Including Frequency-responsive Means In The Signal Transmission Path Patents (Class 330/302)
  • Patent number: 10263575
    Abstract: The disclosure provides an amplifier. The amplifier includes a first transistor that receives a first input and generates a first load current. A first output node is coupled to a power supply through a first load resistor. The first load resistor receives the first load current. A first capacitor network is coupled to the first output node and draws a first capacitive current from the first output node. A first current buffer is coupled between the first output node and the first transistor. A current through the first current buffer is a summation of the first load current and the first capacitive current.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: April 16, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Rajendrakumar Joish
  • Patent number: 10263537
    Abstract: A power conversion apparatus includes: DC input terminals for inputting a DC voltage; AC output terminals for outputting an AC voltage; a switching element; a first resonant capacitance connected across the switching element; a first LC resonance circuit that has an inductance and a capacitance connected in series and is connected together with the switching element between the AC output terminals; and a second LC resonance circuit connected in series together with the switching element between the DC input terminals. The second LC resonance circuit includes a first connector portion connected to one DC input terminal and a second connector portion connected to the switching element, and has a first current path, which includes an inductance, and a second current path, which includes a series circuit with an inductance and a capacitance, formed between the first connector portion and the second connector portion.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: April 16, 2019
    Assignee: TDK CORPORATION
    Inventors: Min Lin, Ken Matsuura, Hitoshi Kinoshita
  • Patent number: 10250212
    Abstract: Radio frequency devices and methods are provided where a network like a filter network or impedance matching network comprises a series connection of at least two inductors.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: April 2, 2019
    Assignee: Infineon Technologies AG
    Inventors: Ralf-Rainer Schledz, Vjekoslav Matic, Peter Solyom
  • Patent number: 10205425
    Abstract: LNA circuitry includes an input node, and output node, a primary amplifier stage, a first ancillary amplifier stage, and an input gain selection switch. The primary amplifier stage is configured to provide a first gain response between a primary amplifier stage input node and a primary amplifier stage output node, wherein the primary amplifier stage input node is coupled to the input node and the primary amplifier stage output node is coupled to the output node. The first ancillary amplifier stage is configured to provide a second gain response between a first ancillary amplifier stage input node and a first ancillary amplifier stage output node, wherein the first ancillary amplifier stage output node is coupled to the primary amplifier stage output node. The input gain selection switch is coupled between the input node and the first ancillary amplifier stage input node.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: February 12, 2019
    Assignee: Qorvo US, Inc.
    Inventors: George Maxim, Marcus Granger-Jones, Kelvin Kai Tuan Yan, Dirk Robert Walter Leipold, Baker Scott
  • Patent number: 10199991
    Abstract: A radio frequency (RF) power transistor circuit includes a power transistor and a decoupling circuit. The power transistor has a control electrode coupled to an input terminal for receiving an RF input signal, a first current electrode for providing an RF output signal at an output terminal, and a second current electrode coupled to a voltage reference. The decoupling circuit includes a first inductive element, a first resistor, and a first capacitor coupled together in series between the first current electrode of the power transistor and the voltage reference. The decoupling circuit is for dampening a resonance at a frequency lower than an RF frequency.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: February 5, 2019
    Assignee: NXP USA, INC.
    Inventors: Hussain H. Ladhani, Gerard J. Bouisse, Jeffrey K. Jones
  • Patent number: 10181822
    Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: January 15, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroki Shounai, Yoshiki Kogushi
  • Patent number: 10177723
    Abstract: A power amplifier circuit, including: an input node configured to receive a radio frequency (RF) signal; an output node configured to output an amplified RF signal; a main path switchably coupled between the input node and the output node, and including a first plurality of amplification stages to generate a first amplified RF signal; a bypass path switchably coupled between the input node and the output node, and including at least one second amplification stage to generate a second amplified RF signal; and a coupling switch configured to reuse at least a portion of the bypass path to drive the main path to generate a third amplified RF signal.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: January 8, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Marco Cassia, Jose Cabanillas
  • Patent number: 10177722
    Abstract: A device includes a low-noise amplifier (LNA) and a matching circuit. The matching circuit is coupled to an output of the LNA and switchably coupled to at least one of a first and a second output of the device. The device may further include a power splitter switchably coupled between an output of the matching circuit and the first and/or the second output of the device.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: January 8, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Chuan Wang, Kevin Hsi Huai Wang, Chiewcharn Narathong, Mehmet Uzunkol, Prakash Thoppay Egambaram
  • Patent number: 10164586
    Abstract: An impedance-matching circuit includes a resonant circuit, first and second capacitors, and first through third inductive circuits. The resonant circuit includes a fourth inductive circuit connected in parallel with a capacitive circuit. The impedance-matching circuit receives a radio frequency power amplifier (RFPA) output signal, which includes first and second signals at first and second frequencies, respectively. A resonant frequency of the resonant circuit is between the first and second frequencies. The resonant circuit offers inductive and capacitive impedances to the first and second signals, respectively. The impedance-matching circuit generates a matched RFPA output signal including the first signal and the second signal, where the second signal is at a reduced voltage level.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: December 25, 2018
    Assignee: NXP USA, INC.
    Inventors: Wenming Li, Yunfei Wang
  • Patent number: 10141911
    Abstract: A high-frequency module includes a plurality of filters, a switch that commonly connects a plurality of paths, and a low noise amplifier that amplifies a high-frequency signal input from the plurality of filters with the switch interposed therebetween, wherein paths in which first and second filters are respectively provided among the plurality of paths connect the respective filters and the switch without connecting impedance elements, and each of the first and second filters has an output impedance located in a matching region between a NF matching impedance at which an NF of the low noise amplifier is minimum and a gain matching impedance at which a gain of the low noise amplifier is maximum in its respective pass band thereof on a Smith chart.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: November 27, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hideki Muto
  • Patent number: 10128799
    Abstract: A multi-frequency tunable low-noise amplifier and a multi-frequency tuning implementation method therefor. The amplifier comprises: a system controller (13) and a micro-electro-mechanical system (MEMS) matching tuner (12) connected to the system controller (13). The system controller (13) is configured to respond to a first operation executed by a user via a user interface (15) when in a first mode, to acquire a first matching value produced on the basis of the first operation, and to output the first matching value to the MEMS matching tuner (12). The MEMS matching tuner (12) is configured to be controlled by the system controller (13) and to support the amplifier working on different frequency bands in tuning processing, thus allowing the matching value of the MEMS matching tuner (12) itself to match a current working frequency band.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: November 13, 2018
    Assignee: ZTE Corporation
    Inventors: Xiaozheng Lu, Shaowu Shen
  • Patent number: 10122329
    Abstract: An impedance matching circuit be connected to a non-linear impedance including a superconductor, includes a first terminal designated first connection port to be connected to a first connector of the non-linear impedance, a second terminal designated second connection port to be connected to a second connector of the non-linear impedance, a third terminal designated input/output terminal to receive the signal to amplify and a fourth terminal designated supply terminal to be connected to a polarisation source and configured so that a voltage V is applied between the first connection port and the second connection port. The circuit further includes a plurality of passive electrical components.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: November 6, 2018
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Max Hofheinz, Salha Jebari
  • Patent number: 10122330
    Abstract: The present disclosure relates to an apparatus, method, system and computer program for amplifying an audio signal derived from an audio signal pickup device, the pickup device having a pickup frequency response profile. The apparatus includes: an amplifier having a maximum open loop frequency response profile in a first frequency range including at least mid-range audible frequencies, the amplifier being configured to apply, in at least the first frequency range, a frequency response profile to the audio signal; wherein the frequency response profile applied to the audio signal is configured such that: it equalises the pickup frequency response profile over the first frequency range, and a difference between a maximum amount of gain able to be applied by the amplifier and an amount of gain applied to the audio signal by the amplifier is substantially constant throughout the first frequency range.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: November 6, 2018
    Assignee: HIFI SYSTEM COMPONENTS LIMITED
    Inventor: Graham Slee
  • Patent number: 10116270
    Abstract: A circuit includes an amplifier configured to amplify an input signal and generate an output signal. The circuit also includes a tuning network configured to tune frequency response of the amplifier. The tuning network includes at least one tunable capacitor, where the at least one tunable capacitor includes at least one micro-electro mechanical system (MEMS) capacitor. The amplifier could include a first die, the at least one MEMS capacitor could include a second die, and the first die and the second die could be integrated in a single package. The at least one MEMS capacitor could include a MEMS superstructure disposed over a control structure, where the control structure is configured to control the MEMS superstructure and tune the capacitance of the at least one MEMS capacitor.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: October 30, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Aritra Banerjee, Nathan R. Schemm, Rahmi Hezar, Lei Ding, Baher Haroun
  • Patent number: 10097051
    Abstract: A rectenna includes (a) a multi-band multi-channel (MBMC) matching network, and/or (b) an adaptively reconfigurable rectifier or a breakdown-protected rectifier. An MBMC matching network includes a plurality of T-shaped transmission line matching structures coupled in series. An adaptively reconfigurable rectifier circuit includes a low input power rectifying portion, a high input power rectifying portion, and a set of transistors configured for selectively and automatically transitioning the adaptively reconfigurable rectifier between a low input power operating configuration and a high input RF power operating configuration, in a manner correlated with input RF power level. A breakdown-protected rectifier includes a transistor-protected diode structure having a diode coupled to a transistor in a manner that protects the diode from direct exposure to negative voltages that would ordinarily cause the diode to break down in the absence of the transistor.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: October 9, 2018
    Assignee: National University of Singapore
    Inventors: Yong Xin Guo, Zheng Zhong, Hucheng Sun
  • Patent number: 10074105
    Abstract: A method for redeeming a coupon using a mobile device is disclosed. The method comprises allowing a user to select the coupon; accessing at least one melody stored in a memory of the mobile device; passing a coupon identifier for the coupon and the at least one melody to an encoder component of the mobile device encoding the coupon identifier and the melody by the encoder component to generate a signal for transmission; and transmitting said signal through a speaker of said mobile device for reception through a microphone of a receiving mobile device.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: September 11, 2018
    Assignee: Aintu Inc.
    Inventor: Arthur Vaysman
  • Patent number: 10062342
    Abstract: Embodiments of the present invention provide a LCD Q-Panel, a LCD panel and a LCD apparatus, for solving the technical problem that there is a large loss of a signal over the resistance of the signal transmission line when the signal is loaded into a general signal connection port of the LCD Q-Panel in the prior art. The LCD Q-Panel provided in embodiments of the present invention comprises: a general signal connection port, at least one LCD panel comprising a signal connection point, and at least one voltage follower; the signal input from the general signal connection port is transmitted via the at least one voltage follower to the signal connection point connected to an output terminal of the at least one voltage follower and the LCD panel comprising the signal connection point.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: August 28, 2018
    Assignee: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xiaoguang Pei, Haisheng Zhao, Haitao Ma, Yu Cao
  • Patent number: 10056941
    Abstract: Systems and methods for providing wireless communication impairment correction using non-linear iterative precoding by a transmitter device are disclosed. The transmitter may exploit the non-linear transmit indications, and perform digital non-linear multiple input multiple output (MIMO) precoding of a transmit signal to improve the error vector magnitude (EVM) at the intended receiver device and/or reduce the adjacent channel leakage ratio (ACLR) at the unintended receiver devices. The non-linear transmit indications may comprise amplitude modulation to amplitude modulation (AM-AM) and amplitude modulation to phase modulation (AM-PM) indications. In operation, the non-linear transmit indications may be received from the intended receiver devices or may be measured by the transmitter device.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: August 21, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Haim Mendel Weissman, Igor Gutman
  • Patent number: 10027371
    Abstract: The application relates to a spreading signal generating method, generating device, receiving method and receiving device. The spreading signal generating method comprises: generating a first spreading signal component and a second spreading signal component, wherein the first spreading signal component and the second spreading signal component each comprise a spreading code and a binary subcarrier, the spreading code of the first spreading signal component is the same as the spreading code of the second spreading signal component, the binary subcarrier of the first spreading signal component is different from the binary subcarrier of the second spreading signal component; and modulating the first spreading signal component and the second spreading signal component with radio frequency (RF) carriers so as to generate the spreading signal, where a phase of RF carrier for modulating the first spreading signal component is different from a phase of RF carrier for modulating the second spreading signal component.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: July 17, 2018
    Assignee: Tsinghua University
    Inventors: Zheng Yao, Mingquan Lu
  • Patent number: 10014832
    Abstract: A power amplification module includes: an amplifier that amplifies an input signal and outputs an amplified signal; and a harmonic-termination circuit to which harmonics of the amplified signal are input and the impedance of which is controlled in accordance with the frequency of a harmonic. The power amplification module can operate in a first mode in which a power supply voltage changes in accordance with the average voltage value of the amplified signal over a prescribed time period or in a second mode in which the power supply voltage changes in accordance with the envelope of the input signal. The impedance of the harmonic-termination circuit is controlled such that at least one even-ordered harmonic is short-circuited when the power amplification module operates in the first mode and at least one odd-ordered harmonic of third order or higher is short-circuited when the power amplification module operates in the second mode.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: July 3, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Shigeki Koya
  • Patent number: 9991857
    Abstract: Matching network for broadband power amplifier. In some embodiments, a power amplifier can include an amplifying transistor having an input and an output, and a matching circuit coupled to the output of the amplifying transistor. The matching circuit can include a first capacitance, an inductance, and a second capacitance connected in series. The matching circuit can further include a third capacitance implemented in a shunt path from a node between the first capacitance and the inductance to a ground, and a fourth capacitance implemented in a shunt path from a node between the inductance and the second capacitance to the ground.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: June 5, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventor: Ramon Antonio Beltran Lizarraga
  • Patent number: 9991331
    Abstract: Apparatuses including compensation capacitors are described. An example apparatus includes: first, second and third capacitors arranged such that the second capacitor is sandwiched between the first and third capacitors, each of the first, second and third capacitors including first and second electrodes. The first electrodes of the first, second and third capacitors are electrically coupled in common to one another. The second electrodes of the first and third capacitors are electrically coupled in common to each other. The second electrode of the second capacitor is electrically insulated from the second electrodes of the first and third capacitors.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: June 5, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Harunobu Kondo, Kenichi Echigoya
  • Patent number: 9979360
    Abstract: An RF amplifier includes a transistor, a shunt circuit, an envelope frequency termination circuit, and an extra lead. The shunt circuit is coupled between a transistor current carrying terminal and a ground reference node. The shunt circuit has a shunt inductive element and a shunt capacitor coupled in series, with an RF cold point node between the shunt inductive element and the shunt capacitor. The envelope frequency termination circuit is coupled between the RF cold point node and the ground reference node. The envelope frequency termination circuit has an envelope resistor, an envelope inductive element, and an envelope capacitor coupled in series. The extra lead is electrically coupled to the RF cold point node. The extra lead provides a lead inductance in parallel with an envelope inductance provided by the envelope inductive element. An additional shunt capacitor can be coupled between the extra lead and ground.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: May 22, 2018
    Assignee: NXP USA, INC.
    Inventors: Roy McLaren, Ning Zhu, Damon G. Holmes, Jeffrey Kevin Jones
  • Patent number: 9966980
    Abstract: A transmission module includes an amplifier that amplifies a plurality of transmission signals in different frequency bands, a power supply voltage regulator circuit that supplies different power supply voltages for the respective frequency bands of the transmission signals to the amplifier, and a variable matching circuit including at least one variable capacitor element and at least one fixed inductor element. The variable matching circuit satisfies different output impedance matching conditions of the amplifier for the respective frequency bands of the transmission signals by changing a capacitance value of the at least one variable capacitor element on the basis of a change in the output impedance matching conditions of the amplifier in response to a change in the power supply voltages supplied to the amplifier.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: May 8, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masao Kondo
  • Patent number: 9948331
    Abstract: A transmission circuit includes a transmission signal generation unit, a control unit, and a transmission signal amplification unit. The transmission signal generation unit generates a transmission signal that has been modulated. The transmission signal amplification unit includes a power amplifier that amplifies the transmission signal. The control unit determines a supply voltage signal having an amplitude characteristic of a period identical to that of an envelope of the transmission signal and supplies the supply voltage signal to the power amplifier. The control unit determines an output timing of the supply voltage signal such that a phase difference between a phase of the envelope of the transmission signal and a phase of the supply voltage signal does not become zero.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: April 17, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidenori Obiya, Shinya Hitomi, Kiichiro Takenaka, Masahiro Ito, Satoshi Arayashiki
  • Patent number: 9941242
    Abstract: A power device without a package structure in a radio frequency power amplifier module and an assembly method for a radio frequency power amplifier module are provided. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board. The power device includes a carrier flange, a plurality of electronic elements and bond-wires, and the electronic elements are adhered to the carrier flange, the power device and the printed circuit board are fixed on the heat dissipating plate, the electronic elements of the power device are connected with each other through the bond-wires, and the electronic elements are directly connected to the printed circuit board through the bond-wires. The electronic elements include at least one passive device, a decoupling capacitor is disposed on the printed circuit board, and the decoupling capacitor is connected to the passive device through the bond-wires.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: April 10, 2018
    Assignee: INNOGRATION (SUZHOU) CO., LTD.
    Inventor: Gordon Chiang Ma
  • Patent number: 9882587
    Abstract: Systems, devices and methods related to multi-band power amplifier. In some embodiments, a power amplifier module includes a power amplifier having an output stage and configured to receive a signal. The power amplifier module also includes a first programmable harmonic termination circuit in electrical communication with the output stage of the power amplifier. The first programmable harmonic termination circuit includes a first plurality of capacitors and a first plurality of switches, with at least one of the first plurality of capacitors being in electrical communication with at least one of the first plurality of switches. The power amplifier module further includes a controller configured to modify a configuration of the first plurality of switches of the first programmable harmonic termination circuit based at least in part on a second harmonic frequency of the signal.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: January 30, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jinghang Feng, Shuqi Zheng, Netsanet Gebeyehu, Ying Shi, James Phillip Young
  • Patent number: 9860052
    Abstract: Techniques are disclosed relating to use of digital predistortion in the context of full-duplex radio. In some embodiments, an apparatus includes one or more antennas and is configured to simultaneously transmit and receive wireless signals via at least partially overlapping frequency resources using the one or more antennas. In some embodiments, the apparatus includes receive chain circuitry that is configured to process both wireless signals transmitted by the apparatus via the one or more antennas and over-the-air wireless signals from one or more other computing devices. In some embodiments, the apparatus includes one or more processing elements configured to determine one or more digital predistortion parameters based on the wireless signals transmitted by the apparatus via the one or more antennas and processed by the receive chain circuitry and apply predistortion to transmitted wireless signals based on the one or more digital predistortion parameters.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: January 2, 2018
    Assignee: National Instruments Corporation
    Inventors: James W. McCoy, Takao Inoue, Jaeweon Kim
  • Patent number: 9820401
    Abstract: A packaged Radio Frequency power transistor device is described, which comprises a component carrier a die comprising a semiconductor transistor having a source, a gate and a drain, wherein the die is mounted at the component carrier, a ground connection being electrically connected to the source, an output lead being electrically connected to the drain, a resonance circuit being electrically inserted between the output lead and the ground connection, and a video lead being electrically connected to the resonance circuit. The video lead is configured for being connected to a first contact of a decoupling capacitor. The ground connection is configured for being connected to a second contact of the decoupling capacitor. It is further described a RF power amplifier comprising such a packaged Radio Frequency power transistor device.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: November 14, 2017
    Assignee: Ampleon Netherlands B.V.
    Inventors: Yi Zhu, Josephus van der Zanden
  • Patent number: 9780730
    Abstract: A wideband self-envelope tracking power amplifier (PA) can use more than a 40-MHz channel bandwidth and improves the envelope bandwidth limit of a self-envelope tracking PAs by ten times. The PA uses an envelope load network, which is based on a general multi-stage low-pass filter. The envelope load network located between an RF choke inductor and main DC power supply provides a dynamically modulated PA supply voltage without using a dedicated envelope amplifier. An input terminal of the network connects a main PA via an RF choke inductor to an input of low-pass filter. An output terminal is connected to the low-pass filter via an envelope choke inductor and to a direct current (DC) power supply. A DC blocker is connected between the output of the low-pass filter and ground by a termination resistor.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: October 3, 2017
    Assignee: Mitsubishi Electric Research Laboratories, inc.
    Inventors: Rui Ma, SungWon Chung, Koon Hoo Teo
  • Patent number: 9697815
    Abstract: To provide an effect circuit that can give round-shaped distortion effect to a music signal. An effect circuit 1 includes a input resistor R2 that is connected to a negative input terminal of an operational amplifier U1, a feedback resistor VR1 that is provided between a positive input terminal of the operational amplifier U1 and an output terminal of the operational amplifier U1, zener diodes D1 and D2 in each of which cathodes are connected and that are provided in parallel with the feedback resistor VR1, and diodes D3 and D4 that are connected in parallel so that each cathode and each anode are connected and are provided between cathodes of the zener diodes D1 and D2.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: July 4, 2017
    Assignee: Onkyo Corporation
    Inventor: Naoto Ishizu
  • Patent number: 9673766
    Abstract: The embodiments described herein provide class F amplifiers and methods of operation. So implemented, the class F amplifiers can be used to provide high efficiency amplification for a variety of applications, including radio frequency (RF) applications. In general, the class F amplifiers are implemented with at least one transistor and an output matching network, where the output matching network includes a plurality of resonant circuits configured to facilitate class F amplifier operation. In addition to facilitating class F amplifier operation, the plurality of resonant circuits can also be implemented with other circuit elements to provide output impedance transformation in a way that facilitates efficient amplifier operation.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: June 6, 2017
    Assignee: NXP USA, INC.
    Inventors: Jeffrey S. Roberts, Damon G. Holmes, Ning Zhu
  • Patent number: 9666236
    Abstract: A multi-chip package (MCP) includes semiconductor chips integrated therein. Each semiconductor chip includes: pad groups which extend in a first direction and are arranged in a second direction, and each of which includes a first metal line and a second metal line that are stacked in a third direction with an interlayer dielectric layer interposed therebetween; receivers which one-to-one correspond to the respective pad groups, and each of which includes a first input terminal coupled with the first metal line of a corresponding pad group, and an output terminal coupled with the second metal line of the corresponding pad group; and selectors, each of which selects one of a feedback signal transferred from the output terminal of a corresponding receiver and a reference voltage, and provides the selected one to a second input terminal of the corresponding receiver, in response to a chip select signal.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: May 30, 2017
    Assignee: SK Hynix Inc.
    Inventor: Hyun-Bae Lee
  • Patent number: 9640457
    Abstract: A device is provided, which includes a wiring structure including a first surface and a second surface opposite the first surface. The device also includes a first semiconductor die on the first surface of the wiring structure where the first semiconductor die includes first power amplifier unit. The device further includes a second semiconductor die on the first surface of the wiring structure where the second semiconductor has a second power amplifier unit and is spaced apart from the first semiconductor die. In addition, the device includes a first input port at the second surface of the wiring structure, and a first conductor in the wiring structure to electrically connect the first input port to the first semiconductor die and the second semiconductor die.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: May 2, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang
  • Patent number: 9608578
    Abstract: A low noise amplifier includes a T-type circuit, a first amplification module and a second amplification module. The T-type circuit is adapted to receive an input signal from a signal source, filters the input signal to generate a filtered signal, and is configured such that an equivalent input impedance seen into the T-type circuit matches an equivalent output impedance seen into the signal source. The first amplification module is coupled to the T-type circuit for receiving the filtered signal therefrom, and amplifies the filtered signal to generate an amplified signal. The second amplification module is coupled to the first amplification module for receiving the amplified signal therefrom, and amplifies the amplified signal to generate an output signal.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: March 28, 2017
    Assignee: NATIONAL CHI NAN UNIVERSITY
    Inventors: Yo-Sheng Lin, Sin-Chen Lin
  • Patent number: 9531328
    Abstract: An embodiment of a packaged radio frequency (RF) amplifier device includes a transistor and an inverse class-F circuit configured to harmonically terminate the device. The transistor has a control terminal and first and second current carrying terminals. The control terminal is coupled to an input lead of the device, and the first current carrying terminal is coupled to a voltage reference. The inverse class-F circuit is coupled between the second current carrying terminal and an output lead. The inverse class-F circuit includes a shunt circuit coupled between a cold point node and the voltage reference, where the cold point node corresponds to a second harmonic frequency cold point for the device. The shunt circuit adds a shunt negative susceptance at a fundamental frequency F0 to the inverse class-F circuit.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: December 27, 2016
    Assignee: NXP USA, INC.
    Inventors: Jeffrey A. Frei, Enver Krvavac, Hussain H. Ladhani
  • Patent number: 9484887
    Abstract: A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to positions on each of the die.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: November 1, 2016
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Chunyun Jian, Somsack Sychaleun
  • Patent number: 9473078
    Abstract: A circuit includes an amplifier configured to amplify an input signal and generate an output signal. The circuit also includes a tuning network configured to tune frequency response of the amplifier. The tuning network includes at least one tunable capacitor, where the at least one tunable capacitor includes at least one micro-electro mechanical system (MEMS) capacitor. The amplifier could include a first die, the at least one MEMS capacitor could include a second die, and the first die and the second die could be integrated in a single package. The at least one MEMS capacitor could include a MEMS superstructure disposed over a control structure, where the control structure is configured to control the MEMS superstructure and tune the capacitance of the at least one MEMS capacitor.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: October 18, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Aritra Banerjee, Nathan R. Schemm, Rahmi Hezar, Lei Ding, Baher Haroun
  • Patent number: 9419561
    Abstract: The present disclosure includes circuits and methods for power amplifiers. In one embodiment, a main amplifier stage and peaking amplifier stage of a power amplifier receive a modulated supply voltage. The peaking amplifier stage is biased dynamically to adjust the bias of peaking stage to compensate for changes in the power supply voltage. A bias voltage may be increased as the supply voltage on the peaking stage decreases, and the bias voltage may be decreased as the supply voltage on the peaking stage increases. Accordingly, bias characteristics of the peaking stage are maintained across supply voltage variations, and the efficiency of the power amplifier is improved.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: August 16, 2016
    Assignee: QUALCOMM, Incorporated
    Inventors: Joonhoi Hur, Paul Joseph Draxler
  • Patent number: 9413308
    Abstract: In RF power transistors, the current distribution along edges of the transistor die may be uneven leading to a loss in efficiency and in the output power obtained, resulting in degradation in performance. When multiple parallel dies are placed in a package, distribution effects along the vertical dimension of the dies are more pronounced. A RF power device (600) for amplifying RF signals is disclosed which modifies the impedance of a portion of the respective one of the input lead and the output lead and redistributes the current flow at an edge of the transistor die.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: August 9, 2016
    Assignee: Ampleon Netherlands B.V.
    Inventors: Josephus van der Zanden, Vittorio Cuoco, Rob Mathijs Heeres
  • Patent number: 9391567
    Abstract: Apparatus and methods for power amplifier output matching is provided. In certain configurations, an output matching circuit includes a supply voltage biasing circuit electrically connected between an input node and a power high supply voltage, a second-order harmonic series resonant circuit electrically connected between the input node and a power low supply voltage, a third-order harmonic parallel resonant circuit electrically connected between the input node and a harmonic frequency grounding node, a third-order harmonic series resonant circuit electrically connected between the harmonic frequency grounding node and the power low supply voltage, and a DC blocking capacitor electrically connected between the harmonic frequency grounding node and an output node.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: July 12, 2016
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Daniel Lee Kaczman
  • Patent number: 9391652
    Abstract: A communications device may include a power amplifier having an input and an output, and a direct current (DC) feed network. The DC feed network may include a radio frequency (RF) transmission line stub having a first end coupled to the output of the power amplifier and a second end coupled to a DC feed voltage, and at least one RF shorting switch coupled between a corresponding location along the RF transmission line stub and a voltage reference. The communications device may further include a controller configured to selectively operate the at least one RF shorting switch to set an operating frequency band of the power amplifier.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: July 12, 2016
    Assignee: HARRIS CORPORATION
    Inventor: John Robert McIntyre
  • Patent number: 9374196
    Abstract: A power amplifier system includes an input operable to receive an original value that reflects information to be communicated and an address data former operable to generate a digital lookup table key. The power amplifier system also includes a predistortion lookup table coupled to the address data former and a power amplifier having an output and coupled to the predistortion lookup table. The power amplifier system further includes a feedback loop providing a signal associated with the output of the power amplifier to the predistortion lookup table and a switch disposed in the feedback loop and operable to disconnect the predistortion lookup table from the output of the power amplifier.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: June 21, 2016
    Assignee: Dali Systems Co. Ltd.
    Inventors: Dali Yang, Jia Yang
  • Patent number: 9373577
    Abstract: A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the substrate, and a first terminal on the first side of the substrate. The semiconductor package further includes copper or aluminum bonding wires or ribbons connecting the first terminal to an output of the RF semiconductor die, and gold bonding wires or ribbons connecting the capacitor to the output of the RF semiconductor die. The gold bonding wires or ribbons are designed to accommodate greater RF Joule heating during operation of the RF semiconductor die than the copper or aluminum bonding wires or ribbons. Corresponding methods of manufacturing are also described.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: June 21, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alexander Komposch, Brian William Condie, Erwin Orejola, Michael Real
  • Patent number: 9369157
    Abstract: A wireless transceiver includes at least one RF transceiver section that generates an outbound RF signal based on outbound data and that generates inbound data based on an inbound RF signal. A configuration controller configures the wireless transceiver, by configuring the wireless transceiver to identify a plurality of communication paths to a remote station, the plurality of communication paths including at least one indirect communication path through at least one intermediate station; configuring the wireless transceiver to communicate with the remote station based on a first path of the plurality of communication paths; and configuring the wireless transceiver to communicate with the remote station based on a second path of the plurality of communication paths.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: June 14, 2016
    Assignee: BROADCOM CORPORATION
    Inventor: Ahmadreza (Reza) Rofougaran
  • Patent number: 9319012
    Abstract: An amplifying apparatus, including an amplitude-phase conversion unit to separate an input signal into first and second signals, wherein a phase difference between the first and second signals depends on an amplitude of the input signal, a first amplifying unit, a first matching circuit including a main line and a first harmonic processing circuit, wherein a length of the line of the first harmonic processing circuit short-circuits a harmonic, a second amplifying unit, a second matching circuit including a main line and a second harmonic processing circuit, wherein a length of the line of the second harmonic processing circuit short-circuits a harmonic, and an output synthesis unit to synthesize outputs from the first and second matching circuits, wherein a distance from the first amplifying unit to the first harmonic processing circuit differs from a distance from the second amplifying unit to the second harmonic processing circuit.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: April 19, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Toru Maniwa, Shigekazu Kimura, Nobuhisa Aoki
  • Patent number: 9294061
    Abstract: A radio that includes a transceiver to transmit and receive RF signals. The transceiver including a transmitter, a transformer, and a receiver, the transformer is coupled to and shared between the transmitter and the receiver. A resonator is formed by the combination of the transformer and capacitive elements of the transmitter and receiver.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: March 22, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Sudipto Chakraborty, David Le Deaut, Josef Einzinger, Jens Graul
  • Patent number: 9237614
    Abstract: A capacitance amplifying circuit applied to a controller of a power convertor includes a comparison unit and a capacitance amplifying module. The comparison unit receives a feedback voltage corresponding to a load coupled to the power convertor, a dimming signal, and a reference voltage, and outputs a compensation current. The capacitance amplifying module generates an equivalent capacitor. A capacitance of the equivalent capacitor is K times to a capacitance of a reference capacitor of the capacitance amplifying module, and K is a real number greater than 1. The compensation current and the equivalent capacitor are used for determining a compensation voltage, and when the dimming signal is disabled, a closed loop within the capacitance amplifying module is changed to an open loop to keep the compensation voltage at a fixed value.
    Type: Grant
    Filed: February 15, 2015
    Date of Patent: January 12, 2016
    Assignee: Leadtrend Technology Corp.
    Inventor: Chung-Wei Lin
  • Patent number: 9231533
    Abstract: Apparatus and methods for power amplifiers are disclosed. In one embodiment, a power amplifier circuit assembly includes a power amplifier and an impedance matching network. The impedance matching network is operatively associated with the power amplifier and is configured to provide a load line impedance to the power amplifier between about 6? and about 10?. The impedance matching network includes a fundamental matching circuit and one or more termination circuits, and the fundamental matching circuit and each of the of the one or more termination circuits include separate input terminals for coupling to an output of the power amplifier so as to allow the fundamental matching circuit and each of the one or more termination circuits to be separately tuned.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: January 5, 2016
    Assignee: Skyworks Solutions, Inc.
    Inventors: Guohao Zhang, Hardik Bhupendra Modi, Sabah Khesbak
  • Patent number: 9231625
    Abstract: A radio that includes a transceiver to transmit and receive RF signals. The transceiver including a transmitter, a transformer, and a receiver, the transformer is coupled to and shared between the transmitter and the receiver. A resonator is formed by the combination of the transformer and capacitive elements of the transmitter and receiver.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: January 5, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Sudipto Chakraborty, David Le Deaut, Josef Einzinger, Jens Graul