Abstract: A video camera is suspended over a printed circuit board for repair by an XY positioning system which permits the camera to be moved into desired positions over the printed circuit board, in alignment with detected defects which have been identified on the printed circuit board, so that an operator is advised of the location of each defect on a conveniently positioned monitor. The image displayed on the monitor can then be used in actually performing the desired repair. The result is an integrated operation which permits the location of detected defects, as well as their repair, without requiring the operator to divert attention from the repair procedures which are then underway. If desired, the image which is present on the monitor can be magnified to facilitate the operator's repairs, and to enhance any inspections required in conjunction with such repairs.

Abstract: A high speed, high accuracy, three-dimensional inspection system for ball and pin grid assemblies. The system uses a three-dimensional scanner to gather data which is analyzed to yield height position measurements along with overall packaged dimensions. The grid array to be scanned is placed upon a fixture above a motion control table. The motion control system is controlled by a personal computer and has a high resolution. The parts can be presented in single trays, tray stackers, tubes or other carriers. Array packages are handled either manually or automatically. In the manual mode, arrays are loaded onto the fixture by hand before activated the image processing hardware. Alternatively, an automatic pick and place module may be used to load the grid array packages on the fixture. The fixture consists of a plate with a cavity the size of the grid array package being inspected. The size of the cavity can be adjusted to fit different size parts.

Abstract: An arrangement for inspecting straightness of an array of pins in which the array is illuminated by a thin beam of light. Images of surfaces of the array of pins that are illuminated are projected on a photo-sensitive device. The array of pins is movable relative to the beam of light and the imaging device. The imaging device and photo-sensitive device are also movable relative to the array of pins.

Abstract: This invention provides a method and apparatus for automatically inspecting the connection of a wire to a lead on lead frame containing a semiconductor chip or similar device. Using an image processor to locate the general position of a soldered lead in a digitized image, the present invention creates a template of an idealized optical indentation left by a good bond; determines parameters such as wire angle, idealized position and shape thresholds for applying the template; conducts a normalized correlation search of the digitized image; compares the results returned to the parameters and reports the resulting signals generated by this comparison to a host controller or other control module.

Abstract: Any shape lead formed on various types of drum may be measured without employing an exclusively-used profiling plane by a lead shape measuring apparatus. The lead shape measuring apparatus includes a shape measuring unit for measuring the shape of a lead formed on a drum used in a VTR while a theoretical value suitable for this lead shape is selected based on the type of drum.

Abstract: Golden Template Comparison (GTC) is a method that can be applied to flaw and defect detection in images of 2-dimensional scenes. When a test image is compared to a golden template image, the images must be registered, and then subtracted. The resulting difference image is then analyzed for features that indicate flaws or defects. The registration step is a major determinant of the performance of GTC, and the invention performs the registration step of GTC using a highly efficient and accurate registration method.

Abstract: A method and resulting system for directing generally collimated illumination from a source at an oblique angle to a surface under inspection (SUS) to produce scattered nonspecular energy substantially normal to the SUS and for observing the scattered nonspecular energy in one of a plurality of fractional windows of a viewed image of the SUS via a plurality of focussing elements. Such arrangement results in simultaneous and significant throughput and sensitivity enhancement over existing art. The method can be enhanced further wherein the observing step is performed through suitable relative motion of the scattering image over the imaging plane to permit over sampling. Furthermore, the DMT is significantly simplified because imaging is utilized to electronically scan the wafer instead of using opto-mechanical scanning means. Imaging sensors with an aggregate 2000.times.2000 pixel resolution could image a 200 mm wafer to 100 microns pitch.

Abstract: The apparatus (10) includes a flat transparent surface (30) and two angled mirrored surfaces (32, 34) which direct the light to the ball grid array (12) on the underside of the semiconductor device (14) positioned on the flat transparent surface (30) in a live bug mode. The mirrored surfaces (32, 34) also direct the image of the ball grid array (12) to an image capturer (18) such as a video camera. The focus information of each solder ball is used to determine the distance to the tips of each solder ball. The coplanarity of the ball grid array can then be determined and/or verified.

Abstract: A method and apparatus which incorporate self learning techniques for the detection of solder defects and for statistical process control of solding operations on printed circuit board assemblies (PCBA) are disclosed. The invention includes learning techniques which are used during the inspection of cross-sectional X-ray images of solder joints. These learning techniques improve measurement accuracy by accounting for localized shading effects, which can occur when inspecting double-sided printed circuit board assemblies. Two specific examples are discussed. The first is a method for detection of solder short defects. The second method utilizes learning to improve the accuracy of statistical process control (SPC) measurements.

Abstract: While relatively transporting a wire to be inspected and a unit including a first light source for emitting a first beam, a second light source for emitting a second beam which intersects with said first beam at a predetermined reference position, and a photodetector for detecting reflection light of said first and second beams derived from said first and second light sources respectively, a relative position between said unit and said wire is detected as a first position when said first beam is reflected from said wire. Then, while relatively moving said unit and said wire, another relative position between said unit and said wire is detected as a second position when said second beam is reflected from said wire. Then, a height of said wire from said reference position is calculated based on an interval between said first and second positions.

Abstract: Pieces of feature information in a bi-level image such as a width, a branching point and an ending point of a wiring pattern are detected in a design rule checking section according to a micro inspection to find out pieces of feature information departing from a design rule. Also, feature codes in the bi-level image such as a corner of the wiring pattern are detected in a specific shape detecting section according to a macro inspection. The feature information are compared with pieces of referential feature information pertaining to a non-defective wiring pattern in a first comparing and judging section to judge whether the wiring pattern indicated by the feature information is defective or non-defective. The feature codes are compared with referential feature codes pertaining to a non-defective wiring pattern in a second comparing and judging section to judge whether the wiring pattern indicated by the feature codes is defective or non-defective.

Abstract: A method and apparatus used with a printed circuit board (PCB) defect detection system generates a reference database image of the PCB having tolerances for each individual PCB feature, The invention is characterized by a tolerance database of at least three states in which each color is weighted and adjacent pixels are grouped into arrays or "bins". An error signal is generated when the sum of the pixel weights in a bin exceeds a preselected threshold.

Abstract: A method for inspecting a semiconductor device includes an inspection station (10), a handling system (12), a microscope (14), a camera (18), and a computer (20) having a monitor (22). A magnified image (40) of the device being inspected is transmitted to monitor (22) via camera (18). A template image (60) is then recalled from computer readable memory and is superimposed upon the magnified image of the device appearing on monitor (22). The template image (60) includes transparent regions (62) and opaque regions (64). The opaque regions block out all areas of the device not associated with the characteristic being inspected, while the transparent regions highlight the area of interest. Using the superimposed image (70), the operator can quickly focus on the area of the device requiring attention. In specific embodiments of the invention, a template is used to assist inspection of a wire bond configuration, a die attach material bondline, lead skew, and mark placement.

Abstract: An apparatus for and method of determining the coplanarity of leads of a semiconductor device is provided. The apparatus comprises a base (24) for placing the semiconductor device, and a plurality of mirrors (38) and (36) surrounding the base. The mirrors reflect an image of the leads of the semiconductor device to a camera. The camera records an image from which the lead coplanarity is determined. The base contains an optical datum (34) which provides a reference plane from which to measure coplanarity. The mirrors can be placed such that an off-axis image of the leads is reflected to the camera. The off-axis image improves the apparent sensitivity of the coplanarity measurement.

Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.

Abstract: Human inspection of an object (12) having a light-reflective areas (20) thereon arrayed in individual arrays (21) is enhanced by first capturing the image of selected portions of the arrays via one or more image capture devices (34). The images are processed to create a single image frame in which like portions of like arrays of light-reflective are uniformly spaced and oriented in a two-dimensional array having large scale regularity. The single image frame is then displayed on a display (48) for observation by a human operator (29). Because the displayed image frame of the light-reflective areas has large scale regularity, the operator bility to detect defects associated with missing or misaligned light-reflective areas will be enhanced.

Abstract: A method and apparatus for efficient registration of a pair of digitized images is provided that obtains a registration metric value based upon a Sum of Absolute Differences registration metric computation for each of a plurality of neighboring-pixel relative displacements, and, for example, iteratively selects a new initial relative displacement from among the plurality of neighboring-pixel relative displacements such that each succeeding new initial relative displacement is associated with a smaller registration metric value, until an initial relative displacement that is associated with a minimum registration metric value is reached. In general, the relative displacement that is associated with the minimum registration metric value is located using a two-dimensional numerical optimization analysis. The invention is especially useful for flaw and defect analysis, such as Golden Template Analysis, third optical inspection, as well as for pair-wise comparison of die images on a semiconductor wafer.

Abstract: A latch-up pulse generator system includes a latch-up pulse generator coupled to first and second power supplies, for outputting JEDEC-standardized first and second output pulse trains. The generator includes a master clock, digital frequency dividers, and digitally controlled delay circuitry for outputting the two pulse trains. The first pulse train is a square-wave signal with a repetition rate of about two seconds. The second pulse train has a pulse width that is digitally controllable between about 0.2 .mu.s and 5 .mu.s. The delay between the fall-time of the second pulse train and the fall-time of the first pulse train is variably controlled between about 1 .mu.s and one second in 1 .mu.s steps. The amplitude and current output of each pulse train may range from 0 to perhaps 15 VDC at a current level of about 5 A. For power pin latch-up testing, the two pulse trains are combined to produce a composite pulse train. Signal and/or power pins of a CMOS device under test may be analyzed.

Abstract: A measurement apparatus includes two mirrors reflecting light rays obtained when a group of leads arranged on one lateral surface of a semiconductor device and a light-shielding band pattern are illuminated in two different directions. The measurement apparatus thus inputs the light rays into a single imaging device without moving the semiconductor device and the transparent mounting plate so that the distance traveled by one light ray from an illumination unit to the imaging device is equal to the distance traveled by the other light ray through the mirror to a second imaging device. Thus, an inexpensive measurement apparatus automatically measures the dimensions of a semiconductor device at high speed using an automatic feeding function and to produces highly accurate measurements.

Abstract: An illumination system having a lighting dome, a vertical light source, an image acquisition means, and a light controlling means, a system controller and a three-axis servo system wherein the dome is of unitary printed circuit board construction populated with a plurality of surface mounted light emitting diodes is disclosed. The dome has a first longitudinal axis and is bendable along hinges formed through the circuit board to define a partially enclosed dome having eight octants or sections, each section having an upper and lower tier portion defining a plurality of planar illumination banks, which illuminate an object from 360.degree. around the object and from predetermined angles relative to the first longitudinal axis. The vertical light source, which is a planar printed circuit board populated with surface mounted LEDs, and the beam splitter are provided for illumination of the object with light parallel to the first longitudinal axis.

Abstract: A printed circuit board inspection system acquires images for purposes of inspection from viewing fields defined along the surface of the printed circuit board to be inspected which can be varied in size to accommodate the density and tolerance of components associated with the printed circuit board under inspection. To this end, the cameras of the inspection head associated with the printed circuit board inspection system are provided with zoom lenses, which are capable of controlled operation responsive to the existing microprocessor systems of the printed circuit board inspection system. This allows the magnification of images acquired by the cameras to be varied, as desired, in turn varying the size of the viewing fields defined for inspection purposes. The inspection head is then operated at a rate commensurate with the size of the viewing fields which have been selected.

Abstract: A method and apparatus used with a printed circuit board (PCB) defect detection system generates a reference database image of the PCB having tolerances for each individual PCB feature wherein a tolerance database of at least three states in which each color is weighted and adjacent pixels are grouped into arrays or "bins". An error signal is generated when the sum of the pixel weights in a bin exceeds a preselected threshold.

Abstract: Disclosed is a new self-reference signal processing technique for detecting the location of any nonregularities and defects in a periodic two-dimensional signal or image. Using high-resolution spectral estimation algorithms, the proposed technique first extracts the period and structure of repeated patterns from the image to sub-pixel resolution in both directions, and then produces a defect-free reference image for making comparison with the actual image. Since the technique acquires all its needed information from a single image, on the contrary to the existing methods, there is no need for a database image, a scaling procedure, or any apriori knowledge about the repetition period of the patterns.

Abstract: A method and apparatus for compensating substrate distortion in automatic optical inspection (AOI) systems eliminates false error signals during printed circuit boards (PCB) defect detection. The present invention is used in feature edge transition AOI systems that employ pixel to pixel comparison between CAD and scanned PCB feature databases. The present invention divides the substrate into a plurality of regions or "tiles". A distortion vector for each tile is calculated and is used to generate a shift of pixels within each tile which removes any variation between the preferred pixel location and the actual pixel location, thereby enabling the AOI system to avoid generating error signals when features are only misplaced on the substrate.

Abstract: The visualization method includes generating a relatively wide beam of light directed onto an object to be inspected and determining the center of intensity of the wide beam of light reflected from the object for facilitating geometric dimensional calculations of a large number of such objects, such as solder deposits on the surface of a printed circuit board, in a very short period of time and in a very accurate manner.

Abstract: Electronic components such as integrated circuit components have rows of parallel leads extending from the sides of their bodies. In detecting bent leads of an electronic component, at least two measuring lines are set along each row of leads. The intersections between the measuring lines and the leads are extracted and processed to detect a bend in leads. The electronic component is photographed to produce image data which is stored in a memory. At least two measuring lines are virtually set along the row of leads of the image data stored in the memory. An intersection extractor extracts, from the image data, the intersections between the measuring lines and predetermined leads in the row of leads. A detector then uses the extracted intersections to detect bent leads.

Abstract: In inspecting a bend of a wire which is bonded to, for example, a semiconductor device, a straight scale line with scale markings of constant intervals and a bonded-point line, both lines crossing each other at right angles, are shown on a monitor. An image of a wire that has a bend is monitored by a camera and displayed on a monitor. By overlapping the image of the bend of the wire on the scale line and then reading a scale marking which is closest to the bend of the wire, it is possible to ascertain the amount of the bend of the wire.

Abstract: A pattern inspection apparatus for comparing/collating a test target pattern with a corresponding design pattern to detect the presence/absence of a defect which is present in the test target pattern includes a bit pattern generating circuit for developing the data of the design pattern into bits, a corner pattern detector for scanning a corner pattern detection window having a predetermined range with respect to reference pattern data as a reference of a pattern obtained by bit development performed by the bit pattern generating circuit to extract a contour pattern, and detecting a corner pattern to be subjected to corner rounding processing on the basis of the extracted contour pattern, a memory for storing predetermined change information corresponding to the corner detected by the corner pattern detector, a graphic pattern synthesizing circuit for changing a graphic pattern in accordance with the information in the memory, and a comparing circuit for comparing reference pattern data, obtained by rounding

Abstract: The invention pertains to a method and apparatus for providing a continuous, uniform, diffuse lighting environment for use in conjunction with electronic machine vision, or manual microscope inspection systems to inspect specular surfaces such as soldered circuits, ball bearings, reflective packaging, relective packaging, etc. The disclosed invention effectively eliminates apparent variations in surface brightness caused by the reflection of discontinuities in traditional machine vision lighting systems that typically require windows or viewing openings or orifices to allow visual access to the object being observed, thus allowing for a true observation signal from which the effect of surface geometry has been substantially removed.

Abstract: A measuring method and apparatus for automatically and accurately measuring the sizes of portions of a hybrid integrated circuit chip and circuit patterns formed thereon or a wiring board and wiring patterns formed thereon. An image of a portion of a hybrid integrated circuit chip or wiring board is obtained through a TV camera which provides image signals representing images including those of objective portions. The image signals are processed to calculate the positions of the objective portions automatically. The size of an arbitrary objective portion is determined from a difference between respective positions of other objective portions.

Abstract: A light source device for an image processor has a plurality of LEDs which are disposed below a television camera. A shelter plate is disposed above the light source so as to prevent light emitted from the light source from directly entering the television camera. A cylindrical light transmitting barrel is provided, extending from the television camera to a position sufficiently close to an object to be detected.

Abstract: An automated electronic module inspection system having illumination sources that produce digitized gray scale images that are then analyzed by a computer. The inspection system illuminates the module including solder joints, components and printed circuit board using a sequence of illumination that produce visual images which are used to identify defects. The inspection system inspects for all defects as specified in MIL-STD-2000A (Section 4.4) by using both surface reflectance properties as well as topological properties of objects. The system comprises two video cameras. A positioning table aligns a module-under-test with the optical axis of each camera thereby enabling the same field-of-view to be observed under different lighting conditions. A dark field illumination associated with a first camera preferentially illuminates non-flat surfaces, but not vertical surfaces. A bright field illumination associated with a second camera preferentially illuminates relatively flat surfaces.

Abstract: A TAB tester for recognizing image on or before testing the TAB so as to prevent erroneous detection. There are provided first, second and third image cameras. The second image camera is disposed upstream relative to a first sprocket, namely, at the front stage of measurement of a tape carrier and it takes a second image of the TAB and outputs a second image to an image processing unit. The third image camera is disposed downstream relative to a punch unit, namely, at the rear stage of the measurement of the tape carrier and it takes a third image of the TAB and outputs the third image to the image processing unit. The image processing unit converts the second and third images into second and third processed image data. The second processed image data is supplied to a control unit where it is stored as data of necessity of measurement of the TAB.

Abstract: Defects and latent defects are detected in connection patterns on a substrate by automated optical testing using bright field illumination and feature extraction template yielding an improved degree of feature discrimination. The feature extraction templates include angularly disposed vectors requiring detection of a predetermined (e.g. foreground) image value with a predetermined distance and a vector angularly interposed between those vectors which requires no detection of the predetermined image value within a distance which is greater than the predetermined distance. Thus, for successful detection of a defect, a portion of one of a set of templates having such a vector condition configuration must be wedged between areas of an image of a surface having the predetermined image values.

Abstract: In a design rule checking method of the invention, pattern data for forming one layer is divided into two types of pattern data for an A layer and a B layer. Then, A rules to be satisfied by the pattern data for the A layer, B rules to be satisfied by the pattern data for the B layer, and AB rules to be satisfied by a combination of the two types of pattern data for the A and B layers are established. Then, based on the established rules, it is checked to see whether the pattern data for the A layer satisfies the A rules, whether the pattern data for the B layer satisfies the B rules and whether the combination of the two types of pattern data for the A and B layers satisfies the AB rules.

Abstract: An apparatus for testing and adjusting audio/video signal waveforms in a color television, comprising a computer unit, a program logic controller, a measurement device, first and second interface units, a printed wiring board remote controller, an adjustment motor driving circuit, adjustment motors, an adjustment motor select circuit and an adjustment motor moving circuit. Therefore, according to the invention, the waveform test and adjustment for the printed wiring board are performed by the present apparatus, resulting in reduction in an inferiority rate and a labor cost in manufacturing the goods.

Abstract: A calibration system for circuit inspection tools in which analog threshold levels are automatically set by digital signals. The inspection too includes an optical detector system that provides video signals to channels each containing an analog processor. In the analog processor an analog reference signal, an analog video inspection signal which may contain a defect indication and a digital threshold signal are employed. The digital threshold signal is converted into an analog threshold signal which is summed with the analog reference signal that has been inverted. The inverted, thresholded reference signal is then summed with the analog video signal. The summed analog video signal and thresholded reference signal is compared with a zero level. If the sum is greater than zero a defect is indicated.

Abstract: An inspection system utilizes an image doubler design that includes a plurality of mirrors that effectively folds the object distance by reflecting the image along a folded path. Strobed illumination is used in conjunction with a shutterless camera. Increased image resolution results from an optional anamorphic lens with vertical magnification. The lens assembly includes concentric toroidal lens that are produced from a single piece of machineable optical material.

Abstract: A printed pattern is provided with a wiring pattern having a land and a through hole surrounded by the land. The wiring pattern and the through hole are read by a photoelectric image sensor to obtain a pattern image and a hole image, respectively. A pattern gauge image is defined by the pattern image, and a hole gauge image having a ring-like shape is obtained from the hole image. A logical product between the inversion image of the pattern gauge image and the hole gauge signal provides a protrusion region image. Since the hole gauge image has an isotropic contour, the minimum annular width of the land is detected, independent of the direction in which the through hole is deviated from the land.

Abstract: The leads of a QFP are examined by an optical system. The optical system includes a sensor head having two lasers, the outputs of the lasers being fed to a beam splitter which provides outputs at right angles to each other, and a ring-light which is disposed under the beam splitter and in actual alignment with the beam splitter. The sensor head is carried by a carriage in a single plane along two transverse directions. The carriage moves the sensor heads so as to examine one lead at a time along the peripheral edges of the QFP.

Abstract: Methods, devices and an image sensor for investigating an object (13) by means of a reflectable radiation beam (25) which forms a spot (24) on the object which can be moved relative to the object (13), whereby the actual position of the spot on the object is determined by means of the reflected portion of the radiation beam detected by an optical detector (23), while the desired position of the spot relative to the object is determined by means of a multidimensional image sensor (21). The radiation beam can subsequently be moved relative to the object until the actual position of the spot corresponds to the desired position of the spot, or differences between the actual and the desired position of the spot may be determined as a measure for differences in the distance between the object and a reference plane (62).

Abstract: The invention is to a system and apparatus for determining the planarity of leads on a semiconductor device. An image system is used to locate the leads with reference to a reference plate on which the device is mounted, and a real-time reference which is used to provide a known correlation between image pixels and linear measurement such as mils.

Abstract: A method and apparatus for detecting neck disconnection between a land and a line in a wiring pattern on a printed board includes a scanner for obtaining images of the wiring pattern and a through hole formed in the pattern. The image of the wiring pattern is converted to a line image representing a wiring line by thinning the pattern image. A window encompassing the image of the through hole is defined, and part of the thinned pattern image overlapping the window is extracted. The number of end points of the thinned pattern image is counted in the window. If the number of the end points is an odd number larger than one, it is determined that neck disconnection is present in the wiring pattern.

Abstract: An optical inspection system is provided in which the background video component of an analog video source which limits imaging integrity is removed enhancing the system's ability to process a wider range of image sources with increase digitizing sensitivity. The overall effects of background and background variations are nulled stabilizing the effective signal to noise ratio, thereby increasing inspection capability of the system and improving the system's process window for effective and efficient inspection.

Abstract: A bonded wire inspection apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame including: a vertical illuminator that illuminates an object of inspection from above; an optical assembly that images particular portions of the object such as the ball at one end of a wire and the crescent at another end of the wire, by receiving the light that is emitted from the vertical illuminator and reflected by the object; a camera that photographs the image obtained by the optical assembly; and a diaphragm that is provided beneath the vertical illuminator and electrically changeable in its opening diameter. Thus, by adjusting the opening diameter of the diaphragm, clear images of the object are constantly obtained despite the differences of surface smoothness of the portions to be inspected.

Abstract: An array of circuit elements which when excited produces voltages is analyzed by examining successive voltage images produced by the circuit elements. Specifically, the array of circuit elements is repeatedly excited at high speed while the voltage image produced by the array is electro-optically sampled at a succession of clock times using a relatively slow-speed electro-optic image sampling technique using a burst clock, thereby to capture a succession of voltage images. The successive voltage images can be viewed on a display device directly individually, or they can be processed by an image processor which compares the successive voltage images with stored representations of voltage images to yield information regarding the condition of the array. Maximum permissible device operating speed can also be determined without examination of individual cells.

Abstract: A pattern defects inspection system inspects the presence/absence of pattern defects in a photomask as an object to be inspected in which a chromium pattern and a phase shift pattern are formed together. Measurement data output from a sensor circuit for generating measurement pattern data by inspecting measurement patterns corresponding to two types of patterns formed on the object by radiating light on the object, and two identifiable design data stored in a magnetic disk unit in advance, i.e., chromium pattern design data used to form a chromium pattern and phase shift pattern design data used to form a phase shift pattern, are read out by a bit pattern generator for performing development processing. The two types of bit data obtained by the bit pattern generator are synthesized according to the same coordinate definition. The synthesized design data is compared with the measurement data by a comparator. As a result, the presence/absence of pattern defects in the object can be determined.

Abstract: An apparatus for inspecting conditions of bonding between, for example, a semiconductor chip and a lead frame including a camera that images objects such as bonding wires, and ball parts and crescents of the wires, a vertical illuminating assembly installed beneath the camera so as to illuminate the objects vertically, and a ring-form illuminating assembly made up of LED's arranged in a concentric circles so as to illuminates the objects from above diagonally. With such illuminating assemblies, clear images of the object are taken easily by the camera for inspection and measuring purposes.

Abstract: A verification and repair station for examining a printed circuit board (PCB) at a plurality of predetermined co-ordinates thereon for enabling an operator to classify suspected faults and to effect manual repair thereof if necessary. A worktable is provided for securing thereon the PCB in precise registration with an origin of the worktable and a fixed camera produces a magnified image of an illuminated area of the PCB. The co-ordinates are stored in a memory of a computer whilst a translatory drive is coupled to the worktable and to the computer for moving the worktable under control of the computer through mutually orthogonal axes so that successive co-ordinates are aligned with the camera.

Abstract: A bonded wire inspection apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame being made up by an objective lens group that takes in an image of an object of inspection (such as a bonding wire, ball at the end of the wire, etc.), imaging lens groups that image the image taken in by the objective lens group, and cameras that photograph the images taken by the imaging lens groups, and these being all installed in an opto-head. The objective lens group is moved in a vertical direction by a Z-direction drive motor. Thus, the over all size of the inspection apparatus can be compact, dirt, etc. that has a deleterious effect on the object of inspection can be avoided, and the inspection precision can be significantly high.