Resistance Element And/or Terminals Printed Or Marked On Base Patents (Class 338/307)
  • Patent number: 10332955
    Abstract: A semiconductor structure that includes a resistor that is located within an interconnect dielectric material layer of an interconnect level is provided. The resistor includes a diffusion barrier material that is present at a bottom of a feature that is located in the interconnect dielectric material layer. In some embodiments, the resistor has a topmost surface that is located entirely beneath a topmost surface of the interconnect dielectric material layer. In such an embodiment, the resistor is provided by removing sidewall portions of a diffusion barrier liner that surrounds a metal-containing structure. The removal of the sidewall portions of the diffusion barrier liner reduces the parasitic noise that is contributed to the sidewall portions of a resistor that includes such a diffusion barrier liner. Improved precision can also be obtained since sidewall portions may have a high thickness variation which may adversely affect the resistor's precision.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: June 25, 2019
    Assignee: International Business Machines Corporation
    Inventors: Baozhen Li, Kirk Peterson, John Sheets, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang
  • Patent number: 10312317
    Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Doo Ho Yoo, Jung Il Kim, Young Key Kim, Jung Min Nam
  • Patent number: 10312002
    Abstract: A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: June 4, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Yasuhiro Kondo, Katsuya Matsuura
  • Patent number: 10290402
    Abstract: The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: May 14, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Masaki Yoneda
  • Patent number: 10192659
    Abstract: Provided is a chip resistor in which cracks, fracture, etc. can be surely prevented from occurring due to thermal stress in solder bonding portions.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: January 29, 2019
    Assignee: KOA Corporation
    Inventors: Yasushi Akahane, Shinsuke Chihara
  • Patent number: 10153074
    Abstract: A support module (10) for polarization resistors of an on-load tap changer comprises:—a supporting region (11) for at least one polarization resistor; —a first joint region (13); —a second joint region (14) which is compatible with the first joint region. A support frame (19) for polarization resistors of an on-load tap changer comprises:—two such support modules which are joined by virtue of the second joint region of the first support module bearing at least partially against the first joint region of the second support module. A fastening element (24) for polarization resistors (22) comprises:—two electrically conductive accommodating sections (25), which each have an accommodating opening (27) for one of the ends (23) of a polarization resistor (22);—an electrically conductive connecting section (26), which connects the two accommodating sections (25) mechanically and electrically to one another;—a first piece (28.1), which comprises the first accommodating section (25.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: December 11, 2018
    Assignee: MASCHINENFABRIK REINHAUSEN GMBH
    Inventors: Robert Hiltner, Thomas Schuster, Moritz Bengler
  • Patent number: 10104776
    Abstract: A chip resistor element includes an insulating substrate, a resistor layer, first and second internal electrodes, a resistor protection layer, first and second electrode protection layers, and first and second external electrodes. The resistor layer is on the insulating substrate, the first and second internal electrodes are on respective sides of the resistor layer, and the resistor protection layer covers the resistor layer and extends onto portions of the internal electrodes. The first electrode protection layers are on the first and second internal electrodes so as to overlap with portions of the resistor protection layer and contain first conductive powder particles and resin, while the second electrode protection layers are disposed on the first electrode protection layers and contain second conductive powder particles and resin. A content of resin in the second electrode protection layer is lower than in the first electrode protection layer.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: October 16, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Seok Yun, Hyung Min Kim, Jin Man Han
  • Patent number: 9984798
    Abstract: Provided is a jumper or current detection resistor element having suppressed occurrence of connection defects resulting from the electromigration. The element (1) of the invention comprises a main body (11) consisting of a metal plate-shaped body, and terminal sections (12) provided at both ends of the main body; the terminal sections protruding from the main body, and both terminal sections provided with a mounting surface; and curved or cut surfaces (A, B, C, D, E) formed at periphery of the mounting surface. Both terminal sections are further provided with opposing surfaces at inside in direction of disposition of both terminal sections, and thickness of the opposing surfaces decreases from the mounting surface (13) to the main body (11).
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: May 29, 2018
    Assignee: KOA CORPORATION
    Inventors: Hitoshi Amemiya, Satoshi Chiku, Takanori Kikuchi
  • Patent number: 9905340
    Abstract: A method for manufacturing a chip resistive element including a substrate, a resistor formed on the substrate, and electrodes connected to opposite ends of the resistor, the method including an electrode forming step of forming the electrodes on the substrate. The electrode forming step includes a step of forming a first electrode layer on the substrate using a first electrode material containing silver, and a step of forming a second electrode layer on the first electrode layer using a second electrode material containing silver and palladium. The first electrode material has a higher silver content than the second electrode material.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: February 27, 2018
    Assignee: KOA CORPORATION
    Inventors: Sohei Koda, Yuya Takeue
  • Patent number: 9870849
    Abstract: A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: January 16, 2018
    Assignee: ROHM CO., LTD.
    Inventor: Masaki Yoneda
  • Patent number: 9633768
    Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: April 25, 2017
    Assignee: ROHM CO., LTD.
    Inventor: Masaki Yoneda
  • Patent number: 9520215
    Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: December 13, 2016
    Assignee: ROHM CO., LTD.
    Inventor: Masaki Yoneda
  • Patent number: 9166465
    Abstract: A power controller controls power to a load and includes a primary conductor, a current divider, first and second current sensors, and a controller. The primary conductor carries a primary current to the load. The current divider is connected between the primary conductor and the load and includes a first conductor and a second conductor. The second conductor has a greater impedance than the first conductor. The first current sensor provides a first output representative of the primary current, and the second current sensor provides a second output representative of a secondary current in the second conductor of the current divider. The controller determines the primary current to the load based upon the first output when the primary current is less than a threshold value, and based upon the second output when the primary current is greater than the threshold value.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: October 20, 2015
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Gregory I. Rozman, Steven J. Moss
  • Patent number: 8994491
    Abstract: There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: March 31, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Min Kim, Jung Il Kim, Ichiro Tanaka, Young Tae Kim, Heun Ku Kang
  • Patent number: 8957756
    Abstract: A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: February 17, 2015
    Assignee: Vishay Intertechnology, Inc.
    Inventors: Michael Belman, Leonid Akhtman
  • Patent number: 8956486
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: February 17, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
  • Patent number: 8854175
    Abstract: A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: October 7, 2014
    Assignee: Ralec Electronic Corporation
    Inventor: Wan-Ping Wang
  • Publication number: 20140247108
    Abstract: [Object] A chip resistor suitable for enhancing manufacturing efficiency is provided. [Means] A chip resistor includes a first electrode 1, a second electrode 2, a resistor portion 3, a first intermediate layer 4 connected to the first electrode 1 and the resistor portion 3, a second intermediate layer 5 connected to the second electrode 2 and the resistor portion 3, a coating film 61 covering the first electrode 1, and oxides existing in the first intermediate layer 4. The coating film 61 is made of a material having a higher absorptance of a laser beam of a predetermined wavelength than that of the material forming the first electrode 1. The oxides are oxides of the material forming the coating film 61.
    Type: Application
    Filed: October 12, 2012
    Publication date: September 4, 2014
    Applicant: ROHM CO., LTD
    Inventors: Torayuki Tsukada, Kentaro Naka
  • Patent number: 8754742
    Abstract: A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: June 17, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yusuke Otsuka, Yuichi Iida, Kazuo Kishida, Takahiro Takada
  • Patent number: 8698593
    Abstract: There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: April 15, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jang Ho Park, Young Key Kim, Ki Won Suh, Jang Seok Yun, Jin Man Han, Sung Jun Kim
  • Publication number: 20130321121
    Abstract: An object of the disclosure is to provide a chip resistor without causing the disconnection in atmosphere of sulfidizing gas and without precipitating silver sulfide on its surface. The chip resistor of the present disclosure includes a resistor layer disposed on a top surface of a substrate; a first upper electrode layer disposed at both sides of the resistor layer and being electrically connected to the resistor layer; and a second upper electrode layer disposed on the first upper electrode layer and including between 75% by weight and 85% by weight (inclusive) of silver particles with an average particle diameter ranging from 0.3 ?m to 2 ?m, between 1% by weight and 10% by weight (inclusive) of carbon, and a resin.
    Type: Application
    Filed: August 6, 2013
    Publication date: December 5, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Takashi OHBAYASHI, Seigo SHIRAISHI, Kazunori SAKAI
  • Patent number: 8530803
    Abstract: There is disclosed a honeycomb structure including a honeycomb structure section, and a pair of band-like electrode sections arranged on a side surface of the honeycomb structure section, an electrical resistivity of the honeycomb structure section is from 1 to 200 ?cm, in a cross section which is perpendicular to a cell extending direction, the one electrode section is disposed on an opposite side of the other electrode section via the center O, an angle which is 0.5 time as large as a central angle of the electrode section is from 15 to 65°, and each of the electrode sections is formed so as to become thinner from a center portion in a peripheral direction toward both ends in the peripheral direction, and in the cross section which is perpendicular to the extending direction of the cells, the whole outer peripheral shape is a round shape.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: September 10, 2013
    Assignee: NGK Insulators, Ltd.
    Inventors: Satoshi Sakashita, Yoshimasa Omiya
  • Patent number: 8514051
    Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: August 20, 2013
    Assignee: Vishay Intertechnology, Inc.
    Inventors: Michael Belman, Leonid Akhtman
  • Patent number: 8487736
    Abstract: Provided may be a semiconductor resistance element including resistance patterns disposed on an insulating substrate. The substrate may have first and second planar surfaces disposed in a first direction, third and fourth planar surfaces at least between the first and second planar surfaces in a second direction and fifth and sixth planar surfaces at least between the first and second planar surfaces in a third direction. The semiconductor resistance element may include a first resistance pattern configured to cover a selected one of the first and second planar surfaces and a second resistance pattern on at least one of the third through sixth planar surfaces.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: July 16, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung-Mo Hwang, Hyun-Seok Choi, Young-Chul Park
  • Patent number: 8471673
    Abstract: A varistor is provided with a varistor element body, a plurality of internal electrodes arranged in the varistor element body so as to sandwich a partial region of the varistor element body between them, and a plurality of external electrodes arranged on the surface of the varistor element body and connected to the corresponding internal electrodes. The external electrode has a sintered electrode layer formed by attaching an electroconductive paste containing an alkali metal to the surface of the varistor element body and sintering it. The varistor element body has a high-resistance region formed by diffusing the alkali metal in the electroconductive paste into the varistor element body from an interface between the surface of the varistor element body and the sintered electrode layer.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: June 25, 2013
    Assignee: TDK Corporation
    Inventors: Hitoshi Tanaka, Katsunari Moriai, Takahiro Itami
  • Patent number: 8456273
    Abstract: A chip resistor device includes: a dielectric substrate that has top and bottom surfaces and two opposite edge faces interconnecting the top and bottom surfaces; two electrodes that are formed on two opposite sides of the dielectric substrate and that cover the edge faces and parts of the top and bottom surfaces; a resistor layer that is formed on one of the top and bottom surfaces of the dielectric substrate between the electrodes and that is brought into contact with the electrodes; and a heat conductive layer that is disposed on the resistor layer oppositely of the dielectric substrate and between the electrodes, that contacts the resistor layer and the two electrodes, and that has a higher resistance than that of the resistor layer. A method for making the chip resistor device is also disclosed.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: June 4, 2013
    Assignee: Ralec Electronic Corporation
    Inventor: Full Chen
  • Patent number: 8450660
    Abstract: A system for effectively defrosting a plastic window includes a transparent plastic panel, a heater grid having a plurality of grid lines that are integrally formed with the plastic panel, and equalizing means for equalizing the electrical current traveling through each of the grid lines.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: May 28, 2013
    Assignee: Exatec LLC
    Inventors: Keith D. Weiss, Yana Shvartsman
  • Patent number: 8451085
    Abstract: A co-fired multi-layer stack chip resistor is provided. The co-fired multi-layer stack chip resistor includes a ceramic substrate and a multi-layer stack resistance structure monomer. The ceramic substrate is formed by stacking multiple layers of the ceramic membranes, wherein the ceramic membranes is formed of a bearing membrane and a porcelain slurry with the solvent, the binder and the dispersant. The multi-layer stack resistance structure monomer is stacked on the ceramic substrate, and includes multiple bearing membranes and multiple resistive layers, wherein each resistive layer is formed on the surface of the corresponding bearing membrane, the resistive layers are parallel to each other, and the contiguous resistive layers are stacked with the interval of the predetermined distance along the vertical direction.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: May 28, 2013
    Assignee: Prosperity Dielectrics Co., Ltd.
    Inventors: Yung Cheng Tsai, Ching Jen Tsai, Tung Yi Chou, Hung Chun Wu
  • Patent number: 8410891
    Abstract: The electrical multilayer component includes a base body with external electrodes and internal electrodes. A ceramic varistor layer is provided with the first internal electrode, and a dielectric layer adjoins the varistor layer. The dielectric layer has at least one opening filled with a semiconducting material or a metal.
    Type: Grant
    Filed: February 2, 2010
    Date of Patent: April 2, 2013
    Assignee: EPCOS AG
    Inventors: Thomas Feichtinger, Georg Krenn, Thomas Puerstinger
  • Patent number: 8350664
    Abstract: Provided may be a semiconductor resistance element including resistance patterns disposed on an insulating substrate. The substrate may have first and second planer surfaces disposed in a first direction, third and fourth planar surfaces at least between the first and second planar surfaces in a second direction and fifth and sixth planar surfaces at least between the first and second planar surfaces in a third direction. The semiconductor resistance element may include a first resistance pattern configured to cover a selected one of the first and second planar surfaces and a second resistance pattern on at least one of the third through sixth planar surfaces.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: January 8, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung-Mo Hwang, Hyun-Seok Choi, Young-Chul Park
  • Patent number: 8339237
    Abstract: A multilayer PTC thermistor 100 includes a ceramic body 10 having a plurality of ceramic layers 12 and internal electrodes 14 between adjacent ceramic layers 12, external electrodes 30 on the end faces 10a, 10b of the ceramic body 10, and a glass layer 20 on the surfaces 10c, 10d of the ceramic body 10, the glass layer 20 containing an oxide of at least one element selected from the group consisting of zinc and bismuth as the major component, wherein the alkali oxide content of the glass layer is no greater than 0.8 mass %.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: December 25, 2012
    Assignee: TDK Corporation
    Inventors: Takashi Kajino, Kazuhiko Itoh, Teiichi Tanaka, Atsushi Hitomi, Takashi Ota
  • Patent number: 8325005
    Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: December 4, 2012
    Assignee: Vishay International, Ltd.
    Inventors: Joseph Szwarc, Dany Mazliah, Makio Sato, Toru Okamoto
  • Patent number: 8310334
    Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: November 13, 2012
    Assignee: Cyntec, Co., Ltd.
    Inventors: Ching-Feng Chen, Kun-Hong Shih, Yen-Ting Lin, Yin-Tien Yeh
  • Patent number: 8284016
    Abstract: The present invention provides an array type chip resistor including: a substrate having a plurality of grooves formed on both sides thereof at equal spaces; lower electrodes formed on both sides of a bottom surface of the substrate; upper electrodes formed on both sides of a top surface of the substrate; side electrodes electrically connected to the upper and lower electrodes; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: October 9, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Heung Bok Ryu, Jang Ho Park, Young Key Kim, Ki Won Suh, Yun Gab Choi
  • Publication number: 20120223804
    Abstract: This invention generally relates to sensors made of granular thin films in the discontinuous phase. More particularly, the invention relates to microbolometers and displacement sensors fabricated from thin films that are close to the metal insulator transition (MIT) or metal semiconductor transition (MST) regime. Sensors of various designs have been fabricated according to the invention and may be used for deflection measurements, nano-indentation, visco-elastic measurements, topographical scanning, explosive detection, low abundance biomolecular detection, electromagnetic radiation detection and other similar detection and measurement systems.
    Type: Application
    Filed: May 11, 2012
    Publication date: September 6, 2012
    Inventor: Angelo Gaitas
  • Publication number: 20120223805
    Abstract: An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.
    Type: Application
    Filed: May 16, 2012
    Publication date: September 6, 2012
    Applicant: INK-LOGIX, LLC
    Inventors: Ronald H. Haag, Jeffrey R. Engel, William W. Boddie, JR.
  • Patent number: 8203422
    Abstract: To provide a glazed metal film resistor device excellent in TCR characteristics with using an economical base body containing glass by reducing affection to TCR characteristics caused by glass contained in the base body. The resistor device comprises base body 11 containing glass, first protective film 12, which does not contain glass, formed on a surface of base body 11, and thick film resistor 13 formed on first protective film 12. By forming first protective film 12 on a surface of base body 11 containing glass and insulating base body 11 containing glass against thick film resistor 13 of ruthenium oxide as primary component, affection of glass contained in base body 11 to thick film resistor 13 of ruthenium oxide can be suppressed, and change of TCR value from original value of thick film resistor itself can be suppressed.
    Type: Grant
    Filed: November 17, 2008
    Date of Patent: June 19, 2012
    Assignee: Koa Corporation
    Inventors: Takashi Naito, Akihiko Nakamura
  • Patent number: 8174355
    Abstract: A resistor R1 formed by forming a first resistor layer 5a of 20 nm thickness including a tantalum nitride film at a concentration of nitrogen of less than 30 at % and a second resistor layer of 5 nm thickness including a tantalum nitride film at a concentration of nitrogen of 30 at % or more successively by a reactive DC sputtering method using tantalum as a sputtering target material and using a gas mixture of argon and nitrogen as a sputtering gas, and then fabricating the first and the second resistor layers, in which the resistance change ratio of the resistor can be suppressed to less than 1% even when a thermal load is applied in the interconnection step, by the provision of the upper region at a concentration of nitrogen of 30 at % or more.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: May 8, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Takeda, Tsuyoshi Fujiwara, Toshinori Imai
  • Patent number: 8154379
    Abstract: An electrical PTC thermistor component includes a base that includes a peripheral surface, first and second faces on different sides of the component, and first and second conductive layers, each of which is on at least one of the first and second faces. The first conductive layer is not on the peripheral surface. The second conductive layer includes a cap that covers, and overlaps edges of, the at least one of the first and second faces.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: April 10, 2012
    Assignee: EPCOS AG
    Inventors: Udo Theissl, Andreas Webhofer
  • Patent number: 8081059
    Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: December 20, 2011
    Assignee: Rohm Co., Ltd.
    Inventors: Masanori Tanimura, Torayuki Tsukada, Kousaku Tanaka
  • Publication number: 20110279221
    Abstract: A resistor and a method of forming a resistor are disclosed. The method of forming a resistor in accordance with an embodiment of the present invention can include: providing an electric conductor having a resistance area in which a plurality of through-holes are formed; measuring a resistance value of the resistance area; and compensating the resistance value of the resistance area by selectively removing a portion connecting the plurality of through-holes. Since it is possible to compensate the resistance value precisely by simply removing a portion connecting through-holes, the resistance value can be readily compensated. Moreover, since most of the through-holes needed for the adjustment of the resistance value can be formed by a common process, the production cost for forming a precise resistor can be saved.
    Type: Application
    Filed: September 28, 2010
    Publication date: November 17, 2011
    Inventors: Hong-Bok WE, Won-Wook So, Jong-Heum Park, Young-Kyu Park
  • Patent number: 8044765
    Abstract: A chip resistor includes a metal resistor element made in the form of a chip that includes an upper surface, a lower surface, two end surfaces, and two side surfaces. Two electrodes are formed on the resistor element to be spaced from each other in a longitudinal direction of the resistor element. Each of the electrodes is formed directly on the resistor element and extends continuously from the lower surface onto the upper surface via a corresponding one of the two end surfaces.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: October 25, 2011
    Assignee: Rohm Co., Ltd.
    Inventor: Torayuki Tsukada
  • Patent number: 8026787
    Abstract: A ceramic component element is provided. The ceramic component element includes: an insulating ceramic base with pores formed on its surface and previously fired; and a functional ceramic sheet bonded to the insulating ceramic base and having electrical characteristics. The functional ceramic sheet is physically bonded to the insulating ceramic base by forming pressing a green sheet for the functional ceramic sheet on the insulating ceramic base at constant temperature and pressure so that parts of the green sheet are forced to put into the pores and anchored, and the functional ceramic sheet is chemically bonded to the insulating ceramic base by firing the anchored green sheet in such a manner that functional oxides of the green sheet penetrate the insulating ceramic base by solid diffusion to form a diffusion bonding layer.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: September 27, 2011
    Assignee: Joinset Co., Ltd.
    Inventors: Kwang-Hwi Choi, Seong-Soo Jo, Sun-Ki Kim
  • Patent number: 8004386
    Abstract: A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: August 23, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Chung Chen, Hung-Kun Lee, Jung-Chou Oung
  • Patent number: 7986213
    Abstract: An electrical component includes a first varistor and a second varistor. The first varistor includes first electrodes and ceramic between the first electrodes. At least part of the first electrodes overlap vertically. The second varistor includes second electrodes and ceramic between the second electrodes. The second electrodes are in a substantially same horizontal plane.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: July 26, 2011
    Assignee: Epcos AG
    Inventors: Thomas Feichtinger, Thomas Pürstinger
  • Patent number: 7982582
    Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.
    Type: Grant
    Filed: February 13, 2008
    Date of Patent: July 19, 2011
    Assignee: Vishay Intertechnology Inc.
    Inventors: Michael Belman, Leonid Akhtman
  • Patent number: 7973638
    Abstract: A voltage non-linear resistor ceramic composition has ZnO as a main component and is represented by the general formula (1?x)ZnO+x[Sr1?yMy]1?a[Co1?zAz]1+aO3. Here, M is at least one of Ca and Ba, and A is Mn or Cr. x, y, z and a indicate molar ratios, and 0.0005?x?0.10, 0?y?0.8, 0?z?0.8, and ?0.1?a?0.2 are satisfied.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: July 5, 2011
    Assignee: Panasonic Corporation
    Inventors: Eiichi Koga, Noriko Sawada
  • Patent number: 7965169
    Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: June 21, 2011
    Inventors: Joseph Szwarc, Dany Mazliah, Makio Sato, Toru Okamoto
  • Patent number: 7948355
    Abstract: An embedded resistor device includes a resistor, a ground plane located near a first side of the resistor and electrically coupled to a first end of the resistor, at the ground plane a hole is provided, a first dielectric layer exists between the resistor and the ground plane, a conductive wire, which is electrically coupled to a second end of the resistor different from the first end of the resistor and partially surrounds the resistor, is used as an auxiliary for supporting a resistor-coating process of the resistor and to provide a terminal of the embedded resistor device at the conductive wire, a conductive region located near a second side of the ground plane different from the first side of the resistor, a second dielectric layer exists between the ground plane and the conductive region, and a conductive path to electrically couple the conductive wire to the conductive region through the hole.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: May 24, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chang-Lin Wei, Chang-Sheng Chen, Cheng-Hua Tsai, Syun Yu, Chin-Sun Shyu
  • Patent number: 7940155
    Abstract: A varistor includes a ceramic substrate having an insulating property, a varistor layer provided on the ceramic substrate and mainly containing zinc oxide, a first glass ceramic layer provided on the second surface of the varistor layer, first and second internal electrodes provided in the varistor layer and facing each other. The varistor has a small, thin size, and has sufficient varistor characteristics against surge voltages. The varistor provides a small electronic component module with resistance to static electricity and surge voltages.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: May 10, 2011
    Assignee: Panasonic Corporation
    Inventors: Hidenori Katsumura, Tatsuya Inoue, Keiji Kobatashi