Abstract: The present disclosure relates to a through-silicon via (TSV) crack detecting apparatus, a detecting method, and a fabricating method of the semiconductor device. The TSV crack detecting apparatus includes a test TSV, a conductive liner, a second dielectric liner, a first contact, and a second contact. The test TSV is disposed within a semiconductor substrate, including a conductive channel and a first dielectric liner for isolating the conductive channel and the semiconductor substrate. The conductive liner surrounds the first dielectric liner. The second dielectric liner surrounds the conductive liner. The first contact is connected to the conductive channel. The second contact is connected to the conductive liner. A voltage difference between the first contact and the second contact is used to determine whether a TSV within a predetermined range to the test TSV has a crack based on a conductive state between the first contact and the second contact.

Abstract: The transformer fault detection apparatus includes an integrated sensor unit for sensing signals through a plurality of sensors located on each of upper and lower drain valves in a transformer. A first possible discharge area calculation unit calculates a first possible discharge area estimated to be a location of a partial discharge source of the transformer, based on arrival times of signals sensed by different sensors located on the upper drain valve. A second possible discharge area calculation unit calculates a second possible discharge area estimated to be the location of the partial discharge source, based on arrival times of signals sensed by different sensors located on the lower drain valve. A final possible discharge area calculation unit calculates a final possible discharge area, based on an overlapping area between the first and second possible discharge areas.

Abstract: A system for detecting partial discharge in electrical components may include a control system that may operate a drive in an industrial automation system. The industrial automation system may include the electrical components being analyzed for partial discharge. The system may also include one or more acoustic sensors that may detect one or more acoustic waveforms generated within at least one of the electrical components. The system may also include a monitoring system that may receive the acoustic waveforms from the acoustic sensors and determine whether the one electrical component is experiencing partial discharge based on the acoustic waveforms. The monitoring system may then send a notification to the control system when the one electrical component is determined to be experiencing partial discharge, such that the notification indicates that the one electrical component is experiencing partial discharge.

Abstract: In an ultrasound probe (2) and a method for manufacturing the ultrasound probe (2) of the invention, an organic piezoelectric element (21) has a sheet-like form, and is directly or indirectly laminated on a part or the entirety of a plurality of inorganic piezoelectric elements (22). Accordingly, the ultrasound probe (2) can be manufactured with a less number of steps. An ultrasound diagnostic apparatus of the invention includes the ultrasound probe (2). Accordingly, the cost of the ultrasound diagnostic apparatus can be reduced.

Abstract: An ultrasonic diagnostic imaging system is described which records expert review of a 3D image data set, including image plane and view manipulation, annotation, and measurements, for the purpose of generating automated review protocols for 3D ultrasound image acquisitions. The ability to provide a standardized 3D review protocol has benefits such as guiding reviewers of all experience levels through the required steps to extract key images and measurements from 3D image data, enabling automation to improve 3D review workflow and reduce review time, monitoring growth or therapy, and standardizing review presentations for easy comparison with prior examination results.

Abstract: A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.