Abstract: An apparatus for inspecting an antenna includes a stage including a ground on which an antenna device is disposed, an inspection board configured to be in contact with and connected to the antenna device, a connection maintaining unit for maintaining a contact and connection between the antenna device and the inspection board, and an inspection unit mounted or connected to the inspection board to inspect the antenna device.

Abstract: A system for measuring the transfer function on a path from a feed antenna via a reflector to a radar sensor testing zone includes: an anechoic chamber; the feed antenna, wherein the feed antenna is configured to transmit and receive a radar signal, and wherein the feed antenna is disposed, together with the reflector, within the anechoic chamber; the radar sensor testing zone, wherein the radar sensor testing zone is a predetermined area within the anechoic chamber; and a retroreflector disposed in the radar sensor testing zone, wherein the retroreflector is configured to cause at least a portion of a measurement signal in the radar frequency range to be reflected back to the feed antenna via the reflector, wherein the measurement signal is received from the feed antenna via the reflector.

Abstract: An over the air measuring device is provided. The over the air measuring device comprises N feed antenna devices, a measuring device, adapted to perform over the air measurements on a device under test, selectively using any one of the N feed antenna devices, and a guide rail adapted to movably hold the N feed antenna devices. The N feed antenna devices are independently movable along the guide rail.

Abstract: An integrated circuit with antenna in package (AiP IC) testing apparatus is provided, and includes: a carrier board, a test socket, and a receiving antenna circuit board. The test socket is disposed on the carrier board and configured to carry an AiP IC which emits a wireless signal. The receiving antenna circuit board is adjacent to the test socket and configured to receive the wireless signal. The receiving antenna circuit board and the reflector are integrated into the AiP IC testing apparatus, so that the AiP IC testing apparatus can be used not only for testing a feedback signal transmitted by a test pin of the IC, but also for testing the wireless signal from the IC.

Abstract: A device testing approach employs optical antennas at test locations of a semiconductor device, usable as either/both radiators or receivers. As a radiator, an antenna responds to localized optical energy at a test location of the device to generate corresponding radiated optical energy that can be sensed and processed by a test system. As a receiver, an antenna receives radiated optical energy as generated by a test system and converts the energy into corresponding localized optical energy for affecting operation of the device. The optical antennas may be formed from metal segments on the same metal layers used for signal interconnections in the device, and thus the disclosed approach can provide enhanced test functionality without burdening the device manufacturing process with additional complexity solely to support testing. The testing approach may be used in different modalities in which the antennas variably act as transmitters, receivers, and reflectors/refractors.

Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.

Abstract: A system and method for testing a wireless earpiece which provides improved efficiencies in manufacturing. Automated testing of one or more printed circuit boards of the wireless earpiece is initiated. The semi-assembled wireless earpiece is tested. End-of-line functional testing is performed. Final acoustic testing of the wireless earpiece is performed.

Abstract: A device according to one embodiment includes a variable-capacitor-tuned isolation tuning circuit having a directional coupler having an input port, an output port, an isolation port, and a coupling port. The variable-capacitor-tuned isolation tuning circuit also has and a tunable capacitor coupled in shunt to the coupling port of the directional coupler.

Abstract: A radio-frequency probe system with a transmitting or receiving element integrated into a cable assembly is disclosed. In some embodiments a preferred configuration may contain one or more sensing elements integrated into the transmitting or receiving element. In another embodiment, the radio frequency probe comprises an antenna body fixed to a coaxial cable, in which the center conductor of the coaxial cable serves as the transmitting or receiving element. A method for monitoring, transmitting, or detecting one or more parameters using a single radio frequency probe is also disclosed.

Abstract: Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.

Abstract: An electromagnetic field measuring apparatus capable of measuring an electromagnetic field for a minuscule area in which electronic devices are densely packed with a high sensitivity is provided. In an electromagnetic field measuring apparatus according to the present invention, the amplitude level of signal light (pf) is adjusted by the analyzer (34) by adjusting its angle with respect to the plane of polarization of the signal light (pf) based on an amplitude level control signal (eb) supplied from the calculation control unit (40). An amplitude level control signal (eb) is supplied from the calculation control unit (40) to the analyzer (34) based on the spectrum (ea) of an electric signal (ed) measured by an RF spectrum analyzer (39). The amplitude level ration between the carrier and the sideband contained in the signal light (ph) incident on the optical receiver (38) is controlled to a fixed value.

Abstract: A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.

Abstract: Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.

Abstract: A method and a system of testing an electrical signal path functionality of a sensing catheter in a dry environment. A variety of test input patterns are generated by an arbitrary near field RF signal generator, transmitted into the sensing catheter disposed in a shielded enclosure. B-mode like images corresponding to the test input patterns are generated and displayed by an imaging system connected to a proximal end of the sensing catheter, and then analyzed by a computer system, as dependent on the frequency, amplitude, and phase of the test input patterns. A determination is made as to whether the sensing catheter retains a desired electrical signal path functionality based on the analysis. The sensing catheter could be a variety of sensing catheters including forward looking catheters, a rotational IVUS catheters, or phased array IVUS catheters.

Abstract: An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.

Abstract: A system and method for measuring recombination lifetime of a photoconductor or semiconductor material in real time and without physically contacting the material involving positioning the sample material between a transmitter and a receiver so that electromagnetic signals, preferably radio frequency signals, traveling from the transmitter to the receiver pass through the sample material. The electromagnetic signals are modulated as they pass through the sample material depending on the carrier density and conductivity of the sample material. The modulated electromagnetic signals received by the receiver are then analyzed to determine the carrier recombination lifetime of the sample material.

Abstract: An apparatus comprises: a first signal source; a dopant profile measurement module (DPPM) configured to receive a portion of the signal from the signal source; a probe tip connected to the reflective coupler; a load connected in parallel with the probe tip; and a second signal source connected to a load, wherein the signal source is configured to provide an amplitude-modulated (AM) signal to the probe tip. A method is also described.

Abstract: A wafer is disclosed that includes a plurality of pipeline interconnected integrated circuit dies that form a plurality of pipelines. A plurality of dies in each pipeline is connected to receive scanned output test data from a neighboring die in a pipeline. A wafer level test access mechanism (TAM) transceiver circuitry, located outside the plurality of pipeline interconnected IC dies, is connected in common to each of the pipelines to provide input test data in a parallel fashion to the plurality of pipelines. The wafer level test access mechanism transceiver circuitry also provides output test results from each of the pipelines for evaluation by a computerized test system. In one embodiment, the wafer level test access mechanism transceiver circuitry is wireless so that it wirelessly receives test data to be passed through the multiple pipelines on a wafer and also includes wireless transmit circuitry to transmit test results from each of the pipelines.

Abstract: A method and apparatus for interrogating an electronic component (20), includes a body (18 or 102) having an interface (10, 24, 108 or 154) for an interrogating device (48/50 or 106) to use as a conduit in reliably performing multiple discrete interrogations of the electronic component (20) without the interrogating device physically touching the electronic component (20).

Abstract: A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.

Abstract: A test module and method for radio frequency identification (RFID) chips are provided. The test module includes a test head having a chip carrier for carrying a RFID chip to be tested, the chip carrier having a first antenna electronically connecting the RFID chip. The module further includes a second antenna for communicating with the first antenna; and a base supporting the chip carrier and the second antenna. The test module further includes a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna.

Abstract: Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.

Abstract: Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.

Abstract: A testing system includes a tester probe and a plurality of integrated circuits. Tests are broadcast to the plurality of integrated circuits using carrierless ultra wideband (UWB) radio frequency (RF). All of the plurality of integrated circuits receive, at the same time, test input signals by way of carrierless UWB RF and all of the plurality of integrated circuits run tests and provide results based on the test input signals. Thus, the plurality of integrated circuits are tested simultaneously which significantly reduces test time. Also the tests are not inhibited by physical contact with the integrated circuits.

Abstract: A light source for injecting excess carriers into a semiconductor wafer, fully illuminating a surface of the wafer. According to the disclosed embodiments, the source includes at least one set of point sources which are spaced apart at regular intervals along the X and Y axes, such that the source emits a monochromatic beam of a size that is at least equal to that of the semiconductor wafer surface to be illuminated. Each of the point sources is sinusoidally modulated by a common electrical modulator, the distance between two point sources and the distance between the source and the semiconductor wafer surface to be illuminated being selected such that the monochromatic light beam uniformly illuminates the surface.

Abstract: A light source for injecting excess carriers into a semiconductor wafer, fully illuminating a surface of the wafer. According to the disclosed embodiments, the source includes at least one set of point sources which are spaced apart at regular intervals along the X and Y axes, such that the source emits a monochromatic beam of a size that is at least equal to that of the semiconductor wafer surface to be illuminated. Each of the point sources is sinusoidally modulated by a common electrical modulator, the distance between two point sources and the distance between the source and the semiconductor wafer surface to be illuminated being selected such that the monochromatic light beam uniformly illuminates the surface.

Abstract: An electromagnetic field measuring apparatus capable of measuring an electromagnetic field for a minuscule area in which electronic devices are densely packed with a high sensitivity is provided. In an electromagnetic field measuring apparatus according to the present invention, the amplitude level of signal light (pf) is adjusted by the analyzer (34) by adjusting its angle with respect to the plane of polarization of the signal light (pf) based on an amplitude level control signal (eb) supplied from the calculation control unit (40). An amplitude level control signal (eb) is supplied from the calculation control unit (40) to the analyzer (34) based on the spectrum (ea) of an electric signal (ed) measured by an RF spectrum analyzer (39). The amplitude level ration between the carrier and the sideband contained in the signal light (ph) incident on the optical receiver (38) is controlled to a fixed value.

Abstract: A method for adapting the signal transmission between two electronic devices (1, 2) that are connected to each other via a physical interface and that each have a transmitter (8a, 8b) and a receiver (7a, 7b), wherein analog signals are transmitted from the transmitter (8a, 8b) of one device (1, 2) along a transmission path (9a, 9b) to the receiver (7a, 7b) of the other device (1, 2). Known scattering parameters (10a, 10b, 10c, 11d) for describing the electromagnetic wave propagation in the transmission path (9a, 9b) between the receiver (7a, 7b) of the first device (1, 2) and the transmitter (8a, 8b) of the second device (1, 2) are retrieved by the first device (1, 2), transmitted to the second device (1, 2), and parameters of the transmitter (8a, 8b) in the second device (1, 2) are adapted with reference to a high-frequency description of the transmission path (9a, 9b) as a function of all of the scattering parameters (10a to 10d, 11a to 11d) known to the two devices.

Abstract: The invention relates to a contactless loop probe for the contactless decoupling of an HF signal for a contactless measuring system, comprising at least one coupling structure (10) and at least one first signal conductor (12) electrically connected to the coupling structure (10) by a first transition (20), said signal conductor being electrically connected by a second transition (22) to an output (14) for electrically connecting to the measuring system, wherein the coupling structure (10) is designed as an HF waveguide comprising at least one signal conductor (24; 30) and at least one reference conductor (26; 32).