Abstract: In a printhead element board including a plurality of printing elements which align in a predetermined direction, driving circuits which drive the printing elements, and an element selection circuit which selects printing elements within each group for each group having a predetermined number of adjacent printing elements, a plurality of element selection circuits are laid out adjacent to the driving circuits of the respective groups. With this layout, even if the number of printing elements increases, only the length in the printing element array direction increases without increasing the length in a direction perpendicular to the printing element array direction.

Abstract: Micro-fluid ejection heads and methods for fabricating the same. One such micro-fluid ejection head includes a substrate having a plurality of fluid ejection actuator devices adjacent to a device surface thereof A valley is adjacent to the device surface of the substrate. A semiconductor chip is associated with the plurality of fluid ejection actuator devices. The chip is in the valley adjacent the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate. The deposited conductive material generally conforms to the valley. The conductive material is in electrical flow communication with the chip.

Abstract: An ink-jet head which includes: a flow passage unit having plural nozzles and pressure chambers respectively communicating with the nozzles, the pressure chambers being arranged along a planar surface; an energy transfer unit which is fixed to the planar surface and transfers ejection energy to ink in the pressure chambers; a driver IC which generates a driving signal supplied to the energy transfer unit; a flat flexible cable in which the driver IC is mounted and plural wirings that make connection between the driver IC and the energy transfer unit are formed; and a heat transfer body which sandwiches at least a part of the energy transfer unit between the heat transfer body and the planar surface of the flow passage unit, the heat transfer body having a thickness in a direction perpendicular to the planar surface, the thickness decreasing in a direction away from the driver IC.

Abstract: A method estimates the temperature of a thermal print head element during printing. In one embodiment, the temperature is estimated using the resistance of the thermal print head element, which typically changes with the print head element temperature. The change in resistance of the print head element is exploited to indirectly estimate the temperature of the print head element.

Abstract: A recording head includes: liquid discharge ports that discharge liquid and are arranged at a pitch corresponding to a resolution, wherein said liquid including an ink; plural drive elements that cause the liquid to be discharged from the liquid discharge ports in correspondence to the liquid discharge ports and are arranged at a pitch corresponding to the resolution; and plural drivers having voltage buffer regions for buffering effects resulting from a high voltage, said drivers being serially connected in a one-to-one ratio to, and unitized with, the drive elements, and being arranged at a pitch enlarged by at least the voltage buffer region portions with respect to the pitch of the drive elements, and driving the drive elements.

Abstract: A method of fabricating an inkjet printhead IC is provided which includes etching a circuitry layer to define first regions, depositing thermally expandable material thereover, etching the thermally expandable material and circuitry layer to define second regions having via holes, forming heaters at the second regions electrically contacting the circuitry layer through the via holes, depositing thermally expandable material on the heaters, forming a nozzle at each second region by etching the thermally expandable material to define an arm suspended at one end from the circuitry layer and an inkjet port in the suspended end, and forming channels aligned with the nozzles by etching a substrate carrying the circuitry layer. Each arm is formed to have one of the heaters embedded in the thermally expandable material such that uneven expansion is caused upon heating resulting in displacement of the arm and associated inkjet port relative to the circuitry layer.

Abstract: A fluid-ejecting device with simplified connectivity is disclosed herein. According to an embodiment of the present invention, a common lead is provided such that a plurality of electrical contacts on a fluid-ejecting chip are connected to the common lead, which is located on a single-layer-flex circuit. Because a common lead is provided at an edge of the single-layer-flex circuit adjacent the fluid-ejecting chip, fewer signals need to be routed through the single-layer-flex circuit to such edge, thereby reducing the complexity of such circuit. Further, bond sites at the edge of the single-layer-flex circuit adjacent the fluid-ejecting device are arranged in a manner that minimizes the required length of wire bonds for connecting such contacts to the contacts on the fluid-ejecting chip.

Abstract: A circuit board on an ink cartridge has contact pads which are electrically conducted to a semiconductor storage element mounted on the circuit board. Connector terminals on an ink jet recording apparatus are brought into relative slide contact with a surface of this circuit board, and electrically connected to the contact pads. When the connector terminals come in contact with the contact pads, the dust adhering to the connector terminals is wiped and removed by step portions that are constituted by no-resist-film formation parts and that are adjacent to the contact pads. Consequently, the reliability of the electrical contact between the connector terminals and the contact pads is ensured.

Abstract: A pagewidth printhead assembly for an inkjet printer comprising: a body portion for receiving ink from one or more ink sources and having one or more channels formed therein for distributing the ink substantially along the length of the printhead assembly; one or more integrated circuits extending substantially the length of the printhead assembly, each integrated circuit having a plurality of nozzles, each of the nozzles being arranged in use to deliver the ink onto passing print media; and an ink distribution member upon which each integrated circuit is fixed and which distributes the ink from the body portion to each of the integrated circuits; wherein the ink distribution member comprises a first layer which directs the ink from the one or more channels of the body portion for delivery to each integrated circuit, and a second layer attached to said first layer for receiving and securing each integrated circuit in a position to receive the ink from the first layer.

Abstract: An object of this invention is to provide a safe and reliable head substrate having a fuse ROM without increasing the substrate size. To achieve the object, a head substrate includes a plurality of printing elements for printing, first driving elements which drive the printing elements, a fuse ROM which stores information, a second driving element which drives the fuse ROM, input device for inputting a printing signal to cause the plurality of printing elements to print and a block selection signal to time-divisionally drive the printing elements, selective driving device for selectively driving the first driving elements on the basis of the input printing signal and block selection signal, a first pad which applies a first voltage to the fuse ROM to write information, and a second pad which applies a second voltage to read out the information from the fuse ROM.

Abstract: A printhead assembly for a pagewidth inkjet printer, having an array of printhead modules mounted to an elongate channel extending substantially across the pagewidth. A flexible printed circuit board carrying data and power to said modules and an elastomeric ink delivery extrusion are situated between the modules and the channel. More particularly, the flexible printed circuit board is sandwiched between the elastomeric ink delivery extrusion and the channel so that it extends around one edge of the extrusion to carry power and data to the printhead modules.

Abstract: An integrated circuit having a plurality of devices. The plurality of devices have a plurality of device characteristics. A sectional cut through the integrated circuit reveals the plurality of device characteristics.

Abstract: An inkjet printhead and a method of manufacturing the same are provided. The inkjet printhead includes a substrate; a plurality of heaters formed on an upper portion of the substrate for heating ink for generating bubbles; a plurality of metal-oxide semiconductor (MOS) field effect transistors (FETs) formed on the substrate for addressing the heaters and applying electric current to the heaters; first, second, and third interconnecting layers that are sequentially formed on the MOS FETs and electrically connected to each other for applying signals to the MOS FETs; a chamber layer for defining an ink chamber, which is filled with ink for ejection, on an upper portion of the heaters; and a nozzle layer having a nozzle, through which the ink is ejected, on an upper portion of the chamber layer.

Abstract: A liquid discharge head includes a substrate, discharge units each including one liquid discharge port discharging the liquid, an energy generating element on the surface of the substrate and generating energy to discharge the liquid from the liquid discharge port, one liquid chamber in which the energy generating element is disposed, one liquid supply port penetrating the substrate, one liquid path extending from the liquid supply port to the liquid discharge port through the liquid chamber, a penetrating wiring penetrating the substrate, an element wiring connecting the energy generating element to the penetrating wiring and a driving element on a back surface of the substrate and driving the energy generating element through the penetrating wiring and a common liquid chamber communicating with the substrate along the surface of which the discharge units are arranged through liquid routes having an equal distance to all of the liquid supply ports.

Abstract: A printer includes an elongate support structure for a printhead assembly. At least one elongate printhead module is positioned on the support structure, along a length of the support structure. The module includes an ink supply and a micromolded ink distribution assembly that is positioned on the supply structure which defines a mounting formation to permit a printhead integrated circuit to be mounted on an ink delivery assembly. A plurality of ink inlets are in fluid communication with the outlets of the supply structure. A printhead integrated circuit is mounted on the ink distribution assembly so that the ink can be fed from the supply structure to the printhead integrated circuit.

Abstract: A fluid ejection device includes a first heater element and a second heater element spaced a first distance from the first heater element. A first drive transistor is associated with the first heater element and a second drive transistor is associated with the second firing heater element. The second drive transistor is spaced a second distance from the first drive transistor. The second distance is different from the first distance.

Abstract: A fluid ejection device comprising a first transistor having a first gate configured in a first loop structure, a second transistor having a second gate configured in a second loop structure, and a third transistor having a third gate configured in a third loop structure disposed around the first transistor. The second transistor and the third transistor share a first active region.

Abstract: A method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.

Abstract: A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.

Abstract: An inkjet printhead assembly includes an elongate casing that defines a longitudinally extending printhead module channel. A printhead module is positioned in the channel and has a fluid channel member that defines a number of longitudinally extending channels. A plurality of printhead tiles is mounted on the fluid channel member. Each printhead tile is in fluid communication with the channels via outlet ports in fluid communication with said respective channels. A printhead integrated circuit is mounted on each printhead tile. The tiles are configured to nest with each other and the printhead integrated circuits are oriented to have adjacent overlapping end portions. Power and control circuitry is mounted on the casing. Flexible printed circuit boards interconnect the printhead integrated circuits and the power and control circuitry.

Abstract: An inkjet printhead heater chip includes a resistor layer, a dielectric layer on the resistor layer and a cavitation layer on the dielectric layer. A grounded-gate MOSFET electrically attaches to the cavitation layer to protect the dielectric layer from breakdown during an electrostatic discharge (ESD) event. Protection typically embodies the safe distribution of ESD current to ground during user printhead installation. Locations of the grounded-gate MOSFET(s) include terminal ends of one or more columns of ink ejecting elements formed by the resistor layer. Also, the MOSFET source electrically connects to the gate while the drain attaches to the cavitation layer. The drain attaches via first and second metallization lines, including attachment generally above the cavitation layer. The dielectric layer is diamond like carbon layer and is about 2000 angstroms thick. Inkjet printheads and printers are also disclosed.

Abstract: A heater/driver array that includes heaters for generating thermal energy utilized to discharge ink and driver circuits for driving these is mounted on a substrate. The heaters are formed into a plurality of groups and are driven by block drive on a per-group basis. A block selection signal of driving-signal voltage level (VHT) and a heater driving signal corresponding to a selected block are generated based upon a print data signal, which has been input at a logic-signal voltage level (VDD), in any of an input circuit, shift register circuit and decoder circuit. The heater/driver array drives the heaters in accordance with the block selection signal and heater driving signal of the driving-signal voltage level.

Abstract: An inkjet printhead assembly includes an elongate chassis that spans a printing zone. An ink supply arrangement is mounted on the chassis and has an ink distribution assembly and a housing enclosing the ink distribution assembly. At least one elongate integrated printhead circuit is mounted on the ink distribution assembly to receive ink from the ink distribution assembly and to span the printing zone. Power and ground busbars are arranged on the housing. A tape automated bond strip interconnects the busbars and the, or each, integrated printhead circuit.

Abstract: An inkjet print head chip usable in an inkjet print head includes a semiconductor substrate having plural switching devices formed therein, plural heaters provided on upper sides of the switching devices and activated by the plural switching devices to heat ink, and metal wiring layers formed between the plural heaters and the switching devices which externally radiate some of the heat generated from the plural heaters.

Abstract: A driver IC (60) for a printhead includes a first set of data side input/output pads (62) and a second set of data side input/output pads (63). The driver IC further includes circuitry (100) that can select that data is to be input at the first set of pads and output at the second set of pads.

Abstract: A printhead assembly includes an elongate ink distribution structure having ink inlets to receive ink and longitudinally extending ink channels in fluid communication with the inlets. An elongate ink duct assembly is mounted on the ink distribution structure and defines a plurality of converging ink ducts with inlets in fluid communication with the ink channels. A plurality of elongate and serially arranged printhead integrated circuits is mounted on the ink duct assembly to receive ink from the ink ducts. Each printhead integrated circuit defines mating formations on respective ends to facilitate mating of consecutive printhead integrated circuits.

Abstract: A method of fabricating an inkjet printhead chip includes the step of etching a drive circuitry layer that is positioned on a substrate to define regions for roof structures. A first layer of a thermally expandable material is deposited on the drive circuitry layer to cover said regions. The first layer of thermally expandable material and the drive circuitry layer are etched to define a deposition zone for heating circuit material at each region and contact vias for the heating circuit material. At least one heating circuit is formed at each region in electrical contact with the drive circuitry layer by means of the contact vias. A second layer of a thermally expandable material is deposited on the heating circuit material.

Abstract: A printhead integrated circuit for a pagewidth printhead includes an elongate substrate that defines a plurality of ink inlet passages. A drive circuitry layer is positioned on the substrate. A plurality of nozzle chamber structures is positioned on the substrate and defines nozzle chambers in fluid communication with respective ink inlet passages and ink ejection ports in fluid communication with respective nozzle chambers. A plurality of ink ejection members is received in respective nozzle chambers. The ink ejection members are reciprocally displaceable to eject ink from the ink ejection ports. Elongate actuators are each fast at a fixed end with the substrate and are attached to respective ink ejection members at a free end. The actuators are connected to the drive circuitry layer to displace respective ink ejection members on receipt of electrical pulses from the drive circuitry layer.

Abstract: An inkjet printhead chip includes a wafer substrate (116). Drive circuitry is positioned on the wafer substrate. A plurality of nozzle arrangements is positioned on the wafer substrate. Each nozzle arrangement includes nozzle chamber walls (132) and a roof wall positioned on the wafer substrate to define a nozzle chamber (134) and an ink ejection port (124) in the roof wall. A micro-electromechanical actuator (128) is connected to the drive circuitry. The actuator includes a movable member (130) that is displaceable on receipt of a signal from the drive circuitry. The movable member defines a displacement surface that acts on ink in the nozzle chamber to eject the ink from the ink ejection port. An area of the displacement surface is between half and twice a cross sectional area of the ink ejection port.

Abstract: An inkjet printhead integrated circuit includes a substrate that defines a plurality of ink passages. An array of control and drive circuits is positioned on the substrate, each control and drive circuit having a drive transistor that includes a series of parallel traces. An array of inkjet nozzles is arranged on the substrate, each inkjet nozzle including a nozzle chamber structure that defines a nozzle chamber in fluid communication with a respective ink passage and an ink ejection port in fluid communication with the nozzle chamber. Each of a plurality of elongate actuators is anchored to the substrate at a fixed end and overlies and is spaced from, an associated control and drive circuit. Each actuator includes a heater element for differential thermal expansion and contraction and thus displacement of the actuator. Each heater element has a series of corrugations corresponding with respective traces of the drive transistor.

Abstract: A fluid ejection device including: a substrate having a first surface having an non-doped region; a first insulative material disposed on a portion of the first surface, the first insulative material having a plurality of openings forming a path to the first surface; a first conductive material disposed on the first insulative material, the first conductive material being disposed so that the plurality of openings are substantially free of the first conductive material; a second insulative material disposed on the first conductive material and portions of the first insulative material, the second insulative material being disposed so that the plurality of openings are substantial free of the second insulative material and a second conductive material being disposed on second insulative material and within plurality of openings so that some of the second conductive material disposed upon the second insulative material is in electrical contact with the non-doped region on the substrate.

Abstract: An inkjet printhead IC is fabricated using a wafer substrate that defines a plurality of ink inlet channels. A plurality of nozzle structures fabricated on the substrate to define nozzle chambers are in fluid communication with the ink inlet channels and an ink ejection nozzle in fluid communication with each nozzle chamber. Each nozzle structure has a chamber, an ejection nozzle in fluid communication with the chamber, and an ejection member for acting on ink within the chamber. A plurality of actuators attached to the substrate move each of the ejection members respectively, the movement being substantially parallel to the ink inlet flow direction; such that, ink is ejected through the ejection nozzle upon activation of the actuator corresponding to that nozzle structure.

Abstract: A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.

Abstract: A replaceable printer component (14) includes a thermal sense resistor (14B) having a first resistance. A resistance modifier (510) coupled to the thermal sense resistor modifies the first resistance.

Abstract: A semiconductor device constituting a liquid ejection head for ejecting a liquid such as an ink, comprising a segment having a plurality of pairs of recording element and driving element, wherein a first wiring for mutually connecting a first terminal of each driving element arranged within the same segment is formed on a first wiring layer on a semiconductor substrate, and a second terminal of the driving element and a first terminal of the recording element are connected on one for one base, and a second terminal of the recording element is connected to a power source wiring formed by the wiring layer different from the first wiring layer, and an auxiliary wiring for mutually connecting the second terminal of the recording element with the same segment is formed by the first wiring layer, thereby eliminating and suitably adjusting the irregularity of wiring resistance values within the segment.

Abstract: A print head has m driver devices 1 that are fed with a supply voltage VDD and that control the driving of resistive elements acting as heaters and a regulator 2 that is fed with a supply voltage VH higher than the supply voltage VDD and that converts the supply voltage VH into a supply voltage VG, which the regulator 2 then feeds to the individual driver devices 1.

Abstract: In a semiconductor device in which a switching element for allowing a current to flow to a load and a circuit for driving the switching element are formed on a common substrate, the switching element is formed of a DMOS transistor, and the circuit for driving the switching element includes an MOS transistor having a characteristic different from that of the DMOS transistor.

Abstract: A circuit board on an ink cartridge has contact pads which are electrically conducted to a semiconductor storage element mounted on the circuit board. Connector terminals on an ink jet recording apparatus are brought into relative slide contact with a surface of this circuit board, and electrically connected to the contact pads. When the connector terminals come in contact with the contact pads, the dust adhering to the connector terminals is wiped and removed by step portions that are constituted by no-resist-film formation parts and that are adjacent to the contact pads. Consequently, the reliability of the electrical contact between the connector terminals and the contact pads is ensured.

Abstract: A micro-miniature fluid ejecting device. The fluid ejecting device includes a semiconductor substrate having fluid ejectors formed on a surface of the substrate. A flexible circuit is fixedly attached to the semiconductor substrate. The flexible circuit has power contacts for providing power to the fluid ejectors. At least one drive circuit is connected to the fluid ejectors. The drive circuit is disposed on one of the semiconductor substrate and the flexible circuit. A fluid sequencer is connected to the drive circuit for selectively activating the fluid ejectors. The fluid sequencer is also disposed on one of the semiconductor substrate and the flexible circuit. The semiconductor substrate is attached to a housing. A fluid source is provided for supplying fluid to the semiconductor substrate for ejection by the fluid ejectors. The fluid ejecting device provides low cost construction for application specific miniature fluid jetting devices.

Abstract: This invention provides a printhead capable of decreasing the ON resistance value without increasing the heater board size in order to downsize the heater board, an image printing apparatus using the printhead, and a control method therefor. In the printhead, heater resistors are series-connected to normal MOS transistors in each group on a heat board. The pitch of the heater resistors and the pitch of the normal MOS transistors are designed equal to each other in order to shorten the connection line. One high-breakdown-voltage MOS transistor is arranged in each group, and the pitch is designed to a length corresponding to the product of the pitch of the heater resistors and the number x of heater resistors. The high-breakdown-voltage MOS transistor has a higher ON resistance value per unit area than that of the normal MOS transistor. However, the area of the high-breakdown-voltage MOS transistor is larger by x times than that of the normal MOS transistor.

Abstract: A printer includes a print engine and a monochrome formatter connected to the print engine and being operatively connectable to a color chip. A monochrome print engine and a monochrome formatter provide a monochrome printer. A color print engine and a monochrome formatter operatively connected to a color chip provide a color printer.

Abstract: An ink jet print head is provided which includes: a print element substrate; a plate accommodating the print element substrate by enclosing a side peripheral portion of the print element substrate; an electric wiring tape member disposed on the plate and having electric wiring portions for the print element substrate; a first sealant filling a space surrounding the print element substrate enclosed by the plate; and a second sealant covering a part of the electric wiring portions. In this construction, stress concentrations in the electric connections are alleviated even if the electric wiring tape used to support the second sealant has a reduced stiffness due to a reduced thickness of the tape. For this purpose, the plate H1401? is provided with protrusions H1402 as support members that support the second sealant H1308 through the extension portions H1305 of the electric wiring tape.

Abstract: There is provided an ink jet head substrate which can sufficiently suppress generation of noises at the time when heating elements are driven, and which can be constituted small in size. In an ink jet head substrate including a plurality of heating elements, a power transistor for driving the heating elements according to image data, an input pad of a heat pulse (pulse width regulating signal) for regulating a width of a drive pulse to be applied to the heating elements, and a block selection unit for dividing the plurality of heating elements into blocks for a predetermined number of heating elements to drive the heating elements in a time division manner with the divided block as a unit, a delay circuit group consisting of a logic circuit (delay circuit) for supplying a drive pulse, which is applied to the heating elements in a selected block, at staggered timing is provided in a line of a heat pulse.

Abstract: A semiconductor substrate for a microfluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection actuators. Each of the driver transistors have an active area ranging from about 1000 to less than about 15,000 ?m2. A plurality of logic circuits including at least one logic transistor are coupled to the driver transistors. The driver and logic transistors are provided by a high density array of MOS transistors wherein at least the logic transistors have a gate length of from about 0.1 to less than about 3 microns.

Abstract: A base plate for use in a recording head, which is used by an ink jet head for printing by discharging ink onto a recording medium, the recording head being provided with energy converting element for discharging the ink by generating a bubble in the ink by converting electric energy to thermal energy, and an anti-cavitation film to protect the energy converting element from shocks generated at the time of bubble growth and extinction, the anti-cavitation film being used as electrodes for detecting the state of the ink by energizing the ink. The base plate comprises a first diode having the a cathode thereof connected to the anti-cavitation film and an anode thereof connected to a ground potential; and a second diode having the anode thereof connected to the anti-cavitation film and the cathode thereof connected to a power supply potential.

Abstract: A pagewidth printhead is provides which comprises a plurality of printhead integrated circuits. Each integrated circuit includes a substrate that incorporates drive circuitry and a plurality of nozzle arrangements positioned on the substrate for ejecting ink onto media. Each nozzle arrangement includes a static structure extending from the substrate and an active structure defining an ink ejection port which form a nozzle chamber. The active structure is displaceable relative to the static structure towards and away from the substrate respectively to reduce and increase the nozzle chamber volume, thereby ejecting ink in the nozzle chamber from the port. At least two actuators are connected to the drive circuitry and are operatively arranged to displace the active structure on receipt of an actuating electrical signal from the drive circuitry. The actuators are configured and connected to the active structure to impart substantially rectilinear movement thereto.

Abstract: An ink jet recording head and an ink jet recording apparatus using the ink jet recording head are disclosed. The adhesion between a substrate and a discharge port forming member can be improved. In order to further reduce the size of the substrate by further optimizing the arrangement of an inspection pad, at least a recording element protecting section covers the upper part of a recording element row with a conductivity, and at least an electrical circuit element protecting section covers the upper part of an electrical circuit element row with a conductivity. An inspection electrode pad is electrically connectable with the recording element protecting section and the electrical circuit element protecting section.

Abstract: A microinjector comprises a chamber for containing fluid, an orifice in fluid communication with the chamber, the orifice being disposed above the chamber, an actuator disposed proximately adjacent the orifice and external to the chamber for ejecting fluid from the chamber, a metal layer disposed above the chamber, and a conduction channel connected between the metal layer and ground, for preventing parasitic capacitance.

Abstract: A fluid ejection device capable of ejecting fluid onto media and a method of manufacture are provided. The device has a carrier having an upper surface that defines a recess. A fluid ejecting substrate is disposed in the recess and is configured for establishing electrical and fluidic coupling with the carrier. The fluid ejecting substrate has a generally planar orifice layer and a generally planar contact surface positioned below the orifice layer. The orifice layer extends above the upper surface of the carrier and defines a plurality of orifices therein. An encapsulant at least partially encapsulates the fluid ejecting substrate and the carrier.

Abstract: A liquid discharge head substrate used for a liquid discharge head is adapted to discharge liquid by applying discharge energy to the liquid. The substrate is a semiconductor substrate including an energy conversion element for converting electric energy into the discharge energy and a function element made of a ferroelectric material.