Resonators (distributed Parameter Type) Patents (Class 333/219)
  • Publication number: 20070205851
    Abstract: A stacked resonator and a filter are provided which are capable of achieving miniaturization and minimum loss, and also capable of transmitting a balanced signal with superior balance characteristics. There are provided a pair of quarter-wave resonators which are interdigital-coupled to each other. One quarter-wave resonator is constructed of a plurality of conductor lines which are stacked and arranged so as to establish a comb-line coupling. By the stacked arrangement so as to establish a comb-line coupling of the plurality of conductor lines, the conductor thickness of this quarter-wave resonator can be increased virtually thereby reducing the conductor loss. Similarly, the other quarter-wave resonator is constructed of a plurality of conductor lines stacked and arranged so as to establish a comb-line coupling, and hence the conductor thickness of this quarter-wave resonator can be increased virtually thereby reducing the conductor loss.
    Type: Application
    Filed: March 1, 2007
    Publication date: September 6, 2007
    Applicant: TDK CORPORATION
    Inventor: Tatsuya Fukunaga
  • Publication number: 20070171005
    Abstract: Provided are a stacked resonator capable of achieving miniaturization and minimum loss, and a stacked resonator capable of suppressing any unnecessary resonance mode due to interdigital-coupling. The stacked resonator includes a first conductor group having a plurality of conductor lines in a stacking arrangement, and a second conductor group having a plurality of other conductor lines in a stacking arrangement so as to be alternately provided opposing to the conductor lines in the first conductor group, thereby establishing an interdigital-coupling together with the first conductor group.
    Type: Application
    Filed: January 23, 2007
    Publication date: July 26, 2007
    Applicant: TDK CORPORATION
    Inventor: Tatsuya Fukunaga
  • Patent number: 7245195
    Abstract: A plurality of one-quarter wavelength coplanar resonators 5a to 5d are formed in series on a dielectric substrate 1, and coplanar input/output terminal sections 4a and 4b are formed on the dielectric substrate at opposite ends of the series connection for coupling with resonators 5a and 5d, respectively. A center conductor line width w1 of each of the resonators 5a to 5d is equal to a center conductor line width wio of each of the input/output terminal section 4a and 4b, but a ground conductor spacing d1 of each of the resonators 5a to 5d is greater than a ground conductor spacing dio of each of input/output terminal section 4a and 4b. Maintaining the accuracy of design is facilitated and a reduction in the maximum current density in the resonator is enabled.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: July 17, 2007
    Assignee: NTT DoCoMo, Inc.
    Inventors: Kei Satoh, Shoichi Narahashi, Tetsuo Hirota, Yasushi Yamao
  • Patent number: 7245196
    Abstract: This invention relates to high frequency electromagnetic circuits, in particular to those made on planar or quasi-planar substrates, where the circuit is patterned on a metallic or superconducting film on top of a dielectric in any of the configurations known to those skilled in the art (for instance micro-strip, strip-line, co-planar, parallel plate or slot-line configurations). A part of the circuit such as the characteristic strip or slot of said configurations is shaped in a novel space-filling geometry which allows a significant size reduction of the circuital component. Miniature transmission lines, capacitors, inductors, resistors, filters and oscillators can be manufactured this way.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: July 17, 2007
    Assignee: Fractus, S.A.
    Inventors: Carles Puente Baliarda, Juan Manuel O'Callaghan Castella, Edouard Jean Louis Rozan, Juan Carlos Collado Gomez, Nuria Duffo Ubeda
  • Patent number: 7239221
    Abstract: A dual mode band-pass filter includes a metallic film for defining a resonator, disposed on the first main surface of a dielectric substrate having first and second main surfaces, or inside of the dielectric substrate. An opening is formed in the metallic film. At least one ground electrode is provided on the second main surface of the dielectric substrate or inside of the dielectric substrate, so as to be opposed to the metallic film through a dielectric layer. A pair of input-output coupling circuits is connected to the metallic film.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: July 3, 2007
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hisatake Okamura, Seiji Kanba, Naoki Mizoguchi
  • Patent number: 7231238
    Abstract: Novel structures and methods for forming useful high temperature superconducting devices, most particularly resonators, are provided. Structures resulting in reduced peak current densities relative to known structures achieve numerous desirable benefits, especially including the reduced intermodulation effects of earlier resonators. In one aspect of this invention, a spiral in, spiral out resonator is provided, characterized in that it has an odd number of long runs, at least equal to five long runs, where the long runs are connected by turns, and wherein there are at least two sequential turns of the same handedness, followed by at least two turns of the opposite handedness. In yet another aspect of this invention, it has been discovered that reducing the size of the input and output pads of HTS resonators increases the relative inductance compared to the capacitance. Yet another resonator structure is a spiral snake resonator having a terminal end disposed within the resonator.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: June 12, 2007
    Assignee: Superconductor Technologies, Inc.
    Inventors: Balam Quitzé Andrés Willemsen Cortés, Albert H. Cardona, Neal O. Fenzi, Roger J. Forse
  • Patent number: 7227432
    Abstract: A plurality of mechanically coupled MEMS resonators that are arranged in an N×M MEMS array structure. Each MEMS resonators includes a plurality of straight (or substantially straight) elongated beam sections that are connected by curved/rounded sections. Each elongated beam section is connected to another elongated beam section at a distal end via the curved/rounded sections thereby forming a geometric shape (e.g., a rounded square). Further, each resonator is mechanically coupled to at least one other adjacent resonator of the array via a resonator coupling section. The resonator coupling sections may be disposed between elongated beam sections of adjacent resonators. The resonators, when induced, oscillate at the same or substantially the same frequency. The resonators oscillate in a combined elongating (or breathing) mode and bending mode; that is, the beam sections exhibit an elongating-like (or breathing-like) motion and a bending-like motion.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: June 5, 2007
    Assignee: Robert Bosch GmbH
    Inventors: Markus Lutz, Aaron Partridge, Zhiyu Pan
  • Patent number: 7215226
    Abstract: A system and method are disclosed for improving the reliability of parallel-coupled line filters. In one embodiment, a parallel-coupled line filter system is disclosed which comprises at least one open-line resonator, at least one defected ground structure arranged on opposite sides of the line resonator having a first lattice and a second lattice in a skew-symmetrical fashion and coupled through a slim gap, wherein the first and second lattices are formed on a ground plane.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: May 8, 2007
    Assignee: VIA Technologies, Inc.
    Inventor: Sheng-Yuan Lee
  • Patent number: 7205867
    Abstract: A micromechanical resonator structure including a plurality of straight or substantially straight beam sections that are connected by curved or rounded sections. Each elongated beam section is connected to another elongated beam section at a distal end via the curved or rounded sections thereby forming a geometric shape having at least two elongated beam sections that are interconnected via curved or rounded sections (for example, a rounded triangle shape, rounded square or rectangle shape). The structure includes one or more nodal points or areas (i.e., portions of the resonator structure that are stationary, experience little movement, and/or are substantially stationary during oscillation of the resonator structure) in one or more portions or areas of the curved sections of the structure. The nodal points are suitable and/or preferable locations to anchor the resonator structure to the substrate.
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: April 17, 2007
    Assignee: Robert Bosch GmbH
    Inventors: Markus Lutz, Aaron Partridge
  • Patent number: 7183882
    Abstract: The present invention relates to a microstrip band pass filter and, more specifically, to a microstrip band pass filter using end-coupled stepped impedance resonators that can be used in a millimeter wave band, wherein the microstrip band pass filter comprises: a dielectric substrate; a conductor plate located on a lower surface of the dielectric substrate; and an input terminal, a plurality of SIRs and an output terminal located on an upper surface of the dielectric substrate in series, wherein the input terminal, the plurality of SIRs and the outputs terminal are conductors and end-coupled through gaps, whereby the microstrip band pass filter has a good attenuation characteristic and a narrowband characteristic, and is insensitive to the manufacturing error, and a fine frequency transition can be made without distortion just with width adjustment of the low impedance transmission line of the SIR.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: February 27, 2007
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kyoung Suk Ko, Dong Suk Jun, Dong Young Kim, Hong Yeol Lee, Sang Seok Lee
  • Patent number: 7181259
    Abstract: A resonator and filter including the resonator is disclosed. The resonator (100) includes an open conductive loop (100) with folded transmission line segments (124, 134) extending from the adjacent ends of the loop. Of each transmission line segment, the portion emanating from the respective end of the loop is positioned generally along-side the corresponding portion of the other transmission line segment. That is, the two transmission line segments are folded away from each other. The resonator can be generally elongated in shape, with the loop at one end of the long axis and the transmission line segments at the other. The transmission line segments occupy a footprint (W2) that is not substantially greater than the width of the loop (W1). The filter includes multiple resonators of the invention, each resonator being coupled to at least another or the resonators. The resonators can be positioned in a side-by-side fashion, with the long axes of the resonators parallel or anti-parallel to one another.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: February 20, 2007
    Assignee: Conductus, Inc.
    Inventors: Genichi Tsuzuki, Shen Ye
  • Patent number: 7164332
    Abstract: Inside a multilayer dielectric substrate, there are a spiral-shaped first slot set in a part of a first ground conductor layer and a spiral-shaped second slot in a part of a second ground conductor layer put on the front surface of the multilayer dielectric substrate, the first slot and the second slot are opposite in a spiral winding direction and the first slot and the second slot overlap with each other as viewed from the top face, so that a resonance phenomenon can be produced at a frequency lower than a resonance frequency of a resonator with a conventional structure.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: January 16, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Kanno, Kazuyuki Sakiyama, Ushio Sangawa, Tomoyasu Fujishima
  • Patent number: 7161449
    Abstract: A center conductor having a length L1, which is equivalent in electrical length to one quarter wavelength, and ground conductors disposed on the opposite sides of the center conductor with a gap portion therebetween in coplanar manner are formed on a dielectric substrate. The center conductor and the ground conductors located on the opposite sides thereof, and are connected together by shorting ends. This results in the formation of corner areas, respectively, whereby obtaining a coplanar waveguide resonator. An edge line of the shorting end is recessed to have a curve configuration so that each corner area has an angle greater than 90 degrees, which reduces power current concentration at the corner points in the respective corner areas.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: January 9, 2007
    Assignee: NTT DoCoMo, Inc.
    Inventors: Kei Satoh, Shoichi Narahashi, Daisuke Koizumi, Yasushi Yamao
  • Patent number: 7157992
    Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embodiments of resonant via arrays are mechanically balanced, which promotes improved manufacturability. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: January 2, 2007
    Assignee: Wemtec, Inc.
    Inventor: William E. McKinzie, III
  • Patent number: 7142837
    Abstract: A multiple-section bandpass filter for broadcast communications includes adjacent waveguide segments with a perpendicular connecting segment between them to form a U-shaped signal path. The waveguide cavities of the segments may be extruded and rectangular in cross section, and have a groundplane spacing that allows signal propagation between filter sections by evanescent coupling. Resonators in each of the adjacent segments have a separation that establishes the coupling bandwidths without the need for passive decoupling structures. A cross coupling conductor between the adjacent segments provides a capacitive or inductive coupling between them. A decoupling structure may be located in the connecting segment.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: November 28, 2006
    Assignee: Myat, Inc.
    Inventor: Derek J. Small
  • Patent number: 7123118
    Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Particular embodiments include clusters of small vias that effectively function as one large via, thereby increasing stop band bandwidth and maximizing parallel plate capacitance. Cluster vias can be configured to additionally provide a shielded and impedance matched route within the interior area of the cluster through which signal vias can connect transmission lines disposed in planes lying above and below the PPW. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: October 17, 2006
    Assignee: Wemtec, Inc.
    Inventor: William E. McKinzie, III
  • Patent number: 7119639
    Abstract: A dual mode band-pass filter includes a metallic film for defining a resonator, disposed on the first main surface of a dielectric substrate having first and second main surfaces, or inside of the dielectric substrate. An opening is formed in the metallic film. At least one ground electrode is provided on the second main surface of the dielectric substrate or inside of the dielectric substrate, so as to be opposed to the metallic film through a dielectric layer. A pair of input-output coupling circuits is connected to the metallic film.
    Type: Grant
    Filed: May 7, 2004
    Date of Patent: October 10, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hisatake Okamura, Seiji Kanba, Naoki Mizoguchi
  • Patent number: 7113058
    Abstract: A conductive film is provided on a dielectric substrate. The conductive film has conductor opening portions, which serve as inductive regions, and a conductor opening portion, which serves as a capacitive region. Multi-step ring resonator elements, each including a conductor line aggregate, are provided on respective substrates to configure resonator elements. The resonator elements are mounted above the conductor opening portions that serve as the inductive regions. This arrangement provides a resonator having a high Qo.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: September 26, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Hidaka, Shin Abe
  • Patent number: 7106152
    Abstract: A dielectric resonator has a metallic casing having an opening, a metallic cover which covers the opening, and a dielectric resonance element having a pair of flat surfaces formed opposite from each other, one of the pair of flat surfaces being brought into contact with a bottom portion of the casing. At least one of the cover and the bottom portion has a resilient portion which supports the dielectric resonance element and presses one of the pair of flat surfaces by a biasing force so as to follow expansion or contraction of the dielectric resonance element due to a change in temperature. The biasing force applied from the resilient portion is obtained by warping of a portion of the cover or a portion of the bottom portion that one of the pair of flat surfaces or an edge portion of the flat surface contacts.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: September 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takehiko Yamakawa, Toshio Ishizaki
  • Patent number: 7102470
    Abstract: A dual-band bandpass filter with stepped-impedance resonators uses only one circuit to generate dual-band effect. It adopts the principle of stepped-impedance resonator, which contains a connecting section and two coupling sections. The impedance and electrical length of the connecting section and coupling sections conforms to a selected condition to generate two passbands at desired frequencies. A multi-layer broadside-coupled parallel lines structure may be applied to increase coupling-amount between the parallel lines so that the dual-band bandpass filters have broader bandwidth and less loss.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: September 5, 2006
    Assignees: Integrated System Solution Corp., Sheng-Fuh Chang
    Inventors: Sheng-Fuh Chang, Shuen-Chien Chang, Jia-Liang Chen, Shih-Chieh Chen, Hung-Cheng Chen, Shu-Fen Tang, Albert Chen
  • Patent number: 7098760
    Abstract: A dual mode band-pass filter includes a metallic film for defining a resonator, disposed on the first main surface of a dielectric substrate having first and second main surfaces, or inside of the dielectric substrate. An opening is formed in the metallic film. At least one ground electrode is provided on the second main surface of the dielectric substrate or inside of the dielectric substrate, so as to be opposed to the metallic film through a dielectric layer.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: August 29, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hisatake Okamura, Seiji Kanba, Naoki Mizoguchi
  • Patent number: 7099645
    Abstract: A multilayer LC filter includes a terminal layer, and a plurality of capacitor electrode layers laminated together on the terminal layer. An inductor layer is disposed above the capacitor electrode layers to thereby form a laminated body. First and second strip-shaped side-surface electrodes are formed on opposite side surfaces of the laminated body, and are connected to input and output terminals of the terminal layer, respectively. The distal ends of the first and second strip-shaped side-surface electrodes extend to the corresponding side surfaces of the capacitor electrode layers, but do not reach the side surfaces of the inductor layer. Thus, the distances between the resonator inductors of the inductor layer and the strip-shaped side-surface electrodes are increased, and as a result, very little stray capacitance is generated between the resonator inductors and the side-surface electrodes.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: August 29, 2006
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Tadashi Shingaki, Junichi Ichikawa
  • Patent number: 7095301
    Abstract: A resonator device including a plurality of resonance units formed on a dielectric substrate, each resonance unit having a plurality of conductor lines forming a capacitive area and an inductive area in a ring shape.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: August 22, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Hidaka, Shin Abe
  • Patent number: 7091801
    Abstract: The invention relates to a micromechanical resonator having a bondable resonance body and a method for fabricating a micromechanical resonator for semiconductor components. The invention provides that the resonator (26) is composed successively of a first layer (16) of silicon for coupling the resonator (26) in terms of a circuit, an insulating layer (14) of silicon dioxide, a cylindrical base layer (cylinder 18), and a metal layer (20) completely surrounding the cylinder (18). The method provides that a cylindrical structure (18) (cylinder) is etched (trench etching process) in a base layer (12) of p?-doped silicon (SOI wafer) separated from a layer (16) of silicon by an insulating layer (14), and the cylindrical structure (18) is coated with a metal layer (20).
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: August 15, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Ewald Schmidt, Juergen Hasch, Heinz Pfizenmaier
  • Patent number: 7084720
    Abstract: A printed bandpass filter is mounted on a precision substrate to eliminate the need for post-fabrication tuning. The filter input is capacitively coupled to a series of quarter wavelength resonators and the filter output. The quarter wavelength resonators are printed as spirals to reduce filter size. The resonators define the bandpass characteristics of the filter. The filter also weakly couples the input signal to the filter output in a manner to cancel the signal image. Mechanical clips mitigate thermal stress on solder connections when the precision substrate is mounted on a second printed circuit board.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: August 1, 2006
    Assignee: Broadcom Corporation
    Inventors: Ramon A. Gomez, Lawrence M. Burns, Sung-Hsien Chang, Carl W. Pobanz
  • Patent number: 7084721
    Abstract: An RF circuit component according to the present invention includes a substrate with a principal surface and a plurality of resonators, including a first resonator, a second resonator and a third resonator, which are arranged on the principal surface of the substrate so as to be coupled in series together. Each of the first, second and third resonators is made of a conductor supported on the substrate. The resonant modes of each of the first, second and third resonators include two fundamental resonant modes that oscillate perpendicularly to each other within a plane that is defined parallel to the principal surface of the substrate. The second resonator is arranged between the first and third resonators, and the oscillation direction of one of the fundamental resonant modes of the second resonator defines an angle greater than 0 degrees but smaller than 90 degrees with respect to that of its associated fundamental resonant mode of the first resonator and/or the third resonator.
    Type: Grant
    Filed: March 2, 2004
    Date of Patent: August 1, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Akira Enokihara
  • Patent number: 7071798
    Abstract: A printed bandpass filter is mounted on a precision substrate to eliminate the need for post-fabrication tuning. The filter input is capacitively coupled to a series of quarter wavelength resonators and the filter output. The quarter wavelength resonators are printed as spirals to reduce filter size. The resonators define the bandpass characteristics of the filter. The filter also weakly couples the input signal to the filter output in a manner to cancel the signal image. Mechanical clips mitigate thermal stress on solder connections when the precision substrate is mounted on a second printed circuit board.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: July 4, 2006
    Assignee: Broadcom Corporation
    Inventors: Ramon A. Gomez, Lawrence M. Burns, Sung-Hsien Chang, Carl W. Pobanz
  • Patent number: 7046103
    Abstract: An electric filter comprises a plurality of thin film bulk acoustic resonants (10, 11) arranged in series and in parallel which have electrodes (24, 25) of different working area (L) and optionally a piezoelectric layer (23) of different thickness (T).
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: May 16, 2006
    Assignee: TDK Corporation
    Inventors: Roger W. Whatmore, Paul B. Kirby, Qingxin Su, Eiju Komuro
  • Patent number: 6995635
    Abstract: The parallel-coupled-resonator coupled line filter with open-and-short end, comprises an input port for receiving an input signal; a bent first resonator and a bent third resonator where their both ends are open circuited; a second resonator whose both ends are shorted to ground; and an output port for outputting signal. Wherein, designing cross coupling between the third resonator and the first resonator to obtain a steep frequency response and reduce the interference of the image signal.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: February 7, 2006
    Assignee: Chung Shan Institute of Science and Technology
    Inventors: Hong-long Wung, Chi-Yang Chang, Dow-Chih Niu
  • Patent number: 6987432
    Abstract: Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: January 17, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Markus Lutz, Aaron Partridge
  • Patent number: 6985054
    Abstract: The present invention relates to an electrically controllable/tunable microwave device comprising a ferroelectric substrate with a variable dielectric permitivity and conducting electrodes, arranged on said substrate, and the capacitance of which depends on applied voltage C/V), the microwave device comprises at least two sections or parts of the substrate/electrodes for each of which different electrical field strengths are generated upon voltage application. Said generated electrical field strengths are controlled by means of the design of the device and/or the voltage application such that the slope (dC(dV) of the voltage dependence of the capacitance (C(V) of the microwave device can be controlled.
    Type: Grant
    Filed: November 10, 2003
    Date of Patent: January 10, 2006
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Spartak Gevorgian, Erland Wikborg
  • Patent number: 6980841
    Abstract: A resonator is formed by forming a microstrip line having an electrical length corresponding to a ?/2 wavelength on a dielectric substrate, forming both side portions of the microstrip line from the center thereof into spiral shapes, making the orientations of the spirals opposite each other, making outer-side portions of the spiral shapes on both sides, inclusive of the central portion of the microstrip line, linear in shape overall, and making linear in shape a portion of prescribed range from the end portion of each spiral shape.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: December 27, 2005
    Assignee: Fujitsu Limited
    Inventors: Manabu Kai, Kazunori Yamanaka, Teru Nakanishi, Akihiko Akasegawa
  • Patent number: 6977564
    Abstract: A bandpass filter includes a dielectric substrate, a resonator electrode that is provided on a portion of a plane at an intermediate height in the thickness direction of the dielectric substrate so as to oppose the top face of the dielectric substrate and includes an aperture, first and second ground electrodes provided over and under the resonator electrode, respectively, so as to oppose the resonator electrode with dielectric layers disposed therebetween and so as to sandwich the resonator electrode, input-output coupling electrodes coupled to the resonator electrode, input-output terminal electrodes that are provided on the outside surface of the dielectric substrate and are electrically connected to the input-output coupling electrodes, and a via-hole electrode that penetrates through the aperture in the thickness direction of the dielectric substrate so as not to be electrically connected to the resonator electrode and is electrically connected to the first and second ground electrodes.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: December 20, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Kanba, Naoki Mizoguchi, Hisatake Okamura
  • Patent number: 6975186
    Abstract: This invention is a filter circuit provided in a radio communication module. First to third conductor patterns (8 to 10) having a length shorter than ?/4 of a passing wavelength ? and electromagnetically coupled with each other are formed as distributed line patterns parallel to each other in a dielectric board (2), and a first capacitor (16) and a second capacitor (17) add parallel capacitance to the first conductor pattern (8) and the second conductor pattern (9) having their distal ends short-circuited. The third conductor pattern (10) has its both end opened. As the first conductor pattern (8) and the second conductor pattern (9) carry out inductive operation and the third conductor pattern (10) is capacitive-coupled with these conductor patterns, resonance is made in a band lower than a frequency band prescribed by the length of the lines.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: December 13, 2005
    Assignee: Sony Corporation
    Inventor: Takayuki Hirabayashi
  • Patent number: 6972645
    Abstract: A conductive film is provided on a dielectric substrate. The conductive film has conductor opening portions, which serve as inductive regions, and a conductor opening portion, which serves as a capacitive region. Multi-step ring resonator elements, each including a conductor line aggregate, are provided on respective substrates to configure resonator elements. The resonator elements are mounted above the conductor opening portions that serve as the inductive regions. This arrangement provides a resonator having a high Qo.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: December 6, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Hidaka, Shin Abe
  • Patent number: 6970058
    Abstract: An L-C type filter module comprising at least two capacitors and at least one inductor. Each of the capacitors consists of a first elongated element made of conductive material partially fitted in a hole made in a second element made of conductive material, connected electrically to the second elements of the other capacitor(s) or possibly common to the various capacitors, at least the internal lateral surfaces defining the holes being covered with dielectric material, as are the edges of the openings of the holes or perforations and at least parts, or preferably all, of the external surfaces of the second element(s) adjoining the edges, and the coil of each inductor is carried by a support body made of dielectric material, possibly contiguous with the second element(s) or the dielectric coating at least partially covering the external face of each second element.
    Type: Grant
    Filed: January 23, 2003
    Date of Patent: November 29, 2005
    Assignee: Bruker Biospin S.A.
    Inventors: Olivier Gonella, Michel Weiss, Christian Brevard
  • Patent number: 6965285
    Abstract: The present invention provides a small, thin filter circuit showing a desired filter characteristic which is highly accurate, and producible with a high efficiency. The filter circuit includes a pair of dielectric insulating layers 2 and 3, upper and lower, each having a ground pattern 11 (16) formed on the main side thereof, and an inner wiring layer 4 formed between the dielectric insulating layers 2 and 3 and having capacitively coupled resonator conductive patterns 6 and 7 each connected at one end thereof to the ground patterns 11 and 16 via inter-layer connecting vias 12 and open-circuited at the other end.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: November 15, 2005
    Assignee: Sony Corporation
    Inventor: Takayuki Hirabayashi
  • Patent number: 6965284
    Abstract: A dielectric filter includes resonator electrodes, an inter-stage coupling capacitor electrode, and an input/output coupling capacitor electrode on dielectric substrates, respectively. The resonator electrodes are electro-magnetically coupled to each other to form a tri-plate structure, are made of a metallic foil embedded in a resonator dielectric substrate. Another dielectric filter includes an upper shield electrode dielectric substrate, an inter-stage coupling capacitor dielectric substrate, a resonator dielectric substrate, and an input/output coupling capacitor dielectric substrate which are made of a composite dielectric material including a high-dielectric-constant material and a low-dielectric-constant material. The above described arrangement provides the dielectric filter with an improved Q factor of a resonator, a low loss, and a high attenuation.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: November 15, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tomoya Maekawa, Yasuhiro Sugaya, Toru Yamada, Toshio Ishizaki
  • Patent number: 6963259
    Abstract: The present invention relates to a circuit for processing radio frequency signals. The resonant circuit includes a substrate. The substrate can be a meta material and can incorporate at least one substrate layer. A resonant line and at least one ground can be coupled to the substrate. An end of the resonant line can electrically shorted to the ground or electrically open with respect to ground. The substrate layer can include a first region with a first set of substrate properties and at least a second region with a second set of substrate properties. At least a portion of the resonant line can be coupled to the second region. The first and/or second set of substrate properties can be differentially modified to vary a permittivity and/or a permeability over a selected region. A third region can be provided with a third set of substrate properties as well.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: November 8, 2005
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6960968
    Abstract: A planar resonator and method of manufacture provides contactless power transfer using at least two electrically isolated axis aligned conductive across the transfer interface in a coupled inductor or transformer configuration. Signal or power transfer is then accomplished by coupling of magnetic flux. The coupling of electric flux is also accomplished across a same interface and driven with the same conductive spiral-wound conductors. An interface of energy transfer(IOET) has a first spiral-shaped conductor arranged on the top surface of said IOET; a second spiral-shaped conductor arranged on the bottom surface of said IOET, has a vertical axis aligned with the first spiral-shaped conductor. The IOET and the first and second spiral-shaped conductors have a predetermined self-resonant frequency.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: November 1, 2005
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Willem G. Odendaal, Yusban Li
  • Patent number: 6958667
    Abstract: A band-pass filter functioning as a electronic chip component includes a chip having upper and lower surfaces, a pair of side surfaces, and first and second end surfaces facing each other. A resonator electrode is disposed in the chip. The band-pass filter also includes input and output electrodes extending in the vertical direction, which are coupled or connected to the resonator electrode, and a tubular first ground electrode surrounding the chip so as to enclose the resonator electrode. The input and output electrodes are disposed at end portions or inner sides of the tubular portion so as not to be electrically connected to the first ground electrode. The band-pass filter further includes two pairs of second ground electrodes which are disposed on both sides of the input electrode and/or output electrode and which are electrically connected to the first ground electrode.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: October 25, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Naoki Mizoguchi, Hisatake Okamura
  • Patent number: 6943644
    Abstract: Ring-shaped resonant elements include respectively conductor lines 2a, 2b, and 2c each formed on a substrate 1 along a full one turn of circumferential length of a ring. Each of the conductor lines 2a, 2b, and 2c has two end portions which additionally extend and which are located such that they closely adjoin each other in a width direction. The respective ring-shaped resonant elements are disposed in a concentric fashion. Capacitive parts are formed in areas in which two ends of respective conductor lines are located in close proximity to each other, and the other parts of the respective conductor lines function as inductive parts. Each conductor line operates as a half-wave transmission line whose both ends are electrically open. It is not needed to form a ground electrode on a surface of the substrate opposite to the surface on which the conductor lines are formed. Thus, a resonator can be formed using a very small number of constituent elements.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: September 13, 2005
    Assignee: Murata Manufacturing Co. Ltd.
    Inventors: Seiji Hidaka, Shin Abe
  • Patent number: 6941650
    Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: September 13, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
  • Patent number: 6937118
    Abstract: A high-frequency circuit device serving as a resonator includes a substrate and an electrode film which is formed on the surface of the substrate and which includes a conductive film and a dielectric film. The conductive film is formed around the substrate such that both ends of the conductive film overlap each other when viewed in a predetermined cross-section of the substrate, and the dielectric film is inserted between both ends of the conductive film. Accordingly, a self-capacitance portion is formed at the overlapped portion of the conductive film, electric-field energy is accumulated therein, and magnetic-field energy is accumulated inside the substrate. With this step impedance structure, the entire high-frequency circuit device can be miniaturized.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: August 30, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Hidaka, Shin Abe
  • Patent number: 6934569
    Abstract: A resonator for use in a radio frequency filter including a substantially planar resonant portion that is substantially elliptical in plan. The resonant portion is mounted on a dielectric substrate. The resonator is configured to operate in at least a mode in which resonance occurs with a radial current and with substantially no current along the edge of the resonant portion. A filter comprising a plurality of the resonators is also disclosed.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: August 23, 2005
    Inventor: Michael John Lancaster
  • Patent number: 6933812
    Abstract: An artificial electro-ferromagnetic meta-material demonstrates the design of tunable band-gap and tunable bi-anisotropic materials. The medium is obtained using a composite mixture of dielectric, ferro-electric, and metallic materials arranged in a periodic fashion. By changing the intensity of an applied DC field the permeability of the artificial electro-ferromagnetic can be properly varied over a particular range of frequency. The structure shows excellent Electromagnetic Band-Gap (EBG) behavior with a band-gap frequency that can be tuned by changing the applied DC field intensity. The building block of the electro-ferromagnetic material is composed of miniaturized high Q resonant circuits embedded in a low-loss dielectric background. The resonant circuits are constructed from metallic loops terminated with a printed capacitor loaded with a ferro-electric material. Modifying the topology of the embedded-circuit, a bi-anisotropic material (tunable) is examined.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: August 23, 2005
    Assignee: The Regents of the University of Michigan
    Inventors: Kamal Sarabandi, Hossein Mosallaei
  • Patent number: 6919783
    Abstract: A device responsive to an electromagnetic signal includes a conductor for conducting the electromagnetic signal, a magnetic structure disposed proximate the conductor to enable gyromagnetic interaction between the electromagnetic signal and the magnetic structure and a transducer disposed on the magnetic structure for controlling a domain pattern in the magnetic structure.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: July 19, 2005
    Assignee: Massachusetts Institute of Technology
    Inventors: Gerald F. Dionne, Daniel E. Oates
  • Patent number: 6911882
    Abstract: A high-frequency module includes a dielectric plate in which a resonator is formed and a cover for covering the dielectric plate. A hole is provided in the cover. A laser beam for laser trimming passes through the hole. The area of opening and the depth of the hole are defined so that electromagnetic waves in a usable frequency band are cut off in the hole. An electrical characteristic is measured in a state where all components including the cover are assembled, and laser trimming is performed through the hole so as to obtain a desired characteristic.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: June 28, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazumasa Haruta, Takehisa Kajikawa
  • Patent number: 6909343
    Abstract: A resonator, a filter, an oscillator, a duplexer, and a communication apparatus employing these devices have improved efficiency characteristics in confining an electromagnetic field in an opening of an electrode, suppressed current concentration, and minimized conductor loss. Electrode patterns are formed near short-circuited positions in a slot so that the slot will be divided into smaller-width slot lines. Consequently, the efficiency in confining the electromagnetic field is improved, and conductor loss is minimized.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: June 21, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kenichi Iio
  • Patent number: 6894587
    Abstract: A coaxial resonator according to an embodiment of the invention includes a tubular dielectric block, an inner conductor having a thin-film, multi-layer electrode structure, which is formed on an outer surface of a cylindrical shaft received in the hole of the tubular dielectric block, and an outer conductor formed on an outer surface of the tubular dielectric block. The cylindrical shaft is inserted into the hole in the dielectric block, and is held by a holding member and an outer frame.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: May 17, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shin Abe, Seiji Hidaka, Shingo Okajima