Strip Type Patents (Class 333/246)
  • Patent number: 10804874
    Abstract: Techniques that facilitate a superconducting combiner or separator of DC-currents and microwave signals are provided. In one example, a device includes a direct current circuit and a microwave circuit. The direct current circuit comprises a bandstop circuit and provides transmission of a direct current signal. The microwave circuit provides transmission of a microwave signal. The microwave circuit and the direct current circuit that comprises the bandstop circuit are joined by a common circuit that provides transmission of the direct current signal and the microwave signal.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: October 13, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Baleegh Abdo
  • Patent number: 10775422
    Abstract: A device includes a substrate that includes a resonant cavity. The resonant cavity includes a plurality of dipolar molecules that have an absorption frequency. The resonant cavity resonates at a frequency that is equal to the absorption frequency of the dipolar molecules. The device further includes a first port on the resonant cavity configured to receive a radio frequency (RF) signal.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 15, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adam Joseph Fruehling, Juan Alejandro Herbsommer, Benjamin Stassen Cook, Swaminathan Sankaran
  • Patent number: 10749263
    Abstract: Printed circuit board mounted antenna and waveguide interfaces are provided herein. An example device includes any of a dielectric substrate or transmission line, an antenna mounted onto the dielectric substrate, and an elongated waveguide mounted onto the dielectric substrate so as to enclose around a periphery of the antenna and contain radiation produced by the antenna along a path that is coaxial with a centerline of the waveguide.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: August 18, 2020
    Assignee: Mimosa Networks, Inc.
    Inventors: Paul Eberhardt, Syed Aon Mujtaba, Brian L. Hinman
  • Patent number: 10727560
    Abstract: A waveguide system for a transition between a waveguide structure having an exterior stripline element and a waveguide structure having a stripline element which is completely shielded. To that end, the present invention provides a transition which is able to be realized particularly easily and efficiently with the aid of a multilayer printed circuit board architecture.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: July 28, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Werner Soergel, Johannes Meyer, Osama Khan
  • Patent number: 10670626
    Abstract: The illustrative embodiments pertain to a test fixture having low insertion inductance for large bandwidth monitoring of current signals. In one exemplary embodiment, the test fixture includes a baseplate with each resistor of a set of resistors embedded inside a respective non-plated through slot in the baseplate. A first terminal of each resistor is soldered to a top metallic zone of the baseplate and a second terminal soldered to a first of two bottom metallic zones of the baseplate. The top metallic zone is connected by plated-through holes to a second of the two bottom metallic zones. When mounted upon a PCB, the test fixture allows current flow from the first bottom metallic zone, upwards through the set of resistors to the top metallic zone, and downwards to the second bottom metallic zone. An observation instrument may be coupled to a coaxial connector that is mounted on the baseplate.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: June 2, 2020
    Assignee: Keysight Technologies, Inc.
    Inventors: Edward Vernon Brush, IV, Neil Martin Forcier, Fei Fred Wang, Zheyu Zhang, Wen Zhang
  • Patent number: 10666231
    Abstract: The present disclosure relates to a balun arrangement (1, 1?, 1?) comprising a single-ended port (2, 2; 17, 26), a differential port arrangement (61), a coupled first and second transmission line section (5, 6) constituting a first coupled pair (7), and a third and fourth coupled transmission line section (8, 9) constituting a second coupled pair (10). The first transmission line section (5) is connected between a first coupled pair first port (11) and the third transmission line section (8), the second transmission line section (6) is connected between a first coupled pair second port (12) and the first differential port (3), the third transmission line section (8) is connected between a second coupled pair first port (13) and the first transmission line section (5), and the fourth transmission line section (9) is connected between a second coupled pair second port (14) and the second differential port (4).
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: May 26, 2020
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventor: Kristoffer Andersson
  • Patent number: 10608314
    Abstract: An electronic device is provided. The electronic device includes a circuit board, a first conductive member electrically connected to the circuit board at a first point, a second conductive member electrically connected to the circuit board at a second point, and a connection member connecting the first conductive member and the second conductive member, where the connection member includes a first conductive layer electrically connected to the first conductive member, a second conductive layer electrically connected to the second conductive member, and a dielectric layer disposed between the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: March 31, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sung Won Park, Sun Young Kim, Seung Yup Lee
  • Patent number: 10594041
    Abstract: A compact wideband RF antenna for incorporating into a planar substrate, such as a PCB, having at least one cavity with a radiating slot, and at least one transmission line resonator disposed within a cavity and coupled thereto. Additional embodiments provide stacked slot-coupled cavities and multiple coupled transmission-line resonators placed within a cavity. Applications to ultra-wideband systems and to millimeter-wave systems, as well as to dual and circular polarization antennas are disclosed.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: March 17, 2020
    Assignee: VAYYAR IMAGING LTD.
    Inventors: Naftali Chayat, Doron Cohen
  • Patent number: 10541479
    Abstract: An interconnection includes a cable assembly and a board assembly. The cable assembly includes a cable having an inner conductor. The board assembly comprises an intermediate layer disposed between first and second outer layers, a recess disposed between the first and second outer layers so as to form a cable-receiving space at a first side edge, and a first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space. The inner conductor is inserted at the first side edge into the cable-receiving space and is disposed at an offset in a longitudinal direction relative to the first inner-conductor contact opening. The inner conductor is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of the first and/or second outer layers, at least in a region of the first inner-conductor contact opening.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: January 21, 2020
    Assignee: MD ELEKTRONIK GMBH
    Inventors: Martin Huber, Robert Hofmann
  • Patent number: 10390439
    Abstract: A circuit apparatus includes at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: August 20, 2019
    Assignee: International Business Machines Corporation
    Inventors: Brian L. Carlson, John R. Dangler, Roger S. Krabbenhoft, Kevin A. Splittstoesser
  • Patent number: 10307603
    Abstract: An implantable device includes a cylindrical housing, a metallic feedthrough, a metallic collar, and a battery. The cylindrical housing has a sidewall and an internal cavity, and is formed from a ceramic. One or more electrical components are integrated into the sidewall. The metallic feedthrough is joined to a first end of the cylindrical housing. The metallic collar is joined to a second end of the cylindrical housing. The battery is joined to the metallic collar.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: June 4, 2019
    Assignee: Verily Life Sciences LLC
    Inventors: Kedar Shah, Peng Cong
  • Patent number: 10290489
    Abstract: There is provided a method for manufacturing a group-III nitride substrate, including: (a) preparing a substrate which is made of a group III-nitride crystal and which has a high oxygen concentration domain where an oxygen concentration is higher than that of a matrix of the crystal; (b) irradiating the substrate with laser beam aiming at the high oxygen concentration domain, forming a through-hole penetrating the substrate in a thickness direction, and removing at least a part of the high oxygen concentration domain from the substrate; and (c) embedding at least a part of an inside of the through-hole by growing the group-III nitride crystal in the through-hole.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: May 14, 2019
    Assignees: Sciocs Company Limited, Sumitomo Chemical Company, Limited
    Inventors: Toshio Kitamura, Masatomo Shibata, Takehiro Yoshida
  • Patent number: 10290603
    Abstract: A high-frequency circuit includes: a first substrate; a transmission line formed on the first substrate and having first and second output portions branched from an input portion; a second substrate; first and second pads formed on the second substrate; a first wire connecting the first output portion to the first pad; and a second wire connecting the second output portion to the second pad, wherein an electrical length from the input portion to an edge of the second output portion is longer than an electrical length from the input portion to an edge of the first output portion, and a length from a junction between the second wire and the second output portion to the edge of the second output portion is longer than a length from a junction between the first wire and the first output portion to the edge of the first output portion.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: May 14, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventor: Shin Chaki
  • Patent number: 10283832
    Abstract: A compact wideband RF antenna for incorporating into a planar substrate, such as a PCB, having at least one cavity with a radiating slot, and at least one transmission line resonator disposed within a cavity and coupled thereto. Additional embodiments provide stacked slot-coupled cavities and multiple coupled transmission-line resonators placed within a cavity. Applications to ultra-wideband systems and to millimeter-wave systems, as well as to dual and circular polarization antennas are disclosed.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: May 7, 2019
    Assignee: VAYYAR IMAGING LTD.
    Inventors: Naftali Chayat, Doron Cohen
  • Patent number: 10230202
    Abstract: An RF signal processing system including multiple drop-in modular circuit blocks is disclosed. The drop-in modular circuit blocks include input and output launches exhibiting the same launch geometry. The RF system may include a conductive plate with a grid of holes disposed on the conductive plate. Multiple modular blocks may be installed on the conductive plate to form a cascade of modular blocks that exhibit common launch geometries. The cascade may include an RF probe with a projection and conductive pin that overhang a portion of a launch of a modular block at an end of the cascade. Flex connects may be disposed on, and held in position by, anchors to connect adjacent modular blocks together in a prototype system. A production RF system may exhibit the same overall geometry as a prototype RF system to speed up the transition from prototype design to production design.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: March 12, 2019
    Assignee: X-MICROWAVE, LLC
    Inventors: John Dale Richardson, Raymond Thomas Page
  • Patent number: 10200216
    Abstract: A variable ISI transmission channel apparatus inserted in a high-speed transmission channel for the high-speed serial data communication simulates a “live” ISI environment to which the high-speed transmission channel in operation is exposed, in a situation such as a bit error test by means of continuously adjusting an amount of inter-symbol interference (ISI) in the high-speed transmission channel. By allowing an undersurface of a transmission loss generating member (6) (16) (26) such as a dielectric, a magnetic body, and an electric conductor to face, and slide on, a top surface of a conductor strip (2) exposed on a top surface of a plate-shaped dielectric substrate (1), a facing area is continuously increased/decreased. A dielectric loss, a magnetic loss, or a resistance loss increased/decreased in the transmission loss generating member is reflected on a high-frequency signal on the conductor strip (2).
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: February 5, 2019
    Assignee: ARTEK KABUSHIKI KAISHA
    Inventor: Kiyoshi Sone
  • Patent number: 10193206
    Abstract: The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: January 29, 2019
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Per Ligander, Tomas Bergsten, Ingolf Larsson, Olle Nyström, Torbjörn Westin
  • Patent number: 10178761
    Abstract: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer, and as an antenna radiates the EMI propagated by the strip lines along the signaling layer outwards from the circuit board. A defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines to minimize the EMI that the element radiates outwards as the antenna.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: January 8, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Karl J. Bois, Benjamin Toby
  • Patent number: 10170817
    Abstract: A technique relates to a superconducting airbridge on a structure. A first ground plane, resonator, and second ground plane are formed on a substrate. A first lift-off pattern is formed of a first lift-off resist and a first photoresist. The first photoresist is deposited on the first lift-off resist. A superconducting sacrificial layer is deposited while using the first lift-off pattern. The first lift-off pattern is removed. A cross-over lift-off pattern is formed of a second lift-off resist and a second photoresist. The second photoresist is deposited on the second lift-off resist. A cross-over superconducting material is deposited to be formed as the superconducting airbridge while using the cross-over lift-off pattern. The cross-over lift-off pattern is removed. The superconducting airbridge is formed to connect the first and second ground planes by removing the superconducting sacrificial layer underneath the cross-over superconducting material. The superconducting airbridge crosses over the resonator.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Josephine B. Chang, John M. Cotte
  • Patent number: 10168745
    Abstract: An information processing apparatus includes: a display unit; a circuit board; a power supply cable coupled to the circuit board; a coupling cable including an overlapping portion that overlaps with the power supply cable as viewed in a thicknesswise direction of the circuit board and coupled to the display unit; and a projection projecting from the circuit board and disposed between the power supply cable and the overlapping portion.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: January 1, 2019
    Inventors: Takashi Abe, Takashi Iijima, Shinya Matsushita
  • Patent number: 10158156
    Abstract: A microwave transmission line having a coplanar waveguide and a pair of conductive members, each one of the pair of conductive members having a proximal end disposed on a portion of a corresponding one of a pair of ground plane conductors of the coplanar waveguide and a distal end disposed over, and vertically spaced from, a region between a center conductor of the coplanar waveguide and a corresponding one of the pair of ground plane conductors of the coplanar waveguide. The distal ends are laterally separated from each other by a region disposed over the center conductor.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: December 18, 2018
    Assignee: Raytheon Company
    Inventors: Christopher M. Laighton, Edward A. Watters, Keith R. Kessler
  • Patent number: 10107958
    Abstract: A flexible substrate includes a first pad that extends from an end of the flexible substrate to a center of the flexible substrate, and at least a part of which is fixed to the first part; a second pad that extends from the end of the flexible substrate to the center at a position adjacent to the first pad, and at least a part of which is fixed to the first part; a signal line that connects a tip of the first pad and the second part and that is narrower in width than the first pad; and a coverlay that covers an area where the signal line is arranged and that includes a protrusion protruding, at a position at which the first pad is arranged, toward the end of the flexible substrate relative to the area where the signal line is arranged.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: October 23, 2018
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Masaki Sugiyama
  • Patent number: 10033082
    Abstract: The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes an attenuation port, wherein the attenuation port is configured to couple the beamforming network to the attenuation component. The attenuation component dissipates received electromagnetic energy.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: July 24, 2018
    Assignee: Waymo LLC
    Inventors: Jamal Izadian, Adam Brown
  • Patent number: 10001693
    Abstract: A light communication device further includes a rigid substrate, a package, and a flexible substrate. The rigid substrate includes a first terminal arranged on a surface thereof and a second terminal having a first hole opened at the surface. The package includes a third terminal and a fourth terminal being provided on a side wall thereof and being electrically coupled to a signal electrode and a ground electrode of the signal processor, respectively. The flexible substrate includes a fifth terminal and a sixth terminal being electrically coupled to the third terminal and the fourth terminal, respectively. The fifth terminal is electrically coupled to the first terminal on the surface, and the sixth terminal, with being placed into the first hole, is electrically coupled to the second terminal.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: June 19, 2018
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventors: Masaki Sugiyama, Akira Ishii, Norihisa Naganuma, Eiichi Kodera
  • Patent number: 9953921
    Abstract: A semiconductor device may include a first metal line; a second metal line; a first insulating layer formed between the first metal line and the second metal line; a first driving unit coupled to the first metal line, the first driving unit being suitable for driving the first metal line in response to first data; and a second driving unit coupled to the second metal line, the second driving unit being suitable for driving the second metal line in response to second data obtained by inverting and delaying the first data.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: April 24, 2018
    Assignee: SK Hynix Inc.
    Inventor: Hyun-Bae Lee
  • Patent number: 9947441
    Abstract: An integrated superconductor device may include a substrate base and an intermediate layer disposed on the substrate base and comprising a preferred crystallographic orientation. The integrated superconductor device may further include an oriented superconductor layer disposed on the intermediate layer and a conductive strip disposed on a portion of the oriented superconductor layer, The conductive strip may define a superconductor region of the oriented superconductor layer thereunder, and an exposed region of the oriented superconductor layer adjacent the superconductor region.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: April 17, 2018
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Connie P. Wang, Paul Murphy, Paul Sullivan
  • Patent number: 9917357
    Abstract: Discussed herein is an antenna system that comprises a feed element and a radiating element that are formed on a dielectric substrate positioned above a circuit board which includes a feed circuit and a ground layer. Specifically, the feed element is disposed within an outer periphery defined by the radiating element. A capacitive coupling is formed between the feed element and the radiating element. With the aforesaid configuration, the antenna system is less affected by the circuit board and interference from other elements that are mounted on the circuit board. Further, manufacturing costs are reduced as compared to the case where the feed element and the radiating element are respectively formed on a front and rear surface of a resin layer.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: March 13, 2018
    Assignees: Sony Corporation, Sony Mobile Communications Inc.
    Inventors: Masato Tanaka, Hideaki Shoji, Aiko Yoshida
  • Patent number: 9893405
    Abstract: Dielectric waveguide comprising dielectric body having an exterior coated with an electrically conductive film. Region in one side surface couples to another dielectric waveguide, and slot in bottom surface exposes the dielectric body in an L-shape in two adjacent side surfaces, except for the one side surface. Front surface of printed circuit board has a ground pattern opposed to the slot, which includes opening with outer shape greater than slot, and a back surface having a ground pattern surrounding a strip line disposed to cross through the slot. A distal end of the strip line and the front surface-side ground pattern are coupled together by a via hole. The opening is surrounded by a via hole group which couples the front and the back surface-side ground patterns together. The dielectric waveguide is disposed to allow the opening and the slot to be opposed to each other.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: February 13, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yukikazu Yatabe
  • Patent number: 9888560
    Abstract: A differential transmission line includes a positive conductor on which a positive complementary component of a differential signal is transmitted, and a negative conductor parallel to the positive conductor on which a negative complementary component of the differential signal is transmitted. A quarter wavelength differential coupler is inserted along a length of the positive and negative conductors. The quarter wavelength differential coupler has a length corresponding to a frequency of common mode noise on the positive and negative conductors. The quarter wavelength differential coupler reduces the common mode noise at the frequency as the differential signal passes through the quarter wavelength differential coupler.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: February 6, 2018
    Assignee: Lenovo Enterprise Solutions (Singapore) PTE. LTD.
    Inventors: Rong Eric Ao, Alexander Philip Campbell, Donald Richard Dignam, Stephen John Flint, Jian Meng
  • Patent number: 9859603
    Abstract: A printed wiring board is provided with a wiring layer, a first ground layer, a second ground layer, a grounding through-hole, a signal through-hole, a first clearance, and a second clearance. The wiring layer has a signal line. The first ground layer has a first ground plane. The second ground layer is positioned between the wiring layer and the first ground layer and has a second ground plane. The grounding through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the second ground plane. The signal through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the signal line. The first clearance is formed in the first ground layer, is positioned in the vicinity of the signal through-hole and the grounding through-hole, and separates the first ground plane from the signal through-hole and the grounding through-hole.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: January 2, 2018
    Assignee: NEC Corporation
    Inventor: Kazuhiro Kashiwakura
  • Patent number: 9860985
    Abstract: A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: January 2, 2018
    Assignee: Lockheed Martin Corporation
    Inventor: Jack V. Ajoian
  • Patent number: 9800338
    Abstract: A diplex filter having tunable inductors. Preferably the tunable inductors include pads that may each selectively receive one end of a jumper.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: October 24, 2017
    Assignee: ARRIS Enterprises LLC
    Inventors: Sergio Alfredo Mendoza Aguirre, LuisJavier Aguirre
  • Patent number: 9774068
    Abstract: A filter configuration including a substrate, a primary microstrip line and a first defected ground structure is disclosed. The substrate has a first face and a second face. The second face is a ground face. The primary microstrip line is arranged on the first face and extends in a first direction. The first defected ground structure is arranged on the second face. The first defected ground structure includes a first section, a first circular section, a second section, a second circular section and a third section that are connected to each other in sequence in a second direction perpendicular to the first direction. The second section is covered by the primary microstrip line in a vertical direction perpendicular to the first and second faces. The primary microstrip line has a width equal to a minimum length of the second section. As such, the filtering effect can be improved.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: September 26, 2017
    Assignee: I-Shou University
    Inventors: Chung-Long Pan, Rong-Ching Wu, Tsu-Chung Tan
  • Patent number: 9716305
    Abstract: According to the invention there is provided a balun including: a slotline which is coupled to an input line and an output line, in which at least a portion of the slotline is sandwiched between a first and a second layer of dielectric material.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: July 25, 2017
    Assignee: BAE SYSTEMS plc
    Inventors: Mark Christopher Nguyen, Gareth Michael Lewis, Richard John Harper
  • Patent number: 9698458
    Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: July 4, 2017
    Assignee: Raytheon Company
    Inventors: Glafkos K. Stratis, Douglas Mills, Kevin R. Hopkins, Raymond A. Graffam, David J. Knapp, Michael S. Smith
  • Patent number: 9672319
    Abstract: Disclosed are techniques for model-based electronic design implementation with a hybrid solver. These techniques generate an extruded via from a linkage node to a reference metal plane that is added to an analysis model for at least a portion of an electronic design. The analysis model for the at least the portion is generated at least by re-establishing interconnection between the at least the portion and a linkage circuit element with the extruded via. At least the portion of the electronic design may further be implemented using the analysis or simulation results that are generated by using the hybrid solver on the model, without using three-dimensional solvers, for a three-dimensional model of the electronic design.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: June 6, 2017
    Assignee: Cadence Design Systems, Inc.
    Inventors: Xiande Cao, Jian Liu, An-yu Kuo
  • Patent number: 9666931
    Abstract: A radio frequency electric power conversion mechanism of the present invention includes a circuit board including a fiber reinforced resin board, instead of an expensive ceramic circuit board. The radio frequency electric power conversion mechanism has a combined configuration of a plurality of fiber reinforced resin boards laminated to each other with a conductive foil therebetween, a via hole array made of an electric conductor passing through the boards, a transmission line closely adhered to the surface of a board, and a waveguide having a notch in a part of the waveguide on the aperture side. The radio frequency electric power conversion mechanism further has other structural features.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: May 30, 2017
    Assignee: NIDEC ELESYS CORPORATION
    Inventor: Jun Suzuki
  • Patent number: 9660594
    Abstract: In general the embodiments described herein can provide alternating-current (AC) resonating filters. These resonating filters comprise a transmission line, a first resonator, and a second resonator. The first resonator is configured to block AC signals in a first frequency range, while the second resonator is configured to block AC signals in a second frequency range, where the second frequency range is higher than the first frequency range. The transmission line has a first node coupled to an AC source, and the first resonator is coupled to the transmission line a first distance from the first node, and the second resonator is coupled to the transmission line a second distance from the first node, where the second distance is greater than the first distance. When so configured the resonating filter can effectively block signals in multiple selected frequency bandwidths.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: May 23, 2017
    Assignee: NXP USA, INC.
    Inventors: Travis A. Barbieri, Basim H. Noori
  • Patent number: 9647312
    Abstract: A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: May 9, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Masahiro Ozawa
  • Patent number: 9607824
    Abstract: A semiconductor device includes a support substrate, an insulating layer provided on the support substrate, and a semiconductor element provided on the insulating layer. The insulating layer has a lower insulating layer consisting of amorphous boron nitride, and an upper insulating layer provided on the lower insulating layer and including amorphous boron nitride and an hexagonal system boron nitride (h-BN) particles.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: March 28, 2017
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventor: Kazufumi Tanaka
  • Patent number: 9577340
    Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: February 21, 2017
    Assignee: PERASO TECHNOLOGIES INC.
    Inventors: Mohammad Fakharzadeh, Andrew Charles Andrade, Saman Jafarlou, Bradley Robert Lynch, Mihai Tazlauanu
  • Patent number: 9564868
    Abstract: There is disclosed a balun for dividing an input electrical signal to produce first and second output electrical signals which are substantially out of phase, the balun including: an input port for receiving the input electrical signal; an input line for coupling the input electrical signal to a slotline; and an output line for coupling the first and second output electrical signals to, respectively a first output port and a second output port, the output line having a junction with the slotline; wherein the slotline couples the input electrical signal to the junction, and the junction acts as a divider to produce the first and second electrical signals; in which at least one of the input line, slotline and output line has a width and a length wherein the width varies over the length.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: February 7, 2017
    Assignee: BAE SYSTEMS plc
    Inventors: Mark Christopher Nguyen, Gareth Michael Lewis, Richard John Harper
  • Patent number: 9530437
    Abstract: A magnetic head has a magnetic head slider that includes a recording element that generates a recording signal magnetic field, a microwave magnetic field generating element that generates a microwave magnetic field, a terminal electrode, and a first transmission line that interconnects the terminal electrode and the microwave magnetic field generating element. A second transmission line is connected to the terminal electrode, the second transmission line being used to transmit a microwave signal from the outside of the magnetic head slider to the magnetic head slider. A capacitor connected to the first transmission line is provided between the terminal electrode and the microwave magnetic field generating element. Accordingly, in the magnetic head, a microwave signal is efficiently propagated.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: December 27, 2016
    Assignee: TDK Corporation
    Inventors: Tomohiko Shibuya, Atsushi Ajioka, Sadaharu Yoneda, Atsushi Tsumita
  • Patent number: 9526167
    Abstract: A many-up wiring substrate includes an insulating base substrate in which a plurality of wiring board regions are arranged in at least one of a vertical direction and a horizontal direction; a hole disposed in one main surface of the insulating base substrate, and straddling adjacent wiring board regions of the plurality of wiring board regions or straddling the wiring board regions and a dummy region; a conductor disposed on an inner surface of the hole; and a through hole disposed so as to extend from the inner surface of the hole of the wiring board regions to the other main surface of the insulating base substrate.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: December 20, 2016
    Assignee: KYOCERA CORPORATION
    Inventor: Hiroyuki Segawa
  • Patent number: 9526165
    Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: December 20, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Tetsuo Saji, Hiroshi Nakamura
  • Patent number: 9525200
    Abstract: The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: December 20, 2016
    Assignee: MANDO CORPORATION
    Inventors: Jong Gyu Park, Han Yeol Yu
  • Patent number: 9515031
    Abstract: In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: December 6, 2016
    Assignee: INTEL CORPORATION
    Inventors: Nevin Altunyurt, Kemal Aygun, Kevin J. Doran, Yidnekachew S. Mekonnen
  • Patent number: 9461677
    Abstract: The present invention is directed to integrated circuits and methods thereof. More specifically, embodiments of the present invention provide a local correction for bending communication line pairs. In an IC package, a pair of communication lines is used to provide a physical link for data communication between two or more components. At regions where the pair of communication lines is bent, the inner bend line is extended in length and shaped to match the length of the outer bend line while preserving integrity of its signal propagation characteristics, thereby providing local phase correction. There are other embodiments as well.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: October 4, 2016
    Assignee: INPHI CORPORATION
    Inventor: Mohammed Ershad Ali
  • Patent number: 9455570
    Abstract: An electrostatic discharge (ESD) limiting device for a coaxial transmission line can include an outer housing or shielding, a ground portion positioned within the outer housing, a center pin positioned within the ground portion, and a beam lead device—such as a Schottky diode or other diode—positioned between the ground portion and the center pin and electrically coupled between the ground portion and the center pin. The ESD limiting device may also include one or more spring members mounted on the ground portion to provide elasticity to the device to maintain signal transmission and grounding within the coaxial transmission line.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: September 27, 2016
    Assignee: TEKTRONIX, INC.
    Inventors: Sahand Noorizadeh, James D. Pileggi, Kyle Grist
  • Patent number: 9426871
    Abstract: The present invention is a wireless communications circuit protection structure, in which a microstrip structure is improved and a combined structure of the microstrip structure and the coplanar waveguide (CPW) structure are improved, so that an external ground and an internal system ground may be totally separated with each other to provide electromagnetic susceptibility (EMS), electrostatic discharge (ESD), electricity leakage proofing ability, and a loss within a specific wireless communications frequency range may satisfy the wireless communications ability requirement.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: August 23, 2016
    Assignee: MOXA INC.
    Inventors: Chung-En Hung, Hsin-Hung Liu