Resistance Element And/or Terminals Printed Or Marked On Base Patents (Class 338/307)
  • Patent number: 4954089
    Abstract: A compact terminator for interconnecting computer devices with each other and with peripheral equipment having contact ends to be interconnected with connectors. The contacts are interconnected on a circuit board employing thick film circuitry mounted thereon. The contacts are press fitted in plated through holes on the circuit board and form male or female connectors at one end. The device may be differential or single ended type.
    Type: Grant
    Filed: September 8, 1989
    Date of Patent: September 4, 1990
    Assignee: Methode Electronics, Inc.
    Inventors: William T. Jensen, Vincent B. Brown, Cathy J. Edgerton, Robert W. Masterson
  • Patent number: 4949065
    Abstract: A resistor composition containing no boride powder is obtained by mechanical grinding of at least one of silicon, silicon monoxide and higher oxidation state precursor of silicon monoxide; and a borosilicate glass containing at least one of zirconium oxide, vanadium pentoxide, chromium oxide, tungsten trioxide, molybdenum trioxide, manganese oxide, titanium oxide, niobium pentoxide and tantalum pentoxide, which are capable of being reduced with silicon, silicon monoxide or higher oxidation state precursor of silicon monoxide. In a sintering step in a non-oxidizing atmosphere, boron oxide and at least one another oxide contained in the borosilicate glass are reduced by silicon, silicon monoxide, higher oxidation state precursor of silicon monoxide or silicide, and metal elements of the oxides contained in the glass combine with each other, so that fine particles of boride are precipitated around glass particles to form a graze resistor.
    Type: Grant
    Filed: September 20, 1988
    Date of Patent: August 14, 1990
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hirotoshi Watanabe, Toru Ishida
  • Patent number: 4904980
    Abstract: This is a structure of, and method for preparation of, molybdenum resistors in a superconductor integrated circuit. It utilizes a pattern superconductor film; applying an aluminum film on the patterned superconductor film; and then applying a molybdenum film on the aluminum film to provide an aluminum-molybdenum, etch-stop interface; applying a patterned resist film on the molybdenum film; etching the exposed molybdenum film to expose a portion of the aluminum-molybdenum, etch-stop interface; and oxidizing the exposed aluminum-molybdenum, etch-stop interface. The aluminum-molybdenum etch stop interface protects the patterned superconductor film and the support (including any other underlayers) and increases processing margins for the etch time.
    Type: Grant
    Filed: August 19, 1988
    Date of Patent: February 27, 1990
    Assignee: Westinghouse Electric Corp.
    Inventors: John X. Przybysz, Joseph Buttyan
  • Patent number: 4899126
    Abstract: A thick film resistor type printed circuit board including an insulating substrate, a plurality of pairs of terminal electrode layers made of silver and formed on the insulating substrate, a plurality of resistor layers formed on the terminal electrode layers so as to connect the pairs of the terminal electrode layers, respectively, a plurality of wiring conductive layers made of copper and connected to predetermined ones of the terminal electrode layers so as to coat the predetermined ones of the terminal electrode layers and a protective layer for covering at least a portion of the insulating substrate, in which portion the terminal electrode layers and the resistor layers are formed.
    Type: Grant
    Filed: January 4, 1989
    Date of Patent: February 6, 1990
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Takeharu Yamada
  • Patent number: 4894635
    Abstract: A strain sensor including a ceramic substrate deformable in response to a stress exerted thereon, and an electrically resistive layer formed on the ceramic substrate, so that a strain of the ceramic substrate caused by the stress is detected as a change in a resistance value of the electrically resistive layer. The electrically resistive layer has a composition which includes a dielectric material selected from the group consisting of glasses and ceramics, and at least one principal electrically conductive component in the form of a powder selected from the group consisting of: borides, carbides and nitrides of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and W; borides of Y, Sc and lanthanide series; BN; B.sub.4 C; BSi; SiC; and Si.sub.3 N.sub.4.
    Type: Grant
    Filed: May 24, 1988
    Date of Patent: January 16, 1990
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasuhita Yajima, Kaszuyoshi Shitaba, Syunzo Mase
  • Patent number: 4878770
    Abstract: Process of making an IC chip with thin film resistors, and IC chips made by such process, wherein a chip substrate first is covered with layers of thin film and interconnect material (with an intermediate barrier layer if needed), such layers being etched away in predetermined regions in accordance with the metal interconnect pattern, the remaining layered material being aligned vertically, and thereafter, in a section of the remaining material, etching away the interconnect material (and barrier material if used) to expose the thin film material to form a thin film resistor which is self-aligned with the adjoining sections of interconnect conductors. The material in the predetermined regions may be etched by a dry-etch (plasma) or by a wet-etch.
    Type: Grant
    Filed: September 9, 1987
    Date of Patent: November 7, 1989
    Assignee: Analog Devices, Inc.
    Inventors: Paul A. Ruggierio, Cynthia E. Anderson
  • Patent number: 4857002
    Abstract: A compact terminator for interconnecting computer devices with each other and with peripheral equipment having contact ends to be interconnected with connectors. The contacts are interconnected on a circuit board employing thick film circuitry mounted thereon. The contacts are press fitted in plated through holes on the circuit board and form male or female connectors at one end. The device may be a differential or single ended type.
    Type: Grant
    Filed: January 18, 1984
    Date of Patent: August 15, 1989
    Assignee: Methode Electronics, Inc.
    Inventors: William T. Jensen, Vincent B. Brown, Cathy J. Edgerton, Robert W. Masterson
  • Patent number: 4806725
    Abstract: A circuit substrate, such as a thermal printing head, having electrodes made of a material suitable for soldering. The electrode to be soldered, at least in part, is composed of an alloy of Ni and Cu, whose composition ranges from 65 mol % Ni - 35 mol % Cu to 75 mol % Ni - 25 mol % Cu.
    Type: Grant
    Filed: July 9, 1987
    Date of Patent: February 21, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Yasunori Narizuka, Keiji Mori, Akira Yabushita, Tsuneaki Kamei, Mamoru Morita
  • Patent number: 4792781
    Abstract: A chip resistor having configuration and dimensions of high precision and capable of operating with high reliability. The chip resistor includes end electrodes deposited on both side end surfaces of an insulating substrate according to a thin film deposition technique and integrally formed into a substantially C-shape so as to continuously and thoroughly cover the side end surfaces of the substrate. A resistance element may be formed according to either a thick film deposition technique or a thin film deposition technique. Also, a method for manufacturing such a chip resistor is provided.
    Type: Grant
    Filed: February 17, 1987
    Date of Patent: December 20, 1988
    Assignee: TDK Corporation
    Inventors: Tetsuo Takahashi, Eisaku Miyauchi, Masayuki Yoshida, Shunichi Kumagai, Akio Sasaki
  • Patent number: 4777718
    Abstract: A resistive element is formed on a printed circuit board using only printed circuit board fabrication techniques. A substrate having a bi-metallic cladding on one side of the substrate and a conductive metallic cladding on an opposing side of the substrate is used. A predetermined trace pattern is formed in the metallic cladding. Resistive elements are formed in the bi-metallic cladding opposing their desired locations in the trace pattern. The bi-metallic cladding consists of a resistive layer between the substrate and a second conductive layer. Tabs are etched in the second conductive layer, then resistors, which couple various tabs together, are etched in the resistive layer. Plated holes connect the tabs to desired locations in the trace pattern located on the opposing side of the substrate.
    Type: Grant
    Filed: June 30, 1986
    Date of Patent: October 18, 1988
    Assignee: Motorola, Inc.
    Inventors: James M. Henderson, Ronald F. Kielmeyer, Jr.
  • Patent number: 4775850
    Abstract: In a thick-film pressure sensor comprising a support plate on at least one surface of which are deposited at least one thick-film resistor acting as a piezo-resistive transducer and at least one pair of thick-film conductors acting as rheophores, the at least one thick-film resistor and the thick-film conductors are covered with a protective layer of dielectric material.
    Type: Grant
    Filed: March 10, 1987
    Date of Patent: October 4, 1988
    Assignee: Marelli Autronica S.p.A.
    Inventors: Roberto Dell'Acqua, Giuseppina Rossi
  • Patent number: 4746838
    Abstract: An ink for use in forming resistive structures for use in a gas discharge display panel containing mercury vapor to inhibit cathode sputtering, the ink comprising a mixture of silver and nickel with the nickel being controllably oxidized to impart the desired resistivity to the mixture and the final resistive body in the display panel.
    Type: Grant
    Filed: July 30, 1986
    Date of Patent: May 24, 1988
    Assignee: Telegenix, Inc.
    Inventor: Nicholas W. Kay
  • Patent number: 4734672
    Abstract: A variable resistor circuit module in which a printed substrate having sliding resistor patterns for variable resistor formed by printing a thick organic film and a copper foil printed substrate for mounting electronic parts are prepared separately and laminated with each other by means of insulating hot melt adhesives and electroconductive heat seal connector to thereby electrically connect the copper foil soldering lands with the sliding resistor patterns and the conductive collector patterns.
    Type: Grant
    Filed: September 19, 1986
    Date of Patent: March 29, 1988
    Assignee: Alps Electric Co., Ltd.
    Inventors: Kofu Kawana, Tsutae Okuya
  • Patent number: 4733056
    Abstract: A heater backed with a ceramic substrate having a ceramic substrate as a base plate and heating element formed thereon, which comprises a conductor for retaining ionized elements, said conductor branching from a terminal lead portion of the minus side connected to the heater element under an applied electric current and extending at the back side of the base plate, along the heating element pattern at least partly thereof. A protecting layer may be provided on the surface of said conductor. The conductor is connected with the lead portion through a conducting through hole.
    Type: Grant
    Filed: August 15, 1986
    Date of Patent: March 22, 1988
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Takao Kojima, Hiroyuki Ishiguro
  • Patent number: 4728534
    Abstract: In one embodiment of the present invention a thick film resistor structure comprising common materials is disclosed. The structure includes a supporting carrier as a base for the thick film resistor arrangement, which comprises a resistive material printed on the carrier, first and second noble metal terminating layers connected to either side of the resistive material, first and second barrier layers respectively connected to the first and second noble metal terminating layers, and first and second conducting layers respectively connected to said first and second barrier layers. The barrier layers are preferably composed of nickel or tungsten, whereas the noble metal terminating layers are preferably composed of silver. The resistive material, being formed between the terminating layers, is electrically connected to said copper conducting layers to form a precise thick film resistor structure whose resistance is measurable between said conducting layers.
    Type: Grant
    Filed: August 4, 1986
    Date of Patent: March 1, 1988
    Assignee: Motorola, Inc.
    Inventors: Roland K. Ho, Richard H. Jung
  • Patent number: 4725925
    Abstract: A circuit board including resistors on one surface of a board or substrate having through hole conductors arranged in a lattice like fashion. At least one electrode is formed on a surface of the resistors, at least one electrode being formed by removing a portion of a surface of the board or substrate coaxially with the through hole conductors thereby forming substantially disk-shaped resistors.
    Type: Grant
    Filed: December 24, 1984
    Date of Patent: February 16, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Minoru Tanaka, Kazuo Hirota, Akira Murata, Fumiuki Kobayashi, Takaji Takenaka
  • Patent number: 4721845
    Abstract: In an electrically heatable automobile glass pane with heating conductors printed onto and baked into a surface, which conductors are connected to printed-on and baked-in collecting conductors, metal strips are disposed on the baked-in collecting conductors and are electrically connected with these collecting conductors. The baked-in collecting conductors and the metal strips connected with them are furnished with a plastic coating which jointly covers them and is glued to them and to the glass surface.
    Type: Grant
    Filed: September 10, 1986
    Date of Patent: January 26, 1988
    Assignee: Saint-Gobain Vitrage
    Inventors: Heinz Kunert, Gerd Sauer, Hans Ohlenforst
  • Patent number: 4719441
    Abstract: At least two electrodes (1, 2) each provided with at least one lead (5) are applied in the form of conductor tracks to a substrate. The leads (5) can be made of a material having a lower standard potential than that of the electrodes (1, 2). A dielectric (6) covers the electrode ends and, up to the contact points (4), the leads (5). As required, the electrodes (1, 2) can be designed and used as a heating electrode and/or as a temperature sensor. Moreover, the electrodes can be arranged on one side or on both sides of the substrate board (7).
    Type: Grant
    Filed: February 14, 1986
    Date of Patent: January 12, 1988
    Assignee: Navasina AG
    Inventor: Petr Horn
  • Patent number: 4703302
    Abstract: A plurality of resistors connected in a ladder format and disposed in parallel with each other. Each of the resistors has a resistance part and two mutual connection ends connected to the resistance part. The mutual connection ends are gathered at one side with respect to the resistance part.
    Type: Grant
    Filed: September 20, 1984
    Date of Patent: October 27, 1987
    Assignee: Fujitsu Limited
    Inventors: Youzi Hino, Hironobu Ogawa
  • Patent number: 4697165
    Abstract: The cermaic heater includes an elongated plate-like ceramic substrate, a resistance heating element arranged on the ceramic substrate and a pair of conductive lead members extending from the resistance heating element and having a specific resistance smaller than that of the resistance heating element. The oxygen sensor element includes a heater unit and a sensor unit, wherein the heater unit has an elongated plate-like ceramic substrate and a resistance heating element and a pair of conductive lead members arranged thereon, and the sensor unit is integrally united with the heater unit and includes an oxygen ion-conducting solid electrolyte body and reference and measuring electrodes and conductive lead members formed thereon.
    Type: Grant
    Filed: October 23, 1985
    Date of Patent: September 29, 1987
    Assignee: NGK Insulators, Ltd.
    Inventors: Fujio Ishiguro, Hideo Maeda
  • Patent number: 4691188
    Abstract: A circuit board that can be manufactured economically and reliably comprises first and second insulating films and an electrically conductive heat-seal film. Circuit patterns of first and second electrical parts are formed on the first and second insulating films, respectively. These circuit patterns are selectively connected with each other through the heat-seal film. The first insulating film has a hole in which the second insulating film is retained in such a way that the patterns on the first and second insulating films are substantially coplanar with each other.
    Type: Grant
    Filed: March 10, 1986
    Date of Patent: September 1, 1987
    Assignee: Alps Electric Co., Ltd.
    Inventors: Masamichi Watanabe, Yasushi Watanabe
  • Patent number: 4682143
    Abstract: An improved thin film resistor material is disclosed which comprises a chromium-silicon-carbon material containing from about 25 to 35 wt. % chromium, about 45 to 55 wt. % silicon, and about 20 to 30 wt. % carbon. The resistor material is further characterized by a resistivity of greater than about 800 ohms per square to less than about 1200 ohms per square, a temperature coefficient of resistance of less than 160 ppm per degree Centigrade, and a lifetime stability of less than 0.1% change in resistivity. In the preferred embodiment, the resistor material contains 31 wt. % chromium, 46 wt. % silicon, and 24 wt. % carbon.
    Type: Grant
    Filed: October 30, 1985
    Date of Patent: July 21, 1987
    Assignee: Advanced Micro Devices, Inc.
    Inventors: John W. Chu, Bradley J. Bereznak
  • Patent number: 4670734
    Abstract: A method of making a high-voltage, noninductive, film-type resistor by providing on an insulating substrate a coating of resistive material. A laser beam is then operated to cut through the coating and remove portions so shaped that the remaining coating portions form a zigzag line. The laser cutting is so effected that each zig converges toward the adjacent zag at an angle sufficiently small that there is a major inductance-cancellation effect.
    Type: Grant
    Filed: November 14, 1984
    Date of Patent: June 2, 1987
    Inventor: Richard E. Caddock
  • Patent number: 4667518
    Abstract: A high density miniature sensor circuit useful for measuring pressure changes in a fluid in a closed chamber, comprising a high density of resistor segments gapped about 0.002 inches and conductors as contact pads which conductors are permanently affixed to a ceramic substrate is disclosed.
    Type: Grant
    Filed: March 18, 1986
    Date of Patent: May 26, 1987
    Assignee: Iden Industries, Inc.
    Inventor: Lee J. Iden
  • Patent number: 4658235
    Abstract: A plurality of switching points are connected in groups to respective teral contact points via conductor strips on a keyboard printer circuit film. In order to achieve suppression of the coupling capacitances with simple means, decoupling resistor strips are printed between adjacent pairs of the conductor strips and are connected with the said conductor strips. The decoupling resistor strips consist of the same carbon resistor layer material as the terminal contact points.
    Type: Grant
    Filed: September 18, 1985
    Date of Patent: April 14, 1987
    Assignee: Preh Elektrofeinmechanische Werke, Jakob Preh, Nachf. GmbH & Co.
    Inventor: Jurgen Oelsch
  • Patent number: 4647877
    Abstract: A signal termination device is illustrated using planar circuit technology for providing both broadband capabilities from DC to over ten gigahertz while maintaining small size and high power dissipation capabilities. This is accomplished by plating a series cascade of resistors and transmission lines such that the sum of the resistors is equal to the desired termination impedance and the impedance of the interconnecting transmission lines is equal to the sum of the remaining resistors between that point and ground. The use of the intervening transmission lines enhances the power handling capability of the resistor elements and enhances uniform power densities in the resistor elements.
    Type: Grant
    Filed: March 11, 1985
    Date of Patent: March 3, 1987
    Assignee: Rockwell International Corporation
    Inventor: William J. Thompson
  • Patent number: 4534814
    Abstract: A large-scale printhead is made up of rows of styli patterned onto thin glass substrates sandwiched together between rugged support substrates, in which a series of thin glass substrate sections are internally butted one to the other. Fabrication of multiple rows of elements is accomplished by stacking the delicate styli-bearing substrates on an associated rugged substrate. In a preferred embodiment, all glass substrates are utilized, with the transparency of the glass permitting accurate alignment of the styli or nibs. The use of glass substrates also increases the wear resistance of the completed printhead. A specialized bus matrix permits reduction in the width of the substrates carrying the styli, with the bus structure being formed on a single side of the substrate carrying the styli, such that thru-holes need not be provided through the thin substrates.
    Type: Grant
    Filed: July 5, 1983
    Date of Patent: August 13, 1985
    Assignee: Dynamics Research Corporation
    Inventors: Luke Volpe, Lowell E. Thomas
  • Patent number: 4500865
    Abstract: A fluid leakage detecting element comprises a heat generating resistive member and a temperature compensating resistive member disposed on a substrate. Each of the resistive members is prepared in the form of a paste of a metal which has a high temperature coefficient and a high thermal conductivity and whose melting point is higher than the baking temperature of the substrate. These resistive members are printed in thick film form on the substrate which is sufficiently electrical insulating and has a high thermal conductivity.
    Type: Grant
    Filed: January 19, 1983
    Date of Patent: February 19, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Yoshito Tanaka, Ken Ichiryu, Naohiko Iwata
  • Patent number: 4464421
    Abstract: This invention is concerned with the fabrication of thick film, RuO.sub.2 -based resistors. More specifically, this invention is directed to the formulation of glass frits for use in such resistors exhibiting temperature coefficient of resistance values of less than 100 ppm. Such glass frits consist essentially, expressed in terms of mole percent on the oxide basis, of about 32-39% PbO, 44-47% B.sub.2 O.sub.3, 14-17% SiO.sub.2, and an effective amount up to 5% of WO.sub.3 or MoO.sub.3.
    Type: Grant
    Filed: October 28, 1983
    Date of Patent: August 7, 1984
    Assignee: Corning Glass Works
    Inventor: Robert G. Howell
  • Patent number: 4463337
    Abstract: Methods for adjusting the resistance of temperature measuring sensors are disclosed, including measuring the resistance for a first heat-sensitive portion of the sensor at a first predetermined temperature, measuring the resistance for a second heat-sensitive portion of the temperature measuring sensor at a second predetermined temperature, determining the overall resistance for the temperature measuring sensor from these measured values, and adjusting the resistance of the second heat-sensitive portion so that the overall resistance for the temperature measuring sensor substantially corresponds to the predetermined resistance value.
    Type: Grant
    Filed: April 13, 1982
    Date of Patent: July 31, 1984
    Assignee: Crafon Medical AB
    Inventor: Bo H. Hakanson
  • Patent number: 4460624
    Abstract: The invention relates to a process for the manufacture of non-linear resistors (varistors) from thick-layer ceramic material, in particular on a hybrid circuit substrate, or any other device requiring that a predetermined temperature should not be exceeded during its manufacture.According to the invention, after crushing a ceramic material in order to obtain a very fine powder of varistor material, a powder is produced of conductive or semiconductive material able to assume the pasty state at a temperature lower than C. and a binder is incorporated therein to obtain a screen printing paste. The layer deposited by screen printing on a substrate such as glass, is dried and then heat treated so as to assure cohesion of the layer. This layer is either inserted between a previously deposited electrode and another electrode, or covered by two separate electrodes. The invention is particularly applicable to matrix access display screens.
    Type: Grant
    Filed: August 31, 1982
    Date of Patent: July 17, 1984
    Assignee: Thomson-CSF
    Inventors: Michel Graciet, Annick Romann, Francois Buchy
  • Patent number: 4418474
    Abstract: Thin film resistors (FIG. 1) are produced on flexible tape 1 to provide at low cost a very wide range of precision resistors having low inductance. A reel of tape 70 coated with resistive material is etched to create a plurality of sinuous resistor patterns 3 and an array of spaced interconnection pads 102 suitable for connection to external leads via intermediate wires. Formation of a resistor of the desired precision value is performed by a selection of two pads, preferably by automated means by a trial and error technique. Prior to pad selection, the resistor can be covered with a material 4 which provides stability of resistance, mechnical protection and facilitation of assembly.
    Type: Grant
    Filed: June 25, 1980
    Date of Patent: December 6, 1983
    Inventor: William P. Barnett
  • Patent number: 4410874
    Abstract: A ceramic substrate includes a multiplicity of alternately screened and fired conductor and dielectric levels, with interconnections between levels through small via holes in the dielectric layers or alternately by means of crossovers. Thick film resistors are incorporated throughout the ceramic substrate, wherever needed, and the thick film resistors are printed and trimmed through windows which extend through any upper layers. In addition, resistors may be printed directly on top of the dielectric layers where necessary. Selective area hermetic sealing is utilized only for those chips and wire bonds which require environmental protection by placement of a ring frame seal encircling the selected area and over insulation on substrate conductors which are routed directly beneath the sealing area. A lid is directly soldered to the frame and, before final sealing, a proper environment is created within a sealed area.
    Type: Grant
    Filed: June 17, 1982
    Date of Patent: October 18, 1983
    Assignee: Hughes Aircraft Company
    Inventors: Robert Y. Scapple, Frank S. Keister, Robert G. Grieger, Richard P. Himmel
  • Patent number: 4368252
    Abstract: In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.
    Type: Grant
    Filed: November 25, 1981
    Date of Patent: January 11, 1983
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Takeshi Kakuhashi, Yasufumi Miyake
  • Patent number: 4359277
    Abstract: The present invention relates to a camera with the main circuit boards and the sub-circuit boards comprising electrical circuit constructions having resistance-conductor laminated constructions so designed that the insulating support on which a resistance material layer and a conductor material layer are laminated are processed by means of selective etching. This is done in such a manner that the resistance members are constituted with the resistance material layer while the conductor parts such as wiring, terminals and so on are constituted with the conductor material layer.
    Type: Grant
    Filed: July 23, 1980
    Date of Patent: November 16, 1982
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masami Shimizu, Junji Omi, Kunio Watanabe, Masanori Uchidoi, Hiroshi Aizawa
  • Patent number: 4350741
    Abstract: Resistor elements made by co-molding of film-resistors comprising conductive powder and polyimide resin and a diallyl isophthalate substrate containing more than 500 ppm inhibitors have good thermal stability and smooth surfaces, and are especially suitable for long life potentiometers for high temperature uses.
    Type: Grant
    Filed: November 14, 1980
    Date of Patent: September 21, 1982
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yo Hasegawa, Shigeru Yasuda, Kunio Kojima
  • Patent number: 4331949
    Abstract: A thick film printed circuit in which a plurality of electrode patterns are disposed with approximately equal spaced intervals between one another, resistance patterns having approximately equal widths are mounted between adjacent electrode patterns of said plurality of electrode patterns, and an identical shaped resistance pattern to said resistance pattern is provided so as to align in parallel with at least one of said resistance patterns, whereby exact divided potential can be obtained.
    Type: Grant
    Filed: August 7, 1980
    Date of Patent: May 25, 1982
    Assignee: Alps Electric Co., Ltd.
    Inventor: Yoshii Kagawa
  • Patent number: 4323726
    Abstract: An electroconductive laminated window having an electroconductive coating applied to one interior substrate surface with a pair of bus bars electrically connecting a source of electrical potential thereto. The bus bars include an electroconductive layer having volume resistivity less than about 10.sup.-2 ohm-cm interposed between and conformable to the surface configurations of the electroconductive coating and a flexible metallic current carrying member. The metallic current carrying member is preferably a mesh of thin copper foil which is substantially bendable in its own plane, and the electroconductive layer is preferably a metallic layer substantially free of non-metallic components, consisting of a mixture of finely divided electroconductive particles and finely divided metal alloy particles having a fusion temperature between about C. and about C.
    Type: Grant
    Filed: July 24, 1980
    Date of Patent: April 6, 1982
    Assignee: PPG Industries, Inc.
    Inventors: Russell C. Criss, Edward J. Stofka
  • Patent number: 4316942
    Abstract: A method for producing a thick film circuit (30) including a copper conductor pattern (19), thereby obviating the need for expensive precious metal compositions. In the process, a fritted copper paint (16) is applied to a ceramic substrate (18) and fired at a temperature of C. to C. and is oxidized. Concurrently, the paint (16) is adhesively joined to the nonreactive and nonconductive ceramic substrate (18). Next, a resistor paint (20) is applied in overlapping relationship with the air-heated copper conductor pattern (19) and fired at C. to C. The entire unit is then fired in a reducing atmosphere at a temperature of C. to C. to reduce the oxidized copper. The air-fired resistor pattern (21) can either be protected by a coating (40) or unprotected during the reducing atmosphere firing.
    Type: Grant
    Filed: October 6, 1980
    Date of Patent: February 23, 1982
    Assignee: CTS Corporation
    Inventor: Charles C. Y. Kuo
  • Patent number: 4311980
    Abstract: A pressure measurement device and a method for making it are disclosed. A plurality of thick-film resistors are screen-printed onto a deformable substrate, after which they are preferably fired. The resistors are then connected to circuitry for measuring changes in their respective resistances due to deformation of the substrate by an external force or pressure to be measured.
    Type: Grant
    Filed: September 21, 1979
    Date of Patent: January 19, 1982
    Assignee: Fabrica Italiana Magneti Marelli, S.p.A.
    Inventor: Maria Prudenziati
  • Patent number: 4310812
    Abstract: An attenuator and termination having a relatively flat frequency response r attenuating and dissipating electrical energy is comprised of a plurality of cascaded tee attenuator sections formed on a substantially flat surface ceramic substrate comprised of alumina, for example. The attenuator sections are configured from a single thin film series resistor comprised of gold and a plurality of shunt resistors formed from a layer of cermet which underlies the gold film resistor. The cermet shunt resistors extend away from the series resistor to the side edge of the substrate where they terminate in a ground contact configuration which wraps around the side and lower surface of the substrate.
    Type: Grant
    Filed: August 18, 1980
    Date of Patent: January 12, 1982
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Roger C. DeBloois
  • Patent number: 4282507
    Abstract: This invention relates to devices for measuring temperature; more particularly it relates to temperature sensing devices operating at high temperature. It is an object of this invention to overcome deterioration of temperature sensitive elements and accordingly the element of the invention comprises a substrate made from an electrically non-conducting material and carrying an electrically conducting path comprising a vitreous phase which is resistant to chemical reduction and loaded with electrically conducting particles.
    Type: Grant
    Filed: September 13, 1978
    Date of Patent: August 4, 1981
    Assignee: Johnson, Matthey & Co., Limited
    Inventors: Richard F. Tindall, Eric R. Baddeley, Peter W. Rudd
  • Patent number: 4267634
    Abstract: The present method and device provides that a thickness of wet ceramic material is laid down and partially dried to provide a base. This step is followed by screen printing one or more patterns of electrical resistance material on the upper surface of the partially dried ceramic base. Thereafter a second thickness of said wet ceramic is laid down and partially dried. In the event that the fabricator desires to provide a plurality of resistance paths, or a capacitor, in a single package, the foregoing process can be repeated with additional patterns of resistance material laid down or conductor material for a capacitor laid down, on the upper layer of partially dried ceramic material. The resistance or conductor patterns are sandwiched by additional thicknesses of ceramic materials screen stacked thereon. When the desired package has been achieved, the multi layered arrangement is given a final drying and it is then diced and fired.
    Type: Grant
    Filed: April 5, 1978
    Date of Patent: May 19, 1981
    Assignee: American Components Inc.
    Inventor: Charles L. Wellard
  • Patent number: 4227039
    Abstract: Deposited on a glass or ceramic substrate for a thin-film microcircuit board such as a hybrid IC board or a transparent electrode is a thin-film laminate, which comprises a dispersion metal thin-film dispersible and evaporable upon application of an energy above a threshold value and an electrical property-imparting film defining a conductor or a resistor. Then a high intensity of light having an energy sufficient to cause dispersion is applied selectively on the thin-film laminate, thereby removing exposed portions of the thin-film laminate as a result of dispersion and evaporation thereof. Unexposed portions of the thin-film laminate provide a desired pattern. The electrical property-imparting film is a thin-film of noble metal such as gold, silver or platinum or a thin film of transparent electrode material such as SnO.sub.2 or In.sub.2 O.sub.3, which is not easily dispersible upon application of the above energy.
    Type: Grant
    Filed: October 23, 1978
    Date of Patent: October 7, 1980
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Ichiro Shibasaki, Kaoru Ohmura, Takeo Kimura, Hidehiko Kobayashi
  • Patent number: 4220944
    Abstract: A resistance transducer with a non-linear characteristic curve, which transmitter has a resistance track with a variable cross-section on an insulating carrier and a slider engaging on the resistance track. On the resistance track on the insulating carrier of a thick layer system at least one additional layer is applied by the same technology made of a conducting resistor substance, and shaped such that it forms a rib which extends in a direction of movement of the wiper, the rib tapering outwardly perpendicularly thereto, and the wiper transversely engages the rib to form an approximately point-like contact surface.
    Type: Grant
    Filed: January 22, 1979
    Date of Patent: September 2, 1980
    Assignee: VDO Adolf Schindling AG
    Inventors: Heinz Pudelko, Gerhard Kallweit
  • Patent number: 4216444
    Abstract: A step adjustable attenuator comprising a silicon substrate on one face of which are deposited thin film-type resistors and electrical conductors by which the resistors are interconnected. Contact points are arranged at the periphery of the substrate and connected to the resistors. However, the attenuating sections are not interconnected on the substrate. A conductive pattern prepared from a conductive film forms finger-like leads of which inner portions are bonded to the contact points. By its shape, the pattern ensures the interconnections between the sections and forms two rows of outputs, one for the connections on the printed-circuit board on which is implanted the attenuator and the other being associated with displaceable straps enabling attenuation to be adjusted.
    Type: Grant
    Filed: September 14, 1978
    Date of Patent: August 5, 1980
    Assignee: Thomson-CSF
    Inventors: Claude Vergnolle, Christian Val
  • Patent number: 4204107
    Abstract: A thermal printing head which effects printing on thermally sensitive paper with Joule's heat generated by passing a current through a thick-film resistor is featured by the surface configuration of the thick-film resistor. In a cross-section perpendicular to the direction of the current passing through the resistor, the resistor is formed in such shape that the center portion is lower than the opposite edge portions. Owing to such concave top surface, despite of the fact that the heating resistor is a thick-film resistor, printing of high quality that is compatible to printing quality by a thin-film resistor can be accomplished. A practically useful thermal head having the resistors with the concave top surface can be realized through the photo-resist pattern technique combined with the screen printing technique.
    Type: Grant
    Filed: May 31, 1978
    Date of Patent: May 20, 1980
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Toshio Ohkubo, Yuji Kajiwara, Tsutomu Itano
  • Patent number: 4204187
    Abstract: In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.
    Type: Grant
    Filed: March 7, 1978
    Date of Patent: May 20, 1980
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Takeshi Kakuhashi, Yasufumi Miyake
  • Patent number: 4150280
    Abstract: A flat plate surface heating unit or cooktop having a solid utensil-supporting plate that is heated by a resistive foil heating element that is bonded to a flexible, ceramic fiber paper substrate by a high temperature inorganic cement of high thermal conductivity and high electrical resistivity. The cement is formed in an electrically insulating layer that overlies the foil, and this cement hardens before the cement surface is applied against the underside of the cover plate so that the cement is not bonded to the cover plate. The soft, fibrous nature of the ceramic fiber paper substrate allows free expansion of the foil during thermal cycling. The relatively high thermal conductivity layer provides good heat transfer from the foil heating element to the utensil-supporting plate for improved efficiency.
    Type: Grant
    Filed: April 4, 1977
    Date of Patent: April 17, 1979
    Assignee: General Electric Company
    Inventor: Bohdan Hurko
  • Patent number: 4146322
    Abstract: The control part of the slide member in contact with electrodes of a variable resistance with resistance members and a plural number of electrodes is made larger than the insulation part between two adjacent electrodes so as to secure the conductivity between the electrodes and the slide member. The form of the slide member and the space provided between each electrode part with respect to other such parts satisfy a predetermined mathematical relationship.
    Type: Grant
    Filed: March 30, 1977
    Date of Patent: March 27, 1979
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masami Shimizu, Junji Omi, Kunio Watanabe, Masanori Uchidoi, Hiroshi Aizawa