Abstract: A method to construct first and second configurable systems including: providing a first configurable system including a first die and a second die, where the first die is diced from a first wafer and the second die is diced from a second wafer and the first die is connected to the second die using at least one through-silicon-via (TSV); providing a second configurable system including a third die and a fourth die, where the third die is diced from a third wafer and the fourth die is diced from a fourth wafer and the third die is connected to the fourth die using at least one through-silicon-via (TSV); where processing the first wafer and the third wafer utilizes a majority of masks that are substantially same; and where the first die is larger than the third die.

Abstract: The present invention provides in a first aspect a programmable interconnect network for an array of logic blocks, which comprises a plurality of switch boxes being connected in a tree-based hierarchical architecture and providing selection and connection for the logic blocks, switch boxes located at the lowest level of the tree structure are connected to the logic blocks; wherein said network comprises a crosslink established between two of said plurality of switch boxes. The present invention helps implement functions with more area and timing efficiency and/or placement-friendliness.

Abstract: Described embodiments provide for a semiconductor device comprising a core and one or more input/output (I/O) buffers surrounding the core. The I/O buffers are adapted to transfer signals associated with core circuitry of the core. The I/O buffers comprise I/O cells having a first orientation and I/O cells having a second orientation. Each I/O cell has a corresponding translator having low voltage transistors in a corresponding footprint. The low voltage transistors in the first orientation I/O cells have the first orientation, and the low voltage transistors in the second orientation I/O cells have the first orientation. The footprints of the first orientation I/O cells and the second orientation I/O cells are compatible with one another.

Abstract: A wafer includes a group of tiles of programmable logic formed thereon, wherein each tile comprises a micro control unit (MCU) communicating with adjacent MCUs, and wherein each MCU is controlled in a predetermined order of priority by adjacent MCUs; and dice lines on the wafer to separate the group into one or more end-devices.

Abstract: A method for a singular programming a programmable component in an electronic circuit includes providing a plurality of programmable components connected between each other in an electronic chain arrangement; providing an interface adapted to connect the programmable components to an external controller wherein the controller is adapted to program the programmable components; isolating and programming a safety component by setting an output pin in the safety component to logical state zero at first power up of the electronic circuit and logical state zero causes input and output data lines from the interface to be connected just to the safety component; and setting the output pin in the safety component to logical state one wherein the logical state one causes input and output data lines from the interface to disconnect from the safety component and connect to the electronic chain of the plurality of programmable components excluding the safety component.

Abstract: A three dimensional semiconductor device is described with two transistor layers overlaid. The first transistor layer comprises a plurality of flip-flops each having an input and an output, wherein the inputs are selectively coupleable to the second transistor layer.

Abstract: A circuit formed in an integrated circuit (chip) is disclosed. The circuit can include a plurality of analog circuit blocks each configured to provide at least one analog function; at least one digital circuit block that provides a digital function; and a programmable interconnect coupled to the analog circuit blocks and configurable to interconnect combinations of the analog circuit blocks to one another. The programmable interconnect can include a plurality of multiplexer (MUX) circuits including port MUX circuits coupled between the analog circuit blocks and ports that provide signal connections for the chip.

Abstract: A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern.

Abstract: Techniques are provided which may be used to reduce power consumed by memory circuits. In one example, a memory circuit includes a static random access memory (SRAM) cell. A pair of bitlines are connected to the SRAM cell. A precharge circuit is connected to the bitlines. The precharge circuit is adapted to precharge the bitlines immediately prior to read and write operations performed on the SRAM cell and float relative to the bitlines at other times.

Abstract: A routing fabric using multiple levels of switching networks along with associated routing matrices to allow a more uniform and shorter interconnection or routing path among logic modules or routing modules compared with those in the conventional designs. The resulting routing fabric can be used in electronic devices, such as switching networks, routers, and programmable logic circuits, etc.

Abstract: A circuit arrangement and method utilize a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: Techniques and technology are provided to enable the testing of a programmable integrated circuit from within the programmable integrated circuit itself. In various implementations of the invention, a hardware verification module is added to the programmable integrated circuit by the manufacturer. Once the programmable integrated circuit is programmed to have a desired functionality, the hardware verification module may be activated and used to apply tests and receive responses from the programmable integrated circuit to verify its functionality.

Abstract: A field programmable gate array (“FPGA”) is provided having integrated application specific integrated circuit (“ASIC”) fabric. The ASIC fabric may be used to implement one or more custom or semi-custom hard blocks within the FPGA. The ASIC fabric can be made up of a “custom region” and an “interface region.” The custom region can implement the custom or semi-custom ASIC design and the interface region can integrate and connect the custom region to the rest of the FPGA circuitry. The custom region may be based on a structured ASIC design. The interface region may allow the ASIC fabric to be incorporated within the hierarchical organization of the FPGA, allowing the custom region to connect to the FPGA circuitry in a seamless manner.

Abstract: The invention relates to a method according to which a cycle-oriented control program generated for a programmable logic controller (110) is at least partially converted into a code that may be executed by a logic component (80) of a communications module (10), such that at least the converted program segment of the cycle-oriented control program may be executed in a cycle-free manner. Cycle-free or virtually cycle-free means that at least some of the implemented control functions and system functions may be executed in a parallel fashion and therefore more quickly than would be the case if the cycle-oriented control program were executed by the PLC (110).

Abstract: Disclosed are methods, systems, and structures for implementing interconnect modeling by using a test structure which include a variation of physical wire structures between local interconnects and distant interconnects. According to one approach, the impact of variations of the physical properties for neighborhood wires are considered for the electrical modeling of interconnects. This variation between the local and distant wire characteristics allows more accurate and robust interconnect modeling to be created.

Abstract: An access pad is used to provide access to a functional block of an integrated circuit (IC) device. The access pad is formed using dummy metal in an open space in a metallization level that is between a top metallization level and a base level on which the functional block is formed in the IC device. The access pad at the metallization level provides a contact to access an underlying circuit of the functional block so that the functional integrity of the functional block of the IC device can be verified during probing.

Abstract: A method of configuring a semiconductor integrated circuit (IC) includes arranging a circuit region in the center of a unit cell. Capacitor/resistor regions are arranged along the left and right edge portions of the unit cell. The capacitor/resistor regions include a plurality of active resistors having the same length and a capacitor having a width equal to the length of the plurality of active resistors. In addition, a first conductive layer is arranged longitudinally in each of the capacitor/resistor regions so as to contact the left and right edge portions of the unit cell.

Abstract: A standard cell library is used in design of a semiconductor integrated circuit. A driving force sequence of cells for a single function is in the form of geometric progression with a geometric ratio of the “pth root of 2,” where p is a natural number of 2 or more. A transistor in an output signal driving section of each of the cell is laid out using only layout devices which are limited to p types of sizes. Even if p is small, the driving force sequence can be formed in geometric progression with an extremely low increasing rate. At the same time, sizes of layout devices are discrete and limited, thereby easily securing accuracy of a performance model of a cell. As a result, the standard cell library allows a high-performance circuit to be designed in a highly reliable model.

Abstract: An integrated circuit may include a plurality of sub bit line groups, each sub bit line group coupled to a different main bit line by a corresponding access device; and a plurality of programmable impedance elements arranged into element groups, each element group being coupled to a corresponding each sub bit line.

Abstract: One aspect provides an input/output cell. The input/output cell, in one example, includes an input/output layout boundary delineated on a substrate, wherein the input/output layout boundary defines a first side parallel and opposing a second side, a third side parallel and opposing a fourth side, wherein the first and second sides are substantially perpendicular the third and fourth sides. The input/output cell, in this example, further includes input/output transistors positioned within the input/output layout boundary over the substrate. The input/output cell, in this example, further includes first and second power conductors and first and second ground conductors located over the substrate, the first power conductor and first ground conductor extending entirely between the first and second sides and the second power conductor and second ground conductor extending entirely between the third and fourth sides.

Abstract: The present invention provides an automated digital circuit design tool that reduces or eliminates adverse timing constraints due to an inherent clock signal skew, and applications thereof In an embodiment, an automated design tool according to the invention generates a clocking system that includes a clock signal generator, control logic, enable logic, and at least one clock gater. The clock signal generator generates a clock signal that is distributed to various logic blocks of the digital circuit using a buffered clock tree. The enable logic receives input values from the control logic and provides a control signal to the clock gater. When enabled, the clock gater allows a clock signal to pass through to multiple registers. An early clock signal is provided to register(s) in the control logic, which allows for an increased clock frequency while still meeting timing constraints.

Abstract: A physically unclonable function (PUF) device, with corresponding method, is provided for characterizing an integrated circuit. The PUF device includes a digital clock manager (DCM), a Butterfly circuit incorporated within the integrated circuit, and a shift register. The DCM receives a clock input signal (CLK) and imposes a temporal offset to produce a phase-shift signal (PS). The Butterfly circuit receives a first excite signal as said CLK and a second excite signal as said PS. In response, the Butterfly circuit produces an output that shifts state in response to a non-concurrent change in the CLK and PS. The shift register increments a shift count in response to the output.

Abstract: Some embodiments provide an IC with configuration context switchers. The IC includes several configurable circuits, each of which configurably performs one of several operations at any given time, based on the configuration data set that it receives at that time. The IC includes several storage circuits for storing several configuration data sets for each of the configurable circuits. The IC also includes a context switching interconnect circuit for switchably connecting the configurable circuit to different sets of storage circuits to receive different sets of configuration data sets. The context switcher includes one or more stages for re-timing the data coming from the configuration storage elements. The stages can include interconnect circuitry or storage circuitry. Some embodiments build one of the stages in the configuration data storage elements. Some embodiments encode the configuration data bits and hence utilize a decoder in the context switcher to decode the encoded configuration data.

Abstract: Some embodiments provide a configurable IC that includes several configurable logic circuits, where the logic circuits include several sets of associated configurable logic circuits. For each several sets of associated configurable logic circuits, the reconfigurable IC also includes a carry circuit for performing up to N carry operations sequentially, wherein N is greater than two.

Abstract: A method and system for providing a logic device are described. The logic device includes a plurality of magnetic input/channel regions, at least one magnetic sensor region, and at least one sensor coupled with the at least one magnetic sensor region. Each of the magnetic input/channel regions is magnetically biased in a first direction. The magnetic sensor region(s) are magnetically biased in a second direction different from the first direction such that at least one domain wall resides in the magnetic input/channel regions if the logic device is in a quiescent state. The sensor(s) output a signal based on a magnetic state of the magnetic sensor region(s). The input/channel regions and the magnetic sensor region(s) are configured such that the domain wall(s) may move into the magnetic sensor region(s) in response to a logic signal being provided to at least a portion of the magnetic input regions.

Abstract: Systems and methods for managing a write operation are described. The systems include a logic element (LE) including an N-input look-up table (LUT) having a configurable random access memory (CRAM) including 2N memory cells. The systems further include a write address decoder coupled to the LE and a write address hard logic register that stores an address of one of the memory cells. N is an integer. The hard logic register removes a dependency of a timing relationship between a write address launch and a write to the CRAM on a design of an integrated circuit.

Abstract: A scalable non-blocking switching network (SN) having switches and intermediate (stages of) conductors that are used to connect a first plurality of conductors to other multiple sets of conductors in a generally unrestricted fashion within respective interconnect resources constraints. The SN can be applied in a wide range of applications, in tandem or hierarchically, to provide a large switch network used in network, routers, and programmable logic circuits. The SN is used to connect a first set of conductors, through the SN, to multiple sets of conductors in a given logic circuit hierarchy whereby the conductors in each of the multiple sets are equivalent or exchangeable, which in term, by construction, makes the first set of conductors equivalent when used in the next level of circuit hierarchy. The SN is scalable for large sized sets of conductors and can be used hierarchically to enable programmable interconnections among large sized circuits.

Abstract: A universal IO unit applied to a chip or an integrated circuit is provided. The universal IO unit includes a power pad and a plurality of signal pads for providing different functions. According to functional requirements of the universal IO unit, the pad power is selectively connected to an electric wire to couple to a predetermined voltage, and each of the signal pads is also selectively connected to a signal wire to transceive signals.

Abstract: Disclosed is a logic element (LE) that can provide a number of advantageous features. For example, the LE can be configured to implement register packing and/or a fracturable look up table.

Abstract: A three dimensional semiconductor device is described with two transistor layers overlaid. The first transistor layer comprises a plurality of flip-flops each having an input and an output, wherein the inputs are selectively coupleable to the second transistor layer.

Abstract: A technique is provided for memory control in a device having programmable circuitry, including providing a dedicated memory controller circuit in the device before the programmable circuitry is field programmed. Another technique involves fabricating a device, where the fabricating involves forming programmable circuitry that includes a dedicated memory controller circuit before the circuitry is field programmed.

Abstract: In one example, a chip includes integrated components configured to operate in the digital domain and the analog domain. An I/O pad located on the chip is configured to provide an external device access to the integrated components. A multifunction I/O interface cell between the I/O pad and the integrated components is configured to selectively connect different combinations of the components to the same I/O pad at different times. The multifunction I/O interface cell may include a first switching device connected to ground, a second switching device connected to a reference voltage, an analog input/output buffer, and a digital input/output buffer.

Abstract: A System-on-Chip (SoC) may include logic blocks connected to each other and to external connections, and a hardware debug infrastructure logic connected to the logic blocks and for performing functional changes to a design layout of the SoC. The hardware debug infrastructure logic may include software re-configurable modules based upon the logic blocks obtained from substituting a mask programmable ECO base cell configured as a functional logic cell for a logic cell in the design layout.

Abstract: An integrated circuit capable of dual configuration of data flow and operable in a plurality of operational modes is provided. The circuit includes eight corner pins, wherein the eight corner pins comprise a first corner pin and a second corner pin on each side of the circuit in each of four side sets, wherein a first corner pin of one side of the circuit is proximate and adjacent to a second corner pin of an adjacent side counterclockwise from the first corner pin and together constitute a paired corner set, each paired corner set comprising a differential input and a differential output.

Abstract: One interface chip and a plurality of core chips are electrically connected via a plurality of through silicon vias. A data signal of a driver circuit is input into the core chip via any one of the through silicon vias. An output switching circuit activates any one of tri-state inverters and selects one of the through silicon vias. The tri-state inverters amplify the data signal and transmit it to the through silicon via. Similarly, an input switching circuit activates any one of tri-state inverters. These tri-state inverters also amplify the data signal transmitted from the through silicon via and supply it to the receiver circuit.

Abstract: In accordance with one aspect of the invention, a hole is formed within an LE array of a PLD by interrupting the LE array base signal routing architecture such that a hole is left for IP function block to be incorporated. An interface region is provided for interfacing the remaining LE array base signal routing architecture to the IP function block.

Abstract: Embodiments of the present invention provide a method/apparatus to measure the jitter of a timing signal used in an integrated circuit chip. The method/apparatus is used to send data from a launch element using a synchronous data path of the timing signal, receive the data at a capture element using the synchronous data path, wherein the launch element and the capture element are disposed on the same integrated circuit chip upon which the timing signal is generated and/or used, and gather statistics about whether a timing violation has occurred by comparing the sent data with the received data over the course of multiple launch/capture events as the timing is adjusted. Other embodiments may be described and/or claimed.

Abstract: An embodiment of the present invention provides a programmable logic device (“PLD”) including a redundancy architecture adapted to selective route signals via first or second staggered vertical lines. Other embodiments provide configuration logic and programs for determining routing selections. Other embodiments provide proximate grouping of vertical lines driven from a same row. Other embodiments provide definition of spare row locations once defective row locations are known.

Abstract: A metal programmable logic unit of a semiconductor device is disclosed. The programmable logic unit comprises: an interconnect structure comprising: a plurality of fixed interconnects including metal and via geometries; and a plurality of selectable interconnect geometries, each selectable geometry coupling a said first fixed interconnect to a said second fixed interconnect; and a programmable logic block comprising a plurality of multiplexers, each multiplexer having a plurality of regular inputs, wherein each said regular input is selectively coupled to one of a zero state, a one state, a first input state, and the compliment of the first input state; and a programmable multiplexer having a plurality of regular inputs, wherein each said regular inputs is selectively coupled to one of a zero state, a one state, and one or more input signals; wherein, selecting a subset of the selectable interconnect geometries program the logic block and the multiplexer regular inputs to implement a logic function.

Abstract: A device including a PLD with at least one interface logic block connection for passing data between (i) a bus arranged for receiving data from an external processor and (ii) at least one I/O register connected with a JTAG interface of the PLD, wherein said interface logic block includes logic for translating data on the bus into a data format for the I/O register. A processor programmable PLD appliance comprising (a) a programmable PLD having a JTAG programming interface supporting real-time re-programming of the PLD while the PLD functions as programmed; and (b) an I/O register interfacing an I/O register and connected with the JTAG programming interface, wherein a PLD logic design implementation of the I/O register is externally accessible through an interface logic block of the PLD, and wherein the interface logic block includes a PLD path between (i) an external processor interface and (ii) the PLD-implemented I/O register.

Abstract: Hardened programmable logic devices are provided with programmable circuitry. The programmable circuitry may be hardwired to implement a custom logic circuit. Generic fabrication masks may be used to form the programmable circuitry and may be used in manufacturing a product family of hardened programmable logic devices, each of which may implement a different custom logic circuit. Custom fabrication masks may be used to hardwire the programmable circuitry to implement a specific custom logic circuit. The programmable circuitry may be hardwired in such a way that signal timing characteristics of a hardened programmable logic device that implements a custom logic circuit may match the signal timing characteristics of a programmable logic device that implements the same custom logic circuit using configuration data.

Abstract: Disclosed is the hardware construction of a radio communication apparatus that can meet advanced radio communications. A control bus for transferring control signals between a main processor and components is separated from a data bus for transferring transmission/receive signals between processor units including sub-processors and an external interface. The sub-processors constitute the processor units, and a software defined radio of the present invention may include plural processor units. The processor units are connected by a dedicated interunit interface. The processor units may include multiple sub-processors, which are connected serially through an interprocessor interface.

Abstract: Methods, circuits, and systems for converting reset mechanisms in a synchronous circuit design into a corresponding asynchronous representation are described. These may operate to convert synchronous state holding blocks that include reset signals to corresponding asynchronous dataflow logic blocks. A replicated reset token at a fraction of the operational frequency of the reset signal may be distributed to the locations of the asynchronous dataflow logic blocks. Additional methods, circuits, and systems are disclosed.

Abstract: Interconnect structure comprising buffers for a semiconductor device is disclosed.

Abstract: A metal programmable semiconductor device is disclosed.

Abstract: Some embodiments provide a circuit for accessing stored data in a configurable IC that includes several configurable circuits. The IC also includes several storage circuits. Each storage circuit has (1) several storage elements for storing data for the configurable circuits, and (2) output circuitry for outputting data stored in the storage elements. The output circuitry includes a first set of interconnects for receiving at least a first repeating periodic signal and for periodically outputting data from at least two storage elements to the configurable circuits.

Abstract: The present invention is directed to methods for disabling unused IO resources in a platform-based integrated circuit. A slice is received from a vendor. The slice includes an IO circuit unused by a customer. The IO circuit is disabled. For example, when the IO circuit is desired to be tied to a power source, a primary input/output pin of the IO circuit is shorted to a power bus of the IO circuit. When the IO circuit is desired to be tied to a ground source, a primary input/output pin of the IO circuit is shorted to a ground bus of the IO circuit. When the IO circuit is desired to be left floated, a primary input/output pin of the IO circuit is not connected to any bonding pad cell of the slice. Next, the IO circuit is removed from the customer's logic design netlist. The IO circuit is inserted in the vendor's physical design database.

Abstract: A semiconductor integrated circuit judges whether a power unit is performing a discharge operation or a charge operation. To reduce clock skew between a plurality of logic blocks in the semiconductor integrated circuit, when the power unit is performing the charge operation, the semiconductor integrated circuit determines a logic block that needs to be operated for the execution of a target process, as an operation block whose operation is to be started, and, determines, in the rest of the logic blocks, a logic block having a termination rate whose value is larger than a value of the minimum termination rate, as the operation block whose operation is to be started, the value of the termination rate being larger by more than a predetermined value.

Abstract: A serial configuration interface (SCI) used to configure a device is disclosed. A device that support SCI includes a first connector configured to receive a first signal and a second connector configured to receive a second signal. In a configuration mode, the first signal serially selects each of a set of one or more configurable options, and the second signal facilitates selection of a desired setting of a selected configurable option. The device further includes control logic configured to determine when configuration of the device is complete and in response output the received first signal via a third connector of the device.

Abstract: A circuit can include a module having signal pads that are configurable to route signals between the circuit and at least one external device. The module can also have unused pads that are interleaved between the signal pads. A circuit can include a module having signal pads that are configurable to route varying signals between the circuit and at least one external device. The module can also have voltage pads that are configurable to route substantially constant voltages between at least one external device and the circuit. The signal pads can be interleaved between the voltage pads. A module with one or more of these features can achieve ideal performance in both wire bond and flip chip packages with the flexibility of setting a different input/output utilization percentage within the module.