Abstract: A method and apparatus for inspecting the surface of an object such as a semiconductor wafer for contaminant particles. The apparatus includes a light source for illuminating an area on the surface of the object. A camera is positioned above the surface of the object and detects light scattered by any particles present on the surface at that area, the camera detecting light scattered from the area over a field of view, or window, which is defined by the camera, a focusing lens and the relative distance therebetween. A computer is coupled to the camera and serves to store, process, identify and/or analyze the light detected by the camera. The computer also serves to calculate a minimum light intensity threshold level which is dynamic to compensate for variances in the background light intensity of different portions of the object. The value of the threshold level is calculated for each window of the object defined by the apparatus using the equation: T.sub.W =.mu..sub.W +.eta.-.delta..sub.W, where T.sub.

Abstract: A method and apparatus for inspecting a printed circuit board assembly especially with surface mount devices are provided. The method and apparatus include a multiple camera set-up utilizing both color and monochrome images. A very strong white light is employed as the light source. The multiple camera setup includes frontal and oblique looking cameras to examine the printed circuited board assembly from different angles. The strong white light source provides sufficient illumination evan at a small camera aperture hence increasing the depth of field. The method and apparatus are resistant against warpage of the PCB and variations in components' height.

Abstract: Disclosed is an apparatus and method for inspecting a connection state of a lead electrode to a bump after TAB (tape automated bonding). An LSI chip is immobilized on a stage. A flexible lead is held by a holding portion and connected to a bump. Above the chip, a CCD camera is provided. The stage is controlled to move up and down by a moving control mechanism. Each of the lead/bump connection states immediately after ILB (Inner lead bonding) is taken in the form of image data and defined as a first image data. A second image data of the lead/bump connection state is taken after the bump and lead are moved to different positions by moving the stage in order to change the position of the chip by means of the moving control mechanism. Whether or not the lead is duly connected to the bump is determined by the comparison of the first and second image data.

Abstract: A part inspection and calibration method for the inspection of printed circuit boards and integrated circuits includes a camera to image a precision pattern mask deposited on a transparent reticle. Small parts are placed on or above the transparent reticle to be inspected. An overhead mirror or prism reflects a side view of the part under inspection to the camera. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A precise reticle mask with dot patterns gives an additional set of information needed for calibration. By imagining more than one dot pattern the missing state values can be resolved using an iterative trigonometric solution. The system optics are designed to focus images for all perspectives without the need for an additional focusing element.

Abstract: Accuracy of a circuit assembly process (100) is determined by capturing an image (306, 1008) of an assembly formed on a substrate by the circuit assembly process (100), calculating coverage (310, 1012, 1024) of the assembly from the image, and comparing the coverage (312, 1016, 1026) to a threshold.

Abstract: A PCB testing circuit for an automatic inserting apparatus and method thereof can minimize an inferior rate of the PCB.

Abstract: The present invention stores digital data of a scanner and includes a component information database for storing information as data of components to be inserted in the printed circuit board and a non-insertion inspection database for storing data of lead wire clinching directions inserted in each hole from predetermined numeric control data. A control section collects hole information as data from the digital data of the scanner, reads the clinching directions of the components inserted in each hole from the non-insertion inspection database, and judges insertion states of the components according to whether or not brightness exists by inspecting a brightness change in the clinching direction around a hole.

Abstract: A probe needle alignment device supports a probe card assembly with probe needles extending upward. A microscope includes a first eyepiece aligned with the probe needles in its field of view. A first video camera is positioned in optical alignment with the first eyepiece to view probe needles through the first eyepiece. An overdriver includes a transparent planar plate movably disposed between the microscope and the probe needles to displace contact tips of the probe needles through an overdrive distance. A mask plate has a plurality of spots located at positions corresponding precisely to positions of contact pads of an integrated circuit to be probe tested. A second video camera includes the spots within its field of view.

Abstract: In a semiconductor testing device, the defective data of a semiconductor device which is detected by a defective detection unit 1 are converted to address data on the basis of inherent information such as the cell size, the divisional size, etc. of the semiconductor device by an address conversion unit 2, and the address data are compared with a redundant circuit area of the semiconductor device to make a quality (defective or non-defective) judgment of the semiconductor device by a judgment unit 3, whereby when any defective exists in the semiconductor device, the judgment as to whether the defective is replaceable (relievable) by the redundant circuits can be more accurately performed.

Abstract: A semiconductor package inspection apparatus comprises single photographic device disposed above the semiconductor package, and comprises light splitter for splitting light in different directions according to three different wavelength ranges in the light; and three image pickup units for separately photographing light of the three wavelength ranges which has been split by the light splitter; lighting device comprising first lighting for inspecting leads of the semiconductor package; second lighting for inspecting marks printed on top face of the semiconductor package; and third lighting for inspecting defects of the semiconductor package, the first, second and third lightings being disposed at locations different from each other, and having wavelength ranges into which the light has been split by the light splitter, and inspection device for simultaneously operating the first, second and third lightings of the lighting device and the three image pickup units of the photographic device to inspect leads of th

Abstract: A pattern inspection apparatus for inspecting an abnormality in a pattern of a plurality of straight lines which are arranged in parallel in a direction perpendicular to the longitudinal direction includes a data acquisition means for acquiring, by photoelectric conversion, first and second image data of the straight lines on first and second lines which pass first and second points at different positions along the straight lines, respectively, and are perpendicular to the straight lines, and a data processing means for detecting the abnormality in the straight lines on the basis of a difference between the first and second image data. The pattern is a pattern of, e.g., inner leads of a TAB tape. When density changes of the first and second image data at a position x along the first and second lines can be approximated by sin.sup.2 x, the data processing means can detect the abnormality by using a relationship established between a phase difference and a density difference between the two changes.

Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted on a printed circuit board by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.

Abstract: A bump-height measuring apparatus for measuring heights of projecting bumps formed on a surface of a work comprises a holding section for holding the work and relatively positioning the work, an illuminating section for emitting light from two positions onto that region of the work held by the holding section, in which bumps to be measured in height are located, such that the bumps project shadows on the work, the two positions being opposite to each other, and each of the positions being located at a predetermined elevation angle with respect to the region, an imaging section for imaging the region onto which the light is emitted from the two positions in the illuminating step, and outputting image signals producing images including shadow images of the bumps, the shadows of each of the bumps extending in two directions, respectively, a shadow extracting section for extracting the shadow images from the images produced by the image signals output from the imaging section, and then outputting binary image sig

Abstract: A pattern inspection apparatus includes a device for acquiring image data of a target inspection pattern, and an image processing unit for extracting a defect in the target inspection pattern on the basis of the image data and image data of a reference pattern.

Abstract: A method for determining spatial characteristics of a selected object in an image that has pixel values representing heights of corresponding portions thereof is characterized by the steps of finding one or more heights of portions of the object, determining a volume of the object at and above (or below) a selected height by summing a count representing a cross-sectional area of the object at that height with a count representing a volume of the object at a greater (or lesser) height, and outputting the volume so determined. A related method determines a cross-sectional area of an object in such a "height" image by finding one or more heights of portions of the object and summing a count of pixels in the object at the selected height with a count representing a cross-sectional area of the object above that height.

Abstract: A surface mount component outer surface inspection system comprising a loader for assembling an inventory of surface mount components and feeding them outward in controlled rectilinear manner and in a timed sequence, a first transfer assembly including a first moving endless belt in racetrack pattern, the belt having a partially perforated outer surface and a vacuum pulled through the perforations from the outer surface along a portion of the belt, for receipt of and retaining the surface mount components from the loader in spaced-apart arrangement on the belt, a surface-mount component, upper-surface viewing device for bringing the exposed surfaces of the moving components into focus at an area for inspecting them for visual defects, a second transfer assembly including a second moving endless belt in racetrack pattern, the belt having a partially perforated outer surface and a vacuum pulled through the perforations from the outer surface along a portion of the belt, the second assembly adjacent the first en

Abstract: A method of determining classification codes for defects occurring in semiconductor manufacturing processes and for storing the information used to determine the classification codes. A wafer is selected from a production lot after the lot is sent through a first manufacturing process. The selected wafer is scanned to determine if there are defects on the wafer. Images of selected defects are examined and a numerical value is assigned to each of N elemental descriptor terms describing each defect. A classification code is determined for each defect based upon the numerical values assigned to the N elemental descriptor terms. The classification code and numerical values assigned to the N elemental descriptor terms are stored in a database. The wafer is sent through each sequential process and classification codes are assigned to additional defects selected after each sequential process.

Abstract: A particle-like point in an image is detected to detect a defect by directly processing an image of an object to be inspected. The image is first binarized, and the binarized image is scanned along an X-axis or a Y-axis, and a particle-like point in the image is approximated by a rectangular area. Information representative of the coordinates of the center of the rectangular area and the size of the rectangular area is outputted as information of the detected particle-like point.

Abstract: A system for transporting and inspecting, seriatim, semiconductor devices with plural prong type or solder ball type leads includes a head for transporting the semiconductor devices from one support structure, such as a tray or tube, to a second support structure, such as a tray or tape, and wherein two dimensional and three dimensional measurements of the positional accuracy of the leads is carried out during the transport process. The inspection apparatus is interposed in the transport path and includes a first optical sensor such as a CCD camera oriented to capture a two dimensional image of the semiconductor device package and compare the image with a predetermined two dimensional image store in a central processing unit (CPU).

Abstract: Disclosed is a method for recognizing a printed circuit board fiducial mark in order to decide an origin point in a chip mounter so that electronic parts can be mounted on a desired position of the printed circuit board. Since the method can be used for a distorted image, it can exactly recognize a damaged object as well as a general object. The method can also reduce a calculation amount relative to a polarity number of a candidate object when the candidate object has the polarity number. The method can recognize a candidate object of the same pattern fiducial mark regardless of its size.

Abstract: In a fine pattern inspection device for inspecting a fine pattern comprising a plurality of pattern elements which have the same form and which are formed on an inspection sample, the device detects a defect in the plurality of pattern elements by the use of an image derived from the fine pattern. An image obtaining unit obtains the image from the fine pattern and produces an image signal representing the image. The image signal is divided into first and second divided image signals. A processing unit extracts a defect image and an inverted defect image that is inverted in lightness of the defect image, by carrying out a first process that gives a predetermined delay to the first divided image signal and then inverts the lightness thereof to obtain a processed image signal and carrying out a second process that adds the processed image signal and the second divided image signal to obtain a difference image signal representing a difference image which includes the defect image and the inverted defect image.

Abstract: A pick-up operation is improved by finding a next non-faulty chip during pick-up of a non-faulty chip. Chips are disposed in alignment with X and Y directions as divided from a wafer, and the field of view of a camera which views the chips is established to provide the image data for the chips. A first non-faulty chip is selected, located at the center of the field of view of the camera, and picked up. During the pick-up of the first non-faulty chip, a chip group comprising a given number of chips is subjected to a preceding recognition which determines a next non-faulty chip to be selected on the basis of the image data. The next non-faulty chip is then positioned at the center of the field of view of the camera for a pick-up operation, thereby saving time period for pick-up operation.

Abstract: A method for sequentially picking up non-faulty chips arranged on an X-Y table. A plurality of chips disposed in an aligned arrangement is viewed by a camera in a field of view of the camera to provide an image data for enabling a preceding image recognition for a chip simultaneously with a pick-up operation for another chip. Three chip locations adjacent to each other along a moving direction of the camera are encompassed by the field of view. During the time period for a pick-up operation of a particular chip located at the center of the field of view, a preceding recognition is conducted for the succeeding chip located adjacent to and ahead of the particular chip on the basis of image data, thereby examining whether the succeeding chip is faulty or non-faulty during the pick-up operation for the particular chip. If the succeeding chip is found to be faulty, the succeeding chip is skipped for positioning a third chip for a next pick-up operation.

Abstract: An inspection system and method uses a ring illumination apparatus to illuminate one or more reflective elements, such as solder balls on an electronic component or other protruding surfaces or objects. The ring illumination apparatus includes a substantially ring-shaped light source that provides a substantially even illumination across the one or more reflective elements. An illumination detection device detects light beams reflecting off of the illuminated reflective elements for forming a reflected image. A method of processing the reflected image includes locating one or more edges of each reflected image element representing an illuminated reflective element. The edges of the reflected image elements are located by determining the maximum intensity gradient in the pixels forming the reflected image element. The inspection system and method thereby determines various characteristics such as the absence/presence, location, pitch, size and shape of each reflective element.

Abstract: A method of taking an image of a convex projection which projects from a plane and whose outer surface has a gloss, including the step of emitting, toward the outer surface of the convex projection, a plurality of lights in a plurality of directions, respectively, which differ from each other as viewed in a direction perpendicular to the plane, so that a plurality of base portions of the outer surface of the convex projection which face the plurality of lights, respectively, and each of which is adjacent to the plane are lighter than a remaining portion of the outer surface as viewed in the direction perpendicular to the plane, and the step of taking, using an image taking device, the image of the convex projection as viewed in the direction perpendicular to the plane.

Abstract: A method and apparatus for identifying and classifying pixel defects, and in particular Mura defects using digital processing techniques. The present method includes steps of acquiring an image with a Mura defect, and performing a Laplacian convolution on the image to enhance the Mura defect against background illumination. A step of thresholding the Mura defect against the background illumination is also provided. The thresholded Mura defect is compared against the original Mura defect to define statistical parameters of the original Mura defect. An annular region is defined around the periphery of the Mura defect. Statistics of the annular region defines statistics for background illumination as compared to the original Mura defect. The statistics from the Mura defect are then compared to the background illumination statistics for Mura defect classification and analysis.

Abstract: A vision inspection system is provided in which eight optical images are instantaneously recorded on singular image frames which are output from two optical cameras. An illumination source is provided for illuminating four spaced apart inspection regions which are disposed about an inspection window. Two optical signals of reflected light emanate from each of the four inspection regions and are directed toward two optical cameras, with the two optical signals from each of the optical regions being at different viewing angles and preferably from a single focal point. Optical directing members receive the optical signals from the various regions and direct the light to respective ones of the cameras. The optical directing members are selectively adjustable for accommodating components of various sizes. The optical inspection of each component instantaneously occurs by recording the eight optical images, on two frames, one frame being recorded by each of the cameras.

Abstract: A part inspection and calibration method for the inspection of integrated circuits includes a camera to image a precision pattern mask deposited on a transparent reticle. Small parts are placed on or above the transparent reticle to be inspected. A light source and overhead light reflective diffuser provide illumination. An overhead mirror or prism reflects a side view of the part under inspection to the camera. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A reference line is located on the transparent reticle to allow an image through the prism to the camera of the reference line between the side view and the bottom view. A precise reticle mask with dot patterns gives an additional set of information needed for calibration. By imaging more than one dot pattern the missing state values can be resolved using an iterative trigonometric solution.

Abstract: A multiple image camera for measuring the alignment of objects in different planes. The camera includes two coupled imaging devices configured to directly image objects in different planes without any intervening reflective optics between the imaging devices and the objects. The camera thus allows measurement of the alignment between the first and second objects without the need for repeated calibration between the image from the two imaging devices.

Abstract: A non-invasive inspection system is disclosed. The system contains light sources or source, viewing optics, an x-y table, and a platen for mounting objects to be inspected. The transparent platen contains a vacuum system that sets up a laminar flow of air which in turn holds the objects in place without altering or damaging the devices, and allows for analysis of light transmitted through devices. The method for operating the system is also included.

Abstract: An image data acquisition system for acquiring visible spectrum image data used in the inspection of circuit boards. The system comprises a rigid structure having upper and lower banks of cameras and telecentric lenses mounted in axial pairs at a substantially right angle to the circuit boards which are transported on the conveyor below. The cameras have overlapping fields of view which form a directionally contiguous band or two-dimensional web of sensor coverage. A beam splitter and mirror arrangement is mounted to the structure under the upper and lower banks such that light striking the mirror is reflected into the lower bank of cameras while light striking the beam splitter is partially reflected toward the mirror and partially transmitted through the body of the beam splitter into the upper bank of cameras.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: An inspection system and method uses a ring illumination apparatus to illuminate one or more reflective elements, such as solder balls on an electronic component or other protruding surfaces or objects. The ring illumination apparatus includes a substantially ring-shaped light source that provides a substantially even illumination across the one or more reflective elements. An illumination detection device detects light beams reflecting off of the illuminated reflective elements for forming a reflected image. A method of processing the reflected image includes locating one or more edges of each reflected image element representing an illuminated reflective element. The edges of the reflected image elements are located by determining the maximum intensity gradient in the pixels forming the reflected image element. The inspection system and method thereby determines various characteristics such as the absence/presence, location, pitch, size and shape of each reflective element.

Abstract: An operator actuates keyboard (22) to register board name of a board for teaching (ST11), sets a reference board (1S) on a Y-axis table unit (4) to actuate a start key (ST12), inputs reference points of the reference board (1S) to be set to an original position (ST13), takes a picture of a predetermined area on the reference board to teach a mounting position (ST14), and reads data about component image and its decision criteria of the corresponding component from a component kind table (19) to be stored as teaching data (ST15). This operation is repeatedly executed until all components are taught to a mounted component inspection device which inspects mounting qualities of a plurality of components mounted on an inspected board.

Abstract: A method and apparatus for inspecting bends in wires bonded between, for instance, pads of semiconductor chips and leads of lead frames using detection ranges established within imaging ranges in which images of bends are taken. Imaging range areas are established by dividing the distance between a first bonding point and a second bonding point of a target wire by the width of the detection range, and the wire bend is then detected in the respective imaging range areas.

Abstract: A high speed, high accuracy, three-dimensional inspection system for ball and pin grid assemblies. The system uses a three-dimensional scanner to gather data which is analyzed to yield height position measurements along with overall packaged dimensions. The grid array to be scanned is placed upon a fixture above a motion control table. The motion control system is controlled by a personal computer and has a high resolution. The parts can be presented in single trays, tray stackers, tubes or other carriers. Array packages are handled either manually or automatically. In the manual mode, arrays are loaded onto the fixture by hand before activated the image processing hardware. Alternatively, an automatic pick and place module may be used to load the grid array packages on the fixture. The fixture consists of a plate with a cavity the size of the grid array package being inspected. The size of the cavity can be adjusted to fit different size parts.

Abstract: An apparatus for inspecting repetitive patterns includes a signal generation device for outputting a signal every time each of repetitive patterns reaches a predetermined observation area, and a flash generation device for generating a flash in synchronism with the signal to instantaneously illuminate each of the patterns sequentially reaching the observation area. The signal generation device may be a device for generating a signal upon detecting the predetermined shape of each pattern. The repetitive patterns may be those on a tape carrier which moves, e.g., in the longitudinal direction thereof. It is preferable to provide an image pickup device for picking up the image of each repetitive pattern on the observation area and a display device for displaying the picked-up image. The display device preferably keeps display of the picked-up image of each of the patterns illuminated by the flash for a predetermined period of time within between this illumination and the next illumination by the next flash.

Abstract: A monitor device for monitoring an object to be tested is provided in a test apparatus which includes a test section for testing the electrical characteristics of the object, a storage section for storing the object, and a transfer section for conveying the object between the storage section and the test section. This monitor device includes an imaging device used in alignment of the object in the test section, a sensor for sensing the position of the object in the transfer section, and a display panel for displaying an image of the interior of the test apparatus and displaying the alignment state in the test section and the position information of the object in the transfer section in the image of the test apparatus.

Abstract: A system for transferring digital information to spatially localizable portable electronic devices has a plurality of portable electronic devices, with each portable electronic device supporting wireless communication. A spatial localizing module determines spatial location with submeter precision for each of the plurality of electronic devices, and a communication module is connected to the spatial localizing module for mediating wireless communication between the portable electronic devices. A user can define electronic data transfers between portable electronic devices in user determined spatial locations with submeter precision. Data transfers are possible to adjacent electronic devices, electronic devices within a defined radius, electronic devices along a defined bearing or having specific orientations, or even located within a defined set of regions or rooms.

Abstract: Graphic data for forming a light-shielding pattern and graphic data for forming a semitransparent pattern are stored in first and second memories, respectively. A synthesis circuit converts the graphic data stored in the first and second memories into bit patterns and writes them in a third memory. A line width determination circuit determines, as a halftone region, a region having the number of continuous bits at the same level, which number is a predetermined number or less, in the bit patterns stored in the third memory. A pattern data generation circuit generates pattern data constituted by the signal levels of a light-transmitting region and a light-shielding region on the basis of an output signal from the synthesis circuit.

Abstract: In a device used to inspect substrates visually, an imaging region and a magnification are specified ahead of time for every component and stored as library data in a memory. The memory also contains CAD data, which include the class of each component on the substrate and its location. During initialization, a control unit links the location data for a component extracted from the CAD data to corresponding library data and specifies a field of view and a magnification for every component on the substrate. Using this data, the control unit creates on the substrate a number of viewing zones to be inspected at various magnifications and stores the data specifying these zones in the memory. When a substrate is to be inspected, the control unit uses the data specifying these zones to control the position and magnification of an imaging unit to collect image data from each zone successively and display them on a monitor.

Abstract: A system and method allows a user to evaluate the critical optical parameters associated with an imaging device including a CCD array. The system includes a series of optical test targets. Digital images of the optical test targets are captured by the imaging device under test. The stored digital image data is automatically analyzed by a computer program which evaluates the dynamic range, contrast resolution and distortion of the imaging device. The results are compared to predetermined criteria and printed for evaluation by a user. The system provides a means for comparing and qualifying various camera systems to be used for package tracking.

Abstract: A semiconductor chip with bumps to be inspected is placed directly below a CCD, which captures an image of the bumps under dark field illumination. A reference window is set around each bump in the image. The reference window is enlarged or reduced or divided into subwindows such that optimal windows are provided for extraction of characteristic values of various defects. Characteristic values of particular defects are extracted from the image data within the corresponding optimal windows. The characteristic values for the bumps are statistically processed to obtain an evaluation value having a permissible range. The characteristic value of each bump is compared with the evaluation value and when the comparison indicates that the characteristic value is outside of the range, the bump is decided as a defective bump.

Abstract: A mounting state of a component mounted on a printed circuit board with adhesive is inspected by an apparatus which includes an image pick-up unit for picking up in colors an image of the board after the component is mounted, a color extracting part for discriminating an adhesive portion of the image based on a predetermined color distribution of the adhesive and then extracting the adhesive portion as extracted data, a cutting part for setting a window frame for a to-be-inspected portion in the image of the board relative to the extracted data so as to detect bulging of the adhesive, and cutting out data within the window frame, and a deciding part for deciding, based on the cut data, a presence/absence of the bulging of the adhesive from a size or an area of a portion in the window frame which shows a color within the color distribution of the adhesive.

Abstract: A wire breakage detecting method, being a method of detecting breakage of wire bonded on a chip of an electronic component by image processing, includes the step of observing a point of the wire as a pixel of one color of binary images of black and white, observing while rotating plural pixels around the present observation pixel being observed in a specific direction, moving the observation point of the wire by detection of the pixel of the same color as said color of the binary images, moving the observation point continuously, and detecting breakage of wire by inversion of the moving direction of the observation point.

Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected by scanning its complete surface at a relatively high speed and with an optical beam of relatively small diameter, particularly a laser beam, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.

Abstract: A probe apparatus incorporated into a lighting inspection system for LCD panels, includes a store section, a process section, and a transfer section interposed between them. An examination mechanism having a probe card is arranged in an examination area of the process section. Right and left alignment areas are formed so as to interpose the examination area, and right and left work tables on which the LCD panels are to be loaded, are arranged on the right and left alignment areas, respectively. The movement of the right and left work tables is controlled by a controller, and the LCD panels on the right and left work tables are alternately examined in the examination area by the examination mechanism.

Abstract: A camera is part of an appearance inspection apparatus which observes electronic components soldered to a printed circuit board from a position located directly above the electronic components. The apparatus includes an illuminating light which is emitted toward the electronic components. A laser beam which is emitted from a laser oscillator to an emission area overlaps a viewing field of a camera. The camera is for acquiring image data of the electronic component. Also included is a photo sensor which is disposed obliquely above the emission area which receives the reflected light of the laser beam which has been reflected by the solder. Also included is a moving apparatus for moving the printed circuit board in a horizontal direction relative to the camera and laser oscillator. The image data is acquired and the solder height is measured at substantially the same time. As a result, inspection time is shortened.

Abstract: An image quality inspection system to test a display panel with high resolution and low cost by forming a synthesized contrast image of the display panel is disclosed.

Abstract: The method and apparatus for providing an elongate linear continuous, uniformed, diffused lighting environment for use in conjunction with an electronic line scanner, a photo-copier or a machine vision system, particularly for inspection and reproduction of specular surfaces such as documents or art work containing highly reflective areas on the surface thereof and other shiny surfaces. The linear illumination device includes at least one elongate source of light, illuminating a primary diffuser, to provide a primary diffused light source and a secondary elongate source of light illuminating a secondary diffuser to provide a secondary diffused light source supplied substantially along an observation plane of the illumination device. The two sources provide uniformly diffused lighting of an elongate strip of an object located at the object observing location to facilitate accurate viewing of a desired elongate portion of the object to be observed.