Tapered Patents (Class 333/34)
  • Patent number: 10374316
    Abstract: Aspects of the subject disclosure may include, for example, a solid dielectric antenna having a non-uniform spatial distribution of relative permittivity.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: August 6, 2019
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Robert Bennett, Irwin Gerszberg, Farhad Barzegar, Thomas M. Willis, III, Donald J. Barnickel, Paul Shala Henry
  • Patent number: 10312581
    Abstract: An antenna system including: a metal base plate; an antenna element arranged on and extending away from the front side of the base plate; a circuit board including a ground plane, adjacent to, and in thermal contact with the base plate; a plurality of electrical components on the circuit board including a power amplifier and an I/O connector; a metal support plate separated from, parallel to, and facing the base plate, with the circuit board located between the base and support plates; a plurality of thermally conductive standoffs thermally connecting the base plate to the support plate; and a master board including an I/O connector mating with the I/O connector on the circuit board and electrically connecting the circuit board to the master board, the master board located between the circuit board and the support plate and including signal paths for routing signals to the circuit board.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: June 4, 2019
    Assignee: BLUE DANUBE SYSTEMS, INC.
    Inventors: James Emerick, Robert M. Honeycutt, Josef Ocenasek
  • Patent number: 10270145
    Abstract: A technique is presented to extract electromagnetic radiation from a dielectric loaded waveguide consisting of a layer or layers of dielectric material enclosed in a metallic conducting jacket. The electromagnetic radiation generated in the dielectric waveguide by a charged particle beam or otherwise generated as input to the waveguide. Dielectric loaded waveguides used for generation (or transport) of electromagnetic radiation at frequencies above 100 GHz have dimensions in the sub-mm range. Due to difficulty in the fabrication of a conventional broadband horn-like antenna to extract electromagnetic radiation from the structure because of the large impedance mismatch between the dielectric loaded waveguide and free space, the designing and fabricating aperture of antennas are formed as part of the dielectric waveguide and utilizes an angle cut or a set of apertures machined into the dielectric loaded waveguide to ensure broadband power extraction with minimal return loss and high directivity.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: April 23, 2019
    Assignee: EUCLID TECH LABS, LLC
    Inventors: Sergey Antipov, Chunuang Jing, Roman Kostin, Jiaqu Qiu, Dan Wang, Alexei Kanareykin, Stanislauv Baturin, Sergey Baryshev
  • Patent number: 9692137
    Abstract: An annular slot antenna includes an inner conductor divided by a dielectric gap into a rear section and a front section. An inner conductor of a coaxial feed line is contacted with the front section of the inner conductor and the outer conductor of the coaxial feed line is contacted with the rear section.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: June 27, 2017
    Assignee: EADS Deutschland GmbH
    Inventor: Michael Sabielny
  • Patent number: 9634371
    Abstract: A transmission line circuit assembly has a substrate layer having a transmission line trace, further having a functional portion and a transitional portion. An enclosure of the assembly houses the transitional portion of the transmission line trace. A first surface of a dielectric plug is conductively coupled to an inner top surface of the enclosure. A second surface of the plug is aligned and spaced apart from the transitional portion of the transmission line trace to define a gap therebetween. An interfacing portion of a connecting pin is housed within the enclosure and bonded to the transitional portion. A connecting portion of the pin is connectable to an external conductor. The gap may be filled with a dielectric material. The transitional portion, dielectric plug, dielectric filler and connecting pin form an electromagnetic transition providing tuning and matching of the function portion with the external conductor.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: April 25, 2017
    Assignee: COM DEV International Ltd.
    Inventors: Arvind Swarup, David Davitt
  • Patent number: 9484614
    Abstract: A dielectric waveguide (DWG) has a longitudinal core member with a first dielectric constant value surrounded by a cladding with a cladding dielectric constant value that is lower than the first dielectric constant value. A first port of a signal divider is connected to receive a signal from the DWG. A second port and a third port are each configured to output a portion of the signal received on the first port, wherein the first and second port are approximately in line and the third port is at an angle to a line formed by the first port and the second port. The first port and second port have a core member with the first dielectric constant value, and the third port has a core member with a second dielectric constant value that is higher than the first dielectric constant value.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: November 1, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Juan Alejandro Herbsommer
  • Patent number: 9419324
    Abstract: A basic cell of a microwave group delay line is disclosed for tuning the electromagnetic signal propagation delay time from signal source (1) to output (5), wherein two pairs of unequal-length stubs ((L1b, L1b), (L2b, L2b)) are placed on both sides of the main transmission path (2) in the signal layer and two pairs of complementary slot-lines ((L1t, L1t), (L2t, L2t)) are placed on both sides of the main transmission path (2) in ground plane for microstrip structure. Unequal-length stubs are placed in central layer and complementary slot-lines are placed in either outer conductor ground planes for strip-line structure. The characteristic impedances (Z0, 2Z1b, 2Z2b, 2Z1t, 2Z2t) of transmission paths are selected to control group delay time and minimize reflection of signals from signal source to output. A cascade connection of the basic cell forms a delay line system.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: August 16, 2016
    Inventors: Ching-Wen Hsue, Thomas Hsue
  • Patent number: 9401532
    Abstract: A high-frequency signal line includes a dielectric element body including regions and a plurality of flexible dielectric sheets. A signal conductive layer is provided in or on the dielectric element body. Ground conductive layers are provided in or on the dielectric element body and face the signal conductive layer. A distance between the ground conductive layer and the signal conductive layer in the region is smaller than a distance between the ground conductive layer and the signal conductive layer in the regions. The dielectric element body is bent in the region.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: July 26, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shigeru Tago, Satoshi Sasaki, Noboru Kato
  • Patent number: 9318786
    Abstract: A high-frequency signal line includes an element assembly including a plurality of insulator layers, a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, and a plurality of floating conductors provided in or on the element assembly on a first side in a direction of lamination relative to the signal line and the first ground conductor, so as to be arranged along the signal line in an orientation crossing the signal line when viewed in a plan view in the direction of lamination. The floating conductors are opposite to the signal line and the first ground conductor with at least one of the insulator layers positioned therebetween, the floating conductors being connected to neither the signal line nor the first ground conductor.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: April 19, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Noboru Kato
  • Patent number: 9281551
    Abstract: A multi-band whip antenna having a 30 MHz to 2 GHz bandwidth and an L-band dipole has its coverage extended up to 6 GHz by eliminating nulls and reducing VSWR problems that are cured through the utilization of a sleeve over the feedpoint of the L-band antenna. Chokes in the form of sleeves are provided at either end of the L-band dipole to shorten the L-band antenna for preventing reverse polarity currents at the L-band antenna feedpoint, with the antenna further including the use of double shielded meanderline to provide improved performance between 410-512 MHz and in which a capacitance sleeve is added at the bottom of the L-band antenna to effectively elongate the antenna below the L-band to permit operation below 700 MHz.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: March 8, 2016
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John T. Apostolos, William Mouyos, Judy Feng
  • Patent number: 9252472
    Abstract: A load for traveling microwave energy has an absorptive volume defined by cylindrical body enclosed by a first end cap and a second end cap. The first end cap has an aperture for the passage of an input waveguide with a rotating part that is coupled to a reflective mirror. The inner surfaces of the absorptive volume consist of a resistive material or are coated with a coating which absorbs a fraction of incident RF energy, and the remainder of the RF energy reflects. The angle of the reflector and end caps is selected such that reflected RF energy dissipates an increasing percentage of the remaining RF energy at each reflection, and the reflected RF energy which returns to the rotating mirror is directed to the back surface of the rotating reflector, and is not coupled to the input waveguide. Additionally, the reflector may have a surface which generates a more uniform power distribution function axially and laterally, to increase the power handling capability of the RF load.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: February 2, 2016
    Assignee: Calabazas Creek Research, Inc.
    Inventors: R. Lawrence Ives, Yosuke M. Mizuhara
  • Patent number: 9007152
    Abstract: A transmission line includes two tapered lines having a tapered planar shape and arranged in parallel, opposite lines provided in opposition to the narrower width sides of the two tapered lines, and a bonding wire for connecting the narrower width sides of the two tapered lines and the opposite lines, wherein the width between two outer edges on the narrower width sides of the two tapered lines arranged in parallel is greater than the width between outer edges on the opposite side of the opposite lines in opposition to the narrower width sides of the two tapered lines.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: April 14, 2015
    Assignee: Fujitsu Limited
    Inventor: Satoshi Masuda
  • Publication number: 20150097634
    Abstract: Embodiments are directed to a structure comprising: a first substrate section having a first thickness, a second substrate section having a second thickness different from the first thickness, a plurality of vias configured to couple a first ground plane associated with the first substrate section and a second ground plane associated with the second substrate section, and a microstrip comprising: a first section associated with the first substrate section and having a first width, a second section associated with the second substrate section and having a second width different from the first width, and a taper between the first width and the second width.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 9, 2015
    Applicant: BLACKBERRY LIMITED
    Inventors: Nasser Ghassemi, Houssam Kanj, Christopher Andrew DeVries, Huanhuan Gu
  • Patent number: 9000863
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: April 7, 2015
    Assignee: Nuvotronics, LLC.
    Inventor: David Sherrer
  • Patent number: 8952678
    Abstract: In a gap-mode waveguide embodiment, an interior gap in a tubular waveguide principally condenses a dominant gap mode near the interior gap, and an absorber dissipates electromagnetic energy away from the gap mode. In this manner, the gap mode may dissipate relatively little power in the absorber compared to other modes and propagate with lesser attenuation than all other modes. A gap mode launched into a gap-mode waveguide may provide for low-loss, low-dispersion propagation of signals over a bandwidth including a multimode range of the waveguide. Gap-mode waveguide embodiments of various forms may be used to build guided-wave circuits covering broad bandwidths extending to terahertz frequencies.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: February 10, 2015
    Inventor: Kirk S. Giboney
  • Publication number: 20150029073
    Abstract: A transmission device for a near field communication (NFC) device includes a matching circuit, a connecting interface with a first width for connecting an operating circuit of the NFC device, a first transmission line electrically connected between an antenna of the NFC device and the matching circuit, and a second transmission line electrically connected between connecting interface and the matching circuit, including an increasing width portion and a constant width portion, wherein a width of the second transmission increases from the first width to a second width within the increasing width portion and keeps the second width within the constant width portion, wherein the second width is greater than and related to the first width.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 29, 2015
    Applicant: Wistron NeWeb Corporation
    Inventors: Mei Tien, Chih-Chun Peng, Liang-Kai Chen, Chin-Shih Lu
  • Patent number: 8933763
    Abstract: Presently disclosed is a matching network provided from a slow wave, wrapped, tapered-transformer transmission line.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: January 13, 2015
    Assignee: Raytheon Company
    Inventor: Bryan Fast
  • Patent number: 8866563
    Abstract: Aspects of the disclosure provide a connector. The connector includes a first signal conductor. The first signal conductor is configured to receive a first electronic signal that includes multiple frequency components. The first signal conductor includes a plurality of conductor portions having portion-dependent impedances. The first signal conductor is configured to transfer the first electronic signal between a via on a circuit board that has a via stub and an electronic device to reduce via stub effects. In addition, in an example, the connector includes a second signal conductor to transfer a second electronic signal. The second electronic signal and the first electronic signal are a pair of differential signals. In an example, the first signal conductor and the second signal conductor have different via stub effects.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: October 21, 2014
    Assignee: Marvell Israel (M.I.S.L.) Ltd.
    Inventor: Liav Ben Artsi
  • Publication number: 20140292195
    Abstract: In a magnetron and a plasma waveguide through which a microwave oscillated from the magnetron moves, there is provided a plasma waveguide including a plurality of step parts formed at any one side on an inner side surface of the waveguide, and a block part of a predetermined height formed at any other side on the inner side surface of the waveguide, wherein the block part is formed at a side opposite to a boundary part between the plurality of step parts.
    Type: Application
    Filed: March 26, 2014
    Publication date: October 2, 2014
    Applicant: TRIPLE CORES KOREA CO., LTD.
    Inventors: Ik Nyun Kim, Sung Ok Kang, Min Heum Eum
  • Patent number: 8847696
    Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: September 30, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: James Leroy Blair, Jeffrey Thomas Smith
  • Publication number: 20140266493
    Abstract: A transition (100, 300) from microstrip to waveguide, the waveguide comprising first (120) and second (105, 105?, 105?) interior surfaces connected by side walls (115, 116) whose height (h1, h2, h3) is the shortest distance between said interior surfaces, and a microstrip structure (130, 135, 110) extending into the closed waveguide (105). The microstrip structure comprises a microstrip conductor (130, 135) on a dielectric layer arranged on said first interior surface. The microstrip conductor (130,135) comprises and is terminated inside the closed waveguide by a patch (135). The height (h1) of the side walls (115, 116) along the distance that the microstrip conductor (130, 135) extends into the closed waveguide (105) being less than half of the greatest height (h3) beyond the microstrip structure's protrusion into the closed waveguide (105).
    Type: Application
    Filed: October 18, 2011
    Publication date: September 18, 2014
    Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
    Inventor: Ola Tageman
  • Patent number: 8792752
    Abstract: Provided is an optical waveguide element module which suppresses reflection of a modulation signal and attenuation of a modulation signal, even when an impedance of a modulation electrode of an optical waveguide element and an impedance of a transmission line for inputting the modulation signal from the external of the optical waveguide element are different from each other. The optical waveguide element module is provided with an optical waveguide element, which has a substrate (1) composed of a material having electro-optical effects, an optical waveguide (2) formed on the substrate, and a modulation electrode (3) which modules optical waves propagating in the optical waveguide; a connector (8), wherein an external signal line which inputs the modulation signal to the modulation electrode is connected to the modulation electrode; and a relay line which connects the connector and the modulation electrode and is formed on a relay substrate (7).
    Type: Grant
    Filed: July 3, 2009
    Date of Patent: July 29, 2014
    Assignee: Sumitomo Osaka Cement Co., Ltd.
    Inventors: Ryo Shimizu, Toru Sugamata
  • Publication number: 20140184351
    Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
    Type: Application
    Filed: December 11, 2013
    Publication date: July 3, 2014
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Hyeon Min BAE, Ha Il SONG, Huxian JIN
  • Publication number: 20140184362
    Abstract: A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers. a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, a plurality of second ground conductors provided in or on the element assembly and arranged at predetermined intervals in a direction in which the signal line extends, on a first side in a direction of lamination relative to the signal line, the second ground conductors being opposite to the signal line with at least one of the insulator layers positioned therebetween, and a plurality of first via-hole conductors extending through at least one of the insulator layers so as to connect the first and second ground conductors.
    Type: Application
    Filed: March 4, 2014
    Publication date: July 3, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Shigeru TAGO, Noboru KATO
  • Patent number: 8766748
    Abstract: On-chip high performance slow-wave microstrip line structures, methods of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a different plane than the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness such that a height of the wide portion is different than a height of the narrow portion with respect to the at least one ground.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: July 1, 2014
    Assignee: International Business Machines Corporation
    Inventors: Essam Mina, Guoan Wang, Wayne H. Woods, Jr.
  • Patent number: 8766747
    Abstract: On-chip high performance slow-wave coplanar waveguide structures, method of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a same plane as the at least one ground. The signal layer has at least one alternating wide portion and narrow portion. The wide portion extends toward the at least one ground.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: July 1, 2014
    Assignee: International Business Machines Corporation
    Inventors: Essam Mina, Guoan Wang
  • Patent number: 8760245
    Abstract: On-chip high performance slow-wave coplanar waveguide structures, method of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and signal layer provided in a same plane as the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness. The wide portion extends toward the at least one ground.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: June 24, 2014
    Assignee: International Business Machines Corporation
    Inventors: Essam Mina, Guoan Wang, Wayne H. Woods, Jr.
  • Publication number: 20140167876
    Abstract: Presently disclosed is a matching network provided from a slow wave, wrapped, tapered-transformer transmission line.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 19, 2014
    Applicant: RAYTHEON COMPANY
    Inventor: Bryan Fast
  • Patent number: 8723616
    Abstract: Provided is a waveguide-microstrip line converter, including: a waveguide; a dielectric substrate that is connected to cover one end of the waveguide; a strip conductor that is disposed on a front surface of the dielectric substrate; a conductor plate that is disposed the front surface of the dielectric substrate, and connected to the strip conductor; a ground conductor that is disposed on a rear surface of the dielectric substrate; and a plurality of connection conductors that connect a periphery of the conductor plate and the ground conductor, in which: the ground conductor has an opening formed therein in a connection region; the strip conductor and the ground conductor form a microstrip line; and the plurality of connection conductors are arranged so that a distance between two lines of the plurality of connection conductors that are aligned in a longitudinal direction of the microstrip line, and disposed on both opposing sides of the conductor plate in a vicinity of a connection portion is narrower than
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: May 13, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akimichi Hirota, Yukihiro Tahara, Naofumi Yoneda
  • Patent number: 8706050
    Abstract: There are provided a matching circuit which is less prone to impedance mismatch even with variations in pattern dimension, and a wiring board, and also a transmitter, a receiver, a transceiver, and a radar apparatus that succeed in offering stable characteristics with the installation of the matching circuit. Characteristic impedance of a first transmission line including a connection portion is varied between a reflection source including a stub portion and a bonding wire serving as a load. Impedance variation is achieved by varying a distance from the connection portion to a back conductor layer coupled thereto with respect to a distance from the stub portion and a transmission line portion to an inner conductor layer coupled to them.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: April 22, 2014
    Assignee: Kyocera Corporation
    Inventor: Nobuki Hiramatsu
  • Patent number: 8704718
    Abstract: A radiating element having a transition from a waveguide to a dipole radiator. The radiating element utilizes the electric field of electromagnetic waves propagating in the waveguide to excite a section of a microstrip transmission line that is collinear with the waveguide's propagation direction. A waveguide septum guides the electric field of the electromagnetic waves into the transmission line and provides impedance matching. The transmission line can be formed on a first side of a dielectric substrate having a ground plane on a second side of the substrate. A first dipole leg is formed by making a ninety degree turn in the transmission line. A second dipole leg is extended from the ground plane and turned opposite from the first dipole leg. The transmission line includes a transformer having stepped or gradual changes in width of the transmission line leading to the dipole to provide additional impedance matching.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: April 22, 2014
    Assignee: Honeywell International Inc.
    Inventor: Michael G. Guler
  • Publication number: 20140091884
    Abstract: A substrate integrated waveguide to air filled waveguide transition includes an electrically conductive top layer, an electrically conductive base layer spaced apart from the top layer, wherein the top and base layers each extend along a length axis from a first end to a second end of the transition, the top layer defining a width axis normal to the length axis in the plane of the top layer, and wherein a separation between the top layer and base layer increases towards the second end in a transition region, wherein the transition further includes a dielectric layer sandwiched between the top and base layers, the dielectric layer including a taper portion having a width which tapers to a point at an end point between first and second ends, the width of the taper decreasing towards the second end.
    Type: Application
    Filed: April 12, 2012
    Publication date: April 3, 2014
    Applicant: FILTRONIC PLC
    Inventor: Gary Flatters
  • Publication number: 20140077893
    Abstract: Disclosed is a substrate integrated waveguide coupler. The substrate integrated waveguide coupler according to the present invention includes: a substrate; an upper conducting plate applied to an upper portion of the substrate; a lower conducting plate applied to a lower portion of the substrate; two peripheral via holes disposed parallel to each other on both sides of the substrate, respectively, and being of a pipeline type electrically connecting the upper conducting plate and the lower conducting plate to each other; and an inner via hole disposed between the two peripheral via holes, and having a center thereof separated by a preset distance and forming a short slot functioning to couple input signals.
    Type: Application
    Filed: December 6, 2012
    Publication date: March 20, 2014
    Applicant: Electronics And Telecommunications Research Institute
    Inventors: Hong Yeol LEE, Man Seok UHM, So Hyeun YUN, Chang Soo KWAK, Jang Sup CHOI, In Bok YOM
  • Patent number: 8669829
    Abstract: A multi-octave power amplifier and related method provides an impedance matching unit configured to match impedances of a pair of balanced radio frequency (RF) signals applied thereto and output a pair of impedance-matched balanced RF signals, a converting unit configured to convert the pair of the impedance-matched balanced RF signals to an unbalanced RF signal and a compensation unit configured to compensate at least one rolled-off frequency component of the unbalanced RF signal and output a compensated RF signal.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: March 11, 2014
    Assignee: Teledyne Wireless, LLC
    Inventors: William Goumas, Yehuda Goren
  • Patent number: 8669830
    Abstract: Embodiments of the present invention are directed to providing an increased trace width when traversing a void in another layer in a printed circuit board or package design. By increasing the trace width or alternatively increasing the capacitance, the degradation due to the void can be reduced. This approach works for microstrip, stripline as well as other transmission lines that use a reference plane. The void can be the result of an antipad associated with a via, or any other disruption in an otherwise uniform reference plane.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: March 11, 2014
    Assignee: Broadcom Corporation
    Inventor: Shengli Lin
  • Publication number: 20140015623
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Application
    Filed: September 17, 2013
    Publication date: January 16, 2014
    Applicant: NUVOTRONICS, LLC
    Inventor: David Sherrer
  • Patent number: 8624693
    Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: January 7, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Noburo Kato
  • Patent number: 8598961
    Abstract: The present invention relates to a transition arrangement comprising two surface-mountable waveguide parts and a dielectric carrier material with a metallization and a ground plane provided on a respective first main side and second main side Surface-mountable waveguide parts comprise a first wall, a second wall, and a third wall, which second and third walls are arranged to contact a part of the metallization, all the walls together essentially forming a U-shape, the surface-mountable waveguide parts also comprising respective bend parts. The metallization on the first main side is removed such that a first aperture and a second aperture are formed, the apertures being enclosed by a frame of via holes electrically connecting the ground plane with the metallization, the bend parts being fitted such that the apertures permit passage of a microwave signal propagating via the bend parts. Then the dielectric carrier material itself acts as a waveguide transition between the first aperture and the second aperture.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: December 3, 2013
    Assignee: Telefonaktiebolaget L M Ericsson (publ)
    Inventors: Marcus Karl Hasselblad, Per Ligander, Simone Bastioli, Uwe Rosenberg
  • Patent number: 8586873
    Abstract: A circuit board includes a pair of differential signal lines and a pair of test point pads, one test point pad coupled to one of the signal lines and another of the test point pads coupled to another of the signal lines. The two test point pads are staggered relative to each other and the two signal lines. The circuit board includes a plurality of conductive layers and a plurality of insulating layers. The conductive layers can be etched into conductive patterns, or traces, for connecting the electronic components, which are soldered to the circuit board. The conductive layers may be selectively connected together by vias. One or more of the conductive layers may be a metal plane for providing a ground plane and/or a power plane. To minimize or eliminate the capacitance generated between the test point pad and an underlying ground plane and/or power plane, portions of the ground plane and/or the portion of the power plane directly aligned with each test point pad are removed.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: November 19, 2013
    Assignee: Flextronics AP, LLC
    Inventor: Leon Wu
  • Publication number: 20130271235
    Abstract: Provided is a coaxial waveguide converter and a ridge waveguide that are insusceptible to manufacturing variances over a broad bandwidth. The coaxial waveguide converter includes a ridge waveguide (10) including a ridge (11) and a coaxial line (20). A projection (12) projecting toward a side of a waveguide space (13) is provided in the ridge (11), an amount of projection of the projection (12) decreases gradually from an end surface of the ridge waveguide (10) on a side of the coaxial line along a waveguide direction and an inner conductor (21) of the coaxial line (20) is inserted in the through-hole (14) at a position displaced from a center of the ridge waveguide (10) in a direction perpendicular to a direction in which the projection (12) projects in the end surface of the ridge waveguide (10) on the side of the coaxial line.
    Type: Application
    Filed: November 28, 2011
    Publication date: October 17, 2013
    Applicant: NEC CORPORATION
    Inventor: Takafumi Kai
  • Patent number: 8552813
    Abstract: Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: October 8, 2013
    Assignee: Raytheon Company
    Inventors: Darin M. Gritters, Kenneth W. Brown, Andrew K. Brown, Michael A. Moore, Patrick J. Kocurek, Thomas A. Hanft
  • Patent number: 8542079
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: September 24, 2013
    Assignee: Nuvotronics, LLC
    Inventors: David W. Sherrer, Jean-Marc Rollin
  • Patent number: 8536955
    Abstract: A microwave waveguide, and a system and method related to a microwave waveguide, is described. One embodiment includes an integrated microwave waveguide comprising a waveguide block, a first waveguide section in the waveguide block, a second waveguide section in the waveguide block, a first impedance transition section integrated with the first waveguide section in the waveguide block, wherein the first impedance section comprises a first conduit with a first end and a second end, wherein the first conduit is tapered from the first end to the second end, and a second impedance transition section integrated with the second waveguide section in the waveguide block, wherein the second impedance section comprises a second conduit with a third end and a fourth end, wherein the second conduit is tapered from the third end to the fourth end, and wherein the second end of the first impedance transition section and the fourth end of the second impedance transition section are connected at an antenna stub.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: September 17, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Michael W. Stowell, Harald Gaertner
  • Patent number: 8497749
    Abstract: A low attenuation surface wave transmission line system for launching surface waves on a bare and unconditioned conductor, such as are found in abundance in the power transmission lines of the existing power grids. The conductors within the power grid typically lack dielectric and special conditioning. Accordingly, the present invention includes a first launcher, preferably including a mode converter and an adapter, for receiving an incident wave of electromagnetic energy and propagating a surface wave longitudinally on the power lines. The system includes at least one other launcher, and more likely a number of other launchers, spaced apart from one another along the constellation of transmission lines. The system and associated electric fields along any given conductor are radially and longitudinally symmetrical.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: July 30, 2013
    Assignee: Corridor Systems, Inc.
    Inventor: Glenn E. Elmore
  • Patent number: 8487711
    Abstract: The present invention relates to a transmission line to waveguide transition arrangement comprising a dielectric carrier material arrangement having a first main side and a second main side, the arrangement comprising a transition portion with an opening, having at least one edge and an electrically conducting border which follows the opening and is electrically connected to a ground metalization on the second main side. A transmission line conductor extends in the dielectric carrier material arrangement towards the border. The arrangement further comprises a transitional part with a border contact section having an outer circumference that essentially follows the border's shape except for a gap dividing the border contact section. The transitional part further comprises a conductor contact section which protrudes from the border contact section through the gap, contacting the end of the transmission line conductor and extending into the opening.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: July 16, 2013
    Assignee: Telefonaktiebolaget LM Ericsson (Publ)
    Inventors: Per Ligander, Marcus Hasselblad
  • Publication number: 20130154759
    Abstract: A waveguide includes: a waveguide portion including a first surface and a second surface that are opposed to each other; a first transmission line provided on the first surface of the waveguide portion; a second transmission line provided on the second surface of the waveguide portion; and a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.
    Type: Application
    Filed: November 29, 2012
    Publication date: June 20, 2013
    Applicant: SONY CORPORATION
    Inventor: SONY CORPORATION
  • Patent number: 8461943
    Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: June 11, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Noboru Kato
  • Patent number: 8456253
    Abstract: The invention relates to a microstrip coupler for coupling a radio frequency, RF, wave into a waveguide. The microstrip coupler comprises a conductive microstrip line having a broadened end portion, and a non-conductive slot (105) following the broadened end portion to form an antenna for irradiating the RF wave.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: June 4, 2013
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Fabio Morgia
  • Patent number: 8410863
    Abstract: There is provided a low loss slow wave transmission line that can be miniaturized. A slow wave transmission line of the present invention has a configuration which includes a repeated arrangement of a low impedance line and a high impedance line and in which the high impedance line is longer than the low impedance line in terms of a line length.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: April 2, 2013
    Assignee: Panasonic Corporation
    Inventors: Junji Satou, Shigeru Kobayashi, Michiaki Matsuo
  • Patent number: 8397566
    Abstract: An apparatus for the transfer of broadband, high-frequency signals of a center wavelength (?c), including a conductor structure, which includes at least one signal path and two reference paths arranged symmetrically to the signal path. Together the conductor structure and the two reference paths form a coplanar line, with the conductor structure being arranged on two oppositely lying sides of at least one dielectric substrate layer of a predetermined thickness in such a manner that the conductor structure overlaps in predetermined coupling regions, whereby the coupling region of the conductor structure transfers the high-frequency signals by an electromagnetic coupling, wherein the thickness of the substrate layer (18) is smaller than ?c/4, and wherein multiple electromagnetic couplings are arranged serially one after the other. The apparatus enables a galvanic isolation having good transfer properties in the case of frequencies greater than 6 GHz.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: March 19, 2013
    Assignee: Endress + Hauser GmbH + Co. KG
    Inventors: Bernhard Michalski, Qi Chen