Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit 11 with the impedance at interface 10 to further reduce loss.

Abstract: A coaxial transition arrangement including a coaxial connector for connecting a coaxial cable to a multilayer package has an improved coaxial connector for accomplishing impedance matching and providing improved broadband performance. Impedance matching is provided by a metal disk structure comprising a plurality of metal disks mounted on a center conductor pin of the coaxial connector. The disks are mounted in spaced-apart relation on the center conductor pin and have different radiuses which decrease with increasing distance from the base of the center conductor pin. The coaxial connector has a shroud which is configured to accommodate the metal disk structure therein, as does the ring of ground vias forming a part of the multilayer package.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

Abstract: The invention is an electromagnetic wave or “EM” coupler for successfully connecting EM waves between an EM generator output and a conductive pathway or “c-pathway” that is not normally considered as an EM transmission medium or line. The coupler includes a dual surface shell-like structure with an electrically conductive outer surface that is insulated from an electrically conductive inner surface that is attached at a specified location along a c-pathway. The forward end of the inside surface of the coupler is attached to the c-pathway while the outside surface of the forward end of the coupler is left unconnected and open. To provide a successful EM connection between the coupler and the c-pathway, the physical size of the coupler is configured as a physically shaped component with a relationship to the c-pathway itself rather than to the particular EM wave required to make such connectivity.

Abstract: A waveguide comprises a connecting part, a main chamber and a buffer. The connecting part is connected to the main chamber via the buffer. The side length of the junction between the connecting part and the buffer is smaller than that of the junction between the buffer and the main chamber.

Abstract: The present invention includes a waveguide for outputting radio frequency wave, a vacuum envelope provided with a slow-wave circuit, a coaxial connection part connecting the waveguide and the vacuum envelope, an insulating window member which is provided in the coaxial connection part and which hermetically seals a said of vacuum envelope and a said of waveguide, a coaxial center conductor of exterior portion with one end supported by the waveguide, and a coaxial center conductor of an interior portion with one end abutting on the slow-wave circuit and the other end connected to the coaxial center conductor of the exterior portion. The waveguide is provided with a screw part supporting the coaxial center conductor of the exterior portion movably in an axial direction of the coaxial center conductor of the exterior portion.

Abstract: A transmission line junction for a coaxial conductor line has mating ends of interfitting cores, sleeves, and dielectrics for communicating broadband signals through the junction that blocks DC currents and voltages, the junction maintaining a quarter wavelength junction length for high frequency coupling while providing improved low frequency coupling across the junction.

Abstract: Integrated circuit transmission lines are designed to match elements at opposing ends of the transmission line over a frequency range of interest. By modifying characteristics of the transmission line over the length of the transmission line, from a first end coupled to a first external element to a second end coupled to a second external element, return loss is improved. In various embodiments one or more of the width of the conductors and the distance between adjacent edges of the conductors are modified across the length of the transmission line. In an alternative embodiment, the conductors of the transmission line are segmented with each segment having a length and a width across the segment.

Abstract: Systems, devices and methods are disclosed herein for reducing crosstalk between pairs of differential signal conductors. One or more ground traces connected to one or more over- or under-lying ground planes by vias are located between pairs of differential signal conductors. The electrical shielding provided by the combination of the one or more ground traces and the one or more ground planes results in reduced cross-talk between different pairs of differential signal conductors, and facilitates high-speed data rates between integrated circuits and printed circuit boards. In a preferred embodiment, such ground traces and ground planes are employed in HiTCE packaging containing multiple pairs of differential signal conductors.

Abstract: The present invention is a system including a first transmission line oriented in a first plane and a second transmission line oriented in a second plane. Both the first transmission line and the second transmission line include a pair of rigid substrate layers, a pair of flexible substrate layers and a trace portion, the trace portion being located between the pair of flexible substrate layers, the pair of flexible substrate layers being located between the pair of rigid substrate layers. The system further includes a transition transmission line which is connected between the first transmission line and the second transmission line. The transition transmission line includes a pair of flexible substrate layers and a trace portion, the trace portion of the transition transmission line being located between the pair of flexible substrate layers of the transition transmission line.

Abstract: A coaxial waveguide converter circuit is provided for converting an input/output coaxial section of a traveling-wave tube to a waveguide. The circuit comprises a waveguide matching part for connecting an inner conductor of the coaxial section extending into the waveguide to a wall of the waveguide. The waveguide matching part includes a fitting hole for fitting the inner conductor thereinto, and a plurality of cantilever supports which define the fitting hole at leading end portions thereof. The leading end portions of the plurality of cantilever supports defining the fitting hole are uniformly kept in close contact with a peripheral surface of the inner conductor.

Abstract: A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric. First and second ground lines are proximate to the first and second dielectrics, respectively, and the ground lines are approximately parallel to the signal line. The device has a transverse cross-section that varies along the principal axis.

Abstract: A low attenuation surface wave transmission line system for launching surface waves on a bare and unconditioned conductor, such as are found in abundance in the power transmission lines of the existing power grids. The conductors within the power grid typically lack dielectric and special conditioning. Accordingly, the present invention includes a first launcher, preferably including a mode converter and an adapter, for receiving an incident wave of electromagnetic energy and propagating a surface wave longitudinally on the power lines. The system includes at least one other launcher, and more likely a number of other launchers, spaced apart from one another along the constellation of transmission lines. The system and associated electric fields along any given conductor are radially and longitudinally symmetrical.

Abstract: While gradually increasing the widths of signal lines (104a, 104b, 105a, 105b) of first and second groups of differential signal lines (104, 105) to suppress attenuation in the lines, the opening widths of slits (104s, 105s) formed in a GND layer (102) below the differential signal lines are similarly changed. Thereby, impedance matching is realized. Further, by alternately disposing a large-width side and a small-width side of the two groups of differential signal lines (104, 105), the total wiring area widths are reduced.

Abstract: A coaxial characteristic-impedance transformer for dividing RF power on a first terminal onto n second terminals situated in the same radial plane by multi-stage serial transformation via ?/4 lines is provided with a short overall size, where the ?/4 lines between the first connection and the second connections are at least partly disposed to surround each other concentrically.

Abstract: Apparatus and methods are provided that are adapted to match the impedance of an electrical load to an impedance of an electrical signal generator. The invention includes providing a plurality of electrical components adapted to collectively match the impedance of the electrical load to the impedance of the electrical signal generator. The electrical components are arranged symmetrically and concentrically about an axis. Additionally, the invention may also include a first connector adapted to electrically couple the electrical signal generator to the electrical components. Additionally, the invention may also include a second connector adapted to electrically couple the load to the electrical components. Numerous other aspects are provided.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

Abstract: A differential transmission line includes: a substrate; a ground conductor layer; and a first and a second signal conductor disposed in parallel to each other on the substrate. The first signal conductor and the ground conductor layer compose a first transmission line, whereas the second signal conductor and the ground conductor layer compose a second transmission line. The first transmission line and the second transmission line compose a differential transmission line. The differential transmission line includes two straight regions and a curved region, interconnecting the two straight regions.

Abstract: In an embodiment of the invention, a package for high frequency waves mounted by a high frequency electronic circuit comprises an hermetic box-shaped high frequency package containing a high frequency electronic circuit in the inside and shielded by a conductor, an input terminal and an output terminal partly led out to the outside of the high frequency package, an input side feed-through section having one of its opposite ends connected to the input terminal and the other end connected to the high frequency electronic circuit and having a predetermined characteristic impedance; and an output side feed-through section having one of its opposite ends connected to the output terminal and the other end connected to the high frequency electronic circuit and having a characteristic impedance lower than the characteristic impedance of the input side feed-through section as viewed from the output terminal side.

Abstract: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.

Abstract: A radial power divider-combiner is disclosed. Such a radial divider-combiner may include a plurality of waveguides, each of which extends between a central monopole antenna and a respective peripheral monopole antenna. Such a waveguide may have a central portion with a height-to-width ratio of two, and a peripheral portion having an aspect ratio of one. To improve impedance-matching, a transformer portion may be disposed between the central portion and the peripheral portion. Such a transformer portion may have any number of sections, from one to infinity, with each section having a respective height between that of the central portion and that of the peripheral portion. In the extreme case, where the number of “sections” is infinite, the height of the transformer portion may vary linearly from that of the central portion and that of the peripheral portion.

Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

Abstract: The present invention discloses to an SMA connector, a preferable embodiment of which comprises a body acting as ground, a central conductor existing in the inner part of the ground, an insulator with a predetermined dielectric constant existing between the body and the central conductor, a first step transition part formed in the body, a taper formed in the central conductor in order to improve RF characteristics and to fix the central conductor and the insulator, and a second step transition part formed in the central conductor corresponding to the first step transition part to improve RF characteristics.

Abstract: High frequency power amplification modules comprise a dielectric substrate supporting a stepped impedance transition coupled to the input of a power amplifier and a symmetrically disposed stepped impedance transition connected to the output of the power amplifier. The power amplification modules are oriented in an electromagnetic energy field so that input electromagnetic energy is coupled to the input of the power amplifier by the input side stepped impedance transition, amplified by the amplifier, and emitted from the module by the output side stepped impedance transition. A plurality of the power amplification modules may be organized into an array to provide a power combiner. The power amplification modules in the array may be linked by isolation impedances that decouple the modules in the array.

Abstract: To provide a transmission line capable of absorbing the reflection caused by mismatching between impedances and restraining the attenuation value of a signal. The following wiring patterns are formed out of a connector mounting area in which a connector is mounted: a wiring pattern designed so as to gradually increase the wiring width and the interval between wirings of a wiring portion (B) and gradually decrease the characteristic impedance of the wiring portion (B) and a wiring pattern designed so as to gradually decrease the wiring width and the interval between wirings of the wiring portion (B?) and gradually amplify the characteristic impedance of the wiring portion (B?).

Abstract: A waveguide substrate has improved signal conversion characteristic to a cavity waveguide at a post wall waveguide less suffering a manufacturing error occurring at a portion leading the signal to the cavity waveguide. The waveguide substrate has a converting part provided at a position shutting off an end of the waveguide, waveguide shutting-off conducting posts penetrating a dielectric plate to electrically conduct between conductor layers on the both surfaces of the dielectric plate, and two slit-like regions, in which no conductor layer is formed, arranged in parallel in the upper stream and the lower stream with respect to a direction of propagation of a high-frequency signal from the waveguide toward the waveguide shutting-off conducting posts.

Abstract: A signal transmission structure for connecting a coaxial cable connector is provided. The coaxial cable connector has a signal pin. The signal transmission structure includes a reference plane and a conductive layer, and the conductive layer is located on one side of the reference plane. Moreover, the conductive layer includes a signal perforated pad, a first line segment, a second line segment, and a compensation pad. The signal pin is suitable for threading the signal perforated pad. The first line segment is connected to the signal perforated pad, and the compensation pad is connected between the first line segment and the second line segment.

Abstract: A hybrid microwave-coupling device is for transmitting signals from non-radiative dielectric (NRD) waveguides to suspended striplines (SSL), and vice-versa. The two transmission lines are placed transversally with a longitudinal side of the NRD guide facing the SSL for conversion of a particular transverse electromagnetic (TEM) mode to a longitudinal section magnetic (LSM) mode.

Abstract: In one aspect, an embodiment of the invention provides a transition from a planar substrate/chip circuit microwave transmission line to waveguide transmission media on the back of the substrate/chip. The transition enables planar waveguide fed MMW ESA architectures to be realized within the tight grid spacing required for emerging MMW ESAs.

Abstract: A method and apparatus for a highpass filter structure using transmission line construction which has multiple output tabs for selection of corner frequencies utilizing a plurality of resonators coupled to the transmission line. The transmission line has a characteristic impedance which increases exponentially with respect to a distance from the input.

Abstract: A non-uniform transmission line, including at least a first section with length L1, uniform width W1 and thickness h1, and a second section with length L2, uniform width W2 and thickness h2, joined together to form a composite structure and arranged in any of at least three distinct configurations. The composite structure (first section plus second section) may be periodic or non-periodic. Length and/or width and/or thickness of each of the two sections may be varied to provide desired values for characteristic impedance, cutoff frequency and/or time delay for signal propagation.

Abstract: A multilayer interconnection board (10) comprises a dielectric substrate (11), a through-hole (15), a signal line (12) having a large width section (12A) and a small width section (12B) connected with the through-hole (15), and a ground layer (13, 14). A length L (mm) of the small width section (12B) meets the formula of 0<L?(3×1010)/(F×??), wherein, ? denotes the dielectric constant of the dielectric substrate (11) and F (Hz) denotes the frequency of a signal transmitted through the signal line (12). The ratio (W2/W1) of a line width W2 of the small width section (12B) relative to a line width W1 of the large width section (12A) is determined to be smaller as the length of a stub portion of the through-hole (15) becomes larger.

Abstract: A technique for interconnecting monolithic microwave integrated circuits (MMICS) on a substrate, and a method for fabricating substrate sections that facilitate such interconnection. A MMIC is positioned in a gap in the substrate, on which are formed conventional microwave transmission lines for purposes of MMIC interconnection. On each side of the gap, the substrate is tapered in thickness between the normal substrate thickness and the much smaller thickness of the MMIC. The transmission lines in this transition region are tapered in width as the substrate is tapered in thickness, thereby maintaining uniform transmission line characteristics, particularly the characteristic impedance of the transmission line. Small connector ribbons provide electrical connection between the tapered transmission lines and the MMIC. A method is also disclosed for fabricating multiple substrate sections for use in the structure of the invention.

Abstract: A microwave energy applicator radiating uniformly all around the applicator that maintains high efficiency Voltage Standing Wave Ratio (V.S.W.R.) for surrounding media of dielectric constants varying from about 1 to about 80. In a particular embodiment, the high efficiency V.S.W.R. is less than about 1.3:1. The applicator can include a circular polarizer connectable to a dielectric waveguide radiator. The radiator can be substantially solid and include a substantially circular outer cross-section that tapers to an end. In one embodiment, the radiator includes a conical void formed in a dielectric entry section.

Abstract: When a microstrip line is connected with a waveguide, there is a limit to reducing the connection loss by using only a matching box. We have discovered that in a transmission mode line transducer for converting between the TEM waves of the microstrip line and the TE01 waves of the waveguide, if the cross-sections of the microstrip line and the waveguide are substantially the same size, in the case of a 50? microstrip line when the characteristic impedance of the waveguide is about 80%, i.e., 40?, the line conversion loss can be optimized. Therefore, according to the present invention, the microstrip line is connected with the waveguide using a ?/4 matching box by means of a ridged waveguide having a low impedance and a length of ?/16 or less.

Abstract: The transition between a rectangular waveguide and a microstrip line consists of a ribbed rectangular waveguide realised in a foam bar in synthetic material of which the metallized base under the rib continues in the form of a foam plate constituting a substrate for the microstrip line, the rib having a base extending between the upper plane of the ribbed waveguide and the upper plane of the substrate and the microstrip line being disposed on the upper plane of the substrate in the continuation of the base of the rib.

Abstract: A segmented stub has at least one serpentine signal path that increases the effective electrical length of the stub without increasing the overall physical length or area of the stub. This permits more compact monolithic millimeter-wave and microwave integrated circuit design.

Abstract: A transmission line used in in-circuit testing point applies the impedance matching concept to optimize the line length and line width of a part of the transmission line where connects to the in-circuit testing point in order to exhibit the high impedance inductance property to approach the impedance matching for the design frequency. Therefore, the discontinuous effect caused by the low impedance property of the capacitive point can be improved.

Abstract: An arrangement for a junction between a microstripline and a waveguide is provided. The arrangement includes a microstripline fitted on the upper face of a dielectric substrate, a waveguide fitted on the upper face of the substrate and has an opening on at least one end surface and has a structure which is in the form of a step or steps in the area of the opening on one side wall and is conductively connected in at least one part to a microstripline. One side wall of the waveguide is a metallized layer formed on the substrate. A cutout is formed in the metallized layer and into which the microstripline projects. A rear-face metallization is formed on the rear face of the substrate, and electrically conductive via holes between the metallized layer on the upper face of the substrate and the rear-face metallization, which surround the cutout.

Abstract: A design for a transmission line on an over split plane structure is provided, which optimizes the line length and line width of the line segment of transmission line part connected to the over split plane structure by using a concept of impedance match, such that this part of line segment behaves with a capacitive low impedance characteristic, achieving the impedance match at a designed frequency point, and thereby eliminating a discontinuous effect caused by a high impedance characteristic of the electrical property of transmission line on the over split plane structure.

Abstract: An impedance matching feed is disclosed for use in a ridge waveguide which allows a coaxial transmission line, generally having an impedance of fifty ohm, to be matched to a ridge waveguide of arbitrary impedance. The matching feed consist of a transformer which is located inside the ridge of the waveguide, a probe and a quarter wave choke.

Abstract: A microstrip-to-microstrip RF transition circuit that employs a wide microstrip line transition to a short co-planar waveguide section. In one embodiment, a first microstrip line and a first ground plane are patterned on a top surface of a semiconductor wafer, and a second microstrip line and a second ground plane are patterned on a bottom surface of the wafer. A signal via is formed through the wafer and makes electrical contact with the first and second microstrip lines. Likewise, at least one ground via is formed through the wafer and makes electrical contact with the first and second ground planes. A widened portion of the microstrip line is positioned between extended portions of the respective ground plane so that a slot is provided between the widened portion and the extended portion.

Abstract: An interconnection includes a microcircuit package having a slot, and a receiving feature. A bead ring is fitted into the receiving feature. A center conductor extends through a dielectric support disposed in the bead ring and through the slot. The center conductor forms a coaxial transmission structure in cooperation with the bead ring and the dielectric support, and forms a slab line transmission structure in cooperation with the slot.

Abstract: A waveguide-transmission line converter has a waveguide including side walls which have inner corners at an open end of the waveguide. The inner corners are beveled to provide tapered inner surfaces. Even if a dielectric substrate is assembled out of alignment with the waveguide due to an assembling error, edges of a ground metal layer on the dielectric substrate are exposed from the beveled inner corners at the open end of the waveguide. The beveled inner corners keep the waveguide spaced widely from edges of a matching element on the dielectric substrate, preventing an electric field concentration from occurring between the waveguide and the matching element. The waveguide-transmission line converter has electromagnetic energy passing and reflecting characteristics prevented from varying.

Abstract: A method of routing or laying out signal traces on printed wire or circuit board in order to improve signal transmission quality. The method includes routing a given signal trace such that it is electrically connected to a rectangular corner of a substantially wider component pin pad and forms an angle of approximately 135 degrees with the proximate sides of the pad, thereby minimizing the impedance discontinuity at the interface or junction of the signal trace and pad and hence minimizing the reflection of the digital signal at the interface or junction.

Abstract: An impedance matching structure for a RF MEMS switch having at least one closeable RF contact in an RF line, the impedance matching structure comprising a protuberance in the RF line immediately adjacent the RF contact that forms one element of a capacitor, the other element of which is formed by the switch's ground plane.

Abstract: A distributed interconnect and a method is provided for interconnecting electrical components which minimizes coupling inductance and increases bandwidth. The interconnect includes a transmission line with a first and second conductive transmission element. The first conductive transmission element is disposed between a first and second terminal, and has an impedance characteristic that increases from the first terminal to the second terminal. The second conductive transmission element is disposed between a third and fourth terminal, and has an impedance characteristic that increases from the third terminal to said fourth terminal. The conductive transmission elements are furthermore positioned in parallel alignment with respect to each other.

Abstract: An impedance matching transformer is disclosed. The transformer includes a conductive ground plane and a dielectric substrate disposed upon the conductive ground plane. The dielectric substrate has a first end and a second end. The dielectric substrate may be of a unitary construction. A conductive current path is disposed upon the dielectric substrate. The height of the dielectric substrate at the second end is greater than the height of the dielectric substrate at the first end.

Abstract: A device for varying the capacitance of an electronic circuit is disclosed. The device comprises a flexible membrane located above the electronic circuit, a metal layer connected to the flexible membrane, and bias circuitry located above the membrane. Variation of the capacitance of the electronic circuit is obtained by pulling the membrane upwards by means of the bias circuitry. The disclosed device provides a sizeable capacitance variation and high Q factor, resulting in overall low filter insertion loss. A nearly constant group delay over a wide operating bandwidth is also obtained.

Abstract: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a first slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. By virtue of their dimensions, spacing and dielectric filler, the conductive surfaces constitute a transmission line. A second slot, also with opposing surfaces, each of which also carry a conductive surface but which are spaced differently than the opposing surfaces of the first slot, provide a second transmission line but with a different impedance. The impedances between the two transmission lines are transformed by an impedance transition section of transmission line that is slot section the dimensions of which are tapered to meet the different slot dimensions of the two different transmission line segments.