Abstract: A lithographic apparatus includes a component and a local cooler to apply a local cooling load to the component. The local cooler has a gas passageway including a flow restriction upstream of the component and configured to direct a flow of gas exiting the flow restriction to cool a surface of the component.

Abstract: A liquid immersion member forms a liquid immersion space on an object movable below an optical member so that a light path of exposure light emitted from an emission surface of the optical member is filled with liquid. The liquid immersion member includes a first member which is disposed in at least a portion of a periphery of the optical member, a second member which is movable relative to the first member and which includes a recovery port that recovers at least a portion of the liquid in the liquid immersion space, and a gas supply opening facing a gap between the first member and the second member, from which gas is supplied to the gap.

Abstract: The present invention provides an exposure apparatus which transfers a pattern of a reticle onto a substrate, the apparatus including a convey unit configured to convey the substrate while chucking and holding a lower surface of the substrate, and a control unit configured to control a conveyance condition of the convey unit so that a conveyance acceleration is lower when the convey unit conveys the substrate in a vertical direction with downward acceleration than when the convey unit conveys the substrate in the vertical direction with upward acceleration.

Abstract: In a lithographic projection apparatus, a liquid supply system maintains liquid in a space between a projection system of the lithographic projection apparatus and a substrate. A sensor positioned on a substrate table, which holds the substrate, is configured to be exposed to radiation when immersed in liquid (e.g., under the same conditions as the substrate will be exposed to radiation). By having a surface of an absorption element of the sensor, that is to be in contact with liquid, formed of no more than one metal type, long life of the sensor may be obtained.

Abstract: The invention relates to a method for compensating at least one defect of an optical system which includes introducing an arrangement of local persistent modifications in at least one optical element of the optical system, which does not have pattern elements on one of its optical surfaces, so that the at least one defect is at least partially compensated.

Abstract: The disclosure provides an arrangement for the thermal actuation of a mirror, in particular in a microlithographic projection exposure apparatus, as well as related methods and systems.

Abstract: A magnetically suspended coarse motion and fine motion integrated reticle stage driven by a planar motor comprises a movable platform (100), a balance mass (200), a drive motor, a mask plate (101), a base (001), a vibration isolation system (500), and a measuring system, wherein, the vibration isolation system is located between the balance mass and the base, and the mask plate is mounted on the movable platform. The drive motor of the movable platform is a moving-iron type planar motor (300). The reticle stage can lower the design complexity of the drive motor of the movable platform. Compared with a linear motor, the planar motor can provide push forces in more directions, the number of motors is reduced, the structure of the movable platform is more compact, the inherent frequency and the control bandwidth of the movable platform are improved, and thus control precision is improved.

Abstract: A lithographic system includes an immersion type lithographic apparatus, which includes a support constructed and arranged to support a substrate, a projection system constructed and arranged to project a patterned beam of radiation onto a target portion of the substrate, a liquid confinement structure configured to at least partially fill a space between the projection system and at least one of the substrate and support with an immersion liquid, a liquid supply system arranged to provide the immersion liquid to the liquid confinement structure, and a cleaning liquid supply system arranged to provide a cleaning liquid to a surface of the lithographic apparatus that comes into contact with the immersion liquid. The system includes a switch to provide the cleaning liquid directly to the liquid confinement structure and to provide the immersion liquid indirectly to the liquid confinement structure via a liquid purification system.

Abstract: A gas knife configured to dry a surface in an immersion lithographic apparatus is optimized to remove liquid by ensuring that a pressure gradient is built up in the liquid film on the surface being dried.

Abstract: A liquid immersion exposure apparatus includes a projection system, a liquid supply inlet, a liquid collection outlet, a separator fluidically connected to the liquid collection outlet, the separator separating one of liquid and gas, which have been collected via the liquid collection outlet, from the other, a first flow-meter which measures an amount of the liquid collected via the liquid collection outlet, and a second flow-meter which measures an amount of liquid to be supplied via the liquid supply inlet.

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a housing configured to house a substrate, and a first temperature regulator configured to regulate a temperature of a fluid. The apparatus further includes first and second flow channels configured to divide the fluid supplied from the first temperature regulator, and a second temperature regulator configured to regulate a temperature of the fluid in the second channel. The apparatus further includes a fluid supply channel configured to join the fluid in the first flow channel and the fluid in the second flow channel and to supply the joined fluids to the housing, and a flow rate regulator configured to regulate a flow rate of the fluid in the first flow channel and a flow rate of the fluid in the second flow channel.

Abstract: A lithographic apparatus is disclosed including a liquid supply system configured to at least partly fill a space between the projection system and the substrate with a liquid, an outlet configured to remove a mixture of liquid and gas passing through a gap between a liquid confinement structure of the liquid supply system and the substrate, and an evacuation system configured to draw the mixture through the outlet, the evacuation system having a separator tank arranged to separate liquid from gas in the mixture and a separator tank pressure controller, connected to a non-liquid-filled region of the separator tank, configured to maintain a stable pressure within the non-liquid-filled region.

Abstract: An exposure apparatus exposes a substrate with exposure light via a liquid. The exposure apparatus includes an optical system including an emission surface from which the exposure light is emitted; a liquid supply port that supplies the liquid in order to fill an optical path of the exposure light emitted from the emission surface with the liquid; and a fluid supply port that supplies a fluid including a material capable of changing the specific resistance of the liquid to at least a part of a space around a liquid immersion space that is formed by the liquid.

Abstract: A sensor for use in lithographic apparatus of an immersion type and which, in use, comes into contact with the immersion liquid is arranged so that the thermal resistance of a first heat path from a transducer of the sensor to a temperature conditioning device is less than the thermal resistance of a second heat flow path from the transducer to the immersion liquid. Thus, heat flow is preferentially towards the temperature conditioning device and not the immersion liquid so that temperature-induced disturbance in the immersion liquid is reduced or minimized.

Abstract: A liquid immersion exposure apparatus exposes a substrate with an exposure beam via a liquid immersion area formed on a portion of a surface of the substrate. The apparatus includes a projection system, a first nozzle member having an aperture through which the exposure beam is projected, the first nozzle member having a liquid supply inlet and a liquid recovery outlet, a second nozzle member having a gas supply inlet via which a gas is supplied to a space surrounding the liquid immersion area during the exposure, a driving system which moves the second nozzle member relative to the first nozzle member, and a stage system having a holder which holds the substrate and which is movable relative to and below the projection system, the first nozzle member and the second nozzle member.

Abstract: A lithographic apparatus includes a support configured to hold an object, the support being moveable relative to a reference structure in a direction; a first position measurement system configured to provide a first measurement signal in a first frequency range, the first measurement signal representative of a position of the support relative to the reference structure in the direction; a second position measurement system configured to provide a second measurement signal in a second frequency range, the second measurement signal representative of the position of the support relative to the reference structure in the direction; and a processor configured to (a) filter the first measurement signal so as to attenuate a signal component having a frequency in the second frequency range, (b) filter the second measurement signal so as to attenuate a signal component having a frequency in the first frequency range, and (c) combine the filtered first measurement signal and the filtered second measurement signal into

Abstract: A lithographic projection apparatus, including a liquid supply system configured to supply a liquid to a space between a projection system and a movable table; a member to at least partly confine liquid in the space, the member including a recovery opening facing toward the movable table, the recovery opening including a first porous structure configured to recover fluid; and a chamber configured to receive recovered fluid and to separate liquid from gas in the recovered fluid, the chamber including a second porous structure.

Abstract: An immersion lithography apparatus comprises a temperature controller configured to adjust a temperature of a projection system, a substrate and a liquid towards a common target temperature. Controlling the temperature of these elements and reducing temperature gradients may improve imaging consistency and general lithographic performance. Measures to control the temperature may include controlling the immersion liquid flow rate and liquid temperature, for example, via a feedback circuit.

Abstract: An information calculation method includes: calculating liquid information regarding a liquid on an object, which faces an optical member that emits exposure light, when moving the object; and calculating region information indicating a region, in which the liquid information satisfies predetermined conditions, on the object.

Abstract: A liquid immersion member is used in a liquid immersion exposure apparatus which exposes a substrate by exposure light via a first liquid between an emitting surface of an optical member and the substrate, and is capable of forming a liquid immersion space on an object movable below the optical member. The liquid immersion member includes a first member that is disposed at at least a portion of surrounding of the optical member; a second member that includes at least a portion disposed below the first member, that is capable of being opposite to the object and that is movable outside an optical path of the exposure light; and a protection part that protects the optical member. The protection part decreases a change in pressure which the optical member receives from the liquid in the liquid immersion space.

Abstract: A liquid immersion photolithography system includes an exposure system that exposes a substrate with electromagnetic radiation and includes a projection optical system that focuses the electromagnetic radiation on the substrate. A liquid supply system provides liquid flow between the projection optical system and the substrate. An optional plurality of micronozzles are arranged around the periphery of one side of the projection optical system so as to provide a substantially uniform velocity distribution of the liquid flow in an area where the substrate is being exposed.

Abstract: A lithographic apparatus includes a projection system configured to project a patterned radiation beam onto a target portion of a substrate. The projection system has a final element. The apparatus also includes a barrier member surrounding a space between the projection system and, in use, the substrate, to define in part with the final element a reservoir for liquid. The barrier member is spaced from the final element to define a gap therebetween. The apparatus further includes a deformable seal between a radially outer surface of the final element and a radially outer surface of the barrier member. The deformable seal is configured to substantially prevent a gas from flowing past the seal towards or away from the reservoir of liquid.

Abstract: A liquid immersion photolithography system includes an exposure system that exposes a substrate with electromagnetic radiation and includes a projection optical system that focuses the electromagnetic radiation on the substrate. A liquid supply system provides liquid flow between the projection optical system and the substrate. An optional plurality of micronozzles are arranged around the periphery of one side of the projection optical system so as to provide a substantially uniform velocity distribution of the liquid flow in an area where the substrate is being exposed.

Abstract: An optical system has a housing with a mount and an opening to a receiving region, the receiving region being located within the housing and including the mount. At least one optical element is inserted into and removed from the receiving region through the opening, and at least one gas supply device provides a flow of gas in the receiving region. An associated method of inserting or removing an optical element into or from a receiving region in a housing is also disclosed.

Abstract: According to one embodiment, an exposure apparatus includes a wafer stage, an irradiation optical system, and a projecting optical system. The wafer stage includes a wafer clamp, and a plate clamp configured to hold a silicon plate having a predetermined film formed on a silicon substrate. A plurality of sensors configured to measure a back surface temperature of the silicon plate is placed on an upper surface side of the plate clamp. The projecting optical system applies exposure light to the silicon plate on the plate clamp upon exposure of the silicon plate.

Abstract: Provided is a mask. The mask may include a mask substrate, mask patterns on the mask substrate, frames disposed on an edge of the mask substrate outside the mask patterns, and a pellicle spaced apart from the mask patterns, the pellicle being disposed on the frames, wherein the pellicle includes protection layers each of which has a nanometer thickness.

Abstract: A lithographic apparatus including a first body including a heat source, a second body and a heater device is presented. The second body has a facing surface facing the first body via a gap between the first and second bodies. The heat source is for providing a heat flux to the second body via the gap. The heater device is attached to the facing surface. The heater device is configured to provide a further heat flux to the second body.

Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.

Abstract: A microlithographic projection exposure apparatus includes a correction device configured to correct optical wavefront deformations. The correction device includes first and second optical elements and a drive mechanism configured to move the first and second optical elements between a first arrangement and a second arrangement. In the first arrangement the first optical element is an inner optical element having at least a portion that is arranged in a projection light path, and the second optical element is an outer optical element that is arranged completely outside the projection light path. In the second arrangement the second optical element is the inner optical element, and the first optical element is the outer optical element. The correction device further includes a temperature control device configured to modify a temperature distribution in the outer optical element.

Abstract: A liquid supply system for an immersion lithographic projection apparatus is disclosed in which a space is defined between the projection system, a barrier member and a substrate. The barrier member is not sealed such that, during use, immersion liquid is allowed to flow out the space and between the barrier member and the substrate.

Abstract: An optical system has a light source having an original etendue of less than 0.1 mm2 for an illumination system for projection lithography. An optical assembly serves for simultaneously increasing the etendue of a used emission of the light source. The optical assembly is embodied such that an increase in the etendue by at least a factor of 10 results. A component of the optical assembly that is impinged on is displaced relative to the light source such that an impingement region of the emission of the light source on the optical component of the optical assembly varies temporally.

Abstract: An EUV collector is rotated between or during operations of an EUV photolithography system. Rotating the EUV collector causes contamination to distribute more evenly over the collector's surface. This reduces the rate at which the EUV photolithography system loses image fidelity with increasing contamination and thereby increases the collector lifetime. Rotating the collector during operation of the EUV photolithography system can induce convection and reduce the contamination rate. By rotating the collector at sufficient speed, some contaminating debris can be removed through the action of centrifugal force.

Abstract: The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.

Abstract: A liquid immersion lithography apparatus includes an optical assembly having a last optical element, a first outlet facing downward, via which an immersion liquid is released, a first inlet via which the immersion liquid is drawn, and a containment member arranged to surround a last portion of the optical assembly. The containment member has (i) a second inlet facing downward, which is arranged radially-outwardly from the first outlet with respect to a space under the last optical element and via which fluid is removed from a gap formed under the containment member, and (ii) a second outlet facing downward, via which gas is supplied to the gap formed under the containment member, the second outlet being arranged radially-outwardly from the second inlet with respect to the space.

Abstract: A liquid immersion member used in an immersion exposure apparatus, and capable of forming a liquid immersion space on a surface of an object opposite to an emitting surface of an optical member which emits exposure light. The liquid immersion member includes a first member that includes a first part disposed at surrounding of an optical path of the exposure light, and in which a first opening part, through which the exposure light is able to pass, and a first liquid supply part, is disposed at at least a portion of surrounding of the first opening part and capable of opposing the surface of the object, are provided at the first part, and a second member includes a first liquid recovery part which can be opposing the surface of the object and is movable with respect to the first member outside the first part with respect to the optical path.

Abstract: The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer or stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.

Abstract: An apparatus and method for cleaning a contaminated surface of a lithographic apparatus are provided. A liquid confinement structure comprises at least two openings used to supply and extract liquid to a gap below the structure. The direction of flow between the openings can be switched. Liquid may be supplied to the gap radially outward of an opening adapted for dual flow. Supply and extraction lines to respectively supply liquid to and extract liquid from the liquid confinement structure have an inner surface that is resistant to corrosion by an organic liquid. A corrosive cleaning fluid can be used to clean photo resist contamination.

Abstract: In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70 C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., <10?6 Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.

Abstract: A system for controlling temperature of a patterning device in a lithographic apparatus is discussed. The system includes a patterning device support configured to support a patterning device and a reticle cooling system configured to provide substantially uniform temperature distribution across the patterning device. The reticle cooling system includes a first and second array of gas inlets configured to provide a first and second gas flow along a first and second direction across a surface of the patterning device, respectively, where first and second directions are opposite to each other. The reticle cooling system further includes a switching control system configured to control operation of the first and second arrays of gas inlets.

Abstract: A lithographic apparatus includes a substrate table constructed to hold a substrate, a projection system configured to project a patterned radiation beam through an opening and onto a target portion of the substrate, and a conduit having an outlet in the opening. The conduit is configured to deliver gas to the opening. The lithographic apparatus includes a temperature control apparatus disposed in a space between the projection system and the substrate table. The temperature control device is configured to control the temperature of the gas in the space after the gas passes through the opening.

Abstract: The reliability of a semiconductor device is improved. In a manufacturing method, a film to be processed is formed over a circular semiconductor substrate, and a resist layer whose surface has a water-repellent property is formed thereover. Subsequently, the water-repellent property of the resist layer in the outer peripheral region of the circular semiconductor substrate is lowered by selectively performing first wafer edge exposure on the outer peripheral region of the semiconductor substrate, and then liquid immersion exposure is performed on the resist layer. Subsequently, second wafer edge exposure is performed on the outer peripheral region of the circular semiconductor substrate, and then the resist layer, on which the first wafer edge exposure, the liquid immersion exposure, and the second wafer edge exposure have been performed, is developed, so that the film to be processed is etched by using the developed resist layer.

Abstract: An immersion lithography apparatus includes an optical member, a gap defined between the optical member and a surface disposed opposite the optical member being filled with an immersion liquid, and a fluid control device including gas outlets through which a gas is supplied to prevent the immersion liquid from entering a surround area external to an exposure area. A flow velocity of the gas supplied from the gas outlets is controlled so that a pressure of the gas supplied by a first one of the gas outlets is different from a pressure of the gas simultaneously supplied from a second one of the gas outlets.

Abstract: An immersion lithographic apparatus has adaptations to prevent or reduce bubble formation in one or more gaps in the substrate table by preventing bubbles escaping from the gap into the beam path and/or extracting bubbles that may form in the gap.

Abstract: A foreign substance detection method includes: judging the presence/absence of a foreign substance by measuring a surface condition of a substrate; measuring a surface condition of a second substrate different from the substrate upon replacing the substrate on the chuck with the second substrate, when it is judged in the judging that a foreign substance exists; and determining whether an adhering location of the foreign substance determined to exist in the judging is the substrate, based on a measurement result obtained in the measurement.

Abstract: An exposure apparatus where liquid supply operation and liquid recovery operation for forming a liquid immersion region are excellently performed to form the liquid immersion region in a desired condition, enabling high exposure accuracy and measurement accuracy to be achieved. An exposure apparatus (EX) is an apparatus that exposes a substrate (P) by emitting exposure light (EL) on the substrate (P) through liquid (LQ). The exposure apparatus has a liquid supply mechanism (10) having a supply opening (13) capable of supplying the liquid (LQ) in the direction substantially parallel to the surface of the substrate (P).

Abstract: A lithographic projection apparatus includes a support structure configured to hold a patterning device, the patterning device configured to pattern a beam of radiation according to a desired pattern; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam onto a target portion of the substrate; a liquid supply system configured to provide liquid to a space between the projection system and the substrate; and a shutter configured to isolate the space from the substrate or a space to be occupied by a substrate.

Abstract: An exposure apparatus (EX) exposes a substrate (P) by irradiating exposure light (EL) on the substrate (P) via a projection optical system (PL) and a liquid (LQ) supplied from a liquid supply mechanism (10). The exposure apparatus (EX) has a pressure adjustment mechanism (90) for adjusting pressure of the liquid (LQ) supplied from the liquid supply mechanism (10). A liquid immersion area is satisfactorily formed to obtain high exposure accuracy and measurement accuracy.

Abstract: A method includes loading a wafer onto a wafer stage of a lithography system, the wafer stage comprising a heating component and a temperature sensing component. The method further includes controlling the heating component such that a temperature of the wafer stage approaches a desired point. The controlling step comprises use of a characterization curve associated with the heating component.

Abstract: A lithography apparatus includes a cleaning unit configured to perform cleaning of a substrate holder, a detector configured to detect a foreign substance by observing a substrate held by the substrate holder, and a controller configured to control execution of a pattern forming operation on the substrate and a cleaning operation. The controller operates such that, if a foreign substance is detected out of a predetermined area including a position at which a foreign substance was previously detected after a predetermined number of executions of the cleaning operation, a next pattern forming operation is performed after executing the cleaning operation. Otherwise, a next pattern forming operation is performed without executing the cleaning operation.

Abstract: A fluid handling structure for a lithographic apparatus, the fluid handling structure having, at a boundary of a space configured to contain immersion fluid to a region external to the fluid handling structure: a meniscus pinning feature to resist passage of immersion fluid in a radially outward direction from the space; a gas supply opening at least partly surrounding and radially outward of the meniscus pinning feature; and optionally a gas recovery opening radially outward of the gas supply opening, wherein the gas supply opening, or the gas recovery opening, or both the gas supply opening and the gas recovery opening, has an open area per meter length which has a variation peripherally around the space.