Abstract: A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (PCB) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test PCB. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor. The frame and guide plate can be removed and a thinner frame coupled to the contactor, which changes its function to a pogo block assembly.

Abstract: A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT.

Abstract: A method and apparatus for an enhanced reverberation chamber are disclosed. In one embodiment, one or more positioners are coupled to a tuner, such that when the tuner moves, the positioner moves. A device involved with a test may be mounted to the positioner so that when the positioner moves, the device moves.

Abstract: Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

Abstract: A system for docking an electronic test head with a handling apparatus is provided. The system includes an assembly for at least partially aligning and subsequently bringing together the electronic test head and the handling apparatus. The system includes a power driven actuator for powered bringing together of the electronic test head and the handling apparatus.

Abstract: A dual-stage fixture for a circuit tester includes a slide plate that can be slid between at least a first position and a second position. In the first position, an upper stripper plate is spring-loaded, and a full set of test probes, including both long-stroke and short-stroke probes, can contact the circuit board or UUT (unit under test). In the second position, the upper stripper plate becomes fixed in position, and only the long-stroke probes can contact the circuit board. The fixed positioning of the upper stripper plate prevents the short-stroke probes from contacting the circuit board even when there is unbalanced loading of probe pressure between the top and bottom of the circuit board, thereby preventing transient signals from interfering with testing. In addition, a vacuum is applied in this position during a non-powered test.

Abstract: A system and a method for testing information handling systems is provided. The system includes a top cover having a memory circuit and a bottom platform for receiving a test printed circuit board assembly (PCBA) including a slot. The system includes a sensor determining the relative position of the memory circuit and the slot; and a host controller coupled to the test PCBA and the sensor through a port. A computer program product including a non-transitory computer readable medium having computer readable and executable code is also provided. The code instructs a processor in a host controller in a test fixture to load a memory circuit on a crane; engage a sub-module carrying the memory circuit; load a printed circuit board assembly (PCBA); place a memory device on a slot in the PCBA; perform a system test on the PCBA; disengage the sub-module and the test fixture.

Abstract: An assembly includes a lower guide plate having a first plurality of through-holes therein, and an upper guide plate over the lower guide plate. The upper guide plate includes a second plurality of through-holes therein. The assembly further includes a plurality of probe pins. Each of the probe pins is inserted through one of the first plurality of through-holes and one of the second plurality of through-holes. The assembly further includes a plurality of probe pin stoppers, each attached to one of the probe pins, wherein the plurality of probe pin stoppers has lateral sizes greater than lateral sizes of the second plurality of through-holes. The plurality of probe pin stoppers is located over the upper guide plate.

Abstract: Elongated flexible probes can be disposed in holes of upper and lower guide plates of a probe card assembly. Each probe can include one or more spring mechanisms that exert normal forces against sidewalls of holes in one of the guide plates. The normal forces can result in frictional forces against the sidewalls that are substantially parallel to the sidewalls. The frictional forces can reduce or impede movement parallel to the sidewalls of the probes in the holes.

Abstract: A terminal testing device provides an adapter customized to a port of a connector being tested so that force applied to the adapter identifies loose and fixed terminals in the connector. The adapter includes springs and push pins that correspond in number to the number of terminals being tested and has a face plate that corresponds to the type of connector being tested. The push pins provide force against the terminal end. Specifically, the device seats the adapter and connector to align both and permit force to be in line with terminal ends. The force applied to the terminal ends is uniform and controlled by means of the adapter and is obtained by a single driving means.

Abstract: A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral sideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed.

Abstract: Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.

Abstract: An apparatus and method for conducting electrical testing of probes is disclosed. Probes may also be tested for deflection and loading hysteresis.

Abstract: The present disclosure relates to a test head for electrical testing of a test specimen, in particular a wafer, having at least two guide plates, which are spaced apart by means of at least one spacer and have guide holes distributed over the surfaces thereof, in which test contact pins for physical contact with the test specimen are guided in a sliding manner. Provision is made for the spacer to be formed by a multiplicity of point supports arranged in a manner distributed over the surfaces of the guide plates and secured on the guide plates.

Abstract: Pressing an electronic device (2) to be tested to contact terminals (132a and 132b) while bringing a heater (112) having equal or close temperature change characteristics to those of the electronic device to be tested by a test pattern, transmitting a test pattern to the electronic device to be tested in this state, and controlling a power consumption of a heater so that total power of a power consumption of the electronic device to be tested by the test pattern and a power consumption of the heater becomes a constant value.

Abstract: A test platform includes a supporting member, a first slide rail located below the supporting member, and a conductive second slide rail located below the first slide rail for being electrically connected to a power source. A wireless router and an uninterruptible power supply (UPS) electrically connected to the wireless router are mounted on a bottom of the supporting member. A network socket is mounted on the supporting member and electrically connected to the wireless router. A power socket is mounted on the supporting member and electrically connected to the UPS. A number of first wheels are rotatably mounted on the bottom of the supporting member. Each first wheel rests on and rolls along the first slide rail. A number of conductive second wheels are rotatably mounted on a bottom of the UPS. Each second wheel rests on and rolls along the second slide rail.

Abstract: A heating device for testing integrated components is disclosed. In one embodiment, an inner casing is arranged in the heating device surrounding a holding chamber. The inner casing contains at least one recess in which an electrically conductive contact device is moveably arranged. This permits contact to be reliably made with a circuit to be tested. If the inner casing is of compact design, there is a very homogeneous temperature distribution in the heating device.

Abstract: An automatic aligning apparatus for aligning aligning components of a first object with aligning components of a second object includes first and second aligning mechanisms. The first aligning mechanism carries the first object and has a guiding groove. The second aligning mechanism has a carrying component that carries the second object, two rear holding plates, and two connecting components, each extending through a through hole in a corresponding rear holding plate and having two clamping parts that clamp a corresponding rear holding plate. The carrying component is movable between an initial position and an aligning position where a guiding stud of the carrying component extends into the guiding groove.

Abstract: An automated electronics circuit test cassette assembly is provided for mating with a test platform. The platform comprises a platform common signal interface and a vacuum manifold having a combined registration and vacuum port coupler. The cassette assembly includes a cassette common signal interface providing electrical communication with the platform common signal interface and an alignment bushing providing combined registration and vacuum communication with the vacuum port coupler. A pattern of test probes mimic a test pattern on a printed circuit assembly (PCA), extending upwards from a probe support substrate and optionally downward from a clamshell probe substrate. The PCA is supported by a PCA support substrate floating above the test probe support substrate. The clamshell test substrate provides a vacuum seal above the PCA support substrate.

Abstract: A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). The elastomer is precompressed from its natural rest state between a top (22) plate and a bottom (70). Pre compression improves the resilient response of the pins. The pin crows (40) are maintained relatively coplanar by the engagement of at least one flang (44a-b) against an up-stop surface 90 of plate 20, thereby insuring coplanarity of the crowns. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

Abstract: There is provided a test fixture for testing a planar circuit. The test fixture comprises a body adapted to retain therein the planar circuit and to be connected to test equipment. The body provides a transition between the planar circuit and the test equipment and comprises a base member having a first surface and a fixation member having a second surface and connected to the base member through a first connection allowing movement along a first axis of the fixation member relative to the base member, a spacing defined between the first surface and the second surface for retaining therein an end of the planar circuit, the fixation member movable along the first axis relative to the base member for adjusting the spacing.

Abstract: A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value.

Abstract: A method for testing a semiconductor device. The method comprises moving a probe in a vertical direction towards an electrical structure on a semiconductor device to position the probe alongside the electrical structure. A tip of the probe is positioned lower than an elevation of an outermost periphery of the electrical structure. The method also includes moving the probe in a lateral direction towards the electrical structure to contact the electrical structure. The probe tip mechanically and electrically engages the electrical structure.

Abstract: A dual-stage fixture for a circuit tester includes a slide plate that can be slid between at least a first position and a second position. In the first position, an upper stripper plate is spring-loaded, and a full set of test probes, including both long-stroke and short-stroke probes, can contact the circuit board or UUT (unit under test). In the second position, the upper stripper plate becomes fixed in position, and only the long-stroke probes can contact the circuit board. The fixed positioning of the upper stripper plate prevents the short-stroke probes from contacting the circuit board even when there is unbalanced loading of probe pressure between the top and bottom of the circuit board, thereby preventing transient signals from interfering with testing. In addition, a vacuum is applied in this position during a non-powered test.

Abstract: Because a guide hole that guides a plunger of a probe requires cumbersome machining of a hole, it is difficult to accommodate to narrowing of pitch and multi-polarization of terminals or electrodes. A probe (2) is fitted into cylindrical retaining holes (12 and 15) formed in upper and lower blocks (10 and 11). The plunger (6) of the probe (2) has a plate-like guide portion (19a), and an edge contact portion (19b). The bottomed retaining hole (12) is formed in the upper block (10) from a lower part thereof and a guide groove (13) is formed from an upper surface (s) thereof. The guide portion (19a) is guided movably vertically while being stopped from turning and from slipping out by the guide groove (13).

Abstract: A contact probe comprises conductively coupled plungers and a coil spring. The plungers have coupling means which enable them to be slidably and non-rotatably engaged. The spring is attached to the plungers in a manner that prevents rotation of the spring's ends. A desired magnitude of torsional bias is generated by twisting the spring a predetermined angle prior to attachment of the spring to the plungers. An additional torsional bias is generated by the tendency of the spring to twist when the spring is axially displaced. The resultant torsional bias rotatably biases the coupling means of the plungers against each other, generating contact forces for a direct conductive coupling between the plungers. The plungers are self-latching or are retentively attached to the spring using the torsional bias of the spring. Plungers with hermaphroditic coupling means can be fabricated from a sheet metal or a profiled stock by stamping or machining.

Abstract: An auxiliary element of a printed circuit board defining a plurality of vias with different shapes and sizes includes a test board defining a plurality of test holes with different shapes and sizes. The test holes of the test board are to have the same shape and size as corresponding vias of the printed circuit board.

Abstract: Shielded probe array. In accordance with a first embodiment, an article of manufacture includes a plurality of rows of electronic probes. Each row of probes is substantially in a plane. Each probe includes a metal signal layer and a ground layer, separated by an insulator. The article of manufacture also includes a space transformer for mechanically supporting the plurality of rows of electronic probes. The space transformer also provides an electrical path from each of the probe metal signal layers and the probe ground layers to a higher level electronic assembly. Each of the plurality of rows of electronic probes may include a handle including a substrate for handling the row of electronic probes.

Abstract: A slider tester includes a disk, movable table, table drive mechanism, guide member, etc. A plurality of suspensions are mounted on the movable table. A slider is mounted on each suspension. A guide member can support respective lift tabs of the suspensions. The guide member includes a first guide surface, second guide surface, and opening arranged in a track width direction of the disk. When any of the lift tabs gets into the opening as the movable table moves in the track width direction of the disk, the slider is dropped toward a recording surface of the disk.

Abstract: A system includes a transformer testing system that includes a mobile platform configured to couple to a vehicle and an impulse testing system coupled to the mobile platform. The impulse testing system includes an impulse generator tower disposed in a lowered position along the mobile platform during transport by the vehicle. The transformer testing system also includes a lift system coupled to the mobile platform. The lift system is configured to lift the impulse generator tower from the lowered position to a raised position. The impulse testing system is configured to perform an impulse test of a high voltage power transformer while the impulse generator tower is disposed in the raised position. The transformer testing system also includes a protective cover disposed on the mobile platform. The protective cover is configured to surround a region having the impulse testing system.

Abstract: High precision connectivity for a device under test (DUT) in an electronic test system at reduced cost and superior performance characteristics is provided by incorporating an appropriate contact structure into a printed circuit board (PCB) of the electronic test system. Alternatively, a superior adapter that is formed on the basis of highly precise volume production techniques, for example using well-established semiconductor materials and related manufacturing techniques, is provided to support high precision connectivity.

Abstract: There is provided an electronic device testing apparatus which can effectively use a space in an electronic device handling apparatus since a preciser is not necessary. The electronic device testing apparatus, which tests DUTs including terminals, comprises: a test head which includes sockets to which the DUTs are electrically connected; and a handler which loads the DUTs onto a test tray, conveys the DUTs, and presses the DUTs against the sockets, the test head is mounted on the handler with an attitude where the sockets are directed downward, the handler loads the DUTs onto the test tray and presses the DUTs against the sockets from below with an attitude where the terminals are directed upward, and each of the sockets includes a positioning plate which positions the DUTs relative to the socket while using the terminals as a reference.

Abstract: A wafer inspection device, which inspects the electrical properties of a semiconductor wafer on which a semiconductor integrated circuit is formed, and the wafer inspection device has: a holding mechanism for holding a probe card; a wafer stage that holds the semiconductor wafer on the upper surface and is movably provided; and a pressing mechanism that are held and press the wafer stage against the probe card. The wafer stage is provided on the outer periphery with a seal ring. The seal ring forms a sealed space in a state where the wafer and the probe card are brought close to each other by contacting the probe card and is provided in such a manner as to reduce the pressure of the sealed space.

Abstract: The present invention relates to a distance adjustment system and a solar wafer inspection machine provided with the system. The inspection machine has a conveyer for carrying a solar wafer, an optical inspection system for inspecting the surface and color appearance of the wafer and an illumination inspection system. A holder is provided in the inspection position where the wafer is clamped along its width direction to prevent the wafer from offset. During the opto-electrical inspection, probes are brought into contact with conductive buses of the wafer and light is applied to the wafer to allow the probing of electric energy thus generated. An adjusting device is employed to adjust the clamping gap of the holder and the distance of the probes in accordance with the size of the solar wafer. The data are collected and transmitted to a sorting system for sorting the wafer.

Abstract: Provided is a test contactor for testing a semiconductor device which includes a cylinder, a piston which is configured to reciprocate between a first position and a second position according to a change in pressure in the cylinder, and a pressing part which is configured to change its location according to the reciprocating motion of the piston. The pressing part is configured to be in contact with the semiconductor device when the piston is located at the first position, and the pressing part is configured not to be in contact with the semiconductor device when the piston is located at the second position.

Abstract: A printed circuit board testing device for performing electrical tests on a printed circuit board having test contacts includes a test platform. An installable and uninstallable positioning module is disposed on the test platform and adapted to receive the printed circuit board. The positioning module has through-holes corresponding in position to the test contacts. A dial module is disposed between the test platform and the positioning module, and has a needle corresponding in position to the through-holes, such that the distance between the dial module and the positioning module can be altered to cause the needle to penetrate a corresponding one the through-holes, insert into the positioning module, and come into contact with the test contacts to facilitate the electrical test. The printed circuit board testing device can perform electrical tests on any printed circuit boards having the test contacts, by changing the positioning module and the dial module.

Abstract: A printed circuit board testing device for performing an electrical test on a printed circuit board having test contacts includes a test platform, a positioning unit, an electrical connection unit, and a detecting unit. The positioning unit is disposed on the test platform and adapted to receive the printed circuit board. The electrical connection unit is disposed on the test platform and has a plurality of preset electrical functions. The electrical test specific to the test contacts is performed on the test contacts by the detecting unit connected to the test contacts and the electrical connection unit and based on the preset electrical functions.

Abstract: A probe apparatus includes a movable mounting table for holding a test object provided with a plurality of power devices including diodes; a probe card arranged above the mounting table with probes; a measuring unit for measuring electrical characteristics of the power devices by bringing the probes into electrical contact with the test object in a state that a conductive film electrode formed on at least a mounting surface of the mounting table is electrically connected to a conductive layer formed on a rear surface of the test object; and a conduction member for electrically interconnecting the conductive film electrode and the measuring unit when measuring the electrical characteristics. The conduction member is interposed between an outer peripheral portion of the probe card and an outer peripheral portion of the mounting table.

Abstract: A method and apparatus for aligning objects may be present. A locating pin may be positioned relative to secondary holes in a plurality of objects. The locating pin may comprise a segment with a cross section having an elliptical shape, a surface, and an indicating feature associated with the segment. The locating pin may be inserted into the secondary hole, wherein a number of portions of the surface align the secondary holes.

Abstract: A method and apparatus for aligning a plurality of objects may be present. A locating pin may be positioned relative to secondary holes in a plurality of objects. The locating pin may comprise a segment with a cross section having a number of portions alternating between curved sections and angled sections and a surface. The locating pin may be inserted into the secondary holes. The number of portions of the surface corresponding to the angled sections may be configured to align the secondary holes in a desired direction to align the plurality of objects.

Abstract: Provided is a micro contact element which is capable of coping with the miniaturization and greater complexity of substrates or boards, which is simplified due to a reduction in the number of components, and which creates sufficient contact pressure and stroke. Also provided is an inspection jig using this contact element. An inspection contact element having the contact pressure and amount of contraction required to carry out an inspection is formed by using notch parts respectively formed in two conductive cylindrical members having different outer and inner diameters so that the notch parts can function as elastic parts, and combining the two cylindrical members in such a way that the elastic parts are arranged in parallel or in series.

Abstract: A probe apparatus for probing a device on a semiconductor wafer to be tested by a testing equipment is provided. The probe apparatus includes a replaceable probe tile removably mounted in a probing location on a base plate. The probe tile is configured into a self-contained assembly which includes a chassis body containing a plurality of probes for probing devices on a wafer, a dielectric block for supporting the probes, and a wireguide for guiding a plurality of cables from the testing equipment into the chassis body. A wafer station having replaceable base plates and replaceable probe tiles are also provided.

Abstract: One embodiment of the present invention is a method for aligning a first workpiece to a second work piece that includes: (a) placing the first workpiece on an alignment apparatus including: (i) two or more fluid chambers disposed in fixed relation to each other, the chambers having a movable wall and one or more apertures for admitting or releasing fluid; (ii) fluid channels coupled to the one or more apertures that enable fluid to flow between at least two of the fluid chambers; and (iii) one or more valves disposed to enable or to stop the flow of fluid through one or more of the one or more fluid channels; (b) pumping incompressible fluid into the fluid chambers; (c) opening the one or more valves; (d) bringing the first and second workpieces into contact; (e) waiting a predetermined time for fluid flow in the fluid channels; (f) determining whether the first and second workpieces are aligned; (g) if they are aligned, shutting the valves; and (h) if they are not aligned, moving the second workpiece a prede

Abstract: To eliminate or otherwise reduce unintended movement of a probe tip of a probe assembly being held by a probe arm, the probe assembly includes one or more resilient members that compensate for the contraction or expansion of the probe arm in accordance with the coefficient of thermal expansion of the material from which the probe arm is made. Thus, the probe tip can remain in contact with a sample being measured at the desired location on the sample, during an automated full or wide scale temperature range sweep.

Abstract: A testing head for a test equipment of electronic devices of the type includes a plurality of contact probes inserted into guide holes which are realized in at least an upper guide and a lower guide separated one another by an air zone. Each of such contact probes include at least a probe body having a substantially rectangular section and a projecting arm from the probe body which ends with a probe tip for contacting one of a plurality of contact pads of a device to be tested. The projecting arm projects outside the probe body so as to have a lug with respect to both faces of the probe body which converge in an edge in order to define a probe tip offset and external with respect to the probe body.

Abstract: A test apparatus features an upper RF impermeable hood and lower RF impermeable hood, wherein each of the hoods have internal dividers. When in a closed position, the hoods and dividers create two or more RF impermeable chambers. The hoods are configured to enclose or sandwich a pallet supporting two or more printed circuit boards. One of the printed circuit boards is disposed in each chamber formed by the hoods and dividers.

Abstract: An apparatus for testing electric characteristics of a test object including first connection terminals on a bottom surface and second connection terminals on a top surface, the apparatus comprises a test board comprising first pads on a predetermined surface; a socket configured to electrically connect the test object to the test board; and a handler configured to transport the test object to the socket. The socket comprises a first connection unit configured to be electrically connected to the first connection terminals of the test object and a second connection unit configured to be electrically connected to the second connection terminals of the test object.

Abstract: A module assembly holding workboard is provided and includes a base having a central portion to support a computing module, a first wing at a first side of the central portion to support a first adapter and a second wing at a second side of the central portion to support a second adapter, the first and second adapters being coupled to the computing module via first and second conductive elements and a plurality of routing channel elements fixedly disposed at the first and second wings to retain the first and second conductive elements.

Abstract: According to an aspect of the invention, there is provided a chip die manipulator apparatus arranged for pick and placing of a chip die (30) in a chip manufacturing process, comprising: a pickup head arranged to pick up the chip die with an active side facing the first pickup head (11); a second pickup head (21) arranged to perform a flip chip movement of the chip die (30), to have the active side facing away from the second pickup head (21), wherein the first pickup head (11) comprises a test card (12) comprising contact pads arranged to contact the active side of the chip die (30); and a clamp for clamping the chip die against the contact pads. Advantages may include reduction of the number of process steps and providing less breakdown risk in the manufacturing process due to in-place testing of chip dies.

Abstract: A portable electronic device includes a housing, a circuit board, an antenna, and a RF connector. The circuit board, the antenna, and the RF connector are within the housing. The antenna and the RF connector are electrically connected to the circuit board. The RF connector includes a probe and is capable of receiving test signals through the probe to test the portable electronic device, and the RF connector is also capable of connecting the antenna through the probe to receive communication signals to implement communication function of the portable electronic device. A RF connector used in the portable electronic device is also provided.