Abstract: R.F. sputtered nickel in silica films containing 64 to 70 atomic percent nickel are employed as electrical resistance elements in a resistance thermometer for measuring temperatures of 50.degree. K and less.

Abstract: A high temperature low density operating element includes a porous high temperature operating element film formed into a predetermined configuration and disposed on one surface of an insulating member with good heat conductivity, a resistive film with a high melting point and good heat conductivity having a higher density than the high temperature operating element film, formed into a predetermined configuration on a second surface of the insulating member with good heat conductivity, a lead wire connected to the resistive film, an insulating protective film disposed on the insulating member covering the resistive film.

Abstract: A circuit board includes an insulative ceramic substrate, electrode portions and wiring portions formed on the ceramic substrate by selectively removing portions of a conductor layer plated on said ceramic substrate, a resistor layer formed on the ceramic substrate and connected to the electrode portions, and a pair of connecting thick film conductors for electrically connecting the thick film resistor and the conductor layer on both ends of the thick film resistor. The resistor layer includes a thick film resistor which is formed on the ceramic substrate. The conductor layer and the thick film resistor each have an end portion which is formed directly on the same connecting thick film conductor.

Abstract: The chip form electrical resistance is designed to be soldered notably on a printed circuit card or on an hybrid circuit substratum. It includes an electrically insulating substratum (1) of the ceramic type, to which is attached by a layer of adhesive organic resin (2) a sheet of metal or of resistive alloy (3) which is engraved to provide a sinuous resistance. The layer of resin (6) leaves in the area of the two opposite sides of the substratum (1), two free areas (5), at the extremities of the engraved resistive sheet (3).

Abstract: A diffusion resistor circuit for reducing distortion caused in a diffusion resistor. The circuit includes the diffusion resistor having a substrate, an island area including an impurity of a first polarity diffused into the substrate and a resistor area including an impurity of a second polarity diffused into the island area, a circuit for supplying a current signal through the resistor area and another circuit connecting the island area to a generally central point of the resistor area for reducing distortion of the current signal.

Abstract: A sliding electric part includes a set of two sliding members, wherein one of the sliding members is composed of a diamond substrate with an electric conductive portion formed by ion implanation or by the deposition of boron-doped p-type diamond on the sliding surface which slides along the other sliding member, and the other sliding member has an electric conductive portion formed on the sliding surface which slides along the one sliding member.

Abstract: A Josephson integrated circuit comprises a substrate formed with a Josephson device, a resistance strip of zirconium provided on the substrate, a first refractory metal layer provided on a first region of the resistance strip; a second refractory metal layer provided on a second region of the resistance strip that is separated from said first region, a first superconductor interconnection pattern provided on the substrate so as to cover the first refractory metal layer, and a second superconductor interconnection pattern separated from the first superconductor interconnection pattern and provided on the substrate so as to cover the second refractory metal layer.

Abstract: A programmable resistor 10 is provided having a resistive element 12. Resistive element 12 includes a substrate 26 formed by a layer of semiconductor of a first conductivity-type. A current path 32 is formed in substrate 26 by a layer of semiconductor of a second conductivity-type. An interface 36 having interfacial traps is formed between current path 32 and substrate 26. A backgate 24 is formed adjacent substrate 26. A first switch 14 selectively couples backgate 24 to a first voltage while a second switch 16 selectively couples backgate 24 to a second voltage.

Abstract: A resistor device includes a thick-film resistor which includes a mixture of electrical conductive material and glass, and which has the electrical conductive material at a surface portion exposed; and electrodes which are deposited on the thick-film resistor to be connected to the exposed electrical conductive material.

Abstract: A resistor constituted by a spiral region (4) of a second conductivity type and having a determined doping level, formed on a first surface of a semiconductor substrate (1) of the first conductivity type, having a first terminal on the first surface of the substrate and a second terminal electrically connected to the opposite surface of the substrate through an overdoped region of the same conductivity type as the substrate, more conductive areas (11) being formed at determined places of the spiral.

Abstract: A dual function circuit board substrate has a layer or sheet of ultrathin metal of relatively high electrical resistivity having a selected sheet resistivity characteristic bonded to a thin layer or sheet of metal of relatively high electrical conductivity. The layer of high electrical resistivity material is adhered to one side of a layer of organic electrically insulating material, and a heat-sink metal layer is adhered to an opposite side of the organic insulating layer to withdraw heat from the layer of high electrical resistivity material. The thin layers of high electrical resisivity and conductivity materials are selectively etched from the organic layer material to form a select circuit, and the layer of high electrical conductivity material is selectively etched from portions of the circuit to form one or more resistor elements having selected electrical resistances in the circuit.

Abstract: This is a structure of, and method for preparation of, molybdenum resistors in a superconductor integrated circxuit. It utilizes a pattern superconductor film; applying a titanium film on the patterned superconductor film; and then applying a molybdenum film on the titanium film to provide a titanium-molybdenum, etch-stop interface; applying a patterned resist film on the molybdenum film; etching the exposed molybdenum film to expose a portion of the titanium-molybdenum, etch-stop interface; and oxidizing the exposed titanium-molybdenum, etch-stop interface. The titanium-molybdenum etch stop interface protects the patterned superconductor film and the support (including any other underlayers) and increases processing margins for the etch time.

Abstract: A printed circuit board has a base made from fibers (e.g., ceramic) and an inorganic coating (e.g., silicon carbide) covering the fibers to provide the base with inorganic properties. The base may have a particular coefficient of thermal expansion (CTE) as by providing the fibers with particular characteristics in the plane of, and perpendicular to, the base. The base may be isotropic thermally as by disposing the fibers in two adjacent transverse layers. An inorganic material (e.g. copper) on the base provides a radio frequency barrier. An inorganic material (e.g., silicon dioxide) on the RF barrier constitutes a dielectric insulator. An electrically conductive layer (eg. copper) partially covers the dielectric layer in a pattern defining an electrical circuit. A dielectric material (eg., silicon dioxide) fills the remaining space in this layer in a flush relationship with the conductive layer.

Abstract: A thin film thermistor which includes an insulating substrate (21A), a Au-Pt fired electrode film (22A) in a particular comb-shaped pattern on the insulating substrate, with a little amount of oxide being added in the electrode film (22A), and a SiC thin film (23A) which is formed by sputtering on the substrate (21A) on which the electrode film (22A) is previously formed.

Abstract: A resistor (10) includes a resistive filling (28) formed within a trench (12) and separated therefrom by an insulating layer (26). Resistive filling (28) is of the same type of semiconductor material as that of second layer (22), but of an opposite extreme of dopant concentration. A head region (32) may be formed below interface (30) within second layer (22) to more clearly delineate the edge of resistive filling (28) from second layer (22). Where resistive filling (28) is of a low dopant concentration, low resistance contact region (34) is formed of a high dopant concentration in order to provide a minimum resistance contact to resistive filling (28).

Abstract: A compact terminator for interconnecting computer devices with each other and with peripheral equipment having contact ends to be interconnected with connectors. The contacts are interconnected on a circuit board employing thick film circuitry mounted thereon. The contacts are press fitted in plated through holes on the circuit board and form male or female connectors at one end. The device may be differential or single ended type.

Abstract: A resistor composition containing no boride powder is obtained by mechanical grinding of at least one of silicon, silicon monoxide and higher oxidation state precursor of silicon monoxide; and a borosilicate glass containing at least one of zirconium oxide, vanadium pentoxide, chromium oxide, tungsten trioxide, molybdenum trioxide, manganese oxide, titanium oxide, niobium pentoxide and tantalum pentoxide, which are capable of being reduced with silicon, silicon monoxide or higher oxidation state precursor of silicon monoxide. In a sintering step in a non-oxidizing atmosphere, boron oxide and at least one another oxide contained in the borosilicate glass are reduced by silicon, silicon monoxide, higher oxidation state precursor of silicon monoxide or silicide, and metal elements of the oxides contained in the glass combine with each other, so that fine particles of boride are precipitated around glass particles to form a graze resistor.

Abstract: This is a structure of, and method for preparation of, molybdenum resistors in a superconductor integrated circuit. It utilizes a pattern superconductor film; applying an aluminum film on the patterned superconductor film; and then applying a molybdenum film on the aluminum film to provide an aluminum-molybdenum, etch-stop interface; applying a patterned resist film on the molybdenum film; etching the exposed molybdenum film to expose a portion of the aluminum-molybdenum, etch-stop interface; and oxidizing the exposed aluminum-molybdenum, etch-stop interface. The aluminum-molybdenum etch stop interface protects the patterned superconductor film and the support (including any other underlayers) and increases processing margins for the etch time.

Abstract: A thick film resistor type printed circuit board including an insulating substrate, a plurality of pairs of terminal electrode layers made of silver and formed on the insulating substrate, a plurality of resistor layers formed on the terminal electrode layers so as to connect the pairs of the terminal electrode layers, respectively, a plurality of wiring conductive layers made of copper and connected to predetermined ones of the terminal electrode layers so as to coat the predetermined ones of the terminal electrode layers and a protective layer for covering at least a portion of the insulating substrate, in which portion the terminal electrode layers and the resistor layers are formed.

Abstract: A strain sensor including a ceramic substrate deformable in response to a stress exerted thereon, and an electrically resistive layer formed on the ceramic substrate, so that a strain of the ceramic substrate caused by the stress is detected as a change in a resistance value of the electrically resistive layer. The electrically resistive layer has a composition which includes a dielectric material selected from the group consisting of glasses and ceramics, and at least one principal electrically conductive component in the form of a powder selected from the group consisting of: borides, carbides and nitrides of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and W; borides of Y, Sc and lanthanide series; BN; B.sub.4 C; BSi; SiC; and Si.sub.3 N.sub.4.

Abstract: Process of making an IC chip with thin film resistors, and IC chips made by such process, wherein a chip substrate first is covered with layers of thin film and interconnect material (with an intermediate barrier layer if needed), such layers being etched away in predetermined regions in accordance with the metal interconnect pattern, the remaining layered material being aligned vertically, and thereafter, in a section of the remaining material, etching away the interconnect material (and barrier material if used) to expose the thin film material to form a thin film resistor which is self-aligned with the adjoining sections of interconnect conductors. The material in the predetermined regions may be etched by a dry-etch (plasma) or by a wet-etch.

Abstract: A compact terminator for interconnecting computer devices with each other and with peripheral equipment having contact ends to be interconnected with connectors. The contacts are interconnected on a circuit board employing thick film circuitry mounted thereon. The contacts are press fitted in plated through holes on the circuit board and form male or female connectors at one end. The device may be a differential or single ended type.

Abstract: A circuit substrate, such as a thermal printing head, having electrodes made of a material suitable for soldering. The electrode to be soldered, at least in part, is composed of an alloy of Ni and Cu, whose composition ranges from 65 mol % Ni - 35 mol % Cu to 75 mol % Ni - 25 mol % Cu.

Abstract: A chip resistor having configuration and dimensions of high precision and capable of operating with high reliability. The chip resistor includes end electrodes deposited on both side end surfaces of an insulating substrate according to a thin film deposition technique and integrally formed into a substantially C-shape so as to continuously and thoroughly cover the side end surfaces of the substrate. A resistance element may be formed according to either a thick film deposition technique or a thin film deposition technique. Also, a method for manufacturing such a chip resistor is provided.

Abstract: A resistive element is formed on a printed circuit board using only printed circuit board fabrication techniques. A substrate having a bi-metallic cladding on one side of the substrate and a conductive metallic cladding on an opposing side of the substrate is used. A predetermined trace pattern is formed in the metallic cladding. Resistive elements are formed in the bi-metallic cladding opposing their desired locations in the trace pattern. The bi-metallic cladding consists of a resistive layer between the substrate and a second conductive layer. Tabs are etched in the second conductive layer, then resistors, which couple various tabs together, are etched in the resistive layer. Plated holes connect the tabs to desired locations in the trace pattern located on the opposing side of the substrate.

Abstract: In a thick-film pressure sensor comprising a support plate on at least one surface of which are deposited at least one thick-film resistor acting as a piezo-resistive transducer and at least one pair of thick-film conductors acting as rheophores, the at least one thick-film resistor and the thick-film conductors are covered with a protective layer of dielectric material.

Abstract: An ink for use in forming resistive structures for use in a gas discharge display panel containing mercury vapor to inhibit cathode sputtering, the ink comprising a mixture of silver and nickel with the nickel being controllably oxidized to impart the desired resistivity to the mixture and the final resistive body in the display panel.

Abstract: A variable resistor circuit module in which a printed substrate having sliding resistor patterns for variable resistor formed by printing a thick organic film and a copper foil printed substrate for mounting electronic parts are prepared separately and laminated with each other by means of insulating hot melt adhesives and electroconductive heat seal connector to thereby electrically connect the copper foil soldering lands with the sliding resistor patterns and the conductive collector patterns.

Abstract: A heater backed with a ceramic substrate having a ceramic substrate as a base plate and heating element formed thereon, which comprises a conductor for retaining ionized elements, said conductor branching from a terminal lead portion of the minus side connected to the heater element under an applied electric current and extending at the back side of the base plate, along the heating element pattern at least partly thereof. A protecting layer may be provided on the surface of said conductor. The conductor is connected with the lead portion through a conducting through hole.

Abstract: In one embodiment of the present invention a thick film resistor structure comprising common materials is disclosed. The structure includes a supporting carrier as a base for the thick film resistor arrangement, which comprises a resistive material printed on the carrier, first and second noble metal terminating layers connected to either side of the resistive material, first and second barrier layers respectively connected to the first and second noble metal terminating layers, and first and second conducting layers respectively connected to said first and second barrier layers. The barrier layers are preferably composed of nickel or tungsten, whereas the noble metal terminating layers are preferably composed of silver. The resistive material, being formed between the terminating layers, is electrically connected to said copper conducting layers to form a precise thick film resistor structure whose resistance is measurable between said conducting layers.

Abstract: A circuit board including resistors on one surface of a board or substrate having through hole conductors arranged in a lattice like fashion. At least one electrode is formed on a surface of the resistors, at least one electrode being formed by removing a portion of a surface of the board or substrate coaxially with the through hole conductors thereby forming substantially disk-shaped resistors.

Abstract: In an electrically heatable automobile glass pane with heating conductors printed onto and baked into a surface, which conductors are connected to printed-on and baked-in collecting conductors, metal strips are disposed on the baked-in collecting conductors and are electrically connected with these collecting conductors. The baked-in collecting conductors and the metal strips connected with them are furnished with a plastic coating which jointly covers them and is glued to them and to the glass surface.

Abstract: At least two electrodes (1, 2) each provided with at least one lead (5) are applied in the form of conductor tracks to a substrate. The leads (5) can be made of a material having a lower standard potential than that of the electrodes (1, 2). A dielectric (6) covers the electrode ends and, up to the contact points (4), the leads (5). As required, the electrodes (1, 2) can be designed and used as a heating electrode and/or as a temperature sensor. Moreover, the electrodes can be arranged on one side or on both sides of the substrate board (7).

Abstract: A plurality of resistors connected in a ladder format and disposed in parallel with each other. Each of the resistors has a resistance part and two mutual connection ends connected to the resistance part. The mutual connection ends are gathered at one side with respect to the resistance part.

Abstract: The cermaic heater includes an elongated plate-like ceramic substrate, a resistance heating element arranged on the ceramic substrate and a pair of conductive lead members extending from the resistance heating element and having a specific resistance smaller than that of the resistance heating element. The oxygen sensor element includes a heater unit and a sensor unit, wherein the heater unit has an elongated plate-like ceramic substrate and a resistance heating element and a pair of conductive lead members arranged thereon, and the sensor unit is integrally united with the heater unit and includes an oxygen ion-conducting solid electrolyte body and reference and measuring electrodes and conductive lead members formed thereon.

Abstract: A circuit board that can be manufactured economically and reliably comprises first and second insulating films and an electrically conductive heat-seal film. Circuit patterns of first and second electrical parts are formed on the first and second insulating films, respectively. These circuit patterns are selectively connected with each other through the heat-seal film. The first insulating film has a hole in which the second insulating film is retained in such a way that the patterns on the first and second insulating films are substantially coplanar with each other.

Abstract: An improved thin film resistor material is disclosed which comprises a chromium-silicon-carbon material containing from about 25 to 35 wt. % chromium, about 45 to 55 wt. % silicon, and about 20 to 30 wt. % carbon. The resistor material is further characterized by a resistivity of greater than about 800 ohms per square to less than about 1200 ohms per square, a temperature coefficient of resistance of less than 160 ppm per degree Centigrade, and a lifetime stability of less than 0.1% change in resistivity. In the preferred embodiment, the resistor material contains 31 wt. % chromium, 46 wt. % silicon, and 24 wt. % carbon.

Abstract: A method of making a high-voltage, noninductive, film-type resistor by providing on an insulating substrate a coating of resistive material. A laser beam is then operated to cut through the coating and remove portions so shaped that the remaining coating portions form a zigzag line. The laser cutting is so effected that each zig converges toward the adjacent zag at an angle sufficiently small that there is a major inductance-cancellation effect.

Abstract: A high density miniature sensor circuit useful for measuring pressure changes in a fluid in a closed chamber, comprising a high density of resistor segments gapped about 0.002 inches and conductors as contact pads which conductors are permanently affixed to a ceramic substrate is disclosed.

Abstract: A plurality of switching points are connected in groups to respective teral contact points via conductor strips on a keyboard printer circuit film. In order to achieve suppression of the coupling capacitances with simple means, decoupling resistor strips are printed between adjacent pairs of the conductor strips and are connected with the said conductor strips. The decoupling resistor strips consist of the same carbon resistor layer material as the terminal contact points.

Abstract: A signal termination device is illustrated using planar circuit technology for providing both broadband capabilities from DC to over ten gigahertz while maintaining small size and high power dissipation capabilities. This is accomplished by plating a series cascade of resistors and transmission lines such that the sum of the resistors is equal to the desired termination impedance and the impedance of the interconnecting transmission lines is equal to the sum of the remaining resistors between that point and ground. The use of the intervening transmission lines enhances the power handling capability of the resistor elements and enhances uniform power densities in the resistor elements.

Abstract: A large-scale printhead is made up of rows of styli patterned onto thin glass substrates sandwiched together between rugged support substrates, in which a series of thin glass substrate sections are internally butted one to the other. Fabrication of multiple rows of elements is accomplished by stacking the delicate styli-bearing substrates on an associated rugged substrate. In a preferred embodiment, all glass substrates are utilized, with the transparency of the glass permitting accurate alignment of the styli or nibs. The use of glass substrates also increases the wear resistance of the completed printhead. A specialized bus matrix permits reduction in the width of the substrates carrying the styli, with the bus structure being formed on a single side of the substrate carrying the styli, such that thru-holes need not be provided through the thin substrates.

Abstract: A fluid leakage detecting element comprises a heat generating resistive member and a temperature compensating resistive member disposed on a substrate. Each of the resistive members is prepared in the form of a paste of a metal which has a high temperature coefficient and a high thermal conductivity and whose melting point is higher than the baking temperature of the substrate. These resistive members are printed in thick film form on the substrate which is sufficiently electrical insulating and has a high thermal conductivity.

Abstract: This invention is concerned with the fabrication of thick film, RuO.sub.2 -based resistors. More specifically, this invention is directed to the formulation of glass frits for use in such resistors exhibiting temperature coefficient of resistance values of less than 100 ppm. Such glass frits consist essentially, expressed in terms of mole percent on the oxide basis, of about 32-39% PbO, 44-47% B.sub.2 O.sub.3, 14-17% SiO.sub.2, and an effective amount up to 5% of WO.sub.3 or MoO.sub.3.

Abstract: Methods for adjusting the resistance of temperature measuring sensors are disclosed, including measuring the resistance for a first heat-sensitive portion of the sensor at a first predetermined temperature, measuring the resistance for a second heat-sensitive portion of the temperature measuring sensor at a second predetermined temperature, determining the overall resistance for the temperature measuring sensor from these measured values, and adjusting the resistance of the second heat-sensitive portion so that the overall resistance for the temperature measuring sensor substantially corresponds to the predetermined resistance value.

Abstract: The invention relates to a process for the manufacture of non-linear resistors (varistors) from thick-layer ceramic material, in particular on a hybrid circuit substrate, or any other device requiring that a predetermined temperature should not be exceeded during its manufacture.According to the invention, after crushing a ceramic material in order to obtain a very fine powder of varistor material, a powder is produced of conductive or semiconductive material able to assume the pasty state at a temperature lower than 850.degree. C. and a binder is incorporated therein to obtain a screen printing paste. The layer deposited by screen printing on a substrate such as glass, is dried and then heat treated so as to assure cohesion of the layer. This layer is either inserted between a previously deposited electrode and another electrode, or covered by two separate electrodes. The invention is particularly applicable to matrix access display screens.

Abstract: Thin film resistors (FIG. 1) are produced on flexible tape 1 to provide at low cost a very wide range of precision resistors having low inductance. A reel of tape 70 coated with resistive material is etched to create a plurality of sinuous resistor patterns 3 and an array of spaced interconnection pads 102 suitable for connection to external leads via intermediate wires. Formation of a resistor of the desired precision value is performed by a selection of two pads, preferably by automated means by a trial and error technique. Prior to pad selection, the resistor can be covered with a material 4 which provides stability of resistance, mechnical protection and facilitation of assembly.

Abstract: A ceramic substrate includes a multiplicity of alternately screened and fired conductor and dielectric levels, with interconnections between levels through small via holes in the dielectric layers or alternately by means of crossovers. Thick film resistors are incorporated throughout the ceramic substrate, wherever needed, and the thick film resistors are printed and trimmed through windows which extend through any upper layers. In addition, resistors may be printed directly on top of the dielectric layers where necessary. Selective area hermetic sealing is utilized only for those chips and wire bonds which require environmental protection by placement of a ring frame seal encircling the selected area and over insulation on substrate conductors which are routed directly beneath the sealing area. A lid is directly soldered to the frame and, before final sealing, a proper environment is created within a sealed area.

Abstract: In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.

Abstract: The present invention relates to a camera with the main circuit boards and the sub-circuit boards comprising electrical circuit constructions having resistance-conductor laminated constructions so designed that the insulating support on which a resistance material layer and a conductor material layer are laminated are processed by means of selective etching. This is done in such a manner that the resistance members are constituted with the resistance material layer while the conductor parts such as wiring, terminals and so on are constituted with the conductor material layer.