Abstract: A thick film resistor assembly comprising: (a) an insulation substrate, (b) a resistor layer being formed on surface of the insulation substrate, (c) a pair of conductor pads comprising a first Ag conductor layer comprising Ag powder and palladium or platinum or mixtures thereof, disposed on the insulation substrate with predetermined spaces from the resistor layer to sandwich the resistor layer in a direction of its conductive resistance path; and (d) a second Ag conductor layer comprising a Ag conductor composition devoid palladium or platinum or mixtures thereof, disposed over the resistor layer and conductor pads at their respective edges to connect electrically the resistor layer to the conductor pads forming a conductive resistance path.

Abstract: The present invention discloses a substrate structure for supporting a thin film with specific temperature coefficient of resistance (TCR) thereon. The substrate structure includes a substrate composed of a borosilicate glass. The substrate further includes an interface layer of LaSiONx covering a top surface of the substrate. The substrate supports the thin film includes a platinum thin film thereon. The substrate structure further includes an adhesion anchoring seam disposed as a bonding seam interfacing the thin film to the substrate for securely attaching the thin film to the substrate therein. The bonding seam is disposed on a boundary edge of the thin film and includes a nickel-chromium alloy anchor seam disposed on the boding seam. In a preferred embodiment, the substrate structure includes a protective layer covering and protecting the substrate structure thereunder.

Abstract: A ceramic circuit substrate having a resistor deposited on a surface thereof, said ceramic substrate having a coefficient of thermal expansion ranging from 5.0.times.10.sup.-6 /.degree. C. to 7.0.times.10.sup.-6 /.degree. C., the resistor being coated with a glass overcoat and made of 15 to 50% of RuO.sub.2 and 85 to 50% of a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 -system glass, the glass overcoat being made of 60 to 100% of a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 -system glass and up to 40% of alumina, wherein the resistor has a coefficient of thermal expansion greater than that of the glass overcoat. Due to the above specific relationship between the coefficient of thermal expansion of the resistor and that of the overcoat, the resistor is not subject to cracking at the time of trimming and thereafter, and realizes the exertion of resistance performance ensuring excellent weather resistance and stability.

Abstract: A heating panel has a resistive heating layer formed on a substrate. Insulating layers can be formed on the substrate. The heating layer has electrodes on opposite edges connected to different phases of a multiphase power source. Capacitive currents caused in the substrate by the different phases cancel each other. Thus, leakage current is minimized through a conductor connected between the substrate and ground. The heating panel can be adapted for two phase or three phase systems. The heating panels are particularly useful for defining a heating cavity of an oven or pots on a cook top.

Abstract: A method of fabricating a low-inductance, in-line resistor includes the steps of: depositing a superconductive layer 12 on a base layer 14; patterning an interconnect region 16 on the superconductive layer 12; and converting the interconnect region 16 of the superconductive layer 12 to a resistor material region 18. The resistor region 18 and the superconductive layer 12 are substantially in the same plane. The method can further include the steps of depositing a conductive layer 22 on the resistor region 18 and on the photo-resist layer 20, and lifting off the photo-resist layer 20 to leave the conductive layer 22 on the resistor region 18. As such, the conductive layer 22 provides a low sheet resistivity for the resistor region 18.

Abstract: The invention relates to a chip resistor which is used as a circuit part for various electric apparatuses. The object of the invention is to realize a low resistance and a low TCR, and also high accuracy and high reliability. In order to achieve the object, a chip resistor is configured so as to have: a substrate; a resistance layer which is formed on at least one face of the substrate and which is made of a copper nickel alloy; upper-face electrode layers which make surface contact with the upper faces of both the end portions of the resistance layer; and end-face electrodes which are formed so as to cover the upper-face electrode layers. Since the bonding between the resistance layer and the upper-face electrode layers is conducted by metal-to-metal bonding, particularly, impurities which may affect the properties do not exist in the interface. As a result, it is possible to realize a chip resistor which is excellent in heat resistance, and which has a low resistance and a low TCR.

Abstract: Disclosed is a resistance material composition comprising at least one resistance material of Ti, Mo and W, and an inorganic binder. The composition can be baked along with a multi-layered ceramic substrate (especially, a low-temperature-sintering, multi-layered ceramic substrate) to be integrated with Cu or the like electrodes, thereby forming built-in resistors with good characteristics within the substrate.

Abstract: Disclosed are a structure and a method of manufacture of a chip composite electronic component with improved moisture resistance. A pair of end electrodes are formed on a surface of the substrate at opposite end portions thereof. An intermediate electrode is formed at a location between the end electrodes on the surface of the substrate. The intermediate electrode includes a lower electrode, a resistor electrode and a pad electrode formed continuous therebetween. Another element is formed on the lower electrode so as to be electrically connected between the lower electrode and one of the end electrodes. A resistance element is formed between the other of the end electrodes and the resistor electrode. A glass layer is formed to cover another element, the resistance element and the pad electrode. A protective layer of a synthetic resin is formed to cover the entire surface of the glass layer and part of each the end electrode.

Abstract: A ceramic heater for heating a sensor such as an oxygen sensor has a ceramic substrate and a heater pattern formed on the substrate. A heater pattern 22 is tightly interposed between first and second alumina substrates 15 and 21. This heater pattern 22 has a meandering heating section 25 and a pair of leads 26 for connecting both ends of the heating section 25 to two terminals at the base side end. The heating section 25 is divided into a tip side subsection 25a located near the tip side end of the device, and a base side subsection 25b. Specifically, the wire width is made greater in the tip side subsection 25a than in the base side subsection 25b so that the resistance per unit length is lower in the tip side subsection 25a. The thus-designed heater section 25 produces a less amount of heat in the tip side subsection than in the base side subsection, and this distribution of heat generation can reduce the possibility of cracks and breakage of a wire.

Abstract: The temperature adjustable coating and medium and method for providing an electrically-resistant temperature-adjustable article and structure. The coating provides a continuous electrically-conductive electrically-resistive path for the application of electrical current to the coating. The electrically-resistant temperature-adjustable article consists of a surface on which a high-temperature conductive-resistive coating is bound. The surface temperature of the article along the path is thereby adjustable between ambient and 2000.degree. F. in response to electric current applied to it without oxidization destroying the electrical conductivity of the medium in temperatures above 600.degree. F. The medium possesses the high-temperature conductive-resistive quality of the coating while maintaining a clay consistency capable of being formed into various shapes without a substrate.

Abstract: An electrically resistive heating element for liquids and a method of fabricating same. The heating element comprises a substrate formed of an electrically insulating material or formed of an electrically conductive material provided with an electrically insulating coating, whereby in both cases the substrate presents an electrically non-conductive surface on at least one side. First and second laterally spaced contact areas are disposed over the electrically non-conductive surface and a thermally sprayed resistive oxide layer is applied to the electrically non-conductive surface and disposed over or under parts of the contact areas to enable an electric current to be passed through the resistive oxide layer via these first and second contact areas.

Abstract: A force transducer includes an elongated lever arm attached to a substrate having a central portion and substantially planar tab regions that project outwardly from the central portion along first and second orthogonal force-detecting axes. The substrate undergoes localized strain approximately at the junctions of the tab regions and the central portion when an external force is applied to the free end of the lever arm. A thick film strain gauge material is screen printed directly onto the substrate in at least a first location and a second location and conductive pads on the substrate are electrically coupled to the thick film strain gauge material at each location to define a first strain gauge oriented along the first force detecting axis and a second strain gauge oriented along the second force detecting axis. The lever arm can be of a compliant construction to provide proprioreceptive feedback to a user.

Abstract: A fan speed controller of an automotive vehicle air conditioning device is usually placed in an air flow duct to be effectively cooled. Thus, compact construction of the speed controller is needed to obtain a larger air flow in the air flow duct. For this purpose, various compact resistor units for the speed controller have been proposed. However, some of them are poor in durability against shocks. In view of this, a compact resistor unit for a speed controller includes a resistor block that has a flat resistor, a flat insulating plate and a flat radiation plate which are respectively positioned against one another. The compact resistor unit further includes a holder block of molded plastic on which the resistor block is mounted. The compact resistor unit also includes a plurality of metal terminals partially embedded in the holder block, where the terminals are connected to particular portions of the flat resistor.

Abstract: An electrical safety barrier for use as a protective device between a hazardous area and a non-hazardous area has a substrate of ceramic material which carries thick film printed resistors and other surface mounted safety components, such as Zener diodes. By using such hybrid circuit technology one can achieve a very slim barrier, reduce the number of soldered connections usually required, and obtain high power density due to the high thermal conductivity of the ceramic. The ceramic substrate is encapsulated within a housing which includes a ground shoe assembly to enable the barrier to be mounted on a rail.

Abstract: A chip resistor device includes an insulating chip substrate having a top surface formed with a resistor film which is covered by a protective coating. The top surface of the substrate is also formed with a pair of terminal electrodes provided at both ends of the chip substrate. Each of the terminal electrodes includes a main top electrode layer formed on the top surface of the chip substrate in electrical conduction with the resistor film, an auxiliary top electrode layer formed on the main top electrode layer, a side electrode layer formed on a corresponding end face of the chip substrate, and a plated metal electrode layer formed on the auxiliary top electrode layer and the side electrode layer. The auxiliary top electrode layer is formed with a cutout at which the plated metal electrode layer is held in direct contact with the main top electrode layer.

Abstract: In a method of manufacturing a multilayered ceramic substrate, a capacitor layer is formed on a green sheet of a low temperature co-firable ceramic by means of printing. The green sheet with the capacitor layer and a plurality of other green sheets are laminated together into a substrate laminate. Two release green sheets of alumina system each unsintered below 1,000.degree. C. are further laminated to the top and the bottom of the substrate laminate respectively. The obtained laminate is fired at a temperature ranging between 800.degree. and 1,000.degree. C. under pressure ranging between 2 and 20 kgf/cm.sup.2. The release green sheets adherent to the side surfaces of the substrate are removed after the firing. Subsequently, a wiring pattern is printed on the substrate, which is then fired at a temperature ranging between 800.degree. and 1,000.degree. C.

Abstract: In an ink ejection recording head, a silicon dioxide layer is formed on the surface of a silicon substrate, a silicon nitride layer is formed on the silicon dioxide layer, and a plurality of heaters are formed on the silicon nitride layer. The heater is constituted by a thin film resistor made from a Ta--Si--O alloy and a thin film conductor made from nickel. Further, a gold layer is formed through plating on at least a portion of the thin film conductor to be connected to another conductor prior to thermally oxidizing the heaters.

Abstract: Disclosed are a structure and a method of manufacture of a one-chip electronic composite component which is reduced of size while providing a resistance value properly adjusted. A resistor is formed on an insulator substrate. The resistor has a trimming groove by which a resistance value thereof is adjusted. An electronic element is in electrical connection with the resistor on the substrate. A protection layer covers at least the trimming groove. The resistor is disposed close to one side edge of the substrate with respect to a centerline extending lengthwise of the substrate. The trimming groove extends toward the one side edge of the substrate from a side defining the resistor remote from the one side edge of the substrate.

Abstract: A ceramic resistor comprising chiefly an aluminum nitride, and an electrostatic chuck using the ceramic resistor as a resistor layer. The ceramic resistor comprises chiefly an aluminum nitride crystal phase, and is doped with at least one kind of atoms selected from the group consisting of elements of the Groups 2b, 4b and 6b of periodic table, and exhibits a volume resistivity of not larger than 10.sup.14 .OMEGA.-cm at 25.degree. C.

Abstract: A chip type electronic component is provided which includes a chip substrate having an opposite pair of end edges and an opposite pair of side edges between the pair of end edges. An opposite pair of first electrodes is formed in a layer on the chip substrate to extend from the end edges toward each other. Each first electrode has a narrower root portion closer to a corresponding end edge of the chip substrate and a wider head portion spaced from the corresponding end edge. An electronic element is formed in another layer on the chip substrate in electrical conduction with both of the first electrodes, and an insulating protective coating is formed on the chip substrate to entirely cover the electronic element together with the entire wider head portion of each electrode.

Abstract: A resistive film includes carbon (40-95 at. %), one or more metal(s) (4-60 at.%) and hydrogen (1-30 at. %). The film has a resistivity in excess of 1000 .mu..OMEGA.cm and a temperature coefficient TC in the range of between -100 and +100 ppm/K.

Abstract: An electrical connection element to be brazed on a conductive layer placed on a glazing consists of a segment of flexible metal braid, a plug mounted on one of its ends and a connection piece to be brazed mounted on the other end. The connection piece to be brazed is a piece of rigid sheet metal.

Abstract: A chip resistor includes a substantially rectangular substrate of an insulating material having opposed substantially flat top and bottom surfaces and edges extending between the top and bottom surfaces. A layer of a resistance material is on the top surface of the substrate. Separate termination layers of a conductive material are on the top surface or the substrate and contact the resistance layer at opposite ends thereof. Each of the termination layers extends across an edge of the substrate and over a portion of the bottom surface of the substrate. The total area of the portions of the termination layers on the bottom surface of the substrate is greater than the total area of the portions of the termination layers on the top surface of the substrate so that the spacing between the ends of the portions of the termination layers on the bottom surface of the substrate is smaller than the spacing between the ends of the portions of the termination layers on the top surface of the substrate.

Abstract: A resistive component which is composed of one or more resistive films which, if necessary, may be provided on a substrate, and at least one of which is on the basis of CrSi, the resistive film on the basis of CrSi comprising 5-50 at. % Cr, 10-70 at. % Si, 5-50 at. % O and at least one element of the group formed by B, C and N in a concentration of 1-50 at. %. The advantageous properties of the resistive component in accordance with the invention are based on the reactive incorporation of oxygen and carbon or oxygen and nitogen or oxygen and carbon and nitrogen into resistive films on the basis of CrSi.

Abstract: A surge resistor has a thick film resistance element containing alloyed nickel-chromium mixed with alloyed copper-nickel and less than twenty percent by weight glass. The surge resistor overcomes the limitations of the prior art by offering the unexpected advantage of improved power surge handling capacity. A thick film composition used to form the surge resistor, which also includes screening agent, is fired at temperatures generally below 1,000.degree. C., yielding a highly stable and well adhered electrical resistor. In addition to improved surge capability, the composition offers lower cost and less migration than the precious metal alternatives that the composition replaces. Additional inventive surge resistors include copper-manganese and nickel-chromium in combination with less than twenty percent by weight glass.

Abstract: An organic vehicle is added to and kneaded with a solid component comprising from 60 to 95% by weight of a resistive material having a composition of La.sub.x Sr.sub.1-x CoO.sub.3 (x is from 0.40 to 0.60) and from 5 to 40% by weight of glass frit to obtain a resistive paste. A substrate is coated with the resistive paste and fired to produce a resistor. The resistive paste can be fired in any of air, neutral and reducing atmospheres. The resistor has any desired resistance value within a broad range, and the reproducibility of the resistor with a desired resistance value is good.

Abstract: A thin film electric heater employs voltage and current suppressed below values of an allowable voltage and an allowable current. The thin film electric heater includes a thin film electric resistor to be formed directly on a surface of an object to be heated and is energized to effect heating. The resistor has a surface resistivity r, expressed by r=.rho./t (where .rho. is the volume resistivity of the thin film electric resistor and t is the film thickness of the thin film electric resistor), within a range to achieve the heating function of the thin film electric heater while the values of voltage and current applied to the thin film electric heater are suppressed below the values of the allowable voltage and the allowable current.

Abstract: A circuit board material is disclosed which includes a support layer, at least one electrical resistance layer having a preselected resistivity adhered to the support layer, a barrier layer adhered to the electrical resistance layer, and a conductive layer adhered to the barrier layer. The barrier layer is capable of protecting the resistance layer from attack by alkaline ammoniacal copper etchants. A method of producing the circuit board material is also disclosed.

Abstract: A high precision chip resistor having a low resistance and a small TCR is obtained. This chip resistor includes an insulating substrate, a resistive layer made of a Cu--Ni alloy formed at least on one face of the insulating substrate, and end face electrodes provided on a pair of end faces of the insulating substrate facing each other so as to be connected to the resistive layer. The resistive layer is formed by heat-treating a plating layer containing Cu and Ni at high temperature. The end face electrodes are formed by metal thin film deposition technique at low temperature. A method for producing the chip resistor is also provided.

Abstract: The invention relates to a resistive film comprising carbon (40-95 at. %), one or more metal(s) (4-60 at. %) and hydrogen (1-30 at. %), said film having a resistivity in excess of 1000.mu..OMEGA.cm and a temperature coefficient TC in the range between -100 and +100 ppm/K.

Abstract: A ceramic resistor comprising chiefly an aluminum nitride, and an electrostatic chuck using the ceramic resistor as a resistor layer. The ceramic resistor comprises chiefly an aluminum nitride crystal phase, and is doped with at least one kind of atoms selected from the group consisting of elements of the Groups 2b, 4b and 6b of periodic table, and exhibits a volume resistivity of not larger than 10.sup.14 .OMEGA.-cm at 25.degree. C.

Abstract: An improvement is proposed in a ceramic heater which is an integral body comprising a flat substrate plate made from an electrically insulating ceramic material, e.g., fused silica glass, and a layer of an electroconductive material formed on one surface of the substrate plate in a pattern of an electric heater element. One of the surfaces of the insulating substrate plate, on which the heater layer is formed, is subjected to a surface roughening treatment, e.g., by sand blasting, prior to the formation of the heater layer so as to be imparted with a specified surface roughness so that the heat generated in the heater layer and transmitted to the other surface as infrared rays is irregularly scattered .

Abstract: An electrically modulatable radiant source includes an essentially planar substrate, a well or hole formed in the substrate, and at least one incandescent filament attached to the substrate. The incandescent filament is aligned with the well or hole and is formed of a metallic compound which readily oxidizes at an operating temperature of the incandescent filament. An oxidation resistant film encapsulates the incandescent filament to prevent the filament from oxidizing. Furthermore, contact pads are formed on the substrate at both ends of the incandescent filament for feeding electric current to the incandescent filament.

Abstract: An electrical heating system uses heating elements made of ribbons of amorphous metallic alloys. The heating elements have a large area using long and wide ribbons, to achieve good heat transfer to the surroundings, that is low thermal resistance. The area of the heating elements and thus the thermal resistance is determined according to the desired thermal power, under the constraint of a low operating temperature, that is a temperature well below the embrittlement temperature of the amorphous alloy used in the heating elements. The operating temperature is preferably kept low enough so as not to generate benzopyrene or other unhealthy or ecologically unfavorable fumes or gases. The thin ribbons with low thermal resistance also have a fast heating constant, that is the heater reaches its steady state temperature in a short time. The electrical heating system uses low cost insulation and support materials, that is materials intended for use at low temperatures only.

Abstract: The present invention involves adding additional structures to a polysilicon resistor which do not significantly affect the resistance of the polysilicon resistor. These additional structures add to the area of the polysilicon resistor, and therefore reduce the self-induced temperature change caused by the voltage across the resistor. Since the resistance of the polysilicon resistor depends on its temperature, the reduction of the self-induced temperature change lowers the variation in the resistance value at different voltages.

Abstract: A lightning surge resistor network includes a ceramic substrate and a thick-film resistor deposited onto the substrate. To prevent material spatter and to contain and isolate any arcing that can occur in the event the thick-film resistor opens during a severe over voltage condition, a ceramic cover is mounted over the thick-film resistor. The thick-film resistor is thus fully contained between the ceramic substrate and the ceramic cover. Preferably, the ceramic cover is adhered to the ceramic substrate by means of an adhesive film deposited onto either the cover or the substrate adjacent the outer periphery of the cover. Preferably, the mount of adhesive is reduced at preselected locations along the outer periphery of the cover to form weakened areas in the seal between the cover and the substrate. The weakened areas permit gasses to escape in a predetermined direction in the event excessive pressures are formed under the cover when the thick-film resistor opens under an over voltage condition.

Abstract: A glazing panel includes at least one sheet of vitreous material; a conductive transparent coating which is provided on at least one face of at least one sheet of the at least one sheet of vitreous material and which constitutes a heating element for the glazing panel when connected to an electrical power source; and a control circuit for controlling heating power output of the glazing panel, the control circuit including adjustable means for controlling the heating power output to a preselected level as a function of voltage of the electrical power source and electrical resistance of the heating element.

Abstract: A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of conductors ranges from 2 mils to 7 mils. Greater spacings are easily accomplished with the present method. The method comprises the steps of screen-printing a resistor swath onto a substrate, the swath being adjacent to one end of the plurality of conductors. After the substrate is dipped into a solution, the resistor swath is laser trimmed to form the plurality of resistors. The substrate is then rinsed with warm water to remove the solution. The solution can be a poly-vinyl alcohol and isopropyl alcohol mixture.

Abstract: A thin-film gas sensor and manufacturing method of the same is disclosed which includes a silicon substrate; an insulating layer formed on the surface of the silicon substrate; a heater formed in zigzag on the surface of said insulating layer; a temperature sensor formed in zigzag on the surface of the insulating layer in parallel with the heater; an interlayer insulating layer for electrically insulating the heater and temperature sensor formed on the insulating layer; a plurality of electrodes formed on the interlayer insulating layer placed between the heater and temperature sensor; a plurality of pairs of gas sensing layers disposed in an array on the electrodes and for reacting on detected gas; and a plurality of gas shielding layers formed on one gas sensing layer out of the pair of gas sensing layers and for shielding the detected gas so that the gas sensing layers do not react on the detected gas.

Abstract: A surface mount resistor is formed by joining three strips of material together in edge to edge relation. The upper and lower strips are formed from copper and the center strip is formed from an electrically resistive material. The resistive material is coated with epoxy, and the upper and lower strips are coated with tin or solder. The strips may be moved in a continuous path and cut, calibrated, and separated for forming a plurality of electrical resistors.

Abstract: A resistor combination and method, that is formed by a substrate having a resistive film on it, and pins extruding from one edge of the substrate and connected to the film. A U-shaped cold region is provided on the substrate around at least much of the film, and is so constructed that application of common high overload voltages to the pins causes vertical fracture of the substrate. The resulting substrate pieces are held by the pins to the circuit board. In one embodiment, a synthetic resin housing is provided around the substrate.

Abstract: A multi-layer polysilicon resistor and a method by which the multi-layer polysilicon resistor is formed. A minimum of two polysilicon layers is formed upon an insulating layer, the insulating layer in turn being formed upon a semiconductor substrate. The first polysilicon layer is formed to a first thickness at a first deposition temperature. The second polysilicon layer is formed directly upon the first polysilicon layer. The second polysilicon layer is formed to a second thickness at a second deposition temperature. The two deposition temperatures are in the range of about 450 degrees centigrade to about 620 degrees centigrade, and the difference in temperature between the first deposition temperature and the second deposition temperature is a minimum of 10 degrees centigrade.

Abstract: In a first embodiment of the invention a layer of ruthenium oxide is reactively deposited onto a substrate, then annealed for TCR adjustment and for stabilization. In a second, bi-layer embodiment of the invention, a layer of tantalum nitride is first reactively deposited onto a substrate, then annealed for stabilization. After a ruthenium oxide layer is reactively deposited onto the annealed tantalum nitride layer, the structure is annealed until a near-zero effective TCR for the bi-layer resistor is achieved. The ruthenium oxide capping layer serves as a barrier against chemical attack.

Abstract: A heating panel has a metal substrate, ceramic inner and outer insulating layers on the substrate. A film of resistive material forms a heating layer on one of the insulating layers. The heating layer has electrodes on opposite edges connected to different phases of a multiphase power source. Another electrode is connected to a neutral of the power source. Capacitive currents caused in the substrate by the different phases cancel each other. Thus, leakage current is minimized through a conductor connected between the substrate and ground. The heating panel can be adapted for two phase or three phase systems. The heating panels are particularly useful for defining a heating cavity of an oven.

Abstract: The present invention concerns a thermal recording apparatus, preferably an ink jet thermal recording device and, a process for forming the same and, accomplishes uniformized heat energy action of the heat acting surface (a protective layer surface when there is protective layer), namely the heat-generating resistors of a plurality of electrothermal transducers. The present invention has uniformized the amount of heat energy generated during recording at the heat acting portions by positively changing the shape or the thickness of the resistors concerned with the heat acing portions or/and the constitution itself of the protective layer depending on its existing position.

Abstract: A thick film circuit board includes a substrate, a thick film resistor on the substrate and having a trimming region and a protecting element on the substrate for protecting the thick film resistor and having a window through which the trimming region is exposed. The protecting element may be a protective coating disposed on the substrate. Alternatively, the protective element may be a protective frame extending along an external periphery of a region where the thick film resistor is located on the substrate and having a height for protecting the thick film resistor from mechanical damage.

Abstract: A chip resistor is provided which comprises an insulating chip substrate, a resistor element formed on the chip substrate, a first pair of electrode terminals branching out from one end of the resistor element, and a second pair of electrode terminals branching out from the other end of the resistor element. One of the first pair electrode terminals is a current terminal while the other of the first pair electrode terminals is a voltage terminal. Similarly, one of the second pair electrode terminals is a current terminal, and the other of the second pair electrode terminals is a voltage terminal.

Abstract: Electrical resistors and resistor networks are provided on an insulative substrate with designated conductive terminations by direct and continuous writing of resistive lines in fine-line patterns between and over each two of neighboring terminations from heterogeneous resistive thick film compositions. The resistive lines of line width w and total length l between conductive terminations can be directly written by suitable writing apparatus to have a high aspect ratio n=l/w, thereby providing resistors and resistor networks of high resistance values on an overall substrate area significantly smaller than required for conventional thick film resistors of comparable resistance value and comparable operational characteristics.

Abstract: A polysilicon resistor structure and a method by which the polysilicon resistor structure may be formed. A polysilicon resistor is formed upon the surface of a semiconductor substrate. A pair of dummy polysilicon layers is formed along opposite edges and separated from the polysilicon resistor. A pair of metal sidewalls is then formed upon the upper surfaces of the pair of dummy polysilicon layers, and a top metal layer is formed bridging the upper surfaces of the pair of metal sidewalls. The pair of dummy polysilicon layers, the pair of metal sidewalls and the top metal layer form an open ended cavity upon the semiconductor substrate within which structure the polysilicon resistor resides. The polysilicon resistor is separated from the structure by an insulating material which is not susceptible to outgassing of hydrogen.

Abstract: A low profile load resistor includes a base plate of an electrically conductive material having a pair of opposed flat surfaces and a hole therethrough. A chip resistor is mounted on one of the surfaces of the base plate. The chip resistor includes a substrate of an electrical insulating material having a pair of opposed flat surfaces and a hole therethrough which is aligned with the hole in the base plate. A resistance film is on one of the surfaces of the substrate and has termination films at opposite ends thereof. A termination tab is electrically connected to one of the termination films and extends through the holes in the substrate and base plate. The other termination film is electrically connected to the base plate. A cover plate of an electrical insulating material is over the resistor film and is mechanically connected to the substrate.