Abstract: A high-frequency substrate in which a coplanar line including a signal line which transmits a signal and a pair of front ground patterns disposed in parallel with the signal line interposed therebetween is formed on one surface of a dielectric substrate, a back ground pattern is formed to cover the other surface of the dielectric substrate, and a plurality of conductive vias which connect the front ground patterns to the back ground pattern are arranged at a predetermined interval, the high-frequency substrate including: a signal line breaking portion which breaks the signal line; a substantially rectangular parallelepiped signal-line capacitor which is formed to connect the breaking ends of the signal line to each other; and ground pattern breaking portions which are disposed on both sides of the signal line breaking portion of the signal line to break the front ground patterns.

Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.

Abstract: An RF switch includes first, second and third transmission lines for forming ports, respectively, and first, second and third slot line pattern portions connected to one another, for transferring signals to the first, second and third transmission lines, respectively. The first slot line pattern portion has a slot line pattern for transferring a signal received from the first transmission line to a connection point with the other slot line pattern portions, and a switching circuit for shorting the gap of a corresponding slot line and thus blocking the signal transfer. The second slot line pattern portion includes a loop slot line formed by a first and a second half loop slot line, a second sub-slot line for transferring a signal received from the connection point to the second transmission line through the loop slot line, and a switching circuit for shorting the gap of a corresponding slot line.

Abstract: A circuit board is provided, and a method for manufacturing the same, suitable for use in high frequency circuits, and comprising a planar pattern of transmission line conductors for linking components formed on or within the circuit board, the transmission line conductors being formed within a corresponding pattern of trenches arranged so that the conductors lie beneath a finished surface of the circuit board which is polished flat to permit one or more cover boards to be bonded thereto.

Abstract: Tuning devices and methods are disclosed. One of the devices comprises a metal structure connected with artificial dielectric elements, and variable capacitance devices. Each variable capacitance device is connected with a respective artificial dielectric element and with a control signal. Control of the variation of the capacitance allows the desired tuning. Another device comprises metallic structures connected with artificial dielectric elements and switches connected between the artificial dielectric elements. Turning ON and OFF the switches allows the capacitance between artificial dielectric elements to be varied and a signal guided by the metallic structures to be tuned.

Abstract: Techniques, apparatus and systems that use composite left and right handed (CRLH) metamaterial structures to combine and divide electromagnetic signals at multiple frequencies. The metamaterial properties permit significant size reduction over a conventional N-way radial power combiner or divider. Dual-band serial power combiners and dividers and single-band and dual-band radial power combiners and dividers are described.

Abstract: A directional coupler (500), which comprises a dielectric substrate (501) on top of a metal plate (510), is functioning as a ground plane. The transmission path is a suspended stripling so that there is a recess on the ground plane below the transmission conductor (520) being on the surface of the substrate. The sensing conductor (530) is a very small-sized conductive strip on the surface of the substrate. It has been connected from its head end to the measurement port (P3) and from its tail end via a termination resistor (550) to a small ground strip (515). The ground strip is next to the sensing conductor on the side of the output port (P2) of the directional coupler. With such an asymmetric structure, some directivity is obtained despite the small size of the sensing conductor. Also below the sensing conductor (530) there is a recess (506) on the ground plane, which joins the recess below the transmission conductor (520).

Abstract: The present invention relates to a transmission line in which a physical value of an inductive element can be changed in various ways while minimizing a size. The transmission line of the present invention includes a transmission unit, a ground unit and inductive elements. The inductive element connects the transmission unit and the ground unit, and has a predetermined pattern. The inductive element is provided between two surfaces of a substrate. According to the present invention, a physical value of the inductive element, in particular, an inductance value can be changed in various ways while not increasing an overall size. Accordingly, a transmission line can be designed freely according to its application.

Abstract: A circuit device includes a substrate 11, and a transmission line 10. The transmission line 10 includes a dielectric film 13 formed on the substrate 11, and a signal line formed on the dielectric film 13. The dielectric film 13 includes a nano-composite film in which particles of a first material are dispersed in a second material.

Abstract: The invention relates to a microwave plasma exciter device which includes a waveguide (23) for concentrating the microwaves; and a plasma generator (110, 120) for forming a plasma, which are disposed in a microwave concentration zone.

Abstract: A multilayered coplanar waveguide (CPW) filter unit and a method of manufacturing the same are provided. A plate having a capacitance element is formed on or below a CPW layer including a signal line for transmitting a signal and a ground plane. As the filter unit has a multilayered structure, characteristic impedance may be reduced without increasing the width of the signal line. Where an inductor line is inserted between the signal line and the plate, a clear frequency response curve may be obtained without performing an additional process or increasing the area of the filter unit.

Abstract: A transmission path (13) for transmitting high frequency (RF) signals is disclosed, which comprises a plurality of lead segments (20, 21, 22) which are coupled to one another on one end by a capacitive coupling element (30) and on the other end by an inductive coupling element (31) and which each have an effective length of approximately ?i/4, wherein ?i is the wavelength of a differential mode signal to be transmitted over the path (13). By providing these element (30, 31) in the form of distributed elements which electrically extend over at least a part of adjacent lead segments (20, 21; 21, 22) a very thin transmission path (13) can be realized, which is especially suitable for use with invasive catheters. Furthermore, this path (13) can be guided through RF fields of a magnetic resonance (MR) imaging system because common mode resonances are effectively suppressed.

Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.

Abstract: An apparatus including a liquid crystal polymer substrate having a top surface and a bottom surface, a coplanar waveguide formed on the top surface of the liquid crystal polymer substrate, the coplanar waveguide having a 90 degree bend with a mitered edge, an inner via positioned adjacent to an inner corner of the 90 degree bend, and an outer via positioned adjacent to the mitered edge of the 90 degree bend, the inner and outer vias positioned along a first plane that is perpendicular to a second plane defined by the mitered edge.

Abstract: The present invention provides a method and apparatus for design of low loss, size restricted high frequency circuits. In a preferred embodiment, an electronic device includes: a first circuit layer located above the main circuit board comprising a first stripline passive circuit; and a second circuit layer located above the first circuit, the second layer comprising a second stripline circuit. The two stripline circuits can be separately coupled to leads, or coupled to each other and other leads using vias through the ground layer(s) separating each stripline. The stacked stripline elements can be used together with other circuits, and the stacked circuit board can be conveniently joined together with other assemblies, e.g., by surface mounting to a main board. The utility of this topology can be extended by the use of n-circuit embodiment or embedding in a multilayered main circuit board.

Abstract: A microstrip line is constituted by including a grounding conductor and a strip conductor with a dielectric substrate being sandwiched between the grounding conductor and the strip conductor. The microstrip line includes a conductor section having at least one groove formed to sterically intersect the strip conductor, thereby exhibiting a substantially more uniform passing characteristic as compared with a prior art microstrip line.

Abstract: A signal transmission structure includes two power planes, a signal line and a first pillar. The power planes spaced by an interval space provide a first voltage and a second voltage respectively. The signal line, disposed on first surfaces of the power planes, is disposed across the interval space. The first pillar is disposed within the interval space and is aside the signal line, in which the first pillar is apart from the power planes and the signal line.

Abstract: Electric circuit device comprises electric element and two conductive plates. The electric element includes two anode electrodes and two cathode electrodes and has relatively low impedance in a frequency range between 1×10?5 to 10 GHz. The one conductive plate has lower impedance than that of the conductive plate comprising the electric element and is connected between two anode electrodes. The other conductive plate has lower impedance than that of the conductive plate comprising the electric element and is connected between two cathode electrodes. As a result, the electric circuit device which has relatively low impedance and is capable of preventing the temperature rise is provided.

Abstract: The present invention is directed to a method for making a hybrid material stripline device. The method includes providing an inner layer of material, the inner layer including a dielectric material and at least one conductive sheet. At least one stripline device is formed in the inner layer by processing the at least one conductive sheet. The at least one stripline device is characterized by a surface area footprint. A first exterior layer and a second exterior layer are provided. At least one of the first exterior layer and/or the second exterior layer includes at least one ceramic portion. The at least one ceramic portion has a ceramic surface area greater than or substantially equal to the surface area footprint of the at least one stripline device. At least one of the first exterior layer and/or the second exterior layer further includes a softboard dielectric material. The inner layer of material is sandwiched between the first exterior layer and the second exterior layer.

Abstract: Each of the plurality of conductive plates is formed on a principal surface of each of stacked dielectric layers. Side anode electrodes are connected to positive electrodes of conductive plates, while side cathode electrodes are connected to cathodes of conductive plates. Anode electrodes are connected to the side anode electrodes. Cathode electrodes are connected to the side cathode electrodes. By passing DC currents through the positive conductive plates and cathode conductive plates so as to flow in the opposite directions, effective inductance of the positive conductive plates becomes smaller than its self-inductance. Consequently, the inductance is reduced, thereby lowering impedance.

Abstract: A serpentine guard trace for reducing far-end crosstalk of a micro strip transmission line is provided. The serpentine guard trace reduces receiving-end crosstalk caused by an electromagnetic interference of a signal of a nearby transmission line when transmitting a high speed signal through a micro strip transmission line on a printed circuit board. The serpentine guard trace is located between two nearby transmission lines and has a line width narrower than that of transmission lines for an effective serpentine structure. A characteristic impedance of the serpentine guard trace increases due to the narrow line width. Termination resistors having impedance which is the same as the characteristic impedance of the serpentine guard trace are located on both ends of the guard trace to minimize a reflection wave generated in the serpentine guard trace. The receiving-end crosstalk can be effectively reduced by using the serpentine guard trace instead of a linear guard trace.

Abstract: A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line.

Abstract: A composite via structure in a multilayer printed circuit board (PCB) and also compact and shielded filters formed by the use of composite via structures as building blocks are provided. The composite via structure consists of two functional parts. The first functional part is designed to form an interconnected circuit with low return and leakage losses between the first pad disposed at the one side of the PCB and the special pad serving for a connection to a planar transmission line. The second functional part of the composite via structure serves to form a shielded open- or short-circuited resonant length (stub) extended in the vertical direction from the special pad to the second pad disposed at the opposite side of the PCB.

Abstract: A multi-mode I/O circuit or cell (10) is provided for transmitting and receiving data between ICs, where each IC contains at least one of the I/O circuits. Each data link includes transmitter circuitry (12) and receiver circuitry (14). The transmitter circuitry sends data to a receiver circuitry in another IC, and the receiver circuitry receives data from a transmitter circuitry in another IC. The I/O circuit is constructed with CMOS-based transistors (e.g., CMOS or BiCMOS) that are selectively interconnected together by a plurality of switches to operate as two single-ended, current or voltage mode links, or as a single differential current or voltage mode link. In the preferred embodiment the transmitter circuitry sends data to the receiver circuitry in another IC over a first pair of adjacently disposed conductors, and the receiver circuitry receives data from the transmitter circuitry in another IC over a second pair of adjacently disposed conductors.

Abstract: A microstrip line includes a signal strip conductor and a ground conductor. A coplanar line includes two regions. A first region includes a signal strip conductor which is connected to the signal strip conductor of the microstrip line via a wire or the like and a ground strip conductor which continues to the ground conductor. A second region is formed with a ground strip conductor formed above the ground strip conductor via a through hole. A transmission mode changes itself in the microstrip line, the first region of the coplanar line, and the second region of the coplanar line in the sequence as described. This enables converting the transmission mode efficiently from the microstrip line to the coplanar line.

Abstract: A bandpass filter having a bandpass width appropriate for UWB, a high frequency module including the bandpass filter, and radio communication device including both is provided. The bandpass filter including a laminate composed of a plurality of dielectric layers 11; first and second ground electrodes arranged on the bottom and top surfaces, respectively, of the laminate; resonance electrodes 30a, 30b, and 30c arranged in an inter-digital structure on a first inter-layer surface of the laminate, one end of each of the resonance electrodes being grounded; an input coupling electrode 40a arranged on an inter-layer surface different from the first inter-layer surface of the laminate facing the resonance electrode 30a of the input stage in the inter-digital type; and an output coupling electrode 40b arranged on an inter-layer surface different from the first inter-layer surface of the laminate to face the resonance electrode 30b of the output stage.

Abstract: A transmission line substrate comprises: a dielectric substrate; a signal line formed on the upper surface of the dielectric substrate; first and second ground conductors formed on the upper surface of the dielectric substrate, field-coupled to the signal line, having potentials different from each other; a dielectric film formed between a part of the overlapping first ground conductor and a part of the second ground conductor to constitute a MIM capacitor; a capacitor connected between the first ground conductor and the second ground conductor in parallel with the dielectric film; and a resistor connected between the first ground conductor and the second ground conductor in series with the capacitor.

Abstract: A substrate module includes a first substrate and a second substrate. The first substrate comprises a base material; a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material; a ground pattern on the rear surface of the base material; and an exposed portion in which the ground pattern on the substrate surface is exposed by partially cutting out the base material and the ground pattern on the substrate rear surface. The second substrate comprises a base material and a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material. In connecting a transmission line of the first substrate and that of the second substrate, the ground patterns of the first and second substrates are fused with each other at the exposed portion and fixed.

Abstract: A directional coupler having a first structure with distributed lines having a first conductive line intended to convey a main signal between two end terminals and having a second conductive line, coupled to the first one, intended to convey a secondary signal proportional to the main signal; and a second structure with local elements including, between a first terminal of the coupler intended to extract the secondary signal and a first end of the second line, two attenuators in series between which is interposed a low-pass filter and, between a second terminal of the coupler and the second end of the second line, at least one attenuator.

Abstract: A high frequency module incorporates a layered substrate, a plurality of elements mounted on a top surface of the layered substrate, and a metallic casing that covers these elements. The plurality of elements mounted on the top surface of the layered substrate include a band-pass filter element. The band-pass filter element includes a plurality of conductor layers for band-pass filter and a plurality of dielectric layers for band-pass filter that implement a function of a band-pass filter, but does not include any conductor layer that functions as an electromagnetic shield. A conductor layer for grounding that the layered substrate includes and the casing are each opposed to the band-pass filter element, and thereby function as an electromagnetic shield for the band-pass filter element.

Abstract: Provided is a guard trace pattern reducing far-end crosstalk and a printed circuit board having the guard trace pattern. The guard trace pattern includes a first guard trace pattern parallel with two signal lines and a plurality of second guard trace patterns perpendicular to the first guard trace pattern to increase mutual capacitance between the two signal lines and the guard trace pattern and increase mutual capacitance between the two signal lines. The printed circuit board includes the aforementioned guard trace pattern disposed between micro strip transmission lines. A characteristic impedance of the guard trace pattern is different from a characteristic impedance of the micro strip transmission lines, and resistances having the same value as a resistance component value of the characteristic impedance of the guard trace pattern are provided to both ends of the guard trace pattern.

Abstract: An electric field coupler includes a strip-like coil formed by bending a strip-like conductor which snakes along a plane perpendicular to a coupling direction in which electric field coupling occurs, such that coil axes are perpendicular to the coupling direction, the strip-like coil having an electrical length of one-half wavelength of a predetermined frequency of a radio-frequency signal and having a form in which the coil axes surround a central portion along the plane. The strip-like coil produces coupling by a longitudinal wave electric field which vibrates in the coupling direction at the central portion.

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract: An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via.

Abstract: Provided is a signal transmission line for a millimeter-wave band. The signal transmission line includes: a dielectric substrate; an input line formed on the dielectric substrate; a pair of serial transmission lines formed on the dielectric substrate, the serial transmission lines being branched at, separated from, and electromagnetically connected in series with one end of the input line; a pair of parallel transmission lines respectively formed on the dielectric substrate at both sides of the input line and the serial transmission lines, and having both ends separated from and electromagnetically connected in parallel with one end of each of the input line and the serial transmission lines; and a pair of wires electrically connected between the other ends of the parallel transmission lines and a connection pad of a monolithic microwave integrated circuit (MMIC). An electrical signal of about 57 to 63 GHz generated from a monolithic microwave integrated circuit (MMIC) can be efficiently transferred.

Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.

Abstract: In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface, and mounting lands arranged to mount at least one element electrically connected to the filter device are arranged at the opposite side. At least two of a plurality of connection terminals provided on a substrate bottom surface are respectively connected to conductor patterns connected to via-hole conductors penetrating the substrate within a mounting area for mounting the filter device via connection lines and are arranged at a pitch which is less than the pitch of the via-hole conductors.

Abstract: The present invention is a system including a first transmission line oriented in a first plane and a second transmission line oriented in a second plane. Both the first transmission line and the second transmission line include a pair of rigid substrate layers, a pair of flexible substrate layers and a trace portion, the trace portion being located between the pair of flexible substrate layers, the pair of flexible substrate layers being located between the pair of rigid substrate layers. The system further includes a transition transmission line which is connected between the first transmission line and the second transmission line. The transition transmission line includes a pair of flexible substrate layers and a trace portion, the trace portion of the transition transmission line being located between the pair of flexible substrate layers of the transition transmission line.

Abstract: An RF switch is provided. In the RF switch, a slot line is divided into a first slot line and a second slot line and an open-end circuit is provided at each end portion of the first and second slot lines. A first transmission line delivers signals from and to the first slot line, and a second transmission line delivers signals from and to the second slot line. A third transmission line delivers signals from and to the portion of the slot line that separates the first slot line from the second slot line. A variable sub open-end circuit portion includes at least one open-end circuit which is selectively switched to the first or second slot line according to an external switching control signal.

Abstract: An integrated circuit is disclosed that includes at least one integrated transmission line for the transmission of a high-frequency differential signal with a number of at least two series-connected line arrangements, each of which has a differential input, a differential output, a first trace, connected to a first terminal of the differential input and a first terminal of the differential output, and a second trace, connected to a second terminal of the differential input and a second terminal of the differential output.

Abstract: A circuit board construction which reduces unwanted electrical effects and lower signal quality resulting from the use of vias in relatively thick circuit boards or in circuit boards carrying signals of relatively high frequency. The circuit board includes a through-hole in the circuit board substrate for carrying a conductive via stub, the stub having an inherent stub characteristic; and a compensation element, such as a surface mount capacitor, positioned on the substrate such that when the stub is carried by the through-hole the inherent stub characteristic is adjusted to define a compensated stub characteristic.

Abstract: The present invention relates to a tunable microwave arrangement (10) comprising a microwave/integrated circuit device (11) and a substrate (6). It comprises a layered structure disposed between said microwave/integrated circuit device and said substrate (5), said layered structure acting as a ground plane and it comprises at least one regularly or irregularly patterned first metal layer (1), at least one second metal layer (3), at least one tunable ferroelectric film layer (2), whereby said layers are so arranged that the ferroelectric film layers) (2) is/are provided between the/a first metal layer (1) and the/a second metal layer (3).

Abstract: A directional coupler includes a laminate including a ground electrode substrate, a dielectric substrate that includes line electrodes thereon, a lead-out conductor substrate that includes lead-out conductors of the line electrodes, a ground electrode substrate, and a protection substrate. External electrodes for grounding, external electrodes for a main line, and external electrodes for a subordinate line are provided in the laminate. The inner line electrode and the outer line electrode preferably have a spiral or helical shape, and the corresponding currents are transmitted in the same direction through sections of these line electrodes that are adjacent and substantially parallel to each other.

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

Abstract: A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.

Abstract: An RF switch is provided. In the RF switch, a T-junction slot line has a horizontal slot line and a vertical slot line. An open-end circuit is provided at each end portion of the horizontal and vertical slot lines. A first transmission line delivers signals from and to one portion of the horizontal slot line, and a second transmission line delivers signals from and to the other portion of the horizontal slot line. A third transmission line delivers signals from and to the vertical slot line. A switching circuit selectively switches the signal path of the one or the other portion of the horizontal slot line to the vertical slot line according to an external switching control signal.

Abstract: A transmission line conversion apparatus connecting a parallel transmission line to a coplanar waveguide (CPW) is provided. To this end, the CPW including a transmission line composed of a signal line and a ground line which is formed on one surface of a dielectric substrate, and a parallel transmission line connected to the CPW, at a predetermined angle with respect to a substrate constituting the CPW, and composed of a signal line and a ground line, are proposed. In addition, the signal line of the CPW and the signal line of the parallel transmission line are connected to each other, and the ground line of the CPW and the ground line of the parallel transmission line are connected to each other. As such, by connecting the CPW to the parallel transmission line, a return loss can be minimized.

Abstract: A broadband surface mounting package includes a housing having a flat bottom wall forming parallel first and second surfaces. An integral wall forms, with the bottom wall, an enclosure having a top opening to provide access to an interior compartment or cavity to receive a microwave component. The second surface is arranged to contact a printed circuit board (PCB) for attachment to lands or pads on the PCB. Cylindrical holes in the enclosure each defines an axis parallel to the bottom wall, and has a dimension, generally transverse to the bottom wall, to extend from the second surface to at least the first surface, and has an axial length sufficient to provide a through hole in the wall and a gap within the bottom wall proximate to and inwardly from the wall.

Abstract: Improved methods and structures are provided for impedance-controlled low-loss lines in CMOS integrated circuits. The present invention offers a reduction in signal delay. Moreover, the present invention further provides a reduction in skew and crosstalk. Embodiments of the present invention also provide the fabrication of improved transmission lines for silicon-based integrated circuits using conventional CMOS fabrication techniques. One method of the present invention provides transmission lines in an integrated circuit. Another method includes forming transmission lines in a memory device. The present invention includes a transmission line circuit, a differential line circuit, a twisted pair circuit as well as systems incorporating these different circuits all formed according to the methods provided in this application.

Abstract: A planar filter has first and second U-shaped open transmission line resonators (103, 105) and a crank-shaped open transmission line resonator (104), so that it is possible to decrease an area to be virtually occupied by the filter on a dielectric substrate (110) and enhance the attenuation characteristic.