Circuit boards are provided that include a functional portion and at least one removable test point portion. The removable test point portion may include test points which are accessed to verify whether the functional portion is operating properly or whether installed electronic components are electrically coupled to the board. If multiple boards are manufactured together on a single panel (in which the individual boards are broken off), the test points can be placed on bridges (e.g., removable portions) that connect the individual boards together during manufacturing and testing. Configurable test boards are also provided that can be adjusted to accommodate circuit boards of different size and electrical testing requirements. Methods and systems for testing these circuit boards are also provided.

Abstract: A driver integrated circuit chip includes a plurality of monitoring bumps, a plurality of output bumps, a plurality of first inner wires electrically connected to the output bumps, a plurality of second inner wires, and a plurality of switching circuits are electrically connected to the second inner wires. Each of the second inner wires is electrically connected between an adjacent pair of monitoring bumps. Each of the switching circuits controls a connection between adjacent monitoring bumps.

Abstract: According to one embodiment, a pressure sensor includes: a base body; a sensor section; and a processing circuit. The sensor section includes: a transducing thin film; a first strain sensing element; and a second strain sensing element. The transducing thin film has a film surface and is flexible. The processing circuit is configured to output as an output signal at least one of a first signal obtained from the first strain sensing element upon application of external pressure to the transducing thin film and a second signal obtained from the second strain sensing element upon application of the external pressure to the transducing thin film.