Abstract: A liquid discharge head comprising a liquid discharge substrate in which a first liquid supply port being a penetration port for supplying a liquid is formed and is provided with a first electrode receiving electric energy for discharging the liquid on a surface thereof on one side, a supporting member which is opposed to the first electrode and a second liquid supply port being a penetration port for supplying the liquid is formed to communicate with the first liquid supply port, the supporting member provided with a second electrode for transmitting the electric energy to the first electrode on a surface opposed to the first electrode, and a conductive first intermediate member abutting with both of the first electrode and the second electrode to electrically connect the first electrode and the second electrode, wherein an abutting surface of the first intermediate member abutting with the first electrode is flattened.

Abstract: A liquid discharge head includes a substrate having a discharge port, a plurality of energy generating elements disposed on a first surface of the substrate for generating energy to discharge liquid from the discharge port, a liquid supply port, and a member provided on the first surface and forming a wall of a liquid chamber and a wall of a liquid path from the liquid supply port through the liquid chamber to the discharge port. A plurality of first penetrating electrodes penetrate the substrate from the first surface to the second surface, wherein one of the first penetrating electrodes electrically connects one of the energy generating elements, and a plurality of second penetrating electrodes penetrate the substrate from the first surface to the second surface, wherein one of the second penetrating electrodes electrically connects to the same energy generating element connected to the first penetrating electrode.

Abstract: Micro-fluid ejection heads and methods for fabricating the same. One such micro-fluid ejection head includes a substrate having a plurality of fluid ejection actuator devices adjacent to a device surface thereof A valley is adjacent to the device surface of the substrate. A semiconductor chip is associated with the plurality of fluid ejection actuator devices. The chip is in the valley adjacent the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate. The deposited conductive material generally conforms to the valley. The conductive material is in electrical flow communication with the chip.

Abstract: A micro-fluid ejecting device includes a semiconductor substrate, a plurality of fluid ejection elements formed on the semiconductor substrate, and a plurality of nonvolatile programmable memory devices for storing information related to the operation of the micro-fluid ejecting device. The programmable memory devices, which are at least partially embedded in the semiconductor substrate, each include a source region and a drain region formed in the semiconductor substrate. The source and drain regions have a conductivity type which is opposite the conductivity type of the semiconductor substrate. An insulative layer is formed on the semiconductor substrate over the source region and drain region. A floating gate region is formed on the insulative layer and is spatially disposed between the source region and drain region. The floating gate region is electrically insulated from the source and drain regions by the insulative layer. Electrical contacts are connected to the source region and the drain region.

Abstract: An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.

Abstract: The invention provides for an elongate printhead assembly for a pagewidth printer. The printhead assembly includes a printed circuit board (PCB) having mounted thereon various electronic components to facilitate operation of the printer. A number of printhead integrated circuits are respectively angularly disposed with respect to a longitudinal axis of the PCB. Tape automated bond (TAB) film is in register with a number of printhead integrated circuits. The film is configured to arrange the integrated circuits in signal communication with the electronic components. The assembly also includes an ink distribution molding for distributing ink from an ink reservoir to the integrated circuits, and a laminated stack arranged between the ink distribution molding and the integrated circuits for ducting the ink to respective integrated circuits.

Abstract: A device includes a substrate, a first gate, a second gate, and a third gate. The substrate has a first active region and a second active region. The first gate is configured in a first loop structure around the first active region. The second gate is configured in a second loop structure around the second active region, and the third gate is configured in a third loop structure around the first gate and the second gate.

Abstract: Micro-fluid ejection apparatuses and devices, and methods related to communication in and with the same. One such micro-fluid ejection apparatus includes a controller configured to generate a data signal, and a transmitter configured to convert the data signal to a current signal. The apparatus further includes a conductor capable of carrying the current signal, and a receiver configured to receive the current signal from the conductor and to convert the current signal to a second data signal. The micro-fluid ejection apparatus is configured to operate on the second data signal. In one embodiment, the micro-fluid ejection apparatus may be a printing apparatus, such as an inkjet printing apparatus. In some embodiments, the current signal comprises a pair of corresponding differential current signals and/or current transfer logic signals offset from a base amperage level.

Abstract: The liquid ejection head includes: a nozzle plate which has a plurality of ejection apertures through which a liquid is ejected; a plurality of pressure chambers which are connected respectively to the ejection apertures; a plurality of liquid supply flow channels which supply the liquid respectively to the pressure chambers; a common liquid chamber which supplies the liquid to the liquid supply flow channels; a plurality of pressure generating devices which respectively deform the pressure chambers; and a plurality of electrical wires which supply drive signals to the pressure chamber generating devices, wherein the electrical wires are provided so as to pass through the common liquid chamber.

Abstract: A printer is provided with a body having a slot for removably receiving a printing cartridge and protrusions arranged in the slot to cooperate with a flat surface of a plurality of corners of the printing cartridge upon mounting of the printing cartridge to the printer. The printing cartridge has at least one printhead integrated circuit with a plurality of fluid ejection nozzles and a fluid distribution support mounting the printhead integrated circuit. The cooperation of the protrusions and corners provide information on the location of the nozzles.

Abstract: This invention is directed to allow efficiently transferring data to each print element (heater) and efficiently laying out circuits in an element substrate including plural heater arrays in which different numbers of heaters are arranged. This substrate includes: a first array having a relatively large number of heaters; and a second array which is equal in length to the first array and has a relatively small number of heaters. These arrays are juxtaposed. The substrate further includes plural shift registers equal in number to the heater arrays of the substrate. The shift registers include a shift register which holds some data for driving the heaters of the first heater array, and data for driving the heaters of the second heater array. The shift registers further include a shift register which holds data other than some data for driving the heaters of the first heater array.

Abstract: A recording head substrate includes a plurality of groups of recording elements arranged in arrays; a number, corresponding to a number of the groups, input contacts for receiving driving pulse signals; signal lines for supplying the driving pulse signals to the groups of recording elements from the input contacts, respectively, wherein in a region between two of the groups of recording elements are adjacent to each other, the signal lines are connected to the recording elements such that areas in which the groups of recording elements are disposed, respectively, have respective driving pulse signal change areas which are overlapped with each other.

Abstract: An inkjet printhead integrated circuit comprising a multilayered substrate having drive circuitry and a plurality of nozzle arrangements. Each nozzle arrangement comprises: a floor having an ink inlet defined therein; a roof spaced apart from the floor; sidewalls extending between the roof and the floor so as to define a nozzle chamber; and a heater element suspended in the chamber and connected to the drive circuitry. When actuation energy is supplied to the heater element from the drive circuitry, a vapour bubble is formed in ink contained in the nozzle chamber resulting in ejection of ink via the ink ejection port.

Abstract: The invention provides an ink jet recording head, in which, for improving heat-dissipating property and electrode terminal connectivity and reducing production cost, second electrode terminals provided on a supporting surface of plural laminated sheets for supporting a liquid discharge substrate and to be connected with first electrode terminals of the liquid discharge substrate are provided outside an ink supply aperture formed in an outermost sheet constituting the supporting surface, and are supported by the outermost sheet and at least a sheet laminated thereunder.

Abstract: An inkjet recording head substrate having an electrothermal transducer for generating thermal energy used to discharge ink and a drive element for driving the electrothermal transducer mounted thereon includes a first circuit portion for outputting selection signals for selecting the electrothermal transducer to be driven at a amplitude level of a second voltage higher than a first voltage based on an input signal of the amplitude level of the first voltage, a second circuit portion for inputting the selection signals from the first circuit portion and controlling the drive element corresponding to the electrothermal transducer to be driven based on the selection signals subject to the second voltage, and a plurality of signal lines for transmitting the selection signals between the first and second circuit portions.

Abstract: A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.

Abstract: A liquid ejecting head for ejection liquid includes an electric wiring member including a plurality of contact pads which are electrically contactable to a liquid ejecting apparatus; a storing element for storing individual information; and a liquid ejection member, provided with an ejection outlet, for ejecting the liquid using electric energy supplied through a part of the plurality of contact pads. The contact pads include an array of information contact pads electrically connected with the storing element, a voltage source contact pad for supplying the electric energy and a grounding contact pad. Directly adjacent to each of front and rear sides of the information contact pads constituting the array, the voltage source contact pad or the grounding contact pad is disposed.

Abstract: An object of this invention is to provide a head substrate having a fuse ROM without increasing the size. To achieve the object, a head substrate includes an ink supply port which has a long hole shape elongated in a first direction, a plurality of printing elements arrayed along the first direction on both sides of the ink supply port, a plurality of first driving elements, arrayed along the first direction at positions spaced apart further away from the ink supply port than the plurality of printing elements, for driving the plurality of printing elements, a plurality of fuse ROMs which store information, and a plurality of second driving elements for driving the plurality of fuse ROMs. A signal line used for driving the plurality of first driving elements and second driving elements is shared. The plurality of second driving elements are arranged on the same array as the first driving elements at positions adjacent to both ends of each array of the plurality of first driving elements.

Abstract: A printing system includes a print head to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the print head. Driving circuitry provides signals to the print head to control delivery of the ink and a flexible circuit interposed between the print head and the ink reservoirs connects the driving circuitry to the print head. The flexible circuit may include a heater to provide heat to the ink reservoirs. Alternatively, the flexible circuit may be replaced with a rigid substrate having a heater within its layers.

Abstract: This invention relates to a printhead substrate capable of suppressing an increase in wiring width and an increase in the size of a substrate formed by a film forming process while increasing the number of simultaneously driven printing elements in order to improve the printing performance, a printhead using the substrate, and a printing apparatus using the printhead. The wiring lines of the substrate are formed into a common wiring line, and energy applied to a heating resistance element is prevented from deviating from a stable ink discharge range owing to the difference in the number of simultaneously driven heating resistance elements. For this purpose, a driving element is greatly downsized in comparison with a conventional one, and the operation region of a MOS transistor is shifted from the non-saturation region to the saturation region.

Abstract: In an ink jet head circuit board including a heater for generating thermal energy used for ejecting ink in response to application of electricity, a drop in thermal energy efficiency is prevented while reducing an area of the heater to achieve higher-resolution and higher-image-quality printing, and damages on the heater attributable to a manufacturing process are avoided. To achieve this, a resistor layer is disposed on an electrode wire layer; and two protective layers are disposed thereon. Then the upper protective layer is removed in a site above the heater. Accordingly, it is possible to dispose the protective layers without causing a decrease in an effective bubble generating region, and to improve thermal energy efficiency by reducing the effective thickness of the protective layer above the heater. Moreover, the resistor layer is covered with the first protective layer and is thereby prevented from adverse effects in the manufacturing process such as etching processes.

Abstract: A heater chip for use in a printing device that includes a first heater array with a left side and a right side and a first ink via placed on the left side of the first heater array. The chip also includes a second heater array with a left side and a right side, where a right side of the first heater array faces the left side of the second heater array, a second ink via placed on the right side of the second heater array, and at least one logic array is disposed between the first heater array and the second heater array.

Abstract: A semiconductor element substrate includes an electrode pad; a semiconductor element; and a connection heater for heating the electrode pad, wherein the connection heater is disposed in a range capable of heating the electrode pad up to a level capable of electrical connection.

Abstract: A recording head includes outlets disposed in a staggered pattern so that the distances from an ink inlet to the outlets differ alternately for adjacent outlets. The recording head includes an outlet group including a plurality of the outlets on at least one side of the ink inlet. The outlet group includes first outlets and second outlets, wherein the distance from the ink inlet to the first outlets differs from the distance from the ink inlet to the second outlets. First recording elements and second recording elements including heat resistors are provided. The first recording elements and second recording elements correspond to the first outlets and the second outlets, respectively, and are disposed in first ink channels and second ink channels, respectively. The first recording elements are rectangular, whereas the second recording elements are substantially square.

Abstract: A silicon chip has a plurality of inkjetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.

Abstract: A method of forming a semiconductor device, the method including forming a substrate including a first surface having a non-doped region, forming an insulative material over the first surface of the substrate, forming a first conductive material over the first insulative material, forming an opening in the first conductive material that forms a path to the substrate that is substantially free of the first conductive material and the first insulative material, forming a second insulative material over the first conductive material, and forming a second conductive material over the second insulative material, wherein the second conductive material is formed in the opening and contacts the non-doped region of the substrate.

Abstract: There is disclosed an electric device comprising: an actuator unit which includes a plurality of electrodes formed thereon; a printed wiring board which comprises: an electrically insulating flexible layer which has on one of its opposite sides protrusions for the respective electrodes, each of the protrusions forming a corresponding recess on the other side of the flexible layer; and a plurality of electrically conducting layers disposed on the respective protrusions to be in contact with the respectively corresponding electrodes; and a plurality of bonding parts each of which is in contact with one of the conducting layers and a corresponding one of the electrodes to completely cover a contact portion between the conducting layer and the electrode so as to maintain the contact therebetween.

Abstract: This invention provides an element substrate having a heater selection circuit normally operable even in the use of voltage conversion circuits, which are arranged along the nozzle arrayed direction, each having a small-area in order to reduce the area of the element substrate. The element substrate according to this invention includes a heater selection circuit, which receives a signal output from a voltage conversion circuit, a block selection signal, and a print data signal, and generates and outputs a signal for performing switching by a switching element.

Abstract: A printhead assembly includes an elongate support structure. A series of side wall sections extend a length of the support structure and define ink supply channels. Edges of the walls delineate a gap. A plurality of carriers is positioned end-to-end in the gap and is supported by said edges of the walls. The carriers define a recess and ink supply passages in fluid communication with the recess and the ink supply channels. A printhead integrated circuit is mounted in each recess to receive ink from the ink supply channels.

Abstract: A method of fabricating a resistor-drive transistor architecture for a printhead of a printer, by depositing printer communication and drive electronics on the printhead. The drive electronics are positioned within a range of one to sixty microns from correlated resistors.

Abstract: This invention provides simpler, low-cost printhead temperature adjustment means without complicating the driver arrangement of a printhead substrate. In a printing apparatus to which this invention is applied, when printing by alternately driving two printheads having the same arrangement, if one of these printheads is in printing, a driving signal having a short pulse width insufficient to print is input to the other printhead to drive all printing elements.

Abstract: An apparatus (such as a printer) including a combination engine controller circuit board having a integrated circuit (IC) chip configured to process (format) incoming data as well as to control the operations of the apparatus is disclosed. The IC chip is adapted to receive and process data as well as to control the operations of the apparatus. For this reason, the IC chip is referred to as a combined controller IC.

Abstract: An inkjet printhead integrated circuit has a substrate. A drive circuitry layer is positioned on the substrate. The substrate and the drive circuitry layer define a plurality of ink inlet channels. Nozzle chamber walls and roofs spanning the nozzle chamber walls are positioned on the substrate to define nozzle chambers in fluid communication with respective ink inlet channels. The roofs define respective ink ejection ports. Ink ejection members are positioned in respective nozzle chambers and are displaceable with respect to the roofs to eject ink from the ink ejection ports. Thermal actuators are outside of and associated with respective nozzle chambers and are connected to the drive circuitry layer to move with respect to the substrate on receipt of electrical signals from the drive circuitry layer. Work transmitting structures define at least one of the walls of respective nozzle chambers and are configured to transmit work from the actuators to the ink ejection members.

Abstract: An image forming process comprises the steps of applying a first material for improving the wettability of the surface of an intermediate transfer medium to the intermediate transfer medium, applying a second material for lowering the flowability of an ink to the intermediate transfer medium to which the first material has been applied, applying the ink to the intermediate transfer medium, to which the first material and second material have been applied, from an ink-jet recording head to form an image of the ink on the intermediate transfer medium, and transferring the ink image formed to a recording medium.

Abstract: A fluid ejection device having a first fluid feed source having a first fluid feed source edge in communication with a substrate surface, first firing resistors disposed along the first fluid feed source and configured to respond to a first current to heat fluid provided by the first fluid feed source, and a reference conductor. The reference conductor is configured to conduct the first current from the first firing resistors, wherein the reference conductor is disposed between the first fluid feed source edge and the first firing resistors.

Abstract: A inkjet printer having: a body configured to receive a printhead assembly of at least one printhead integrated circuit having a plurality of ink ejection nozzles and an ink distribution support mounting the, or each, printhead integrated circuit, and arranged, in use, to distribute ink to the nozzles; and at least one mounting feature on the body for mounting the printhead assembly at the ink distribution support. The, or each, mounting feature is configured to cooperate with a corresponding complementary reference feature of the ink distribution support upon mounting of the printhead assembly to the printer, where the cooperation providers information on the location of the nozzles.

Abstract: A printhead assembly having: at least one printhead integrated circuit having a plurality of ink ejection nozzles; and an ink distribution support mounting the, or each, printhead integrated circuit, the ink distribution support being arranged, in use, to distribute ink to the nozzles, the printhead assembly being arranged to be mounted to a printer at the ink distribution support, wherein the ink distribution support is provided with at least one reference feature, the, or each, reference feature serving to provide information on the location of the nozzles upon mounting of the printhead assembly to the printer.

Abstract: A nozzle assembly for an inkjet printhead is disclosed. The nozzle assembly includes an inkjet nozzle having an actuator for ejecting an ink droplet from the inkjet nozzle when a resistive element of the actuator is heated by an electrical current. A drive transistor provides an energy pulse to the resistive element of the actuator, and control logic controls the drive transistor. The volume of said droplet is less than 3 pl.

Abstract: A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.

Abstract: A printhead includes a plurality of switching elements which are arranged in correspondence with respective printing elements and control energization to the respective printing elements, a reference voltage circuit which generates a reference voltage, a current generation circuit which generates a reference current (Iref) on the basis of a reference voltage (Vref) generated by the reference voltage circuit, and a plurality of constant current sources which supply, in accordance with the reference current (Iref) generated by the current generation circuit, constant currents via the switching elements arranged in correspondence with the respective printing elements.

Abstract: A driving circuit layout can suppress an increase in the area of a head substrate in an inkjet printhead adopting a constant electric current driving method. A plurality of printing elements and a plurality of switching elements which are very large in number are arrayed in the longitudinal direction of a head substrate. A terminal which receives a driving signal and a control signal that are used to drive the plurality of printing elements is arranged at the end of the board in the widthwise direction of the board. An electric current source for supplying a predetermined electric current is interposed in an area between these two areas.

Abstract: Limitations on the number of recording elements capable of being simultaneously driven are relaxed so that driving voltage fluctuation falls within an allowable range. The substrate includes arrays of recording elements, common power supply wires extended from portions near one end portions of the arrays to portions near the other end portions thereof and connected to a power supply-side electrode pad through a position near the one end portions of the arrays, and common ground wires extended from portions near the one end portions of the arrays to portions near the other end portions thereof and connected to a ground-side electrode pad through a position near the other end portions of the arrays. Thus, since the sum of the lengths of common wires from the electrode pads is equal for all the plurality of elements included in each array, and the combined resistance of common wiring portions becomes substantially equal.

Abstract: A printhead assembly is provided. The printhead assembly comprises (a) a plurality of printhead integrated circuits comprising; and (b) an ink manifold having a mounting surface, the backside of each printhead integrated circuit being bonded to the mounting surface with an adhesive. Each printhead integrated circuit comprises a plurality of nozzles formed on a front side of the printhead integrated circuit; a plurality of ink supply channels for supplying ink from a backside of the printhead integrated circuit to the nozzles; and a plurality of etched trenches defined in the backside. The adhesive is received, at least partially, in the plurality of etched trenches, thereby increasing the adhesive bond strength whilst avoiding surface roughening of the printhead integrated circuits.

Abstract: A liquid discharge head including a discharge element substrate including an orifice plate having a discharge port for discharging a liquid, and a supply port opened in the reverse side of the surface forming the discharge port for supplying a liquid into the discharge port; a support member having a supply path for supplying a liquid into the supply port; and a flexible wiring substrate having a blanking portion for transmitting a signal for discharging a liquid to the discharge element substrate. The discharge element substrate is electrically connected to the flexible wiring substrate on the surface opening the supply port, the flexible wiring substrate is bonded to both the discharge element substrate and the support member by means of an adhesive, the end face of the blanking portion is covered with the adhesive, the covered blanking portion communicates with the supply port, and the adhesive is a thermally fusible adhesive composed of denatured polyolefin, having a softening point of 80° C. or higher.

Abstract: An inkjet printhead that has a substrate with a first layer, a second layer; and a flexible element supported by the second layer. The flexible element has an orifice through which ink is ejected. An actuator deflects the flexible element to force the ink through the orifice. The substrate has an opening formed through the first layer and a hole through the second layer such that the hole and the opening are in fluid communication to supply ink to the flexible element.

Abstract: The present invention relates to a printhead for ejecting ink. The printhead comprises a first row of nozzle pods, and each nozzle pod comprises a plurality of nozzles arranged in rows and ranks. There is also provided a first ink supply for storing a first type of ink. The first ink supply is in fluid communication with the nozzles in the first row. The printhead also comprises a printhead controller for controlling the firing of the nozzles. In one embodiment, the printhead controller controls the firing order of the nozzles.

Abstract: An element substrate includes a plurality of printing elements, a plurality of driving circuits which drive the plurality of printing elements, an input unit which inputs an enable signal to define the driving period of each printing element, a shift register which inputs a print data, a latch circuit which stores, in accordance with an externally input latch signal, the print data output from the shift register and outputs a print data signal, a time-divisional selection circuit which generates a block selection signal to divide the plurality of printing elements into a plurality of blocks and time-divisionally drive the printing elements, and a delay unit which changes the drive timing between the printing elements in a single block. The delay unit delays the enable signal and the print data signal.

Abstract: A bonded assembly is provided. The bonded assembly comprises: (a) a first substrate having a plurality of etched trenches defined in a first bonding surface; and (b) a second substrate having a second bonding surface. The second bonding surface is bonded to the first bonding surface with an adhesive and the adhesive is received, at least partially, in the plurality of etched trenches. Semiconductors chips bonded to a second substrate exemplify the advantages of the invention. The etched trenches allow the adhesive bond to be strengthened whilst avoiding increased surface roughening.

Abstract: A head substrate having a fuse ROM can be provided without increasing the size. The head substrate includes an ink supply port which has a long hole shape elongated in a first direction, a plurality of printing elements arrayed along the first direction on both sides of the ink supply port, a plurality of first driving elements, arrayed along the first direction at positions spaced apart further away from the ink supply port than the plurality of printing elements, for driving the plurality of printing elements, a plurality of fuse ROMs which store information, and a plurality of second driving elements for driving the plurality of fuse ROMs. A signal line used for driving the plurality of first driving elements and second driving elements is shared. The plurality of second driving elements are arranged on the same array as the first driving elements at positions adjacent to both ends of each array of the plurality of first driving elements.

Abstract: A printhead IC for an inkjet printer, the inkjet printer having a PEC for sending print data to the printhead IC in accordance with a predetermined data transmission protocol, the printhead IC comprising: an array of nozzles for ejecting drops of printing fluid onto a media substrate; and, drive circuitry for driving the array of nozzles; wherein, the circuitry is configured to receive print data in any one of a plurality of different data transmission protocols.