Abstract: A continuous ink jet print head is formed of a silicon substrate that includes integrated circuits formed therein for controlling operation of the print head. An insulating layer or layers overlies the silicon substrate and has a series or an array of nozzle openings or bores formed therein along the length of the substrate and each nozzle opening is formed in a recess in the insulating layer or layers by a material depletion process such as etching. The process of etching defines the nozzle openings at locations where heater elements are formed in the insulating layer or layers during a conventional CMOS processing of the integrated circuits. The print head structure thereby provides for minimal post processing of the print head after the completion of the CMOS processing.

Abstract: An ink jet print head is formed of a silicon substrate that includes an integrated circuit formed therein for controlling operation of the print head. The silicon substrate has one or more ink channels formed therein along the longitudinal direction of the nozzle array. An insulating layer or layers overlie the silicon substrate and has a series or an array of nozzle openings or bores formed therein along the length of the substrate and each nozzle opening communicates with an ink channel. The area comprising the nozzle openings forms a generally planar surface to facilitate maintenance of the print head. A heater element is associated with each nozzle opening or bore for asymmetrically heating ink as ink passes through the nozzle opening or bore.

Abstract: The semiconductor device is in the form of a semiconductor chip formed as a recording head of an ink-jet printer or in the form of a semiconductor wafer having at least two semiconductor chips. The semiconductor chip has at least an ink ejection unit, an integrated circuit composed of a drive circuit for driving the ink ejection unit, bonding pads and a metal film covering at least part of an upper layer of the integrated circuit. The metal film is formed to extend from the integrated circuit to an edge of the semiconductor chip. The semiconductor wafer further has at least one grounding pad being formed of the metal film in a region peripheral to the semiconductor wafer and which is outside the semiconductor chips.

Abstract: A microinjector head with a driving circuit and the manufacturing method of the microinjector head are shown. The microinjector head uses a bubble as a virtual valve to eject fluid. The microinjector head has a manifold, chambers, a pair of first and second bubble generators, orifices, and a driving circuit. The driving circuit is used to control the pair of first and second bubble generating devices and eject fluid inside the corresponding chamber from the corresponding orifice. In addition, because the driving circuit and the bubble generators are integrated on a single substrate, the number of manufacturing processes is reduced and the circuit devices and connecting circuits of the microinjector array are fewer.

Abstract: A dynamic memory based integrated circuit ink jet firing cell that includes a heater resistor, a drive transistor, and a dynamic memory circuit for storing firing data only for such heater resistor. Also disclosed is an integrated circuit firing array that includes a plurality of dynamic memory based firing cells divided into a plurality of fire groups of firing cells, each fire group having a plurality of subgroups; data lines for providing energizing data to the firing cells; control lines for providing control information to the firing cells wherein all firing cells within a subgroup are connected to a common subset of the control lines so as to be controlled to concurrently store energizing data; and a plurality fire lines for supplying energizing energy to the firing cells, wherein all firing cells of a fire group receive energizing energy from only one fire line.

Abstract: The functions of an ink-jet print head drive transistor and ink-ejecting heat transducer (resistor) are combined into a single component, a high-temperature transistor. The transistor is turned on when an ink drop is required, and the resultant heat generated by the transistor is used for creating the vapor bubble for ejecting the ink drop. The drop-ejector transistor is a silicon carbide transistor.

Abstract: A printing head is intended to achieve high reliability and a production method of the printing head is intended to achieve high yield at low cost. A liquid ejecting printing head employs a base body, in which an electrothermal transducer element, a driving functional element for driving the electrothermal transducer element, a wiring electrode connecting between the electrothermal transducer element and the driving functional element, and an insulation layer provided on the wiring electrode are formed on a substrate. The electrothermal transducer element has a heat generating resistor formed of a material selected from the group consisting TaN, HfB2, Poly-Si, Ta—Al, Ta—Ir, Au and Ag. A protective layer above the heat generating body is formed of an insulative compound deposited to be low density to high density in order.

Abstract: In a thermal ink jet printhead, an emission resistor includes a layer of electrically conductive material for making connections to the resistor. A temperature sensor and a reference temperature sensor, provided for detecting the temperature of enucleation of a bubble and used to directly determine the amount of energy needed for the emission resistor to effectively reach the temperature of enucleation, are arranged in correspondence with an integrated test resistor identical in construction to the emission resistor. The temperature sensor is formed from the layer of electrically conductive material. A differential amplifier having inputs connected to the temperature sensor and the reference temperature sensor effects regulation of a variable duration of pulses applied to the emission resistor.

Abstract: A thermal ink jet printhead system has a printhead with base member and a plurality of ink flow channels formed in the base member that connect to an ink reservoir and terminate in a nozzle through which ink is expelled. A heating element is associated with each ink flow channel. A monolithically integrated multiple output power driver circuit is formed as a semiconductor integrated circuit and connected to each heating element in the printhead. The multiple output driver circuit includes a power MOS transistor connected to each heating element. A reference circuit is operatively connected to each gate of the power MOS transistor and includes a reference transistor having a gate and a reference amplifier that receives as inputs a reference voltage and a source of current. An amplifier output is operatively connected to the gates of the power output transistors and the gate of the reference transistor.

Abstract: This patent describes a method of manufacturing a a buckle plate ink jet print head wherein an array of nozzles are formed on a substrate utilizing planar monolithic deposition, lithographic and etching processes. Multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer. The print heads can be formed utilizing standard VLSI/ULSI processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably being of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate plane.

Abstract: A printhead mainly includes at least two ink supply holes on a single semiconductor substrate, a first signal processing circuit laid out at at least one corner of the semiconductor substrate to arbitrarily select a heater for heating the ink, and a second signal processing circuit, other than the first signal processing circuit for arbitrarily selecting a heater, that realizes a function without dividing an arrangement. The lengths of signal lines are minimized to realize a printhead free from any malfunction.

Abstract: An ink jet printhead having a ground bus that partially overlies active regions of FET drive circuits.

Abstract: Methods and apparatus are provided for aligning a TAB circuit on first and second intersecting surfaces of a print head. The methods comprise aligning a chip portion of the TAB circuit on the first surface and applying a progressive force along the contact pad portion of the TAB circuit to align the contact pad portion on the second surface of the print head. The apparatus comprise a machine for aligning the chip portion of the TAB circuit on the first surface and roller for applying a progressive force along the contact pad portion of the TAB circuit to align the contact pad portion on the second surface.

Abstract: A substrate having plural recording elements and electrical leads for supplying electric signals to the recording elements includes electrical contacts for external electrical connection for reception of image signals used for driving the recording elements; and a processing circuit for converting signals which are serially supplied to the connecting contact to parallel signals to be applied to the recording elements.

Abstract: A method of manufacturing an ink jet printhead includes providing a substrate. A doped layer is deposited on the substrate and is etched to create an array of nozzles on the substrate with a nozzle chamber in communication with each nozzle. Planar monolithic deposition, lithographic and etching processes are used to form a shutter for openably closing each nozzle chamber and a coiled, thermally responsive actuator to which the shutter is connected for displacing the shutter to open and close the nozzle on demand for controlling ejection of ink from the nozzle.

Abstract: An integrated circuit chip with a low voltage differential signaling receiver (LVDS). The receiver has first and second input lines, and an output line. The first input line is connected to a first input node on the chip, and the second input line connected via a termination resistor on the chip to a second input node on the chip. The second input line is connected to a third input node on the chip. The chip may be installed on a substrate with one or more identical chips, with the first nodes of each chip connected to a first conductor on the substrate, and a second conductor on the substrate connected to the third node of each chip. A second node on one of the chips is connected to the first conductor to involve the resistor.

Abstract: A drive transistor for an ink jet print head includes a semiconductor substrate having a serpentine channel of a first type doping, the channel comprising substantially parallel first and second serpentine channel portions, the first and second serpentine channel portions defining an inner region disposed between the first and second serpentine channel portions and an outer region disposed outside the first and second serpentine channel portions. A drain of a second type doping which is disposed within the inner region. A source of a second type doping which is disposed within the outer region. The transistor has a serpentine gate that overlies the serpentine channel. An elongate drain conductor, which tapers from a wide drain conductor end to a narrow drain conductor end, at least partially overlies a portion of the drain and the serpentine channel. An elongate source conductor has two tapered source conductor portions that at least partially overly the source and the serpentine channel.

Abstract: A heater chip module is provided comprising a carrier adapted to be secured directly to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes inner side walls and a support section which together define an inner cavity. An edge feed heater chip is coupled to the carrier support section. The heater chip includes side walls. The support section includes first and second passages which define first and second paths for ink to travel from the container to the inner cavity. The inner cavity and the heater chip are sized such that a first side wall of the heater chip is spaced from a first inner side wall of the carrier and a second side wall of the heater chip is spaced from a second inner side wall of the carrier. A nozzle plate is coupled to the heater chip and the carrier. The nozzle plate has a width such that the nozzle plate extends over an outer surface of the carrier.

Abstract: This patent describes a method of manufacturing a permanent magnet electromagnetic ink jet print head wherein an array of nozzles are formed on a substrate utilising planar monolithic deposition, lithographic and etching processes. Multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer. The print heads can be formed utilising standard VLSI/ULSI processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably being of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate plane.

Abstract: An ink jet head is provided with heaters to generate energy to be utilized for discharging ink, and MOS transistors to supply electric power to the heaters for recording by discharging ink. For this ink jet head, the MOS transistors comprise source regions and drain regions formed by doping layers arranged near the surface of a semiconductor substrate, gates formed on the semiconductor substrate through an oxide film and arranged to cross over the source regions and the drain regions, and contact units formed by a doping layer different from that of the source regions, and arranged near the surface within the source regions in order to draw out electrons or holes to be unintentionally generated on the semiconductor substrate. With the structure thus arranged, the potential difference becomes smaller between the source regions and back gate area on the semiconductor substrate, making it possible to prevent heaters from being destroyed by any excessive current that may flow uncontrollably.

Abstract: An apparatus addresses ink jet heating elements based on image data to cause ejection of ink droplets toward a print medium. The apparatus includes a controller for generating address signals, power signals, and first and second bank signals. The first and second bank signals, which are carried on first and second bank lines, alternate between on and off states. The first bank signal is off when the second bank signal is on, and the second bank signal is off when the first bank signal is on. The apparatus has m address lines and n power lines connected to the controller for carrying the address signals and the power signals. A print head has m×n number of first driver circuits, each of which is connected to the first bank line and to a corresponding one of the m address lines. The first driver circuits enable flow of a first driving current when the first bank signal and the address signal are simultaneously on on the first bank line and the corresponding address line.

Abstract: A substrate for a recording head has a plurality of recording elements, a plurality of functional elements electrically connected to the recording elements, and a common electrode electrically connected to the recording elements and selectively feeding a driving signal to the recording elements on a base boad. Also, the common electrode is prepared as a layer by the same step as that of forming a conductor electrode layer to be electrically connected to a semiconductor layer constituting the functional elements arranged in the substrate. Therefore, the recording apparatus, can be prepared by the process including the step of forming the recording elements and simultaneously connecting these elements to reduce the number of film forming operations.

Abstract: A thin-film print head is provided that includes at least one MOSTFT transistor, at least one resistor, a conductive line between the transistor and resistor. External interconnects between the internal circuitry of print head and external driver circuitry are provided. The thin-film print head device is adjacent to an ink barrier and an orifice plate that together define the firing chamber. Each firing chamber has associated with it a respective thin-film resistor of the print head that is selectively driven by a respective transistor. The transistor includes a source, a gate, a channel, and a drain, wherein the source, channel, and drain are formed by a first polysilicon layer. The MOSTFT transistor selectively drives the resistor with sufficient current to vaporize ink in the chamber and eject ink therefrom.

Abstract: In order to simply form individual wiring and common wiring in single layer, single layer of individual wiring and common wiring connected to heating resistors are formed. Electrode connected to common wiring is located at a position closer to the heating resistor than electrodes connected to the individual wiring.

Abstract: A drive transistor for a high resolution ink jet printhead having a pocket implant in the gate region of the device. The pocket implant enables a reduced source to drain spacing without loss of breakdown voltage. Accordingly, the size of the transistor may be reduced. Alternatively, this device is suitable for addressing 1200 spi resolution printheads. In one embodiment, the pocket implant extends about 1 .mu.m beyond the gate region towards the drain region. Both embodiments produce a graded drift region.

Abstract: To provide a print head unit and device and a method for evaluation of the print head unit without performing a printing operation. A current probe 21 detects a head ground current, which corresponds to a driving circuit output current. A current-voltage converter 22 converts the head ground current to a voltage level. Then, an integrating device integrates the voltage level to a waveform which corresponds to the head ground current. By comparing the produced waveform with a proper waveform one can determine, whether the print head unit is operational.

Abstract: An object of the present invention is to provide an ink jet recording head and an apparatus using the same, wherein electrothermal conversion element for thermally emitting a recording ink is provided at a side of a substrate on which the head structure is formed, thereby reducing a loss in the thermal energy.

Abstract: A recording head has a liquid emission section with an orifice for emitting ink, an electro-thermal transducer producing thermal energy for ink emission and a functional element electrically connected to the electro-thermal transducer. The functional element is connected to the transducer by a layer formed of the same material and at the same time as a layer of a heat generating resistive layer constituting the electro-thermal transducer, which enables the formation of a large number of functional elements on a single substrate while maintaining the elements in electrical isolation without increasing manufacturing cost.

Abstract: Thermal ink jet apparatus includes an ink jet pen with a plurality of ink ejection nozzles. Associated with each nozzle is a first resistor and second resistor. A feed channel introduces a quantum of ink into thermal communication with each first resistor and second resistor. The quantum of ink requires a level of applied thermal energy of E.sub.min to be caused to be ejected from the associated nozzle. An X-Y matrix drive circuit selectively applies a half-select address current to a first resistor and a half-select address current to a second resistor, both resistors located at a common nozzle. Each half-select current is insufficient to cause a resistor to emit E.sub.min thermal energy, but both half-select currents cause the first and second resistors to couple at least E.sub.min of thermal energy to the co-located quantum of ink so as to enable an ejection thereof.

Abstract: The present invention provides a method of making an auxiliary electrode layer for a common electrode pattern in a thermal printhead. The method of the present invention includes the steps of: preparing a master substrate (1') which has an obverse surface provided with a common electrode pattern (4) and corresponds to a plurality of head substrates; forming at least one slit (9) in the master substrate (1') where the slit extends along the common electrode pattern (4); and forming an auxiliary electrode layer (6) on a reverse surface of the master substrate (1') so that the auxiliary electrode layer (6) extends via the slit (9) for electrical connection to the common electrode pattern (4). The slit has a width of no less than 0.5 mm for example, particularly no less than 0.8 mm for controlling to provide a proper turnover (R) of the auxiliary electrode layer (6).

Abstract: An ink jet head provided with discharging orifices for discharging ink, which includes a substrate having a supporting member having at least a surface having substantially insulating properties and a plurality of diodes provided on the supporting member, the diodes each comprising a polycrystalline silicon layer and at least one metal silicide layer, wherein the polycrystalline silicon layer has a p-n junction surface therein.

Abstract: An ink jet recording head includes a substrate with ejection energy generating elements for ejecting ink, a wiring board electrically connected at a first connecting region to an electric connection pad on the substrate and functioning to apply voltage to the ejection energy generating elements, and a plate is combined with the substrate, the plate being provided with a groove constituting an ink passage when it is combined with the substrate. A second connecting region is found between the substrate and plate, the substrate having a projection at a position between the second connecting region and the pad, the first connecting region and second connecting region each being sealed by a resin sealing material.

Abstract: The present invention provides a structure and a method of manufacturing a resistor in a semiconductor device and especially for a resistor in an ink jet print head. The method begins by providing a substrate 10 having a field oxide region 20 surrounding an active area. The field oxide region 20 has an ink well region 52. Also a transistor is provided in the active area. The transistor comprises a source 12, drain 14 and gate electrode 16 18 19. A dielectric layer 24 is formed over the field oxide region 20 and the transistor 12 14 16 18. The dielectric layer 24 has contact openings over the source 12 and drain 14. A resistive layer 26 27 is formed over the dielectric layer 24 and contacting the source 12 and drain 14. The resistive layer 26 27 is preferably comprised of two layers of: a Titanium layer 26 under a titanium nitride 27 or a titanium layer 26 under a tungsten nitride layer 27. A first metal layer 28 is formed over the resistive layer.

Abstract: Disclosed is a process which comprises reacting a polyimide precursor with borane. Also disclosed is a thermal ink jet printhead containing a layer comprising the product of this reaction.

Abstract: The occupied area of a heater drive circuit of a recording head is reduced, and the number of manufacturing steps is decreased. As a circuitry of the heater drive unit, the final stage of the drive unit is constituted of a pnp or npn bipolar transistor, the heater, which is a load, is connected to the emitter side, and the collectors of each transistor are connected commonly to the base itself and grounded. The prestage of the drive unit is formed of the prestage of a MOS type element whose polarities are reversed to those of the final stage, i.e., an n-type MOS transistor with respect to the final stage of a pnp bipolar transistor and a p-type MOS transistor with respect to the final stage of a npn bipolar transistor, and the source of the prestage is grounded.

Abstract: A process is disclosed for fabricating a thermal inkjet printhead in which the driving circuitry and heating resistors are incorporated in a single integrated circuit. In the process, a protective cavitation layer, which may contain tantalum, is deposited at the locations of the heating regions over a passivation layer and is then patterned prior to any patterning or etching of the passivation layer. A via is then formed in the passivation layer.

Abstract: There is disclosed an ink-jet head for performing recording by discharging an ink, including a discharge port for discharging the ink, and an ink channel which communicates with the discharge port and is provided with a discharge energy generating element for discharging the ink. An optical element is arranged at a position, corresponding to the ink channel, of the ink-jet head. There are also disclosed an ink-jet apparatus using the ink-jet head and a substrate for the ink-jet head.

Abstract: A method of fabricating bubblejet print devices uses semiconductor fabrication techniques, and this method involves forming a heater means and an electrical connection to the heater means on a substrate, and forming a passageway through the substrate. A given end of the passageway is disposed adjacent to the heater means, and this given end is formed as an outlet for ejecting ink.

Abstract: To generate an amount of heat uniformly in respective heaters which are selectively driven to eject ink droplets from the corresponding nozzles, a bypass common line is connected to a common conductor line with at least one connection conductor line. The heaters are connected between an LSI driver circuit and the common conductor line. The common conductor line and the connection conductor lines are made from nickel and the bypass common line is made from aluminum. Alternatively, the common conductor line may be of a three-lay structure having a first layer of a thin-film aluminum, a second layer of a Ta--Si--O alloy thin-film deposited to cover the first layer, and a third layer of a nickel thin-film deposited on the second layer.

Abstract: For each printhead nozzle, nozzle circuitry includes a warming transistor, drive transistor and heating resistor. To maintain a threshold temperature at the printhead, a warming pulse is sent from the warming transistor to the heating resistor of one or more nozzles when the temperature falls below a prescribed temperature. To fire a nozzle a firing pulse is output from the drive transistor to the heating resistor. The warming transistor is laid out as a segmented portion of the drive transistor layout area. No layout penalty is incurred by including the warming transistor for each nozzle. The source of a warming transistor is coupled in common to the source of a drive transistor. The drain of the warming transistor is coupled in common to the drain of the drive transistor. The gates are separate. The gates receive respective warming or firing control signals. The drains are coupled to the heating resistor.

Abstract: Single faults in shift registers incorporated on monolithic printing heads can render inoperable large numbers of printing actuators, as data will either be stuck high or stuck low for subsequent shift register and actuator stages. This can reduce the effectiveness of other means of fault tolerance, and increase the device sensitivity to faults in individual, normally redundant, actuators. A printing head is disclosed which provides block fault tolerance in the shift registers, limiting the effect of shift register fabrication faults to small numbers of redundant actuators. This allows a high probability of defect correction by other forms of fault tolerance integrated on the chip, thereby increasing overall device yield.

Abstract: An ink jet print head includes a substrate and a plurality of nozzles provided on the substrate for ejecting ink. The plurality of nozzles are arranged in two dimensions on the substrate such that a shortest distance between adjacent nozzles in at least one dimension is shorter than a pixel pitch.

Abstract: Large print heads with many thousands of nozzles may have current consumption in excess of 20 Amperes. This would cause significant problems if standard interconnection techniques were used. The present invention effects very high current delivery to print heads by utilizing the entire long edges of the print head as power terminals.The V+ and V- connections are fabricated as 200 .mu.m wide strips of 1 .mu.m aluminum along the edges of the chip which are perpendicular to the print direction. Lines of aluminum extend from the V.sup.+ connection until the row of nozzles closest to the V.sup.- connection. These lines pass between every second nozzle, and are as wide as the device layout and process technology will allow. Lines of aluminum extend from the V.sup.- connection until the row of nozzles closest to the V.sup.+ connection. These lines are interdigitated with the V.sup.+ lines.

Abstract: A liquid ink, drop-on-demand printhead includes a substrate having a plurality of drop-emitter orifices, an ink channel coupled to each of the orifices for delivery of a body of ink to the orifices at a pressure above ambient, thereby forming an ink meniscus at the orifices. Drop selection is effected by selectively delivering heat to ink which has been delivered to selectively addressed ones of the orifices, thereby causing a difference in meniscus position between ink in addressed and non-addressed orifices. A heater is suspended in each ink meniscus close to its surface when the meniscus is at its position in a non-addressed orifice, the heater being effective to heat the meniscus and to thereby reduce surface tension of the meniscus at selectively addressed orifices.

Abstract: In an ink ejection recording head, a silicon dioxide layer is formed on the surface of a silicon substrate, a silicon nitride layer is formed on the silicon dioxide layer, and a plurality of heaters are formed on the silicon nitride layer. The heater is constituted by a thin film resistor made from a Ta--Si--O alloy and a thin film conductor made from nickel. Further, a gold layer is formed through plating on at least a portion of the thin film conductor to be connected to another conductor prior to thermally oxidizing the heaters.

Abstract: A substrate usable for a liquid jet recording head having a semiconductor substrate, transistors, and electricity-heat converting elements for generating heat energy to be utilized for discharging a liquid, which is electrically connected to said transistors, in which a plurality of said transistors is provided and the collector region of said transistors is made common.

Abstract: In an active ink jet printhead chip (13) a layer of boron-phosphorus doped silicate glass (BPSG) immediately underneath the heaters followed by a silicon dioxide layer. This insulates the substrate during the fire pulse of its heater, yet allows thermal energy to diffuse into the silicon during the time between firing pulses.

Abstract: An ink jet recording head includes an ink discharging portion having a discharge opening for discharging ink, a substrate having an electrical/thermal converting element for generating thermal energy supplied to the ink discharging portion and used to discharge the ink, and a temperature detecting element, and an information bearing means for carrying information providing the feature of the temperature detecting element. The output from the temperature detecting element are used to adjust the temperature of the ink jet recording head.

Abstract: A liquid injection recording head includes an integrated drive circuit a recording current energization time for electrothermal conversion elements. The setting circuit has a counter. The recording current energization time data can be set in the counter in the setting circuit in synchronism with a signal obtained by frequency-dividing a recording data transfer clock or with this clock signal supplied to a circuit arranged in the integrated drive circuit to align recording data.

Abstract: An ink jet head includes a common electrode formed on a semiconductor substrate. A charge is applied to the common electrode and an electrode disposed on another substrate in opposition to a diaphragm formed in the semiconductor substrate to electrostatically deform the diaphragm and eject ink. The common electrode comprises a single layer or multiple layer metallic coating forming ohmic contact on the semiconductor substrate. In addition, a group III or group V element is doped to a high concentration at the area on the semiconductor substrate where the common electrode is formed. The diaphragm can therefore vibrate at high speed. An ink jet head capable of high speed printing can be provided because supply and elimination of the charge to the diaphragm can be accomplished at high speed.