Integrated Patents (Class 347/59)
  • Patent number: 6946718
    Abstract: A device includes a substrate and a first layer disposed adjacent the substrate. A second layer is disposed adjacent the first layer. A third layer contains a gap and is disposed adjacent the second layer. A fuse is electrically coupled to the third layer and is located in the proximity of the gap in the third layer.
    Type: Grant
    Filed: January 5, 2004
    Date of Patent: September 20, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Victorio Chavarria
  • Patent number: 6932453
    Abstract: An inkjet printhead assembly includes at least one inkjet printhead including N primitives and an address having M possible address values. Each primitive includes a group of at most M drop generators. The address is cycled through all M address values to control a sequence of which one drop generator in the primitive is fired at a given time. One drop generator in the primitive can be fired simultaneously with one drop generator in each of the other primitives. A primitive to address ratio (N/M) of the printhead is at least 10 to 1.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: August 23, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James A. Feinn, Winthrop D. Childers, Michael J. Barbour
  • Patent number: 6921156
    Abstract: The present invention includes as one embodiment a printhead including a flat panel substrate made of a non-crystalline material, an array of inkjet drop generators formed onto the flat panel substrate to define an inkjet printhead and thin film transistors formed on the flat panel substrate that are electrically coupled to the array of ink jet drop generators.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: July 26, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Winthrop D. Childers, Douglas A. Sexton
  • Patent number: 6902258
    Abstract: An integrated circuit (IC) is formed on a substrate. The IC has a first well having a first dopant concentration that includes a second conductivity low-voltage transistor. The IC also has a second well having a dopant concentration equal to the first dopant concentration that includes a first conductivity high-voltage transistor. In addition, the IC has a third well having a second dopant concentration of an opposite type than the first well that includes a first conductivity low-voltage transistor. The first conductivity low-voltage transistor and the second conductivity low-voltage transistor are created without a threshold voltage (Vt) implant.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: June 7, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Zhizang Chen, Bao-Sung Bruce Yeh, S. Jonathan Wang, Cathy P. Peltier
  • Patent number: 6902257
    Abstract: The present invention provides a fluid injection head structure and a method of fabricating the same. The fluid injection head structure is disposed on a substrate and has a bubble generator, a functional device for control the bubble generator, a first conductive trace composed of poly-silicon, a chamber, a manifold in flow communication with the chamber, and a second conductive trace. The second conductive trace electrically couples the functional device with the bubble generator and the first conductive trace. Moreover, the chamber further has at least one orifice through the substrate and a gate and the first conductive trace are formed in the same photo-etching process (PEP).
    Type: Grant
    Filed: November 3, 2002
    Date of Patent: June 7, 2005
    Assignee: BenQ Corporation
    Inventors: Tsung-Wei Huang, Chih-Ching Chen
  • Patent number: 6890048
    Abstract: This invention provides a printhead capable of decreasing the ON resistance value without increasing the heater board size in order to downsize the heater board, an image printing apparatus using the printhead, and a control method therefor. In the printhead, heater resistors are series-connected to normal MOS transistors in each group on a heat board. The pitch of the heater resistors and the pitch of the normal MOS transistors are designed equal to each other in order to shorten the connection line. One high-breakdown-voltage MOS transistor is arranged in each group, and the pitch is designed to a length corresponding to the product of the pitch of the heater resistors and the number x of heater resistors. The high-breakdown-voltage MOS transistor has a higher ON resistance value per unit area than that of the normal MOS transistor. However, the area of the high-breakdown-voltage MOS transistor is larger by x times than that of the normal MOS transistor.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: May 10, 2005
    Assignee: Canon Kabushiki Kaisha
    Inventor: Nobuyuki Hirayama
  • Patent number: 6871942
    Abstract: An electrical device includes an interconnect and a pair substrates at least one of which includes an integrated circuit, the pair of substrates being bonded together by a bond that includes a structure having multiple widths and a composition that is selected from the group consisting of a graded material and a first material upon a second material.
    Type: Grant
    Filed: April 15, 2002
    Date of Patent: March 29, 2005
    Inventors: Timothy R. Emery, William J. Edwards, Donald W. Schulte
  • Patent number: 6841830
    Abstract: A MOSFET and the method for fabricating them are disclosed to make the inkjet head chips. The MOSFET has the scaled-down junction formation for the source and drain. Using a lower temperature process and interlayer dielectric, the source and drain dopants can not be diffused deeply due to high-temperature driver-in. The contact holes of the drain are provided with plugs of refractory material to avoid spiking between the metal and silicon. This achieves the requirement of high-density devices on the print head chip.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: January 11, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Hung Liu, Jian-Chiun Liou, Chun-Jung Chen, Je-Ping Hu
  • Patent number: 6814428
    Abstract: A method for manufacturing a fluid injection head. The fluid injection head structure is formed on a substrate and has a manifold therein, bubble generators, a conductive trace, and at least two rows of chambers adjacent to the manifold in flow communication with the manifold. The conductive trace disposed on a top surface of the substrate and partially disposed between the two rows of the chambers above the manifold is used to drive the bubble generator.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: November 9, 2004
    Assignee: BenQ Corporation
    Inventors: Tsung-Wei Huang, Chih-Ching Chen
  • Patent number: 6805432
    Abstract: A method of forming a fluid ejecting device such as an ink jet printing device that includes forming a plurality of fluid drop generators on a first surface of a silicon substrate, forming a partial fluid feed slot in the silicon substrate by deep reactive ion etching, and forming a fluid feed slot by wet etching the partial fluid feed slot.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: October 19, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Donald J Milligan, Timothy L. Weber
  • Publication number: 20040169702
    Abstract: A narrow ink jet printhead having efficient FET drive circuits that are configured to compensate for parasitic resistances of power traces. The ink jet printhead further includes ground busses that overlap active regions of the FET drive circuits.
    Type: Application
    Filed: March 3, 2004
    Publication date: September 2, 2004
    Inventors: Joseph M. Torgerson, Robert N.K. Browning, Mark H. MacKenzie, Patrick V. Boyd
  • Publication number: 20040169701
    Abstract: A printer includes an inkjet printhead having a plurality of nozzles. The nozzles include a thermal actuator and drive circuitry for operating the thermal actuator. The drive circuitry and actuator overlie a common area of the support substrate.
    Type: Application
    Filed: March 4, 2004
    Publication date: September 2, 2004
    Inventor: Kia Silverbrook
  • Patent number: 6758552
    Abstract: A thin-film ink-jet drive head provides a MOSTFT (metal oxide semiconductor thin-film transistor) transistor, a resistor and the interconnect between the two electrical components, all comprised of the same, multi-functional thin-film layer. Differing portions of the multi-functional thin-film layer function as (1) heating resistors to propel ink droplets from the printhead (2) ink MOSTFT transistors to selectively drive (fire) the resistors, and (3) direct conductive pathways between the drive transistors and the resistors.
    Type: Grant
    Filed: December 6, 1995
    Date of Patent: July 6, 2004
    Assignee: Hewlett-Packard Development Company
    Inventor: Domingo A. Figueredo
  • Patent number: 6758551
    Abstract: An acoustic inkjet print head having the RF generator and amplifier located at the load location for directly driving the load is disclosed. In so doing the power distribution medium, e.g. transmission line and any power divider device are eliminated. The overall power efficiency can be near to the high efficiency amplifier. In the case of Class-E, greater than 90 percent efficiency can be achieved. Due to the miniaturization of components the high efficiency power supply can be shielded effectively to minimize EME and can be further be integrated to a MCM or IC.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: July 6, 2004
    Assignee: Xerox Corporation
    Inventors: Paul C. Tien, Mehrdad Zomorrodi
  • Publication number: 20040125173
    Abstract: An inkjet printhead heater chip has an ink via asymmetrically arranged in a reciprocating direction of inkjet printhead movement. The ink via has two sides and a longitudinal extent substantially parallel to a print medium advance direction. A column of fluid firing elements exists exclusively along a single side of the two sides. The heater chip and ink via each have a centroid and neither resides coincidentally with one another. Preferably, the heater chip centroid resides externally to a boundary of the ink via. In other aspects, the column of fluid firing elements can be a sole column or plural and may be centered in the reciprocating direction. The ink via can be a sole via or plural. The heater chip can be rectangular and the ink vias can be closer to either the long or short ends thereof. Inkjet printers for housing the printheads are also disclosed.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 1, 2004
    Inventors: George Keith Parish, Kristi Maggard Rowe
  • Patent number: 6742874
    Abstract: Printhead substrate for inputting a data signal (DATA) in synchronization with a clock signal (CLK). The printhead substrate comprises: input terminals inputting the clock signal and data signal; shift registers inputting and maintaining the data signal in synchronization with the clock signal inputted from the input terminals; and a time lag adjuster arranged between an input terminal and the shift register to adjust a time lag of at least one of the clock signal or data signal. By virtue of adjusting the time lag by the time lag adjuster, setup time and hold time between the clock signal and the data signal inputted to the shift register is ensured.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: June 1, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Nobuyuki Hirayama, Tatsuo Furukawa, Yoshiyuki Imanaka
  • Publication number: 20040100534
    Abstract: An acoustic inkjet print head having the RF generator and amplifier located at the load location for directly driving the load is disclosed. In so doing the power distribution medium, e.g. transmission line and any power divider device are eliminated. The overall power efficiency can be near to the high efficiency amplifier. In the case of Class-E, greater than 90 percent efficiency can be achieved. Due to the miniaturization of components the high efficiency power supply can be shielded effectively to minimize EME and can be further be integrated to a MCM or IC.
    Type: Application
    Filed: November 26, 2002
    Publication date: May 27, 2004
    Applicant: Xerox Corporation
    Inventors: Paul C. Tien, Mehrdad Zomorrodi
  • Publication number: 20040085405
    Abstract: An ink-jet printhead including a substrate, in which an integrated circuit for a driving logic circuit to selectively drive the nozzle, and a logic circuit to input/output printing data to/from a fuse array, are formed. The printhead further includes an electrode which is used for wirings of the integrated circuit and the logic circuit and is patterned on the substrate, a plurality of heaters which are formed on the electrode and generate heat by current applied through the electrode from the integrated circuit, and a fuse array which includes a plurality of fuse members formed on the electrode on a same plane with the heater and selectively fused by current applied through the electrode from the logic circuit and stores printing data. The printhead further includes a cover member which is provided on the heater and the fuse array and in which an ink chamber and a nozzle are formed in a position corresponding to each of the heaters.
    Type: Application
    Filed: June 3, 2003
    Publication date: May 6, 2004
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Oh-hyun Baek
  • Patent number: 6728013
    Abstract: A printing apparatus comprises CPUs provided for corresponding one of a plurality of colors, each of which generates image data of a specified color; memories, each of which stores the image data of the specified color; system ASICs, each of which manages the memories; video output controllers, each outputting the image data supplied from the corresponding system ASICs as a video signal; and image generating sections, each generating an image based on the video signal outputted from the video output controllers.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: April 27, 2004
    Assignee: NEC Corporation
    Inventor: Hiromi Yanagita
  • Publication number: 20040061743
    Abstract: An integrated circuit fabricated on a single substrate that includes a data bus and purpose-specific functional units connected to the data bus. The functional units include a JPEG decoder and a printhead interface. A general-purpose processor is also connected to the data bus and controls the functional units by running software that coordinates the functional units to receive, expand and print pages.
    Type: Application
    Filed: September 11, 2003
    Publication date: April 1, 2004
    Applicant: Silverbrook Research Pty Ltd
    Inventors: Paul Lapstun, Kia Silverbrook
  • Patent number: 6702413
    Abstract: A liquid discharge head which comprises an element substrate having on one surface thereof energy generating element for generating energy to be utilized for discharging liquid from a liquid discharge port, and a liquid supply port communicated with the liquid discharge port, a printed substrate provided with an external fetch electrode, and an IC component for control use for the energy generating element having provided therefor an output side electrode connected with the energy generating element and an input side electrode connected with the external fetch electrode. For this liquid discharge head, at least the aforesaid output side electrode of the IC component for control use is provided for the one surface of the element substrate.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: March 9, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroshi Takabayashi, Tadayoshi Muta, Toru Yamane
  • Patent number: 6692112
    Abstract: A monolithic ink-jet printhead, and a method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: February 17, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeon-cheol Kim, Yong-soo Oh, Keon Kuk, Kwang-joon Yoon, Jae-sik Min, Sang-hyun Lee, Chang-seung Lee, Seog Soon Baek, Sang-wook Lee, Jong-cheol Shin
  • Patent number: 6682174
    Abstract: An ink jet printhead chip includes a wafer substrate. Drive circuitry is positioned on the wafer substrate. A plurality of nozzle arrangements is positioned on the wafer substrate. Each nozzle arrangement includes nozzle chamber walls and a roof wall positioned on the wafer substrate to define a nozzle chamber and an ink ejection port in the roof wall. A micro-electromechanical actuator is connected to the drive circuitry. The actuator includes a movable member that is displaceable on receipt of a signal from the drive circuitry. The movable member defines a displacement surface that acts on ink in the nozzle chamber to eject the ink from the ink ejection port. An area of the displacement surface is between half and twice a cross sectional area of the ink ejection port.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: January 27, 2004
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook
  • Patent number: 6663227
    Abstract: The semiconductor device is in the form of a semiconductor chip formed as a recording head of an ink-jet printer or in the form of a semiconductor wafer having at least two semiconductor chips. The semiconductor chip has at least an ink ejection unit, an integrated circuit composed of a drive circuit for driving the ink ejection unit, bonding pads and a metal film covering at least part of an upper layer of the integrated circuit. The metal film is formed to extend from the integrated circuit to an edge of the semiconductor chip. The semiconductor wafer further has at least one grounding pad being formed of the metal film in a region peripheral to the semiconductor wafer and which is outside the semiconductor chips.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: December 16, 2003
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Ryoichi Yamamoto, Masao Mitani
  • Patent number: 6648453
    Abstract: An ink jet printhead chip includes a wafer substrate. A CMOS drive circuitry layer is positioned on the wafer substrate. A plurality of nozzle arrangements is positioned on the wafer substrate and the CMOS drive circuitry layer. Each nozzle arrangement includes nozzle chamber walls and a roof wall that define a nozzle chamber and an ink ejection port defined in the roof wall. A micro-electromechanical actuator is connected to the CMOS drive circuitry layer. The actuator has at least one movable member that is positioned to act on ink in the nozzle chamber to eject the ink from the ink ejection port on receipt of a signal from the drive circuitry layer. The movable member is spaced between 2 microns and 15 microns from the CMOS drive circuitry layer.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: November 18, 2003
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook
  • Patent number: 6644788
    Abstract: An ink jet printhead having FET drive circuits that are configured to compensate for power trace parasitic resistances.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: November 11, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Joseph M. Torgerson, David M. Hurst
  • Publication number: 20030193548
    Abstract: An electrical device includes an interconnect and a pair substrates at least one of which includes an integrated circuit, the pair of substrates being bonded together by a bond that includes a structure having multiple widths and a composition that is selected from the group consisting of a graded material and a first material upon a second material.
    Type: Application
    Filed: April 15, 2002
    Publication date: October 16, 2003
    Inventors: Timothy R. Emery, William J. Edwards, Donald W. Schulte
  • Publication number: 20030184618
    Abstract: This present invention is embodied in a large array printhead having a large array of thin-film ink drop generators formed on a single monolithic substrate. The large array printhead includes a multiplexing device to reduce parasitic resistance and the number of incoming leads. In a preferred embodiment, the substrate is initially patterned and etched and the multiplexing device is attached to the substrate at a later time. The present invention also includes methods of fabricating a plurality of large array printhead embodiments using a single monolithic substrate made of a suitable material, preferably having a low coefficient of thermal expansion.
    Type: Application
    Filed: May 16, 2003
    Publication date: October 2, 2003
    Inventors: Winthrop D. Childers, Douglas A. Sexton
  • Patent number: 6619786
    Abstract: An improved TAB circuit is provided for use with ink jet printer cartridges, which carries electrical signals to an array of nozzles on a heater chip. The TAB circuit eliminates bent or broken electrical circuit traces before being bonded to the heater chip by creating a chip window that partially overlaps the edges of the heater chip, and by bringing the electrical circuit traces to the chip window and terminating these circuit traces at a PI (polyimide) edge, which defines the inner perimeter of the chip window. The circuit traces thus are not unsupported at their ends before being assembled to the heater chip, and are automatically correctly positioned to make contact with bond pads of the heater chip when the overall TAB circuit is in correct registration therewith. The TAB circuit also provides an improved tolerance for a covercoat placement that will tend to prevent corrosive ink from coming into contact with these metal traces.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: September 16, 2003
    Assignee: Lexmark International, Inc.
    Inventors: Brian Lee Cobb, Jeffrey Louis Sangalli
  • Patent number: 6594899
    Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, a protection layer having a first heating surface on the heater resistor and a second heating surface entirely surrounding the first heater surface on the heater resistor, and an ink ejection nozzle. The drop generator vaporizes ink at the first heating surface and ejects a drop of ink of a first mass from the nozzle when a first range of energies is applied to the heater resistor. The drop generator vaporizes ink at the first heating surface and the second heating surface and ejects a drop of ink of a second mass from the nozzle when a second range of energies is applied to the heater resistor.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: July 22, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert C. Maze, Todd A. Cleland, Arun K. Agarwal, Mark A. Buonanno
  • Publication number: 20030132988
    Abstract: A printer has a print head with multiple nozzles and firing elements for corresponding nozzles. The print head receives one or more power supply inputs to operate the firing elements. The print head has power supply fault protection circuitry to guard against harmful and destructive effects on firing resistors resulting from power supply fluctuations. The power supply fault protection circuitry is integrated into a pen-based chip that also forms the firing elements and optionally the firing logic.
    Type: Application
    Filed: December 10, 2002
    Publication date: July 17, 2003
    Applicant: Hewlett-Packard Corporation
    Inventors: Jeffery S. Beck, Adam L. Ghozeil
  • Patent number: 6582063
    Abstract: A silicon wafer substrate is used in ink-jet printhead fabrication. The fabrication process is improved by simultaneously forming MOSFET source/drain contact vias simultaneously with substrate contact vias. A dry etch having a silicon oxide:silicon etch rate of at least 10:1 is employed.
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: June 24, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Victorio A. Chavarria, Sadiq S. Bengali, Ronald L. Enck
  • Patent number: 6582062
    Abstract: This present invention is embodied in a large array printhead having a large array of thin-film ink drop generators formed on a single monolithic substrate. The large array printhead includes a multiplexing device to reduce parasitic resistance and the number of incoming leads. In a preferred embodiment, the substrate is initially patterned and etched and the multiplexing device is attached to the substrate at a later time. The present invention also includes methods of fabricating a plurality of large array printhead embodiments using a single monolithic substrate made of a suitable material, preferably having a low coefficient of thermal expansion.
    Type: Grant
    Filed: October 18, 1999
    Date of Patent: June 24, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Winthrop D. Childers, Douglas A. Sexton
  • Patent number: 6575562
    Abstract: Inkjet printhead chips comprise a substrate, a plurality of transducers, a plurality of interconnects and driver circuitry capable of electrically connecting the transducers and the interconnects. The substrate has a surface with opposing first and second edges, with a plurality of transducers arranged along the first edge and a plurality of interconnects arranged along the second edge. The driver circuitry is arranged on the substrate. The printhead chips can also be included in inkjet printhead chip assemblies wherein the printhead chip is arranged on a print surface of a body, and wherein the print surface is capable of being arranged generally parallel to a surface of a print-receiving medium. In this embodiment, an edgefeed is disposed between the first edge and the printhead body, and is in fluid communication with an ink reservoir.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: June 10, 2003
    Assignee: Lexmark International, Inc.
    Inventors: Frank Edward Anderson, Bruce David Gibson
  • Patent number: 6565762
    Abstract: This patent describes a method of manufacturing a shutter based ink jet print head wherein an array of nozzles are formed on a substrate utilizing planar monolithic deposition, lithographic and etching processes. Multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer. The print heads can be formed utilizing standard VLSI/ULSI processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably being of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate plane.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: May 20, 2003
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook
  • Publication number: 20030090547
    Abstract: A base plate for use of a recording head, which is used for an ink jet head for printing by discharging ink to a recording medium, being provided with energy converting element for discharging ink by generating a bubble in ink with the conversion of electric energy to thermal energy, and an anti-cavitation film to protect the energy converting element from shocks generated at the time of bubble growth and extinction, said anti-cavitation film being used as electrodes for detecting the state of ink by energizing the ink, comprises a first diode having the anode thereof connected to the anti-cavitation film and the cathode thereof connected to the ground potential, and a second diode having the cathode thereof connected to the anti-cavitation film and the anode thereof connected to the power supply potential. With the structure thus arranged, it is made possible to reduce the possibility that the circuit element formed on a semiconductor substrate is destroyed by electrostatic discharge.
    Type: Application
    Filed: November 14, 2002
    Publication date: May 15, 2003
    Inventors: Yoshiyuki Imanaka, Ichiro Saito, Teruo Ozaki, Muga Mochizuki, Takaaki Yamaguchi
  • Publication number: 20030081069
    Abstract: A monolithic ink-jet printhead, and a method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.
    Type: Application
    Filed: October 24, 2002
    Publication date: May 1, 2003
    Inventors: Hyeon-Cheol Kim, Yong-Soo Oh, Keon Kuk, Kwang-Joon Yoon, Jae-Sik Min, Sang-Hyun Lee, Chang-Seung Lee, Seog Soon Baek, Sang-Wook Lee, Jong-Cheol Shin
  • Patent number: 6543883
    Abstract: A fluid ejection device includes drive circuitry for a heating element, wherein at least part of the drive circuitry is positioned proximate to and within 60 microns of the heating element.
    Type: Grant
    Filed: September 29, 2001
    Date of Patent: April 8, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Simon Dodd, Joseph M Torgerson
  • Patent number: 6520616
    Abstract: A printer system for and corresponding method of determining an arrangement of status objects forming a status tree structure used to represent hardware components contained within a printer and the status tree structure stored within a print engine of the printer. A change in operational condition of one of the hardware components are detected with a sensor. A state of a status object corresponding to the one of the hardware components is changed to have an active state. A name of the status object having the changed state is transmitted from the print engine to a controller. The status object having the changed state is queried for a root path of the status object with the controller.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: February 18, 2003
    Assignee: Hewlett-Packard Company
    Inventors: David D Parks, Trung Vu Nguyen
  • Patent number: 6520617
    Abstract: A drop emitting device that includes a plurality of nozzle openings and a plurality of grooves in the vicinity of the nozzle openings.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: February 18, 2003
    Assignee: Hewlett-Packard Company
    Inventor: Dustin W Blair
  • Patent number: 6512284
    Abstract: A semiconductor antifuse device that utilizes a resistive heating element as both a heating source or fuse blowing and as part of the fuse link. The antifuse device may also be utilized as a fuse and the antifuse or fuse embodiment can be programmed and read with the same two electrodes. The antifuse or fuse is well suited for use and efficient fabrication in a printhead apparatus or other circuit arrangements.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: January 28, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Donald W. Schulte, Galen H. Kawamoto, Deepika Sharma
  • Patent number: 6502925
    Abstract: An ink jet print head is formed of a silicon substrate that includes an integrated circuit formed therein for controlling operation of the print head. The silicon substrate has one or more ink channels formed therein along the longitudinal direction of the nozzle array. An insulating layer or layers overlie the silicon substrate and has a series or an array of nozzle openings or bores formed therein along the length of the substrate and each nozzle opening communicates with an ink channel. The area comprising the nozzle openings forms a generally planar surface to facilitate maintenance of the printhead. A heater element is associated with each nozzle opening or bore for asymmetrically heating ink as ink passes through the nozzle opening or bore.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: January 7, 2003
    Assignee: Eastman Kodak Company
    Inventors: Constantine N. Anagnostopoulos, John A. Lebens, David P. Trauernicht, James M. Chwalek, Christopher N. Delametter
  • Patent number: 6499834
    Abstract: A printhead mainly includes at least two ink supply holes on a single semiconductor substrate, a first signal processing circuit laid out at least at one corner of the semiconductor substrate to arbitrarily select a heater for heating the ink, and a second signal processing circuit, other than the first signal processing circuit for arbitrarily selecting a heater, that realizes a function without dividing an arrangement. The lengths of signal lines are minimized to realize a printhead free from any malfunction.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: December 31, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventor: Masahiro Takizawa
  • Publication number: 20020186280
    Abstract: Provided is a recording head substrate on which are mounted energy generating elements that contribute to the formation of images by a recording head, and on which both light-receiving elements and light-emitting elements, or at least, light-receiving elements are mounted. In addition, provided is a recording head substrate on which are mounted energy generating elements that contribute to the formation of images by a recording head, and on which are mounted a plurality of head position detecting elements for detecting the position of the recording head.
    Type: Application
    Filed: July 26, 2002
    Publication date: December 12, 2002
    Inventors: Yoichi Taneya, Hiroyuki Ishinaga
  • Patent number: 6488363
    Abstract: A narrow ink jet printhead having efficient FET drive circuits that are configured to compensate for parasitic resistances of power traces. The ink jet printhead further includes ground busses that overlap active regions of the FET drive circuits.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: December 3, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Joseph M. Torgerson, Robert N. K. Browning, Mark H. MacKenzie, Patrick V. Boyd
  • Patent number: 6474790
    Abstract: The invention provides an ink jet recording head in which a discharge port forming member including plural discharge ports for discharging droplets of recording liquid is provided on a substrate bearing thereon plural recording elements for providing the recording liquid with discharge energy and electrical circuit elements for driving the recording elements, the head comprising a first metal film covering the upper side of the recording elements and a second metal film covering the upper side of the electrical circuit elements; wherein the discharge ports are so arranged as to form plural arrays and the recording elements are so arranged as to form an array in the vicinity of each array of the discharge ports; the first metal film is provided over the plural arrays of the recording elements; and the first and second metal films are formed in the form of a mutually opposed pair of comb teeth.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: November 5, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventor: Mineo Kaneko
  • Patent number: 6474789
    Abstract: A substrate having plural recording elements and electrical leads for supplying electric signals to the recording elements includes electrical contacts for external electrical connection for reception of image signals used for driving the recording elements; and a processing circuit for converting signals which are serially supplied to the connecting contact to parallel signals to be applied to the recording elements.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: November 5, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroyuki Ishinaga, Masahiko Ogawa, Masami Ikeda, Asao Saito, Hideo Saikawa, Akihiro Yamanaka, Kimiyuki Hayasaki, Teruo Ozaki, Shuichi Murakami, Hiroto Matsuda
  • Patent number: 6471338
    Abstract: A microinjector head with a driving circuit and the manufacturing method of the microinjector head are shown. The microinjector head uses a bubble as a virtual valve to eject fluid. The microinjector head has a manifold, chambers, a pair of first and second bubble generators, orifices, and a driving circuit. The driving circuit is used to control the pair of first and second bubble generating devices and eject fluid inside the corresponding chamber from the corresponding orifice. In addition, because the driving circuit and the bubble generators are integrated on a single substrate, the number of manufacturing processes is reduced and the circuit devices and connecting circuits of the. microinjector array are fewer.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: October 29, 2002
    Assignee: Benq Corporation
    Inventors: Chih-Ching Chen, Tsung-Wei Huang
  • Publication number: 20020140772
    Abstract: A narrow ink jet printhead having three columnar arrays of ink drop generators configured for multi-pass color printing at a print resolution having a media axis dot spacing that is less than the columnar nozzle spacing of the ink drop generators. The ink jet printhead more particularly includes high resistance heater resistors and efficient FET drive circuits that are configured to compensate for variation in parasitic resistance presented by power traces.
    Type: Application
    Filed: January 30, 2001
    Publication date: October 3, 2002
    Inventors: Joseph M. Torgerson, Robert N.K. Browning, Mark H. MacKenzie, Michael D. Miller, Angela White Bakkom
  • Publication number: 20020140779
    Abstract: A narrow ink jet printhead having efficient FET drive circuits that are configured to compensate for parasitic resistances of power traces. The ink jet printhead further includes ground busses that overlap active regions of the FET drive circuits.
    Type: Application
    Filed: December 17, 2001
    Publication date: October 3, 2002
    Inventors: Joseph M. Torgerson, Robert N.K. Browning, Mark H. MacKenzie, Patrick V. Boyd