Abstract: The present disclosure provides for a circuit package that can include a signal input port that receives an electronic signal that includes multiple frequency components and a signal output port that outputs the electronic signal. The circuit package can include a trace having multiple portions that have a portion-dependent impedance. The trace can transfer the electronic signal from the signal input port to the signal output port. The present disclosure provides an apparatus to compensate a package trace parasitics, such as parasitic capacitance, to improve signal fidelity over a predetermined frequency range. The apparatus can provide a broadband impedance matching structure that matches the impedance of an I/O cell to the impedance of a printed circuit board and can compensate for the parasitic effects of both the I/O cell, terminals, and other discontinuities that may be present within the package.

Abstract: A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other.

Abstract: A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise.

Abstract: A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmission lines. The ground layer includes a first void, a second void, a third void, and a common mode filter. The first void and the second void are respectively arranged at opposite sides of a projection of the pair of differential transmission lines on the ground layer, and are bridged with the third void. The common mode filter includes a first filter portion positioned in the first void, and a second filter portion positioned in the second void. Each of the first and second filter portions includes a number of coils arranged side by side along a direction parallel to the projection of the pair of differential transmission lines.

Abstract: Provided is a printed circuit board configured to remove undesired signals generated in a transmission line, the signals having frequencies that are integral multiples of a basic frequency. Two 1/4 wavelength lines 5 and 6 each having a length that is 1/4 of a basic frequency corresponding to a data rate of coded digital signal are arranged at a signal wiring layer, which is one of surface layers of a substrate 8, along a transmission line 3 for transmitting the digital signal. One end 15a of the first 1/4 wavelength line 5 is opened, and another end 15b is grounded to a ground 7. Both ends 16a and 16b of the second 1/4 wavelength line 6 are opened.

Abstract: Filter design techniques and filters based on metamaterial structures including an extended composite left and right handed (E-CRLH) metamaterial unit cell.

Abstract: An electromagnetic noise suppression circuit is provided. The suppression circuit comprises a first substrate, a first grounding plane and at least one transmission line. The transmission line is configured on a top surface of the first substrate and the first grounding plane is configured on the bottom surface of the first substrate. The first grounding plane comprises a first distributed coupling structure. The first distributed coupling structure and the transmission line can be equivalent to an inductor-capacitor resonant circuit. The electromagnetic noise within a designated frequency band can be suppressed by the distributed coupling structure of the electromagnetic noise suppression circuit to avoid interfering the signal transmitted by the transmission line and the electromagnetic radiation induced by the electromagnetic noise.

Abstract: The present invention relates to a transmission line in which a physical value of an inductive element can be changed in various ways while minimizing a size. The transmission line of the present invention includes a transmission unit, a ground unit and inductive elements. The inductive element connects the transmission unit and the ground unit, and has a predetermined pattern. The inductive element is provided between two surfaces of a substrate. According to the present invention, a physical value of the inductive element, in particular, an inductance value can be changed in various ways while not increasing an overall size. Accordingly, a transmission line can be designed freely according to its application.

Abstract: The invention relates to a transmission line (1) comprising: a groove (2) defined by two parallel conducting walls (3) and a conducting floor (4) all electrically connected to each other, together forming a peripheral conductor of the transmission line, and a center conductor (5), at least partly submersed in the groove (2), the center conductor (5) being isolated from the conducting walls (3) and the conducting floor (4) of the groove (2). The transmission line is distinguished in that the center conductor (5) comprises at least one conductor formed on a side of a printed circuit board (6). The invention also relates to a method for the production of a transmission line.

Abstract: The present invention provides a thin film balun capable of preventing a resonant frequency from being increased to a high frequency due to size and thickness reductions and maintaining a preferable passage characteristic, while improving a balance characteristic. A thin film balun 1 includes: an unbalanced transmission line 2 having a first coil portion C1 and a second coil portion C2; and a balanced transmission line 3 having a third coil portion C3 and a fourth coil portion C4 which are magnetically coupled with the first coil portion C1 and the second coil portion C2, respectively. The first coil portion C1 is connected to an unbalanced terminal T0, and the second coil portion C2 is connected to a ground terminal G (ground potential) via a capacitor D (C component). The third coil portion C3 is connected to a balanced terminal T1 and the fourth coil portion C4 is connected to a second balanced terminal T2.

Abstract: An on-chip vertical coplanar waveguide with tunable characteristic impedance, a design structure, and a method of making the same. An on-chip transmission line includes a signal line, an upper ground line spaced apart from and above the signal line, and a lower ground line spaced apart from and below the signal line. The signal line, the upper ground line and the lower ground line are substantially vertically aligned in a dielectric material.

Abstract: The present invention provides a thin film balun capable of preventing a resonant frequency from being increased to a high frequency, and thus realizing a preferable passage characteristic. A thin film balun 1 includes: an unbalanced transmission line 2 having a first coil portion C1 and a second coil portion C2; and a balanced transmission line 3 having a third coil portion C3 and a fourth coil portion C4 which are magnetically coupled with the first coil portion C1 and the second coil portion C2, respectively. The first coil portion C1 is connected to an unbalanced terminal T0, and the second coil portion C2 is connected to a ground terminal G (ground potential) via a capacitor D (C component). The third coil portion C3 is connected to a balanced terminal T1 and the fourth coil portion C4 is connected to a second balanced terminal T2. The capacitor D is provided, in a plan view, in an area S1 between the outer end of the unbalanced terminal T0 and the outer end of the ground terminal G.

Abstract: The present invention provides a complementary-conducting-strip (CCS) structure for miniaturizing microwave transmission line. The CCS structure comprises a substrate; a transmission part formed on the substrate, the transmission part consisted of M metal layers and at least one connecting arm extending from the metal layers to connect to an adjacent CCS structure, the M metal layers interlaminated M?1 dielectric layer(s) perforating a plurality of first metal vias to connect the M metal layers, wherein M?2 and M is a nature number; and a frame part formed on the substrate, the frame part surrounding the transmission part and consisted of M?1 metal frame(s), the M?1 metal frame(s) interlaminated M?2 dielectric frame(s) perforating a plurality of second metal vias to connect the metal frames.

Abstract: Disclosed are a microstrip transmission line having a common defected ground structure (DGS) and a wireless circuit apparatus having the same. The microstrip transmission line realizes a common defected ground structure (DGS) and a double microstrip structure, and includes: a first dielectric layer; a first signal line pattern formed on a first surface of the first dielectric layer; a common ground conductive layer formed on a second surface of the first dielectric layer and having a defected ground structure, the first surface facing the second surface; a second dielectric layer having a first surface brought into contact with the common ground conductive layer, and facing the first dielectric layer while interposing the common ground conductive layer between the first dielectric layer and the second dielectric layer; and a second signal line pattern formed on a second surface of the second dielectric layer, the first surface facing the second surface.

Abstract: Tuning devices and methods are disclosed. One of the devices comprises a metal structure connected with artificial dielectric elements, and variable capacitance devices. Each variable capacitance device is connected with a respective artificial dielectric element and with a control signal. Control of the variation of the capacitance allows the desired tuning. Another device comprises metallic structures connected with artificial dielectric elements and switches connected between the artificial dielectric elements. Turning ON and OFF the switches allows the capacitance between artificial dielectric elements to be varied and a signal guided by the metallic structures to be tuned.

Abstract: A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

Abstract: An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one end is connected to the first metal plate; a second metal plate connected to the other end of the via; a first metal layer being connected to the second metal layer through a metal line; a first dielectric layer, layer-built between the first metal layer and the first metal plate; a second dielectric layer, layer-built on the first metal plate and the first dielectric layer; and a second metal layer, layer-built on the second dielectric layer. With the present invention, it is possible to solve the aforementioned mixed signal problem by preventing the EM wave of a certain frequency range from being transferred.

Abstract: Provided is a microstrip transmission line for reducing far-end crosstalk. In a conventional microstrip transmission line on a printed circuit board, a capacitive coupling between adjacent signal lines is smaller than an inductive coupling therebetween, so that far-end crosstalk occurs. According to the present invention, the capacitive coupling between the adjacent signal lines is increased to reduce the far-end crosstalk. A vertical-stub type microstrip transmission line is provided.

Abstract: A high-frequency transmission line includes: a dielectric substrate; a signal line formed on one surface of the dielectric substrate; a first and a second surface ground patterns formed so as to sandwich the signal line at a given distance from the signal line on the surface of the dielectric substrate; a backside surface ground pattern formed on another surface of the dielectric substrate; and a plurality of contacts penetrating the dielectric substrate for connecting the first and the second surface ground pattern to the backside surface ground pattern. In a given frequency range, the sum of the shortest distance from any point of the first and the second surface ground patterns to the nearest contact and the thickness of the dielectric substrate is shorter than ¼ of the effective wavelength of a transmission signal converted in the effective permittivity of the dielectric substrate.

Abstract: The present invention relates to A radio frequency (RF) switch and an apparatus including the RF switch. In an aspect of the present invention, an RF switch includes a transmission line having one end connected to an input terminal or an output terminal and the other end connected to a signal line and configured to transfer an RF signal, and a diode disposed between the input terminal and the transmission line or between the output terminal and the transmission line, the diode being configured to control whether or not to transmit the RF signal. In another aspect, an RF switch includes a transmission line having one end connected to an input terminal and the other end connected to an output terminal, and a diode disposed between the input terminal and the transmission line or between the output terminal and the transmission line, the diode being configured to control whether or not to transmit the RF signal. Here, a CRLH (Composite Right/Left-Handed) transmission line is employed as the transmission line.

Abstract: A thin film balun includes: an unbalanced transmission line which includes two coils; a balanced transmission line which includes two coils and is electromagnetically coupled to the unbalanced transmission line; a first electrode which is connected to the balanced transmission line and constitutes a capacitor; and a second electrode which is connected to a ground terminal and disposed to be opposed to the first electrode and constitutes the capacitor. The second electrode has a section opposed to the coils configuring the unbalanced transmission line or the balanced transmission line, the section being integrally formed with a section opposed to the first electrode.

Abstract: The invention provides a high frequency circuit module according to the present invention includes: a circuit component having a plurality of terminals arranged on an outer side thereof, and a circuit board of a multilayered construction or a single-layered construction. A first outer face of the circuit board serves as a component mounting face for mounting the circuit component. The circuit board includes a ground conductor layer; a plurality of electrode pads provided on the component mounting face, the electrode pads being configured for connection with the associated terminals of the circuit component; and a plurality of waveguides provided on the first outer face or a second outer face, or in an inner portion of the circuit board. The waveguides are electrically connected with the associated electrode pads. Routing directions of all or some of adjacent waveguides are opposite from each other.

Abstract: A semiconductor device having a GaAsFET and input and output matching circuits connected to the FET is provided. In the semiconductor device, a line, including a wire connection portion connected to the input or output matching circuit and a lead connection portion connected to an input or output lead which is connected to an external circuit, is formed in such a manner that a line width at the wire connection portion is wider than that at the lead connection portion. With the semiconductor device, the number of wires connecting the input or output matching circuits with the wire connection portion can be increased.

Abstract: A bandpass filter includes a combination of a BAW filter and a patterned planar filter with stubs. The BAW filter is composed of a plurality of piezoelectric resonators to give a specific frequency bandpass, while the planer filter is configured to attenuate frequencies near and outside the bandpass. The resonators are connected in a ladder configuration between a first signal transmission path and a ground. The planar filter includes a strip line formed on a dielectric layer to define a second signal transmission path. The BAW filter and the planar filter are formed on a common substrate with the first and second transmission paths connected to each other. The BAW filter, in combination with the patterned planar filter added with the stub, can improve a deep near-band rejection inherent to the BAW filter, exhibiting an excellent out-of-band rejection over certain adjacent frequency ranges outside of the bandpass, and therefore give a sharp and wide bandpass.

Abstract: A three-dimensional integrated device includes at least two integrated circuit substrates laminated to each other, each of the integrated circuit substrates having at least one ground plane, at least one aperture provided at a desired location in the ground plane, the end of a microstrip line formed in a pair with the ground plane and placed in the aperture, and a transmitter and/or a receiver that is connected to the microstrip line and transmits and/or receives signals at a frequency substantially corresponding to the perimeter ? of the aperture. Each of the apertures in each of the integrated circuit substrates is superimposed on at least one of the apertures in the other integrated circuit substrates in the direction perpendicular to the ground planes, and the signals are transported in a contactless manner between the integrated circuit substrates through the apertures at a frequency substantially corresponding to the perimeter ? of the apertures.

Abstract: A thin film balun includes: an unbalanced transmission line which includes two coils; a balanced transmission line which includes two coils and is electromagnetically coupled to the unbalanced transmission line; a capacitor having one end connected to the balanced transmission line; and a ground terminal connected to the other end of the capacitor. The capacitor is disposed in a region which does not overlap a coil included in the unbalanced transmission line and a coil included in the balanced transmission line.

Abstract: An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via.

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

Abstract: An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure that blocks a noise of a certain frequency band can include 4 or more conductive plates, a first stitching via, which electrically connects any two of the conductive plates with each other by having a part of the first stitching via pass through a planar surface that is different from a planar surface of the conductive plates, a second stitching via, which electrically connects another two of the conductive plates with each other by having a part of the second stitching via pass through a planar surface that is different from a planar surface of the conductive plates, and a stitching via chain, which electrically connects the first stitching via and the second stitching via with each other.

Abstract: An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and in the interconnect structure; a second dielectric layer in the interconnect structure and over the first dielectric layer; and a wave-guide. The wave-guide includes a first portion in the first dielectric layer and a second portion in the second dielectric layer. The first portion adjoins the second portion.

Abstract: A high-load coupler with a first input port, which is connected via a first stripline to an output port, and with at least one second input port, which is connected to an absorber, which provides at least one second stripline, a coupling portion and a connection portion. The at least one second input port is connected via at least one second stripline directly to the absorber. The at least one second stripline is designed as a middle conductor of a triplate line and the absorber is disposed on a thermally-conductive surface of a cooling-medium pipe. The cooling-medium pipe is connected to one housing half.

Abstract: Transmission lines for electronic devices such as microstrip and stripline transmission lines may be provided that include patterned conductive lines and a conductive paint in the patterned conductive lines. The transmission lines may include one or more planar ground conductors. The ground conductors may include conductive lines arranged in a crosshatch pattern with spaces between the conductive lines. The ground conductors may also include conductive paint in spaces within the crosshatched pattern. The ground conductors may form one or more ground planes for the transmission lines.

Abstract: In a semiconductor integrated circuit, a second wiring layer includes a ground conductor having at least one opening formed therein. At least one opening is overlapped by at least one patch conductor included in a third wiring layer. At least one patch conductor and the ground conductor are electrically connected to each other by at least one via hole included in a second dielectric layer. A first wiring layer includes a signal line above the ground conductor.

Abstract: A variable resonator includes a first transmission line 101, a second transmission line 102 and a plurality of switch circuits 150. The electrical length of the first transmission line 101 is equal to the electrical length of the second transmission line 102. The characteristic impedance for the even mode of the first transmission line 101 is equal to the characteristic impedance for the even mode of the second transmission line 102. The characteristic impedance for the odd mode of the first transmission line 101 is equal to the characteristic impedance for the odd mode of the second transmission line 102. Each switch circuit 150 is connected to any of the first transmission line 101 and the second transmission line 102, and one of the switch circuits 150 is turned on.

Abstract: A microwave circuit assembly includes a Liquid Crystalline Polymer (LCP) layer that supports at least one microwave circuit component. First and second ground plane layers form the outer surfaces of the assembly and these are spaced apart at least partially by a gas, a mixture of gases, or a vacuum, from the LCP supporting layer and the at least one microwave circuit.

Abstract: An apparatus including a liquid crystal polymer substrate having a top surface and a bottom surface, a coplanar waveguide formed on the top surface of the liquid crystal polymer substrate, the coplanar waveguide having a 90 degree bend with a mitered edge, an inner via positioned adjacent to an inner corner of the 90 degree bend, and an outer via positioned adjacent to the mitered edge of the 90 degree bend, the inner and outer vias positioned along a first plane that is perpendicular to a second plane defined by the mitered edge.

Abstract: A multiple-layer signal conductor has increased surface area for mitigation of skin effect. Parallel extending elongated strips of conductive material are placed in parallel layers and are separated by a thin layer of dielectric. The elongated strips are conductively connected to one another by regularly spaced vias such that a single signal conductor with multiple conductive layers is formed. During high-speed signaling, the skin effect causes current to concentrate near the surfaces of conductors. The multiple-layer signal conductor, however, has increased surface area with respect to its total cross-sectional area. The effective cross-sectional area which is conductive during high-speed signaling is therefore increased, leading to positive effects on transmission line resistance, heating, signal integrity and signal propagation delay.

Abstract: A balanced-to-unbalanced transformer includes a +90° phase shift circuit, which is disposed between a branch point connected to an unbalanced terminal and a first terminal, and a ?90° phase shift circuit, which is disposed between the branch point and a second terminal. A first inductor is connected between the first terminal and a power supply terminal, and a second inductor is connected between the branch point and the power supply terminal. A power-supply-terminal-side capacitor is connected in shunt between the power supply terminal and a ground. A second-terminal-side series inductor is connected in series between the branch point and the second terminal.

Abstract: A transmission line substrate includes: a dielectric substrate; a signal line disposed on the upper surface of the dielectric substrate; first and second ground conductors disposed on the upper surface of the dielectric substrate, field-coupled to the signal line, having potentials different from each other; a dielectric film disposed between an overlapping part of the first ground conductor and a part of the second ground conductor at which the first and second ground conductors overlap each other, to constitute a MIM capacitor; a capacitor connected between the first ground conductor and the second ground conductor in parallel with the dielectric film; and a resistor connected between the first ground conductor and the second ground conductor in series with the capacitor.

Abstract: A metamaterial transmission line for transmitting an electromagnetic wave. The metamaterial transmission line may include a substrate including a substrate configured to include a an upper portion and a lower portion on which a ground plane is formed, a signal line configured to be formed on the substrate, and a defected ground structure configured to include an etched region and two metal portions, wherein the etched region is generated by etching a part of the ground plane and the metal portions extend from the signal line and are disposed on the etched region.

Abstract: A signal converter includes: a dielectric substrate; a first conductor layer disposed on one of opposite sides of the dielectric substrate, while including an input section receiving high-frequency signals inputted thereto; a second conductor layer disposed on the other of the opposite sides of the dielectric substrate; and plural first conducting sections penetrating the dielectric substrate for electrically connecting the first and second conductor layers, while forming a waveguide in the inside of the dielectric substrate with the first and second conductor layers. The first conductor layer is disposed on the dielectric substrate without occupying a separator section disposed on the dielectric substrate. The separator section includes first and second sections extend from the input section towards the waveguide. The first and second sections are separated away from each other for gradually increasing their interval in proportion to a distance away from the input section towards the waveguide.

Abstract: A strip conductor is provided on a dielectric board, and a ground conductor facing the strip conductor in a thickness direction of the dielectric board is provided on a surface of the dielectric board. The ground conductor is provided with a plurality of holes penetrating therethrough along the thickness direction of the dielectric board. This structure accomplishes a microstrip line that can obtain consistent passing frequency characteristics.

Abstract: A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line.

Abstract: There is provided a thin film balun which, while incorporating a capacitor used to supply a DC bias, allows improvement of various required characteristics. A thin film balun according to the present embodiment includes: an unbalanced transmission line which includes two first coils; a balanced transmission line which includes two second coils and which magnetically couples with the unbalanced transmission line; a capacitor having one end connected to the balanced transmission line; and a ground terminal connected to the other end of the capacitor. The capacitor is disposed to have a region which does not overlap a part of coil openings defined by the first coils and the second coils.

Abstract: An apparatus for implementing a left-handed transmission line includes: a substrate coated with a conductor and having a rectangular shape with a predefined size; a plurality of concave-convex lines disposed on a bottom surface of the substrate; two conductive vias disposed on a top surface of the substrate; a first bonding wire connecting top portions of a conductive line between the concave-convex lines connected between the first etching surface and the second etching surface; and a second bonding wire connecting bottom portions of a conductive line between the concave-convex lines connected between the first etching surface and the second etching surface.

Abstract: Disclosed is a DPDT RF switch. The DPDT RF switch includes: first to fourth transmission lines for forming first to fourth ports, respectively; and first to fourth slot line pattern sections. The first slot line pattern section includes: a first slot line; and a first switching device for blocking signal transfer by short-circuiting a gap of a slot line. The third slot line pattern section includes: a third slot line; and a third switching device for blocking signal transfer by short-circuiting a gap of a slot line. The second slot line pattern section includes: a first loop-shaped slot line; a second slot line; and a second switching device for blocking signal transfer by short-circuiting a gap of a slot line. The fourth slot line pattern section includes: a second loop-shaped slot line; a fourth slot line; and a fourth switching device for blocking signal transfer by short-circuiting a gap of a slot line.

Abstract: To reduce cross-talk, an integrated circuit may include a uniform signal trace for a first signal; and a pair of non-uniform signal traces forming a differential pair for a differential signal. The pair of non-uniform signal traces near the uniform signal trace.

Abstract: In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines.

Abstract: Each of the plurality of conductive plates is formed on a principal surface of each of stacked dielectric layers. Side anode electrodes are connected to positive electrodes of conductive plates, while side cathode electrodes are connected to cathodes of conductive plates. Anode electrodes are connected to the side anode electrodes. Cathode electrodes are connected to the side cathode electrodes. By passing DC currents through the positive conductive plates and cathode conductive plates so as to flow in the opposite directions, effective inductance of the positive conductive plates becomes smaller than its self-inductance. Consequently, the inductance is reduced, thereby lowering impedance.

Abstract: High-speed interconnect systems for connecting two or more electrical elements for both on-chip and off-chip applications are provided. Interconnect system has the means, which could reduce the microwave loss induced due to the dielectrics. Reducing the effective loss tangent of the dielectrics reduces the microwave loss. With optimize design of the interconnects, the speed of the electrical signal can be made to closer to the speed of the light. The interconnect systems consists of the electrical signal line, inhomogeneous dielectric systems and the ground line, wherein inhomogeneous dielectric system consisting of the opened-trenches into the dielectric substrate or comb-shaped dielectrics to reduce the microwave loss. Alternatively dielectric structure can have the structure based on the fully electronic or electromagnetic crystal or quasi crystal with the line defect.