Strip Type Patents (Class 333/246)
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Patent number: 10804874Abstract: Techniques that facilitate a superconducting combiner or separator of DC-currents and microwave signals are provided. In one example, a device includes a direct current circuit and a microwave circuit. The direct current circuit comprises a bandstop circuit and provides transmission of a direct current signal. The microwave circuit provides transmission of a microwave signal. The microwave circuit and the direct current circuit that comprises the bandstop circuit are joined by a common circuit that provides transmission of the direct current signal and the microwave signal.Type: GrantFiled: June 12, 2018Date of Patent: October 13, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Baleegh Abdo
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Patent number: 10775422Abstract: A device includes a substrate that includes a resonant cavity. The resonant cavity includes a plurality of dipolar molecules that have an absorption frequency. The resonant cavity resonates at a frequency that is equal to the absorption frequency of the dipolar molecules. The device further includes a first port on the resonant cavity configured to receive a radio frequency (RF) signal.Type: GrantFiled: September 5, 2017Date of Patent: September 15, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Adam Joseph Fruehling, Juan Alejandro Herbsommer, Benjamin Stassen Cook, Swaminathan Sankaran
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Patent number: 10749263Abstract: Printed circuit board mounted antenna and waveguide interfaces are provided herein. An example device includes any of a dielectric substrate or transmission line, an antenna mounted onto the dielectric substrate, and an elongated waveguide mounted onto the dielectric substrate so as to enclose around a periphery of the antenna and contain radiation produced by the antenna along a path that is coaxial with a centerline of the waveguide.Type: GrantFiled: January 10, 2017Date of Patent: August 18, 2020Assignee: Mimosa Networks, Inc.Inventors: Paul Eberhardt, Syed Aon Mujtaba, Brian L. Hinman
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Patent number: 10727560Abstract: A waveguide system for a transition between a waveguide structure having an exterior stripline element and a waveguide structure having a stripline element which is completely shielded. To that end, the present invention provides a transition which is able to be realized particularly easily and efficiently with the aid of a multilayer printed circuit board architecture.Type: GrantFiled: September 19, 2018Date of Patent: July 28, 2020Assignee: Robert Bosch GmbHInventors: Werner Soergel, Johannes Meyer, Osama Khan
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Patent number: 10670626Abstract: The illustrative embodiments pertain to a test fixture having low insertion inductance for large bandwidth monitoring of current signals. In one exemplary embodiment, the test fixture includes a baseplate with each resistor of a set of resistors embedded inside a respective non-plated through slot in the baseplate. A first terminal of each resistor is soldered to a top metallic zone of the baseplate and a second terminal soldered to a first of two bottom metallic zones of the baseplate. The top metallic zone is connected by plated-through holes to a second of the two bottom metallic zones. When mounted upon a PCB, the test fixture allows current flow from the first bottom metallic zone, upwards through the set of resistors to the top metallic zone, and downwards to the second bottom metallic zone. An observation instrument may be coupled to a coaxial connector that is mounted on the baseplate.Type: GrantFiled: December 15, 2017Date of Patent: June 2, 2020Assignee: Keysight Technologies, Inc.Inventors: Edward Vernon Brush, IV, Neil Martin Forcier, Fei Fred Wang, Zheyu Zhang, Wen Zhang
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Patent number: 10666231Abstract: The present disclosure relates to a balun arrangement (1, 1?, 1?) comprising a single-ended port (2, 2; 17, 26), a differential port arrangement (61), a coupled first and second transmission line section (5, 6) constituting a first coupled pair (7), and a third and fourth coupled transmission line section (8, 9) constituting a second coupled pair (10). The first transmission line section (5) is connected between a first coupled pair first port (11) and the third transmission line section (8), the second transmission line section (6) is connected between a first coupled pair second port (12) and the first differential port (3), the third transmission line section (8) is connected between a second coupled pair first port (13) and the first transmission line section (5), and the fourth transmission line section (9) is connected between a second coupled pair second port (14) and the second differential port (4).Type: GrantFiled: October 27, 2016Date of Patent: May 26, 2020Assignee: Telefonaktiebolaget LM Ericsson (publ)Inventor: Kristoffer Andersson
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Patent number: 10608314Abstract: An electronic device is provided. The electronic device includes a circuit board, a first conductive member electrically connected to the circuit board at a first point, a second conductive member electrically connected to the circuit board at a second point, and a connection member connecting the first conductive member and the second conductive member, where the connection member includes a first conductive layer electrically connected to the first conductive member, a second conductive layer electrically connected to the second conductive member, and a dielectric layer disposed between the first conductive layer and the second conductive layer.Type: GrantFiled: March 9, 2017Date of Patent: March 31, 2020Assignee: Samsung Electronics Co., LtdInventors: Sung Won Park, Sun Young Kim, Seung Yup Lee
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Patent number: 10594041Abstract: A compact wideband RF antenna for incorporating into a planar substrate, such as a PCB, having at least one cavity with a radiating slot, and at least one transmission line resonator disposed within a cavity and coupled thereto. Additional embodiments provide stacked slot-coupled cavities and multiple coupled transmission-line resonators placed within a cavity. Applications to ultra-wideband systems and to millimeter-wave systems, as well as to dual and circular polarization antennas are disclosed.Type: GrantFiled: May 6, 2019Date of Patent: March 17, 2020Assignee: VAYYAR IMAGING LTD.Inventors: Naftali Chayat, Doron Cohen
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Patent number: 10541479Abstract: An interconnection includes a cable assembly and a board assembly. The cable assembly includes a cable having an inner conductor. The board assembly comprises an intermediate layer disposed between first and second outer layers, a recess disposed between the first and second outer layers so as to form a cable-receiving space at a first side edge, and a first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space. The inner conductor is inserted at the first side edge into the cable-receiving space and is disposed at an offset in a longitudinal direction relative to the first inner-conductor contact opening. The inner conductor is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of the first and/or second outer layers, at least in a region of the first inner-conductor contact opening.Type: GrantFiled: July 9, 2018Date of Patent: January 21, 2020Assignee: MD ELEKTRONIK GMBHInventors: Martin Huber, Robert Hofmann
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Patent number: 10390439Abstract: A circuit apparatus includes at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.Type: GrantFiled: December 12, 2017Date of Patent: August 20, 2019Assignee: International Business Machines CorporationInventors: Brian L. Carlson, John R. Dangler, Roger S. Krabbenhoft, Kevin A. Splittstoesser
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Patent number: 10307603Abstract: An implantable device includes a cylindrical housing, a metallic feedthrough, a metallic collar, and a battery. The cylindrical housing has a sidewall and an internal cavity, and is formed from a ceramic. One or more electrical components are integrated into the sidewall. The metallic feedthrough is joined to a first end of the cylindrical housing. The metallic collar is joined to a second end of the cylindrical housing. The battery is joined to the metallic collar.Type: GrantFiled: October 5, 2017Date of Patent: June 4, 2019Assignee: Verily Life Sciences LLCInventors: Kedar Shah, Peng Cong
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Patent number: 10290489Abstract: There is provided a method for manufacturing a group-III nitride substrate, including: (a) preparing a substrate which is made of a group III-nitride crystal and which has a high oxygen concentration domain where an oxygen concentration is higher than that of a matrix of the crystal; (b) irradiating the substrate with laser beam aiming at the high oxygen concentration domain, forming a through-hole penetrating the substrate in a thickness direction, and removing at least a part of the high oxygen concentration domain from the substrate; and (c) embedding at least a part of an inside of the through-hole by growing the group-III nitride crystal in the through-hole.Type: GrantFiled: October 20, 2017Date of Patent: May 14, 2019Assignees: Sciocs Company Limited, Sumitomo Chemical Company, LimitedInventors: Toshio Kitamura, Masatomo Shibata, Takehiro Yoshida
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Patent number: 10290603Abstract: A high-frequency circuit includes: a first substrate; a transmission line formed on the first substrate and having first and second output portions branched from an input portion; a second substrate; first and second pads formed on the second substrate; a first wire connecting the first output portion to the first pad; and a second wire connecting the second output portion to the second pad, wherein an electrical length from the input portion to an edge of the second output portion is longer than an electrical length from the input portion to an edge of the first output portion, and a length from a junction between the second wire and the second output portion to the edge of the second output portion is longer than a length from a junction between the first wire and the first output portion to the edge of the first output portion.Type: GrantFiled: July 13, 2017Date of Patent: May 14, 2019Assignee: Mitsubishi Electric CorporationInventor: Shin Chaki
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Patent number: 10283832Abstract: A compact wideband RF antenna for incorporating into a planar substrate, such as a PCB, having at least one cavity with a radiating slot, and at least one transmission line resonator disposed within a cavity and coupled thereto. Additional embodiments provide stacked slot-coupled cavities and multiple coupled transmission-line resonators placed within a cavity. Applications to ultra-wideband systems and to millimeter-wave systems, as well as to dual and circular polarization antennas are disclosed.Type: GrantFiled: December 26, 2017Date of Patent: May 7, 2019Assignee: VAYYAR IMAGING LTD.Inventors: Naftali Chayat, Doron Cohen
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Patent number: 10230202Abstract: An RF signal processing system including multiple drop-in modular circuit blocks is disclosed. The drop-in modular circuit blocks include input and output launches exhibiting the same launch geometry. The RF system may include a conductive plate with a grid of holes disposed on the conductive plate. Multiple modular blocks may be installed on the conductive plate to form a cascade of modular blocks that exhibit common launch geometries. The cascade may include an RF probe with a projection and conductive pin that overhang a portion of a launch of a modular block at an end of the cascade. Flex connects may be disposed on, and held in position by, anchors to connect adjacent modular blocks together in a prototype system. A production RF system may exhibit the same overall geometry as a prototype RF system to speed up the transition from prototype design to production design.Type: GrantFiled: November 4, 2015Date of Patent: March 12, 2019Assignee: X-MICROWAVE, LLCInventors: John Dale Richardson, Raymond Thomas Page
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Patent number: 10200216Abstract: A variable ISI transmission channel apparatus inserted in a high-speed transmission channel for the high-speed serial data communication simulates a “live” ISI environment to which the high-speed transmission channel in operation is exposed, in a situation such as a bit error test by means of continuously adjusting an amount of inter-symbol interference (ISI) in the high-speed transmission channel. By allowing an undersurface of a transmission loss generating member (6) (16) (26) such as a dielectric, a magnetic body, and an electric conductor to face, and slide on, a top surface of a conductor strip (2) exposed on a top surface of a plate-shaped dielectric substrate (1), a facing area is continuously increased/decreased. A dielectric loss, a magnetic loss, or a resistance loss increased/decreased in the transmission loss generating member is reflected on a high-frequency signal on the conductor strip (2).Type: GrantFiled: January 27, 2014Date of Patent: February 5, 2019Assignee: ARTEK KABUSHIKI KAISHAInventor: Kiyoshi Sone
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Patent number: 10193206Abstract: The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.Type: GrantFiled: September 2, 2014Date of Patent: January 29, 2019Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)Inventors: Per Ligander, Tomas Bergsten, Ingolf Larsson, Olle Nyström, Torbjörn Westin
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Patent number: 10178761Abstract: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer, and as an antenna radiates the EMI propagated by the strip lines along the signaling layer outwards from the circuit board. A defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines to minimize the EMI that the element radiates outwards as the antenna.Type: GrantFiled: April 28, 2016Date of Patent: January 8, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Karl J. Bois, Benjamin Toby
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Patent number: 10170817Abstract: A technique relates to a superconducting airbridge on a structure. A first ground plane, resonator, and second ground plane are formed on a substrate. A first lift-off pattern is formed of a first lift-off resist and a first photoresist. The first photoresist is deposited on the first lift-off resist. A superconducting sacrificial layer is deposited while using the first lift-off pattern. The first lift-off pattern is removed. A cross-over lift-off pattern is formed of a second lift-off resist and a second photoresist. The second photoresist is deposited on the second lift-off resist. A cross-over superconducting material is deposited to be formed as the superconducting airbridge while using the cross-over lift-off pattern. The cross-over lift-off pattern is removed. The superconducting airbridge is formed to connect the first and second ground planes by removing the superconducting sacrificial layer underneath the cross-over superconducting material. The superconducting airbridge crosses over the resonator.Type: GrantFiled: June 24, 2015Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Josephine B. Chang, John M. Cotte
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Patent number: 10168745Abstract: An information processing apparatus includes: a display unit; a circuit board; a power supply cable coupled to the circuit board; a coupling cable including an overlapping portion that overlaps with the power supply cable as viewed in a thicknesswise direction of the circuit board and coupled to the display unit; and a projection projecting from the circuit board and disposed between the power supply cable and the overlapping portion.Type: GrantFiled: June 20, 2016Date of Patent: January 1, 2019Inventors: Takashi Abe, Takashi Iijima, Shinya Matsushita
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Patent number: 10158156Abstract: A microwave transmission line having a coplanar waveguide and a pair of conductive members, each one of the pair of conductive members having a proximal end disposed on a portion of a corresponding one of a pair of ground plane conductors of the coplanar waveguide and a distal end disposed over, and vertically spaced from, a region between a center conductor of the coplanar waveguide and a corresponding one of the pair of ground plane conductors of the coplanar waveguide. The distal ends are laterally separated from each other by a region disposed over the center conductor.Type: GrantFiled: June 20, 2016Date of Patent: December 18, 2018Assignee: Raytheon CompanyInventors: Christopher M. Laighton, Edward A. Watters, Keith R. Kessler
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Patent number: 10107958Abstract: A flexible substrate includes a first pad that extends from an end of the flexible substrate to a center of the flexible substrate, and at least a part of which is fixed to the first part; a second pad that extends from the end of the flexible substrate to the center at a position adjacent to the first pad, and at least a part of which is fixed to the first part; a signal line that connects a tip of the first pad and the second part and that is narrower in width than the first pad; and a coverlay that covers an area where the signal line is arranged and that includes a protrusion protruding, at a position at which the first pad is arranged, toward the end of the flexible substrate relative to the area where the signal line is arranged.Type: GrantFiled: April 18, 2016Date of Patent: October 23, 2018Assignee: FUJITSU OPTICAL COMPONENTS LIMITEDInventor: Masaki Sugiyama
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Patent number: 10033082Abstract: The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes an attenuation port, wherein the attenuation port is configured to couple the beamforming network to the attenuation component. The attenuation component dissipates received electromagnetic energy.Type: GrantFiled: August 5, 2015Date of Patent: July 24, 2018Assignee: Waymo LLCInventors: Jamal Izadian, Adam Brown
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Patent number: 10001693Abstract: A light communication device further includes a rigid substrate, a package, and a flexible substrate. The rigid substrate includes a first terminal arranged on a surface thereof and a second terminal having a first hole opened at the surface. The package includes a third terminal and a fourth terminal being provided on a side wall thereof and being electrically coupled to a signal electrode and a ground electrode of the signal processor, respectively. The flexible substrate includes a fifth terminal and a sixth terminal being electrically coupled to the third terminal and the fourth terminal, respectively. The fifth terminal is electrically coupled to the first terminal on the surface, and the sixth terminal, with being placed into the first hole, is electrically coupled to the second terminal.Type: GrantFiled: August 22, 2016Date of Patent: June 19, 2018Assignee: FUJITSU OPTICAL COMPONENTS LIMITEDInventors: Masaki Sugiyama, Akira Ishii, Norihisa Naganuma, Eiichi Kodera
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Patent number: 9953921Abstract: A semiconductor device may include a first metal line; a second metal line; a first insulating layer formed between the first metal line and the second metal line; a first driving unit coupled to the first metal line, the first driving unit being suitable for driving the first metal line in response to first data; and a second driving unit coupled to the second metal line, the second driving unit being suitable for driving the second metal line in response to second data obtained by inverting and delaying the first data.Type: GrantFiled: April 4, 2016Date of Patent: April 24, 2018Assignee: SK Hynix Inc.Inventor: Hyun-Bae Lee
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Patent number: 9947441Abstract: An integrated superconductor device may include a substrate base and an intermediate layer disposed on the substrate base and comprising a preferred crystallographic orientation. The integrated superconductor device may further include an oriented superconductor layer disposed on the intermediate layer and a conductive strip disposed on a portion of the oriented superconductor layer, The conductive strip may define a superconductor region of the oriented superconductor layer thereunder, and an exposed region of the oriented superconductor layer adjacent the superconductor region.Type: GrantFiled: November 12, 2013Date of Patent: April 17, 2018Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Connie P. Wang, Paul Murphy, Paul Sullivan
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Patent number: 9917357Abstract: Discussed herein is an antenna system that comprises a feed element and a radiating element that are formed on a dielectric substrate positioned above a circuit board which includes a feed circuit and a ground layer. Specifically, the feed element is disposed within an outer periphery defined by the radiating element. A capacitive coupling is formed between the feed element and the radiating element. With the aforesaid configuration, the antenna system is less affected by the circuit board and interference from other elements that are mounted on the circuit board. Further, manufacturing costs are reduced as compared to the case where the feed element and the radiating element are respectively formed on a front and rear surface of a resin layer.Type: GrantFiled: June 6, 2013Date of Patent: March 13, 2018Assignees: Sony Corporation, Sony Mobile Communications Inc.Inventors: Masato Tanaka, Hideaki Shoji, Aiko Yoshida
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Patent number: 9893405Abstract: Dielectric waveguide comprising dielectric body having an exterior coated with an electrically conductive film. Region in one side surface couples to another dielectric waveguide, and slot in bottom surface exposes the dielectric body in an L-shape in two adjacent side surfaces, except for the one side surface. Front surface of printed circuit board has a ground pattern opposed to the slot, which includes opening with outer shape greater than slot, and a back surface having a ground pattern surrounding a strip line disposed to cross through the slot. A distal end of the strip line and the front surface-side ground pattern are coupled together by a via hole. The opening is surrounded by a via hole group which couples the front and the back surface-side ground patterns together. The dielectric waveguide is disposed to allow the opening and the slot to be opposed to each other.Type: GrantFiled: July 15, 2016Date of Patent: February 13, 2018Assignee: Murata Manufacturing Co., Ltd.Inventor: Yukikazu Yatabe
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Patent number: 9888560Abstract: A differential transmission line includes a positive conductor on which a positive complementary component of a differential signal is transmitted, and a negative conductor parallel to the positive conductor on which a negative complementary component of the differential signal is transmitted. A quarter wavelength differential coupler is inserted along a length of the positive and negative conductors. The quarter wavelength differential coupler has a length corresponding to a frequency of common mode noise on the positive and negative conductors. The quarter wavelength differential coupler reduces the common mode noise at the frequency as the differential signal passes through the quarter wavelength differential coupler.Type: GrantFiled: March 27, 2015Date of Patent: February 6, 2018Assignee: Lenovo Enterprise Solutions (Singapore) PTE. LTD.Inventors: Rong Eric Ao, Alexander Philip Campbell, Donald Richard Dignam, Stephen John Flint, Jian Meng
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Patent number: 9859603Abstract: A printed wiring board is provided with a wiring layer, a first ground layer, a second ground layer, a grounding through-hole, a signal through-hole, a first clearance, and a second clearance. The wiring layer has a signal line. The first ground layer has a first ground plane. The second ground layer is positioned between the wiring layer and the first ground layer and has a second ground plane. The grounding through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the second ground plane. The signal through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the signal line. The first clearance is formed in the first ground layer, is positioned in the vicinity of the signal through-hole and the grounding through-hole, and separates the first ground plane from the signal through-hole and the grounding through-hole.Type: GrantFiled: January 8, 2014Date of Patent: January 2, 2018Assignee: NEC CorporationInventor: Kazuhiro Kashiwakura
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Patent number: 9860985Abstract: A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.Type: GrantFiled: December 17, 2012Date of Patent: January 2, 2018Assignee: Lockheed Martin CorporationInventor: Jack V. Ajoian
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Patent number: 9800338Abstract: A diplex filter having tunable inductors. Preferably the tunable inductors include pads that may each selectively receive one end of a jumper.Type: GrantFiled: July 25, 2014Date of Patent: October 24, 2017Assignee: ARRIS Enterprises LLCInventors: Sergio Alfredo Mendoza Aguirre, LuisJavier Aguirre
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Patent number: 9774068Abstract: A filter configuration including a substrate, a primary microstrip line and a first defected ground structure is disclosed. The substrate has a first face and a second face. The second face is a ground face. The primary microstrip line is arranged on the first face and extends in a first direction. The first defected ground structure is arranged on the second face. The first defected ground structure includes a first section, a first circular section, a second section, a second circular section and a third section that are connected to each other in sequence in a second direction perpendicular to the first direction. The second section is covered by the primary microstrip line in a vertical direction perpendicular to the first and second faces. The primary microstrip line has a width equal to a minimum length of the second section. As such, the filtering effect can be improved.Type: GrantFiled: December 30, 2015Date of Patent: September 26, 2017Assignee: I-Shou UniversityInventors: Chung-Long Pan, Rong-Ching Wu, Tsu-Chung Tan
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Patent number: 9716305Abstract: According to the invention there is provided a balun including: a slotline which is coupled to an input line and an output line, in which at least a portion of the slotline is sandwiched between a first and a second layer of dielectric material.Type: GrantFiled: June 17, 2013Date of Patent: July 25, 2017Assignee: BAE SYSTEMS plcInventors: Mark Christopher Nguyen, Gareth Michael Lewis, Richard John Harper
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Patent number: 9698458Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.Type: GrantFiled: August 26, 2015Date of Patent: July 4, 2017Assignee: Raytheon CompanyInventors: Glafkos K. Stratis, Douglas Mills, Kevin R. Hopkins, Raymond A. Graffam, David J. Knapp, Michael S. Smith
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Patent number: 9672319Abstract: Disclosed are techniques for model-based electronic design implementation with a hybrid solver. These techniques generate an extruded via from a linkage node to a reference metal plane that is added to an analysis model for at least a portion of an electronic design. The analysis model for the at least the portion is generated at least by re-establishing interconnection between the at least the portion and a linkage circuit element with the extruded via. At least the portion of the electronic design may further be implemented using the analysis or simulation results that are generated by using the hybrid solver on the model, without using three-dimensional solvers, for a three-dimensional model of the electronic design.Type: GrantFiled: June 29, 2015Date of Patent: June 6, 2017Assignee: Cadence Design Systems, Inc.Inventors: Xiande Cao, Jian Liu, An-yu Kuo
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Patent number: 9666931Abstract: A radio frequency electric power conversion mechanism of the present invention includes a circuit board including a fiber reinforced resin board, instead of an expensive ceramic circuit board. The radio frequency electric power conversion mechanism has a combined configuration of a plurality of fiber reinforced resin boards laminated to each other with a conductive foil therebetween, a via hole array made of an electric conductor passing through the boards, a transmission line closely adhered to the surface of a board, and a waveguide having a notch in a part of the waveguide on the aperture side. The radio frequency electric power conversion mechanism further has other structural features.Type: GrantFiled: August 24, 2015Date of Patent: May 30, 2017Assignee: NIDEC ELESYS CORPORATIONInventor: Jun Suzuki
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Patent number: 9660594Abstract: In general the embodiments described herein can provide alternating-current (AC) resonating filters. These resonating filters comprise a transmission line, a first resonator, and a second resonator. The first resonator is configured to block AC signals in a first frequency range, while the second resonator is configured to block AC signals in a second frequency range, where the second frequency range is higher than the first frequency range. The transmission line has a first node coupled to an AC source, and the first resonator is coupled to the transmission line a first distance from the first node, and the second resonator is coupled to the transmission line a second distance from the first node, where the second distance is greater than the first distance. When so configured the resonating filter can effectively block signals in multiple selected frequency bandwidths.Type: GrantFiled: June 2, 2014Date of Patent: May 23, 2017Assignee: NXP USA, INC.Inventors: Travis A. Barbieri, Basim H. Noori
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Patent number: 9647312Abstract: A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes.Type: GrantFiled: December 9, 2014Date of Patent: May 9, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Masahiro Ozawa
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Patent number: 9607824Abstract: A semiconductor device includes a support substrate, an insulating layer provided on the support substrate, and a semiconductor element provided on the insulating layer. The insulating layer has a lower insulating layer consisting of amorphous boron nitride, and an upper insulating layer provided on the lower insulating layer and including amorphous boron nitride and an hexagonal system boron nitride (h-BN) particles.Type: GrantFiled: December 3, 2015Date of Patent: March 28, 2017Assignee: STANLEY ELECTRIC CO., LTD.Inventor: Kazufumi Tanaka
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Patent number: 9577340Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.Type: GrantFiled: March 18, 2014Date of Patent: February 21, 2017Assignee: PERASO TECHNOLOGIES INC.Inventors: Mohammad Fakharzadeh, Andrew Charles Andrade, Saman Jafarlou, Bradley Robert Lynch, Mihai Tazlauanu
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Patent number: 9564868Abstract: There is disclosed a balun for dividing an input electrical signal to produce first and second output electrical signals which are substantially out of phase, the balun including: an input port for receiving the input electrical signal; an input line for coupling the input electrical signal to a slotline; and an output line for coupling the first and second output electrical signals to, respectively a first output port and a second output port, the output line having a junction with the slotline; wherein the slotline couples the input electrical signal to the junction, and the junction acts as a divider to produce the first and second electrical signals; in which at least one of the input line, slotline and output line has a width and a length wherein the width varies over the length.Type: GrantFiled: June 17, 2013Date of Patent: February 7, 2017Assignee: BAE SYSTEMS plcInventors: Mark Christopher Nguyen, Gareth Michael Lewis, Richard John Harper
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Patent number: 9530437Abstract: A magnetic head has a magnetic head slider that includes a recording element that generates a recording signal magnetic field, a microwave magnetic field generating element that generates a microwave magnetic field, a terminal electrode, and a first transmission line that interconnects the terminal electrode and the microwave magnetic field generating element. A second transmission line is connected to the terminal electrode, the second transmission line being used to transmit a microwave signal from the outside of the magnetic head slider to the magnetic head slider. A capacitor connected to the first transmission line is provided between the terminal electrode and the microwave magnetic field generating element. Accordingly, in the magnetic head, a microwave signal is efficiently propagated.Type: GrantFiled: September 8, 2015Date of Patent: December 27, 2016Assignee: TDK CorporationInventors: Tomohiko Shibuya, Atsushi Ajioka, Sadaharu Yoneda, Atsushi Tsumita
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Patent number: 9526167Abstract: A many-up wiring substrate includes an insulating base substrate in which a plurality of wiring board regions are arranged in at least one of a vertical direction and a horizontal direction; a hole disposed in one main surface of the insulating base substrate, and straddling adjacent wiring board regions of the plurality of wiring board regions or straddling the wiring board regions and a dummy region; a conductor disposed on an inner surface of the hole; and a through hole disposed so as to extend from the inner surface of the hole of the wiring board regions to the other main surface of the insulating base substrate.Type: GrantFiled: March 30, 2011Date of Patent: December 20, 2016Assignee: KYOCERA CORPORATIONInventor: Hiroyuki Segawa
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Patent number: 9526165Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area.Type: GrantFiled: November 5, 2013Date of Patent: December 20, 2016Assignee: TAIYO YUDEN CO., LTD.Inventors: Tetsuo Saji, Hiroshi Nakamura
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Patent number: 9525200Abstract: The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.Type: GrantFiled: April 29, 2015Date of Patent: December 20, 2016Assignee: MANDO CORPORATIONInventors: Jong Gyu Park, Han Yeol Yu
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Patent number: 9515031Abstract: In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.Type: GrantFiled: December 29, 2011Date of Patent: December 6, 2016Assignee: INTEL CORPORATIONInventors: Nevin Altunyurt, Kemal Aygun, Kevin J. Doran, Yidnekachew S. Mekonnen
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Patent number: 9461677Abstract: The present invention is directed to integrated circuits and methods thereof. More specifically, embodiments of the present invention provide a local correction for bending communication line pairs. In an IC package, a pair of communication lines is used to provide a physical link for data communication between two or more components. At regions where the pair of communication lines is bent, the inner bend line is extended in length and shaped to match the length of the outer bend line while preserving integrity of its signal propagation characteristics, thereby providing local phase correction. There are other embodiments as well.Type: GrantFiled: January 8, 2015Date of Patent: October 4, 2016Assignee: INPHI CORPORATIONInventor: Mohammed Ershad Ali
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Patent number: 9455570Abstract: An electrostatic discharge (ESD) limiting device for a coaxial transmission line can include an outer housing or shielding, a ground portion positioned within the outer housing, a center pin positioned within the ground portion, and a beam lead device—such as a Schottky diode or other diode—positioned between the ground portion and the center pin and electrically coupled between the ground portion and the center pin. The ESD limiting device may also include one or more spring members mounted on the ground portion to provide elasticity to the device to maintain signal transmission and grounding within the coaxial transmission line.Type: GrantFiled: April 25, 2013Date of Patent: September 27, 2016Assignee: TEKTRONIX, INC.Inventors: Sahand Noorizadeh, James D. Pileggi, Kyle Grist
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Patent number: 9426871Abstract: The present invention is a wireless communications circuit protection structure, in which a microstrip structure is improved and a combined structure of the microstrip structure and the coplanar waveguide (CPW) structure are improved, so that an external ground and an internal system ground may be totally separated with each other to provide electromagnetic susceptibility (EMS), electrostatic discharge (ESD), electricity leakage proofing ability, and a loss within a specific wireless communications frequency range may satisfy the wireless communications ability requirement.Type: GrantFiled: February 4, 2014Date of Patent: August 23, 2016Assignee: MOXA INC.Inventors: Chung-En Hung, Hsin-Hung Liu