Abstract: A color image of an inspection object is taken by an imaging means capable of taking a color image to obtain color information of an RGB color space. A gray-scale image of a color component of the RGB color space or another color space is generated, and the inspection object is detected by a pattern recognition technique. Alternatively, a binary image is generated from the generated gray-scale image, and the inspection object is detected by performing pattern recognition on the binary image. Color data of a pixel occupied by the detected inspection object is compared with color data of a non-defective inspection object which is previously prepared to judge whether or not the inspection object is defective. In addition, this judgment result is reflected in another manufacturing step through a network and product quality is improved.

Abstract: The invention provides a substrate surface imaging method and apparatus that compensates for non-linear movement of the substrate surface during an imaging sequence. In one aspect of the invention, the imaging method and apparatus compensate for the non-linear substrate surface movement by adjusting the image receiver trigger points to correspond to image positions on the substrate surface. In another aspect, the invention provides synchronous imaging where the distance between each image position is determined by counting the number of stepper motor steps between image positions. In still another aspect, the invention provides for asynchronous substrate imaging by determining an image trigger time between each image position and using the image trigger time to trigger the receiver at the appropriate time to accurately image the substrate surface.

Abstract: An apparatus for processing a defect candidate image, including: a scanning electron microscope for taking an enlarged image of a specimen by irradiating and scanning a converged electron beam onto the specimen and detecting charged particles emanated from the specimen by the irradiation; an image processor for processing the image taken by the scanning electron microscope to detect defect candidates on the specimen and classify the detected defect candidates into one of plural classes; a memory for storing output from the image processor including images of the detected defect candidates; and a display unit which displays information stored in the memory and an indicator, wherein the display unit displays a distribution of the detected and classified defect candidates in a map format by distinguishing by the classified class, and the display unit also displays an image of a defect candidate stored in the memory together with the map which is indicated on the map by the indicator.

Abstract: Semiconductor wafer inspection device comprising a wager transport arm provided with at least one wafer support element, a wafer gripper, the gripper having two distant branches designed to take hold of the opposed edges of the wafer, the gripper being mounted so as to rotate on a shaft in order to be able to rotate the wafer between an approximately horizontal position and an approximately vertical position, and at least two inspection systems placed on one side of the wafer and on the other, in an approximately vertical position symmetrically with respect to the plane passing through the wafer.

Abstract: A wafer viewer system is provided for graphical presentation and analysis of a wafer and a wafer series. More specifically, the wafer viewer system includes a graphical user interface for displaying a wafer, graphically selecting regions of the wafer for analysis, performing analysis on the selected regions of the wafer, and displaying results of the analysis.

Abstract: An observation device (1) for observing a portion near the end of a wafer (10), comprising an imaging section (40) for imaging an image near the end of a wafer (10) from the extending direction of the wafer (10), and an image processing section (50) for detecting the edge of a film formed on the surface of the wafer (10) is further provided, as an illumination section for illuminating a portion near the end of a wafer (10), with an epi-illumination source (48) for illuminating a portion near the end of a wafer (10) via an observation optical system (41), and a diffusion illumination source (31) arranged to face the surface of the wafer (10) and illuminate a portion near the end of a wafer (10) using diffused light.

Abstract: A visual image retrieval system is provided. The system includes an image database for storing images. The system also includes a preprocessor communicatively linked to the image database for segmenting the images and generating based upon segmented images a region-of-interest (ROI) extraction output. Additionally, the system includes an ROI feature extraction module for computing ROI feature vectors based upon the output, and a global feature extraction module for computing global feature vectors based upon the output. The system further includes an ROI feature vectors database for storing the ROI feature vectors, and a global feature vectors database for storing the global feature vectors. The system also includes a perceptually-relevant image search machine (PRISM) interface for displaying query images and retrieved images, the retrieved images being retrieved in response to a user selecting at least one displayed query image.

Abstract: An apparatus for processing a defect candidate image, including: an imager for taking an enlarged image of a specimen; an image processor for processing the image taken by the imager to detect defect candidates existing on the specimen and classify the detected defect candidates into one of plural defect classes; a memory for storing information of the defect candidates including the images of the defect candidates and the classified defect class data outputted from the image processor; and a display unit having a display screen for displaying information stored in the memory, wherein the display unit displays an image of the defect candidates together with the defect class data stored in the memory and the displayed defect class data is changeable on the display screen, and the memory changes the stored defect class data of the displayed defect candidate to the changed defect class data.

Abstract: An apparatus for inspecting pattern defects, the apparatus including: an image acquisition unit which acquires an image of a specimen and stores the acquired image in an image memory; a defect candidate extraction unit which performs a defect candidate extraction process by using the acquired image, which is read from the image memory; and a defect detection unit which performs a defect detection process and a defect classification process based on a partial image containing a defect candidate that is extracted by the defect candidate extraction unit, wherein the processes performed by the defect detection unit is performed off-line asynchronously with an image acquisition process that is performed by the image acquisition unit.

Abstract: Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for imaging light reflected from an object. The imaging device also includes a first light source attached to a planar circuit board and a second light source attached to the planar circuit board. The imaging device further includes a first Fresnel prism for directing light from the first light source toward the object from a first direction and a second Fresnel prism for directing light from the second light source toward the object from a second direction. In one embodiment, the imaging device also includes one or more optical elements for increasing or decreasing the divergence of the light.

Abstract: The pattern defect inspection apparatus is operable to detect defects by comparing a detection image, which is obtained through scanning by an image sensor those patterns that have the identical shape and are continuously disposed on the object under tested at equal intervals in row and column directions, with a reference image obtained by scanning neighboring identical shape patterns in the row and column directions. This apparatus has a unit for generating an average reference image by statistical computation processing from the images of identical shape patterns lying next to the detection image including at least eight nearest chips on the up-and-down and right-and-left sides and at diagonal positions with the detection image being intermediately situated. The apparatus also includes a unit that detects a defect by comparing the detection image to the average reference image thus generated.

Abstract: The present invention is directed to eliminate mistaken recognition of the presence of the disc even when displaying the presence of the disc with one light emitting element. In a television incorporating a slot-in type disc loader in which an LED emits light with a pulse signal output from an output terminal of the microcomputer when the power is turned OFF, which light of the LED is interrupted by the insertion of the disc thereby turning ON the power, the display control signal fixed to “L” is output from the output terminal when the pulse signal “L/H” is input to the input terminal of the microcomputer from the disc detecting section when the power is turned OFF and the disc is not inserted. The light emitting diode does not flash and is in a light out state by the display control signal, and thus the fact that the disc is not present in the slot is accurately notified.

Abstract: Provided is a defect correcting device for an electronic circuit pattern, which is capable of making a defect seed obvious, and normalizing a pixel or forming a pixel into a semi-black spot. A defect correcting device for an electronic circuit pattern includes: an imaging unit for irradiating a defective portion of the electronic circuit pattern with irradiation light having a wavelength of a visible light region and a wavelength of an infrared light region, and receiving reflected light having the wavelength of the visible light region and the wavelength of the infrared light region from the electronic circuit pattern; a signal processing unit for extracting the defective portion from a picked-up image, and determining a correcting method; a laser irradiating unit for irradiating the defective portion with laser light; and a correction determining unit for determining success or failure of defect correction before and after laser irradiation.

Abstract: An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.

Abstract: In a board inspection system, a line sensor of a first scanning unit scans, via a telecentric lens, the image of the surface to be inspected on a board, viewed in a perpendicular direction. A line sensor of a second scanning unit scans the image of the surface to be inspected on the board, viewed at an angle, which is tilted toward a first direction by a first angle ? from the direction perpendicular to the surface to be inspected. A line sensor of a third scanning unit scans the image of the surface to be inspected on the board, viewed at an angle, which is tilted toward a second direction by a second angle ? from the direction perpendicular to the surface to be inspected. A determination unit computes the height of the surface to be inspected on the board with use of image data acquired by a first scanning unit, a second scanning unit, and a third scanning unit.

Abstract: Non-destructive, below-surface defect rendering of an IC chip using image intensity analysis is disclosed. One method includes providing an IC chip delayered to a selected layer; determining a defect location below a surface of the selected layer using a first image of the IC chip obtained using an CPIT in a first mode; generating a second image of the IC chip with the CPIT in a second mode, the second image representing charged particle signal from the defect below the surface of the selected layer; and rendering the defect by comparing an image intensity of a reference portion of the second image not including the defect with the image intensity of a defective portion of the second image including the defect, wherein the reference portion and the defective portion are of structures expected to be substantially identical.

Abstract: A system for generating a camera trigger that causes a camera to capture image data includes a memory for storing a plurality of trigger values. Each trigger value corresponds to a position of a moving stage. The system includes a controller for receiving position information indicative of a current position of the moving stage, generating a current position value based on the position information, comparing the current position value to at least one of the trigger values, and generating a camera trigger if the current position value matches one of the trigger values.

Abstract: An apparatus for inspecting pattern defects, the apparatus including: a defect candidate extraction unit configured to perform a defect candidate extraction process by comparing a detected image signal with a reference image signal; and a defect detection unit configured to perform a defect detection process and a defect classification process based on a partial image containing a defect candidate that is extracted by the defect candidate extraction unit, wherein the processes performed by the defect candidate extraction unit and/or the defect detection unit are performed asynchronously with an image acquisition process.

Abstract: An inspection method comprises receiving light emanating from a first surface of a wafer substantially along a first axis for obtaining a first image of the first surface therefrom, the wafer having a crack formed therein and the first image containing at least one portion of the crack. The inspection method also comprises receiving light emanating from the first surface of the wafer substantially along a second axis for obtaining a second image of the first surface therefrom, the second image containing at least one second portion of the crack, the first surface extending substantially parallel a plane, and the orthographic projection of the first axis on the plane being substantially perpendicular the orthographic projection of the second axis on the plane. The inspection method further comprises constructing a third image from the at least one first portion of the crack and the least one second portion of the crack of the first and second images respectively.

Abstract: A color image of an inspection object is taken by an imaging means capable of taking a color image to obtain color information of an RGB color space. A gray-scale image of a color component of the RGB color space or another color space is generated, and the inspection object is detected by a pattern recognition technique. Alternatively, a binary image is generated from the generated gray-scale image, and the inspection object is detected by performing pattern recognition on the binary image. Color data of a pixel occupied by the detected inspection object is compared with color data of a non-defective inspection object which is previously prepared to judge whether or not the inspection object is defective. In addition, this judgment result is reflected in another manufacturing step through a network and product quality is improved.

Abstract: Methods and apparatus for integrated, in-line metrology of solar cells involve three distinct inspection and testing operations, prior to string and module assembly. Two of the inspections are performed by image analysis using bright field illumination. The third inspection involves electroluminescence imaging, where luminescence in the solar cell is achieved by inducing a forward bias in the solar cell, and analyzing a resulting grayscale image for defects.

Abstract: The present disclosure provides a system and method for recognizing a defect image associated with a semiconductor substrate. In one example, the method includes collecting defect data of the defect image by testing and measuring the semiconductor substrate, extracting a pattern from the defect data, normalizing a location, orientation, and size of the pattern, and identifying the pattern after the pattern is normalized.

Abstract: The invention relates to a method for analyzing a group of at least two masks for photolithography, wherein each of the masks comprises a substructure of a total structure, which is to be introduced in a layer of the wafer in the lithographic process, and the total structure is introduced in the layer of the wafer by introducing the substructures in sequence. In this method, a first aerial image of a first one of the at least two masks is recorded, digitized and stored in a data structure. Then, a second aerial image of a second one of the at least two masks is recorded, digitized and stored in a data structure. A combination image is generated from the data of the first and second aerial images, which combination image is represented and/or evaluated.

Abstract: A wafer viewer system is provided for graphical presentation and analysis of a wafer and a wafer series. More specifically, the wafer viewer system includes a graphical user interface for displaying a wafer, graphically selecting regions of the wafer for analysis, performing analysis on the selected regions of the wafer, and displaying results of the analysis.

Abstract: The present invention relates to a defect detection or observation method that detects fine defects in the course of defect inspection and observation, does not detect locations not constituting defects, or classifies a defect candidate as a grain phenomenon or other phenomenon that does not affect a product.

Abstract: A defect review apparatus includes a storage device which stores data about a defect of an inspection target object; a first imaging device which captures an image located in a position on a surface of the inspection target object, the position being specified by information regarding the position of the inspection target object which has been input; and a control device which controls the first imaging device. The storage device stores: first defect detection data including a defect number as which the defect of the inspection target object detected by a first defect detection process is labeled, and information regarding the position of the defect; and second defect data including a defect number as which the defect of the inspection target object detected by a second defect detection process is labeled, and information regarding its position.

Abstract: A method and apparatus for assessing a height of a specimen includes an electron beam unit having an electron beam source, lenses, a table for setting a specimen and controllable in a height direction, and a detector, and a height detection system for detecting height of the specimen set on the table while the specimen is irradiated by an electron beam. The height detection system further includes an illumination system, a collection system, first and second detectors, a device configured to receive output signals from the first and second detectors while the specimen is irradiated by the electron beam and to generate a comparison signal from the output signals, wherein the comparison signal is responsive to the height of the specimen.

Abstract: In a visual inspection method and apparatus, a picture processing unit converts an original picture, obtained by taking a photograph of a BGA illuminated by a ring illuminator from above, by using a camera, and labels a binary picture obtained by this binary conversion. Then, it forms a circumscribing rectangle circumscribing an outer circumference of a labeling picture obtained by the labeling, and inverts a labeling picture within the formed rectangle, and removes a portion of a region formed by the outer circumference and the circumscribing rectangle in a picture obtained by the inversion, and then generates an inspection picture by adding a picture obtained by the removal to the labeling picture, and accordingly judges a pass or rejection of the inspection target sample based on the generated inspection picture. Thus, the inspection can be carried out at a high accuracy irrespectively of a low cost.

Abstract: Disclosed is a surface inspection device that performs a defect inspection throughout a surface of a wafer. In the defect detection using a defect review SEM, an X-Y coordinate system is set throughout a surface (excluding a round end face) of a product wafer to allow the inspection throughout the surface of the product wafer. Therefore, the defect detection can be performed also in an area other than an effective chip area. Further, the inspection results of the area are stored in relation to the coordinates in a position where the inspection results are acquired. Therefore, the inspection results can be effectively used for an analysis and a defect cause can be investigated with a higher degree of accuracy. As a result, the quality and yield of chips can be improved.

Abstract: An inspection device is configured having: an illumination unit that illuminates a wafer with illumination light having a plurality of kinds of wavelengths; a photographing unit that photographs the image of the wafer illuminated with the illumination light; and an image processing unit that generates an inspection image of the wafer photographed by the photographing unit, by performing a predetermined weighting for each of the plurality of kinds of wavelengths, and judges whether any defect is present in the wafer based on the generated inspection image.

Abstract: A defect inspection system for the semiconductor and microelectronics industry. More particularly, the present invention relates to an automated defect inspection system for wafers or other semiconductor or electronic substrates of any kind or type that are transparent, translucent, opaque or otherwise capable of allowing at least some light to pass through.

Abstract: An objective lens system opposing an imaged surface of semiconductor device, and imaging lens system arranged between this objective lens system and image sensor is used to inspect a lower component of the semiconductor device without being influence by an upper component. The F value of objective lens system is made into 1.5 or less, and an imaged surface is photographed and inspected. The imaging lens system also has several lenses with different focal distances. According to the desired magnification, a predetermined lens among the plurality of lenses is arranged in the predetermined location of an optical axis, and the other lenses are evacuated from an optical axis.

Abstract: A method for imaging a surface includes generating a traveling lens in an acousto-optic material and incorporating a traveling mask into a portion of the traveling lens so as to produce a composite traveling lens. The method further includes irradiating the composite traveling lens so as to produce a composite focused beam having a spatial variation across the composite focused beam. The composite focused beam is directed onto a region of the surface so as to generate radiation characteristic of the region from the region. The radiation is imaged onto a detector so as to generate a signal characteristic of the region, responsively to the spatial variation.

Abstract: An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.

Abstract: An imaging sensor for capturing images of the beveled surface of a wafer edge is herein disclosed. The imaging sensor is aligned with the edge of a wafer to maximize the area of the bevel that is encompassed by the depth of view of the imaging sensor. One or more sensors may be used to capture images of the wafer edge.

Abstract: Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.

Abstract: A method for processing the image data of the surface of a wafer (2) recorded by at least one camera (5) is disclosed, wherein an image field (15) is defined for each camera (5) in such a way that the recorded image content is repeated after N recorded images. In an evaluation electronics (18) M utility programs (19) are determined, wherein M is equal to the number of recorded images after which the image content is repeated. The number M of utility programs (19) is adapted to the number N of images. Each of the M utility programs (19) of the plurality of recorded images is only fed with images having the same image contents in order to detect defects on the basis of the image contents of the images of the surface of the wafer. The results of the M utility programs (19) are respectively forwarded to a central program (20) in a sequential manner, which compiles a distribution of the defects present on the surface of the wafer (2) from the individual results of the M utility programs (19).

Abstract: In a visual inspection method and apparatus, a picture processing unit converts an original picture, obtained by taking a photograph of a BGA illuminated by a ring illuminator from above, using a camera, and labels a binary picture obtained by this binary conversion. Then, it forms a rectangle circumscribing an outer circumference of a labeling picture obtained by the labeling, and inverts a labeling picture within the formed circumscribing rectangle, and removes a portion of a region formed by the outer circumference and the circumscribing rectangle in a picture obtained by the inversion, and then generates an inspection picture by adding a picture obtained by the removal to the labeling picture, and accordingly judges a pass or rejection of the inspection target sample based on the generated inspection picture. Thus, the inspection can be carried out at high accuracy irrespectively of a low cost.

Abstract: A system for inspecting a substrate. An inspector includes a sensor that inspects the substrate and produces a video stream. A control interface sends and receives a control stream, and a network receives and transports the video stream and the control stream as two separate data streams. A desktop receives the video stream and the control stream as two separate data streams. The desktop has a display that presents the video stream, and a user interface controls that control the operation of the inspector, using the control stream across the network.

Abstract: Disclosed is a method of operating a manufacturing facility. A processor detects whether abnormal first image data exists at a first common location for each of the last N wafers of the first set of wafers to be placed on a platform, excluding any abnormal image data at a location for wafers that previously had abnormal image data at the location; and detects whether abnormal second image data exists at as second common location for each of the last N wafers of the second set to be placed on the platform, excluding any abnormal image data at a location for wafers that previously had abnormal image data at the location. A decision is made whether to clean the platform depending on results from the processor.

Abstract: A dark field surface inspection tool and system are disclosed herein. The tool includes an illumination source capable of scanning a light beam onto an inspection surface. Light scattered by each inspection point is captured as image data by a photo detector array arranged at a fourier plane. The images captured are adaptively filtered to remove a portion of the bright pixels from the images to generate filtered images. The filtered images are then analyzed to detect defects in the inspection surface. Methods of the invention include using die-to-die comparison to identify bright portions of scattering patterns and generate unique image filters associated with those patterns. The associated images are then filtered to generate filtered images which are then used to detect defects. Also, data models of light scattering behavior can be used to generate filters.

Abstract: A pair of edges that are located at ends as viewed in the widthwise direction of a design pattern are recognized. On the basis of the edge direction in which the paired edges are recognized, edge points on the design pattern are detected as sub-pixels. The widthwise dimension of the design pattern is calculated on the basis of the edge points. In addition, the widthwise dimension of a circuit pattern is calculated at the same position as the widthwise dimension of the design pattern. On the basis of the calculated widthwise dimensions, the semiconductor wafer circuit pattern is checked.

Abstract: The pattern defect inspection apparatus is operable to detect defects by comparing a detection image, which is obtained through scanning by an image sensor those patterns that have the identical shape and are continuously disposed on the object under tested at equal intervals in row and column directions, with a reference image obtained by scanning neighboring identical shape patterns in the row and column directions. This apparatus has a unit for generating an average reference image by statistical computation processing from the images of identical shape patterns lying next to the detection image including at least eight nearest chips on the up-and-down and right-and-left sides and at diagonal positions with the detection image being intermediately situated. The apparatus also includes a unit that detects a defect by comparing the detection image to the average reference image thus generated.

Abstract: A pattern inspection apparatus including: an image detecting part for detecting a digital image of an object substrate; a display having a screen on which the digital image of the object substrate and/or a distribution of defect candidates in a map form are displayable; an input device for inputting information of a non-inspection region to be masked on the object substrate by defining a region on the screen on which said distribution of defect candidates is displayed in a map form; a memory part for storing coordinate data, pattern data or feature quantity data of the non-inspection region to be masked on the object substrate inputted on the screen by the input device; and a defect judging part in which the digital image detected by the image detecting part is examined in a state that a region matching with a condition stored in the memory part is masked and a defect is detected in a region other than said masked region.

Abstract: A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.

Abstract: The present invention relates to a pattern defect inspection method and apparatus that reveal ultramicroscopic defects on an inspection target in which ultramicroscopic circuit patterns are formed, and inspect the defects with high sensitivity and at a high speed. The present invention provides a pattern inspection apparatus for comparing the images of corresponding areas of two formed patterns that should be identical with each other, and judging any mismatched image area as a defect. The pattern inspection apparatus includes means for performing an image comparison process on a plurality of areas in a parallel manner. Further, the pattern inspection apparatus also includes means for converting the gradation of the image signals of compared images in each of a plurality of different processes. Therefore, the present invention can properly detect defects even if the same patterns of compared images differ in brightness.

Abstract: A device for inspecting a substrate having at least one printed-on layer, including a guide carrier on which the substrate is supported. An inspection head is movable in at least two directions relative to the guide carrier and is provided with an illumination mechanism and an detection device for detecting electromagnetic radiation reflected from the substrate and conveying it to an evaluation device for detecting substrate errors. The detection device has a digital camera with optics for detecting a definition of less than 200 microns. A movement mechanism controls the relative movement between guide carrier and inspection head during an image-taking cycle during which sequential or overlapping individual images can be joined together to form an overall image of the substrate.

Abstract: An imaging method and imaging system for inspecting features located at a known inter-feature pitch on portions of a target surface. The system includes a lens array having a plurality of lenses wherein the lenses of the lens array have an inter-lens pitch and an inter-field of view pitch corresponding to the inter-feature pitch, and an array of imaging elements having an inter-element pitch corresponding to the inter-feature pitch, whereby the imaging system images only field of view areas of the target surface containing features.

Abstract: A circuitry testing method, comprising: providing a circuit board needing testing; applying a potential(160) to the circuit board needing testing so that the circuit board works and operating elements of the circuit board needing testing emit infrared rays; testing an intensity of radiation of the infrared rays using an infrared sensor(110); converting the radiation intensity to RGB(red, green, blue) data signals in order to form a diagnostic infrared image, using a processor(130); providing a standard infrared image; comparing the diagnostic infrared image with the standard infrared image; and determining whether the circuit board is defective according to the comparison.

Abstract: A film frame aligner for automatically aligning a film frame includes a film frame support, a film frame pusher for pushing the film frame, and a film frame location mechanism for locating at least one notch in the film frame.