Abstract: A plasma monitoring method using a sensor, the sensor having a substrate; a first electrode, the first electrode being a conductive electrode and formed on the substrate while being isolated from the substrate; an insulating film formed on the first electrode; a contact hole formed in the insulating film and having a depth from a surface of the insulating film to the first electrode; and a second electrode, the second electrode being a conductive electrode, formed on the surface of the insulating film, and faced to plasma during a plasma process, the plasma monitoring method including measuring and monitoring potentials of the first electrode and the second electrode or a potential difference between the first electrode and the second electrode during the plasma process is disclosed. A plasma monitoring system carrying out the plasma monitoring method is also disclosed.

Abstract: A non-mechanical contact signal measurement apparatus includes a first conductor on a structure under test and a gas in contact with the first conductor. At least one electron beam is directed into the gas so as to induce a plasma in the gas where the electron beam passes through the gas. A second conductor is in electrical contact with the plasma. A signal source is coupled to an electrical measurement device through the first conductor, the plasma, and the second conductor when the plasma is directed on the first conductor. The electrical measurement device is responsive to the signal source.

Abstract: An arrangement for measuring process parameters within a processing chamber is provided. The arrangement includes a probe arrangement disposed in an opening of an upper electrode. Probe arrangement includes a probe head, which includes a head portion and a flange portion. The arrangement also includes an o-ring disposed between the upper electrode and the flange portion. The arrangement further includes a spacer made of an electrically insulative material positioned between the head portion and the opening of the upper electrode to prevent the probe arrangement from touching the upper electrode. The spacer includes a disk portion configured for supporting an underside of the flange portion. The spacer also includes a hollow cylindrical portion configured to encircle the head portion. The spacer forms a right-angled path between the o-ring and an opening to the processing chamber to prevent direct line-of-sight path between the o-ring and the opening to the processing chamber.

Abstract: Apparatus for optically testing LEDs or other light-emitting components in a wide variety of test environments and to the degree necessary pertinent to the type(s) of faults encountered. In one embodiment, the present invention includes one or more fiber optic probes coupled to a multi-mode sensor unit, incorporating a photo-sensor coupled to a processor which may be programmed to provide a variety of test modes including simple on/off testing, color determination, color matching, wavelength and relative intensity among others. An extremely high sensitivity test mode is also provided for testing LEDs which emit very low intensity light in the microcandela range in products such as automobile/aircraft cockpit control panel lighted push-buttons for night-time viewing. The multi-mode sensor unit operates over a wide dynamic range and is capable of accurately testing LEDs that may be very dim to very bright without adjustment.

Abstract: Apparatus for optically testing LEDs or other light-emitting components in a wide variety of test environments and to the degree necessary pertinent to the type(s) of faults encountered. In one embodiment, the present invention includes one or more fiber optic probes coupled to a multi-mode sensor unit, incorporating a photo-sensor coupled to a processor which may be programmed to provide a variety of test modes including simple on/off testing, color determination, color matching, wavelength and relative intensity among others. An extremely high sensitivity test mode is also provided for testing LEDs which emit very low intensity light in the micro-candela range in products such as automobile/aircraft cockpit control panel lighted push-buttons for night-time viewing. The multi-mode sensor unit operates over a wide dynamic range and is capable of accurately testing LEDs that may be very dim to very bright without adjustment.

Abstract: Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.