Radio Wave Patents (Class 324/754.31)
  • Patent number: 10705138
    Abstract: A device testing approach employs optical antennas at test locations of a semiconductor device, usable as either/both radiators or receivers. As a radiator, an antenna responds to localized optical energy at a test location of the device to generate corresponding radiated optical energy that can be sensed and processed by a test system. As a receiver, an antenna receives radiated optical energy as generated by a test system and converts the energy into corresponding localized optical energy for affecting operation of the device. The optical antennas may be formed from metal segments on the same metal layers used for signal interconnections in the device, and thus the disclosed approach can provide enhanced test functionality without burdening the device manufacturing process with additional complexity solely to support testing. The testing approach may be used in different modalities in which the antennas variably act as transmitters, receivers, and reflectors/refractors.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: July 7, 2020
    Assignee: Trustees of Boston University
    Inventors: M. Selim Ünlü, Bennett B. Goldberg, Yusuf Leblebici
  • Patent number: 10128962
    Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: November 13, 2018
    Assignee: Infineon Technologies AG
    Inventors: Karl Dominizi, Oliver Frank, Herbert Jaeger, Herbert Knapp, Hao Li, Florian Starzer, Rainer Stuhlberger, Jonas Wursthorn
  • Patent number: 10104487
    Abstract: A system and method for testing a wireless earpiece which provides improved efficiencies in manufacturing. Automated testing of one or more printed circuit boards of the wireless earpiece is initiated. The semi-assembled wireless earpiece is tested. End-of-line functional testing is performed. Final acoustic testing of the wireless earpiece is performed.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: October 16, 2018
    Assignee: BRAGI GmbH
    Inventor: Lisa Kingscott
  • Patent number: 9419675
    Abstract: A device according to one embodiment includes a variable-capacitor-tuned isolation tuning circuit having a directional coupler having an input port, an output port, an isolation port, and a coupling port. The variable-capacitor-tuned isolation tuning circuit also has and a tunable capacitor coupled in shunt to the coupling port of the directional coupler.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: August 16, 2016
    Assignee: Applied Wireless Identifications Group, Inc.
    Inventor: Liming Zhou
  • Publication number: 20150123688
    Abstract: A radio-frequency probe system with a transmitting or receiving element integrated into a cable assembly is disclosed. In some embodiments a preferred configuration may contain one or more sensing elements integrated into the transmitting or receiving element. In another embodiment, the radio frequency probe comprises an antenna body fixed to a coaxial cable, in which the center conductor of the coaxial cable serves as the transmitting or receiving element. A method for monitoring, transmitting, or detecting one or more parameters using a single radio frequency probe is also disclosed.
    Type: Application
    Filed: November 7, 2014
    Publication date: May 7, 2015
    Inventors: Alexander Sappok, Roland Smith, III, Leslie Bromberg
  • Publication number: 20150048858
    Abstract: Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.
    Type: Application
    Filed: September 29, 2014
    Publication date: February 19, 2015
    Inventors: Joshua G. Nickel, Jonathan P.G. Gavin
  • Patent number: 8941402
    Abstract: An electromagnetic field measuring apparatus capable of measuring an electromagnetic field for a minuscule area in which electronic devices are densely packed with a high sensitivity is provided. In an electromagnetic field measuring apparatus according to the present invention, the amplitude level of signal light (pf) is adjusted by the analyzer (34) by adjusting its angle with respect to the plane of polarization of the signal light (pf) based on an amplitude level control signal (eb) supplied from the calculation control unit (40). An amplitude level control signal (eb) is supplied from the calculation control unit (40) to the analyzer (34) based on the spectrum (ea) of an electric signal (ed) measured by an RF spectrum analyzer (39). The amplitude level ration between the carrier and the sideband contained in the signal light (ph) incident on the optical receiver (38) is controlled to a fixed value.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: January 27, 2015
    Assignee: NEC Corporation
    Inventors: Mizuki Iwanami, Hiroshi Fukuda, Risato Ohhira
  • Patent number: 8901945
    Abstract: A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: December 2, 2014
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Ahmadreza Rofougaran, Arya Behzad, Jesus Castaneda, Michael Boers
  • Patent number: 8847617
    Abstract: Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: September 30, 2014
    Assignee: Apple Inc.
    Inventors: Joshua G. Nickel, Jonathan P. G. Gavin
  • Publication number: 20140176175
    Abstract: A method and a system of testing an electrical signal path functionality of a sensing catheter in a dry environment. A variety of test input patterns are generated by an arbitrary near field RF signal generator, transmitted into the sensing catheter disposed in a shielded enclosure. B-mode like images corresponding to the test input patterns are generated and displayed by an imaging system connected to a proximal end of the sensing catheter, and then analyzed by a computer system, as dependent on the frequency, amplitude, and phase of the test input patterns. A determination is made as to whether the sensing catheter retains a desired electrical signal path functionality based on the analysis. The sensing catheter could be a variety of sensing catheters including forward looking catheters, a rotational IVUS catheters, or phased array IVUS catheters.
    Type: Application
    Filed: December 19, 2013
    Publication date: June 26, 2014
    Applicant: Volcano Corporation
    Inventor: Jeffery H. Brown
  • Patent number: 8643395
    Abstract: An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: February 4, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 8581613
    Abstract: A system and method for measuring recombination lifetime of a photoconductor or semiconductor material in real time and without physically contacting the material involving positioning the sample material between a transmitter and a receiver so that electromagnetic signals, preferably radio frequency signals, traveling from the transmitter to the receiver pass through the sample material. The electromagnetic signals are modulated as they pass through the sample material depending on the carrier density and conductivity of the sample material. The modulated electromagnetic signals received by the receiver are then analyzed to determine the carrier recombination lifetime of the sample material.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: November 12, 2013
    Assignee: Colorado School of Mines
    Inventors: Richard Keith Ahrenkiel, Donald John Dunlavy
  • Patent number: 8471580
    Abstract: An apparatus comprises: a first signal source; a dopant profile measurement module (DPPM) configured to receive a portion of the signal from the signal source; a probe tip connected to the reflective coupler; a load connected in parallel with the probe tip; and a second signal source connected to a load, wherein the signal source is configured to provide an amplitude-modulated (AM) signal to the probe tip. A method is also described.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: June 25, 2013
    Assignee: Agilent Technologies, Inc.
    Inventors: Hassan Tanbakuchi, Roger B. Stancliff, Timothy M. Graham, Wenhai Han
  • Patent number: 8400181
    Abstract: A wafer is disclosed that includes a plurality of pipeline interconnected integrated circuit dies that form a plurality of pipelines. A plurality of dies in each pipeline is connected to receive scanned output test data from a neighboring die in a pipeline. A wafer level test access mechanism (TAM) transceiver circuitry, located outside the plurality of pipeline interconnected IC dies, is connected in common to each of the pipelines to provide input test data in a parallel fashion to the plurality of pipelines. The wafer level test access mechanism transceiver circuitry also provides output test results from each of the pipelines for evaluation by a computerized test system. In one embodiment, the wafer level test access mechanism transceiver circuitry is wireless so that it wirelessly receives test data to be passed through the multiple pipelines on a wafer and also includes wireless transmit circuitry to transmit test results from each of the pipelines.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: March 19, 2013
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Sravan Kumar Bhaskarani
  • Patent number: 8390307
    Abstract: A method and apparatus for interrogating an electronic component (20), includes a body (18 or 102) having an interface (10, 24, 108 or 154) for an interrogating device (48/50 or 106) to use as a conduit in reliably performing multiple discrete interrogations of the electronic component (20) without the interrogating device physically touching the electronic component (20).
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: March 5, 2013
    Inventors: Steven Slupsky, Chistopher Sellathamby
  • Patent number: 8373429
    Abstract: A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: February 12, 2013
    Inventors: Steven Slupsky, Christopher Sellathamby
  • Patent number: 8344734
    Abstract: A test module and method for radio frequency identification (RFID) chips are provided. The test module includes a test head having a chip carrier for carrying a RFID chip to be tested, the chip carrier having a first antenna electronically connecting the RFID chip. The module further includes a second antenna for communicating with the first antenna; and a base supporting the chip carrier and the second antenna. The test module further includes a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna.
    Type: Grant
    Filed: October 6, 2009
    Date of Patent: January 1, 2013
    Assignee: Mutual-Pak Technology Co., Ltd.
    Inventor: Lu-Chen Hwan
  • Publication number: 20120306521
    Abstract: Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.
    Type: Application
    Filed: June 3, 2011
    Publication date: December 6, 2012
    Inventor: Joshua G. Nickel
  • Publication number: 20120268153
    Abstract: Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.
    Type: Application
    Filed: April 22, 2011
    Publication date: October 25, 2012
    Inventors: Joshua G. Nickel, Jonathan P. G. Gavin
  • Patent number: 8294483
    Abstract: A testing system includes a tester probe and a plurality of integrated circuits. Tests are broadcast to the plurality of integrated circuits using carrierless ultra wideband (UWB) radio frequency (RF). All of the plurality of integrated circuits receive, at the same time, test input signals by way of carrierless UWB RF and all of the plurality of integrated circuits run tests and provide results based on the test input signals. Thus, the plurality of integrated circuits are tested simultaneously which significantly reduces test time. Also the tests are not inhibited by physical contact with the integrated circuits.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: October 23, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Lucio F. C. Pessoa, Perry H. Pelley, III
  • Patent number: 8278954
    Abstract: A light source for injecting excess carriers into a semiconductor wafer, fully illuminating a surface of the wafer. According to the disclosed embodiments, the source includes at least one set of point sources which are spaced apart at regular intervals along the X and Y axes, such that the source emits a monochromatic beam of a size that is at least equal to that of the semiconductor wafer surface to be illuminated. Each of the point sources is sinusoidally modulated by a common electrical modulator, the distance between two point sources and the distance between the source and the semiconductor wafer surface to be illuminated being selected such that the monochromatic light beam uniformly illuminates the surface.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: October 2, 2012
    Assignee: Universite Paul Cezanne
    Inventors: Olivier Palais, Marcel Pasquinelli
  • Publication number: 20120133384
    Abstract: A light source for injecting excess carriers into a semiconductor wafer, fully illuminating a surface of the wafer. According to the disclosed embodiments, the source includes at least one set of point sources which are spaced apart at regular intervals along the X and Y axes, such that the source emits a monochromatic beam of a size that is at least equal to that of the semiconductor wafer surface to be illuminated. Each of the point sources is sinusoidally modulated by a common electrical modulator, the distance between two point sources and the distance between the source and the semiconductor wafer surface to be illuminated being selected such that the monochromatic light beam uniformly illuminates the surface.
    Type: Application
    Filed: January 31, 2007
    Publication date: May 31, 2012
    Applicant: UNIVERSITE PAUL CEZANNE
    Inventors: Olivier Palais, Marcel Pasquinelli
  • Publication number: 20120098560
    Abstract: An electromagnetic field measuring apparatus capable of measuring an electromagnetic field for a minuscule area in which electronic devices are densely packed with a high sensitivity is provided. In an electromagnetic field measuring apparatus according to the present invention, the amplitude level of signal light (pf) is adjusted by the analyzer (34) by adjusting its angle with respect to the plane of polarization of the signal light (pf) based on an amplitude level control signal (eb) supplied from the calculation control unit (40). An amplitude level control signal (eb) is supplied from the calculation control unit (40) to the analyzer (34) based on the spectrum (ea) of an electric signal (ed) measured by an RF spectrum analyzer (39). The amplitude level ration between the carrier and the sideband contained in the signal light (ph) incident on the optical receiver (38) is controlled to a fixed value.
    Type: Application
    Filed: May 18, 2010
    Publication date: April 26, 2012
    Inventors: Mizuki Iwanami, Hiroshi Fukuda, Risato Ohhira
  • Patent number: 8150331
    Abstract: A method for adapting the signal transmission between two electronic devices (1, 2) that are connected to each other via a physical interface and that each have a transmitter (8a, 8b) and a receiver (7a, 7b), wherein analog signals are transmitted from the transmitter (8a, 8b) of one device (1, 2) along a transmission path (9a, 9b) to the receiver (7a, 7b) of the other device (1, 2). Known scattering parameters (10a, 10b, 10c, 11d) for describing the electromagnetic wave propagation in the transmission path (9a, 9b) between the receiver (7a, 7b) of the first device (1, 2) and the transmitter (8a, 8b) of the second device (1, 2) are retrieved by the first device (1, 2), transmitted to the second device (1, 2), and parameters of the transmitter (8a, 8b) in the second device (1, 2) are adapted with reference to a high-frequency description of the transmission path (9a, 9b) as a function of all of the scattering parameters (10a to 10d, 11a to 11d) known to the two devices.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: April 3, 2012
    Assignee: Fujitsu Technology Solutions Intellectual Property GmbH
    Inventor: Robert Depta
  • Publication number: 20110267088
    Abstract: The invention relates to a contactless loop probe for the contactless decoupling of an HF signal for a contactless measuring system, comprising at least one coupling structure (10) and at least one first signal conductor (12) electrically connected to the coupling structure (10) by a first transition (20), said signal conductor being electrically connected by a second transition (22) to an output (14) for electrically connecting to the measuring system, wherein the coupling structure (10) is designed as an HF waveguide comprising at least one signal conductor (24; 30) and at least one reference conductor (26; 32).
    Type: Application
    Filed: July 15, 2009
    Publication date: November 3, 2011
    Applicant: ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG
    Inventors: Thomas Zelder, Bernd Geck