Abstract: A lithographic apparatus is disclosed that includes a projection system configured to project a patterned radiation beam onto a target portion of a substrate, a vacuum chamber through which the patterned beam of radiation is projected during use, and a purge system configured to provide a purge gas flow in the chamber.

Abstract: Surface modifications and improvements to piezoelectric-based sensors, such as QCMs and other piezoelectric devices, that significantly increase the sensitivity and the specificity (selectivity). These modifications can comprise mechanical and chemical changes to the surfaces of the sensors, either individually or together. For example, nanosize structures may be provided on the surface to improve sensitivity. Additionally, chemical coatings may be tethered to the surfaces, walls, or crystal to provide targeted sensitivity. Additionally, porous, layered and multiple sensor arrays may be formed to enhance sensitivity and selectivity.

Abstract: A system that may include a movable support module for supporting an object and a controller, wherein the controller is configured to: receive an estimated location of a movable support module that supports an object and temperature information about an actual or estimated temperature of at least a portion of the object support module; and calculate movable support module location information, in response to (a) the estimated location of the movable support module, (b) the temperature information, and (c) a mapping between (i) values of the temperature information, (ii) estimated locations of the movable support module, and (iii) location errors of the movable support module.

Abstract: According to one embodiment, an alignment method includes calculating a position gap of a predetermined point in a device area of a wafer based on a stress applied to the device area, and correcting an exposure condition in a lithography process of the device area based on the position gap of the predetermined point.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and the substrate is filled with a liquid. An edge seal member at least partly surrounds the substrate or other object on a substrate table to prevent liquid loss when edge portions of the substrate or other object are, for example, imaged or illuminated. A lithographic projection apparatus includes a support structure configured to hold a patterning device, the patterning device configured to pattern a beam of radiation according to a desired pattern; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam onto a target portion of the substrate; a liquid supply system configured to provide liquid to a space between the projection system and the substrate; and a shutter configured to isolate the space from the substrate or a space to be occupied by a substrate.

Abstract: An exposure apparatus is equipped with a fine movement stage that can hold a liquid with a projection optical system when the stage is at a position facing an outgoing surface of the projection optical system, and a blade that comes into proximity within a predetermined distance of the fine movement stage when the fine movement stage is holding the liquid with the projection optical system, and moves along with the fine movement stage while maintaining the proximity state, and then holds the liquid with the projection optical system after the movement. Accordingly, a plurality of stages will not have to be placed right under the projection optical system interchangeably, which can suppress an increase in footprint of the exposure apparatus.

Abstract: A lithographic apparatus includes a first table to support a substrate; a second table, not being configured to support a substrate, including a sensor unit to sense a property of a patterned beam of radiation from a projection system, the second table to move under the projection system when the first table is moved out from under the projection system during a substrate exchange, the first and second tables being independently movable from each other; and a liquid supply system to supply a liquid to a space between the projection system and the substrate, the first table, and/or the second table, wherein the second table is configured to provide a confining surface at a bottom of a liquid confinement structure when the first table is removed from under the projection system so as to prevent the liquid from leaking out into the remainder of the lithographic apparatus.

Abstract: A mirror, in particular for a microlithographic projection exposure apparatus, has a mirror substrate (101), a reflection layer system (102) configured to reflect electromagnetic radiation that is incident on the optically effective surface (100a), and a capping layer (104), which is arranged on the side of the reflection layer system (102) facing the optically effective surface. The capping layer is produced from a first material. Particles (105) of a second material, either individually or in clusters, are applied onto this capping layer, wherein the second material differs from the first material.

Abstract: A lithographic apparatus is disclosed including a liquid supply system configured to at least partly fill a space between the projection system and the substrate with a liquid, an outlet configured to remove a mixture of liquid and gas passing through a gap between a liquid confinement structure of the liquid supply system and the substrate, and an evacuation system configured to draw the mixture through the outlet, the evacuation system having a separator tank arranged to separate liquid from gas in the mixture and a separator tank pressure controller, connected to a non-liquid-filled region of the separator tank, configured to maintain a stable pressure within the non-liquid-filled region.

Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.

Abstract: A vacuum system, in particular an EUV lithography system, includes: a vacuum housing, in which a vacuum environment is formed, and also at least one component (14), e.g., an optical element, having a surface (14a) which is subjected to contaminating particles in the vacuum environment. A surface structure (18) is formed at the surface in order to reduce adhesion of the contaminating particles, said surface structure having pore-shaped depressions (24) separated from one another by webs (25). The optical element has a substrate (19), and a multilayer coating (20) applied to the substrate and configured to reflect EUV radiation (6). The surface structure formed at the surface (14a) of the multilayer coating (20) reduces adhesion of contaminating particles (17) via pore-shaped depressions (24) separated from one another by webs (25).

Abstract: An apparatus and method for controlling temperature of a patterning device in a lithographic apparatus, by flowing gas across the patterning device. A patterning apparatus includes: a patterning device support structure configured to support a patterning device; a patterning device conditioning system including a first gas outlet configured to provide a gas flow over a surface of the patterning device and a second gas outlet configured to provide a gas flow over a part of a surface of the patterning device support structure not supporting the patterning device; and a control system configured to separately control the temperature of the gas exiting the first and second gas outlets such that the gas exiting the second gas outlet is at a higher temperature than the gas exiting the first gas outlet and/or to separately control the temperature and gas flow rate of the gas exiting the first and second gas outlets.

Abstract: A lithographic apparatus having: a substrate table constructed to hold a substrate; a projection system configured to project a patterned radiation beam onto a target portion of the substrate; a substrate surface actuator including a fluid opening for fluid flow therethrough from/onto a facing surface facing the substrate surface actuator to generate a force between the substrate surface actuator and the facing surface, the facing surface being a top surface of the substrate or a surface substantially co-planar with the substrate; and a position controller to control the position and/or orientation of a part of the facing surface by varying fluid flow through the fluid opening to displace the part of the facing surface relative to the projection system.

Abstract: An immersion lithographic apparatus is configured to subject a photosensitive layer on a substrate to a patterned beam of radiation via a liquid. The immersion lithographic apparatus includes a moveable object having a surface, a fluid handling system to control a presence of the liquid in a volume restricted by the surface, the fluid handling system, and a free surface of the liquid, the free surface extending between the surface and the fluid handling system; and a heating system configured to locally heat a portion of the liquid at a receding side of a periphery edge of the volume in contact with the surface, where the object is receding from the volume along a direction of movement of the object relative to the fluid handling system.

Abstract: A lithographic apparatus having a first outlet to provide a thermally conditioned fluid with a first flow characteristic to at least part of a sensor beam path, and a second outlet associated with the first outlet and to provide a thermally conditioned fluid with a second flow characteristic, different to the first flow characteristic, adjacent the thermally conditioned fluid from the first outlet.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A lithographic apparatus injects gas between a patterning device and a patterning device masking blade to help protect the patterning device from contamination. The gas may be injected into the space defined between the patterning device and the patterning device blade by one or more gas supply nozzles that are arranged on at least one side of the patterning device. The one or more gas supply nozzles are coupled to a frame which a patterning device support structure moves relative to. Each nozzle may be constructed and arranged to supply gas over at least the patterning region of the reflective patterning device.

Abstract: A liquid supply system for an immersion lithographic apparatus provides a laminar flow of immersion liquid between a final element of the projection system and a substrate. A control system minimizes the chances of overflowing and an extractor includes an array of outlets configured to minimize vibrations.

Abstract: A liquid immersion lithography apparatus includes a projection system having a final optical element and a nozzle member having a first opening disposed on a first side of the final optical element and from which an immersion liquid is supplied, a second opening disposed on a second side of the final optical element and from which the immersion liquid is recovered, and a liquid recovery portion disposed to surround a path of an exposure beam and from which the immersion liquid is recovered. A tank is fluidicly connected to the liquid recovery portion of the nozzle member. During exposure of a substrate to the exposure beam, an upper surface of the substrate faces the liquid recovery portion, and the immersion liquid is supplied from the first opening while performing liquid recovery from the second opening and the liquid recovery portion.

Abstract: An exposure apparatus includes a substrate stage having a substrate holder to hold a substrate, a gap being formed between an edge of the held substrate and a surface surrounding the held substrate, and a controller that controls an exposure operation in which shot areas of the substrate are exposed sequentially and respectively with an image through liquid of a liquid immersion area which covers a portion of an upper surface of the substrate. The controller moves the substrate stage at a first speed to expose one of the shot areas to the image through the liquid, moves the substrate stage at a second speed, that is lower than the first speed, to expose another one of the shot areas to the image through the liquid, and during the exposing of the another one of the shot areas, the liquid immersion area is formed over a portion of the gap.

Abstract: Exposure apparatus exposes a substrate by irradiating the substrate with exposure light via a projection optical system and a liquid. The exposure apparatus is provided with a liquid immersion mechanism for supplying the liquid and recovering the liquid. The liquid immersion mechanism has an inclined surface, which is opposite to a surface of the substrate and is inclined with respect to the surface of the substrate, and a liquid recovering port of the liquid immersion mechanism is formed in the inclined surface. A flat portion is provided between the substrate and the projection optical system. A liquid immersion area can be maintained to be small.

Abstract: The present invention provides an exposure apparatus exposing a substrate through a projection optical system, the apparatus comprising a stage configured to hold the substrate, a detection unit configured to emit detection light in a first direction and detect a position of the stage, a blowing unit configured to blow out a gas, and a guide unit including a first portion and a second portion, wherein the first portion is configured to guide the gas to a first space between the projection optical system and the substrate, such that a gas flow along the substrate is formed in the first space, and wherein the second portion is configured to guide the gas to a second space where the detection light passes through, such that a gas flow in a second direction is formed in the second space.

Abstract: An exposure apparatus exposes a substrate with illumination light via a liquid. A liquid immersion member of the exposure apparatus has a lower surface, a plurality of collection ports, and a plurality of supply ports. The lower surface has an opening through which illumination light passes. The collection ports are arranged at the lower surface to surround the opening, and the supply ports are arranged at the lower surface and between the opening and the collection ports to surround the opening, such that the liquid is supplied via the supply ports onto the substrate while the substrate is arranged opposite to a plane-convex lens of a projection optical system and such that the liquid is collected via the collection ports from the substrate.

Abstract: A thermal conditioning unit to thermally condition a substrate in a lithographic apparatus, the thermal conditioning unit including: a thermal conditioning element having a first layer, in use, facing the substrate and including a material having a thermal conductivity of 100 W/mK or more, a second layer and a heat transfer component positioned between the first and second layers; and a stiffening member which is stiffer than the thermal conditioning element and configured to support the thermal conditioning element so as to reduce mechanical deformation thereof, wherein the thermal conditioning element is thermally isolated from the stiffening member.

Abstract: A cleaning liquid for rinsing an ink adhering to an article includes water and a first organic solvent, wherein a liquid mixture of the water and the first organic solvent has a Hansen solubility parameter including a hydrogen bond term of 10.0 (cal/cm3)1/2 or less, wherein the ink includes water, a second organic solvent, a polyurethane resin particle, and a polysiloxane surfactant having an HLB value of 8 or less, wherein the polyurethane resin particle accounts for 5 percent by mass or more of a total amount of the ink.

Abstract: An apparatus and method for cleaning a contaminated surface of a lithographic apparatus are provided. A liquid confinement structure comprises at least two openings used to supply and extract liquid to a gap below the structure. The direction of flow between the openings can be switched. Liquid may be supplied to the gap radially outward of an opening adapted for dual flow. Supply and extraction lines to respectively supply liquid to and extract liquid from the liquid confinement structure have an inner surface that is resistant to corrosion by an organic liquid. A corrosive cleaning fluid can be used to clean photo resist contamination.

Abstract: Optical element protection systems for protecting optical elements and particularly reflective optical elements from degradation of their optical properties in harsh environments such as the environment inside a vacuum chamber of an EUV light source. The systems include the uses of combinations of materials in various layers where the materials are chosen and the layers are configured and arranged to extend the lifetime of the optical element without compromising its optical properties.

Abstract: An exposure apparatus includes a projection optical system having a last optical element via which an exposure beam is projected to a projection area, and a liquid supply system having a first supply port and a second supply port via which an immersion liquid is supplied to form a liquid immersion area. The first supply port is arranged on one side of the projection area in a scanning direction, and the second supply port is arranged on the other side of the projection area in the scanning direction, the first and second supply ports facing downwardly. A plurality of shot areas of a substrate are successively exposed with the exposure beam through the liquid immersion area covering only a portion of an upper surface of the substrate.

Abstract: A lithographic projection apparatus is disclosed which includes a cleaning station. Several embodiments of the cleaning station are disclosed. In an embodiment, measures are taken to avoid contact of a cleaning fluid with the final element of the projection system. In an embodiment, measures are taken to avoid foaming of the cleaning fluid. The use of a thermally isolated island is also disclosed as well as its optimal position.

Abstract: An extreme ultraviolet (EUV) lithography system includes a collector designed to collect and reflect EUV radiation, a cover integrated with the collector, a first exhaust line connected to the cover and configured to receive debris vapor from the collector, a debris trapper connected to the first exhaust line and configured to trap the debris vapor, and a second exhaust line connected to the debris trapper.

Abstract: The invention relates to a projection exposure apparatus for semiconductor lithography, comprising an illumination system for illuminating a mask arranged on a movable mask stage, and comprising a projection lens for imaging the mask onto a semiconductor substrate, wherein at least one means is present for at least partly decoupling at least parts of the illumination system and/or of the projection lens from the influence of pressure fluctuations in the medium surrounding the projection lens or the illuminated system, the pressure fluctuations being attributed to movements of the mask stage during the operation of the apparatus.

Abstract: An immersion lithography apparatus comprises a temperature controller configured to adjust a temperature of a projection system, a substrate and a liquid towards a common target temperature. Controlling the temperature of these elements and reducing temperature gradients may improve imaging consistency and general lithographic performance. Measures to control the temperature may include controlling the immersion liquid flow rate and liquid temperature, for example, via a feedback circuit.

Abstract: An exposure apparatus includes a projection system having a final optical element via which an exposure beam is projected, an immersion member having an opening through which the exposure beam is projected, liquid supply ports and liquid recovery ports, a stage which is movable below and relative to the projection system and the immersion member, the stage including a holder configured to hold a substrate, and a detection system configured to detect a residual liquid on at least one of the substrate held on the holder of the movable stage and the movable stage. A liquid immersion area that covers only a portion of the upper surface of the substrate is formed on an upper surface of the substrate held on the holder of the movable stage, while supplying immersion liquid via the liquid supply ports and removing the immersion liquid via the liquid recovery ports.

Abstract: A component for a lithography tool, the component including a member having a primary surface; a conduit defined within the member and configured to receive a fluid under pressure; a compressible region within the member and located between the conduit and the primary surface; and a deformable region between the compressible region and the conduit, wherein the compressible region and the deformable region are configured to accommodate local deformation of the member resulting from the pressure of the fluid.

Abstract: A liquid immersion exposure apparatus includes a liquid immersion member which forms a liquid immersion space under an emitting surface of a last optical member. The exposure light is projected to a substrate through liquid in the liquid immersion space to expose the substrate while the substrate is moved in a scanning direction. The liquid immersion member includes (i) a first member having a liquid supply port and an opening through which the exposure light is projected, and (ii) a second member having a liquid recovery port facing downwardly and that is movable with respect to the first member. The liquid recovery port has a plurality of openings disposed in a four-sided shaped having four corners to surround the opening of the first member.

Abstract: A liquid immersion member is used in a liquid immersion exposure apparatus which exposes a substrate by exposure light via a first liquid between an emitting surface of an optical member and the substrate, and is capable of forming a liquid immersion space on an object movable below the optical member. The liquid immersion member includes a first member that is disposed at at least a portion of surrounding of the optical member; a second member that is capable of being opposite to the object and is movable outside an optical path of the exposure light; and a protection part that protects the optical member. The protection part decreases a change in pressure which the optical member receives from the liquid in the liquid immersion space.

Abstract: An exposure apparatus includes a projection system having an optical element via which an exposure beam is projected; an immersion area forming member having an opening through which the exposure beam is projected, the immersion area forming member having a liquid supply inlet facing downward, a liquid recovery outlet facing downward, and a liquid supply port disposed between the liquid supply inlet and the liquid recovery outlet; a frame by which the projection system and the immersion area forming member are supported; a first vibration isolator by which transmission of vibration from the frame to the projection system is limited; and a second vibration isolator by which transmission of vibration from the immersion area forming member to the frame is limited. A liquid immersion area is formed, using the immersion area forming member, on a portion of an upper surface of a substrate, which is exposed to the exposure beam.

Abstract: A fluid handling structure, an immersion lithographic apparatus and a device manufacturing method are disclosed. In one arrangement, a fluid handling structure has a fluid extraction conduit with a recovery port configured to receive a used fluid into the conduit. A plurality of flow breakers are provided that each extends across at least a portion of the conduit. The flow breakers are positioned downstream of the recovery port. The flow breakers are arranged so that a common plane cuts through at least a portion of two or more of the flow breakers. The common plane is aligned so as to be perpendicular to the average direction of flow in the conduit at the position of the common plane.

Abstract: A support apparatus for a lithographic apparatus has an object holder and an extraction body radially outward of the object holder. The object holder is configured to support an object. The extraction body includes an extraction opening configured to extract fluid from a top surface of the support apparatus. The extraction body is spaced from the object holder such that the extraction body is substantially decoupled from the object holder. The extraction body comprises a projection configured such that it surrounds the object holder and such that, in use, a layer of liquid is retained on the projection and in contact with an object supported on the object holder.

Abstract: The disclosure relates to arrangements for manipulating the position of an element. An arrangement according has at least one actuator for each degree of freedom of the positional manipulation for exerting adjustable forces on the element, at least one position sensor for each degree of freedom of the positional manipulation for generating in each case a sensor signal that is characteristic of the position of the element, and at least one position controller, which in a position control circuit controls a force exerted on the element by the at least one actuator for the positioning of the element in dependence on the at least one sensor signal. At least one actuator and at least one position sensor are mounted on a common module frame.

Abstract: The present disclosure relates to an optical arrangement for use in an optical imaging process. The optical arrangement includes an optical element, an immersion zone and a liquid repelling device. During the optical imaging process, the immersion zone is located adjacent to the optical element and is filled with an immersion liquid. The optical element has a first surface region and a second surface region. During the optical imaging process, the first surface region is wetted by the immersion liquid. At least temporarily during the optical imaging process, the liquid repelling device generates an electrical field in the region of the second surface. The electrical field being is adapted to cause a repellent force on parts of the immersion liquid which are responsive to the electrical field and inadvertently contact the second surface region. The repellent force has a direction to drive away the parts of the immersion liquid from the second surface region.

Abstract: A method of thermally conditioning a physical object, includes guiding a two-phase cooling medium through a cooling duct of the physical object, wherein the guiding includes: guiding the two-phase cooling medium in a liquid phase via a pre-heating duct of the physical object from a supply side of the physical object at least partly towards a discharging side of the physical object, the two-phase cooling medium being pre-heated in the pre-heating duct; guiding the two-phase cooling medium from the pre-heating duct to a phase transitioning duct of the physical object, the two-phase cooling medium at least partly transitioning from the liquid phase towards a gas phase in the phase transitioning duct; guiding the two-phase cooling medium from the phase transitioning duct to a discharging duct of the physical object; and discharging at the discharging side the two-phase cooling medium from the discharging duct.

Abstract: A lithographic apparatus including a projection system configured to project a patterned radiation beam onto a substrate and a fluid confinement structure configured to confine immersion fluid in a localized region between a final element of the projection system and a surface of the substrate. The lithographic apparatus is configured to have a space bounded on one side by a surface of the projection system and/or a component of the lithographic apparatus at least partially surrounding the final element of the projection system, and on the other side by a surface of the fluid confinement structure. The apparatus is configured to increase the humidity of the gas within the space.

Abstract: An apparatus has a first component with a first surface and a second component with a second surface, wherein the first and second components can undergo relative movement. The first surface and the second surface face each other. The first surface accommodates a barrier system to provide a barrier to reduce or prevent an inflow of ambient gas into a protected volume of gas between the first and second surfaces. The barrier system includes a curtain opening adapted for a flow of curtain gas therefrom for establishing a gas curtain enclosing part of the protected volume, and an inner entrainment opening, located inward of the curtain opening with respect to the protected volume, adapted for a flow of inner entrainment gas therefrom for being entrained into the flow of curtain gas. The apparatus is configured such that the inner entrainment gas flow is less turbulent than the curtain gas flow.

Abstract: A laser direct imaging system includes a stage, a laser device and an oxygen-reducing device. The stage is subjected to an atmospheric pressure. The laser device is configured to provide a laser beam to scan across the substrate. The oxygen-reducing device operates simultaneously with the laser device for outputting an inert gas only to a specific area where the laser beam is being aimed such that any portion of the substrate, if enters the specific area, will be exposed to the laser beam under a low-oxygen environment.

Abstract: An exposure apparatus (EX) is an apparatus which exposes a substrate (P) by irradiating exposure light (EL) onto the substrate (P) via a projection optical system (PL) and a liquid (1). The exposure apparatus (EX) has a substrate table (PT) for holding the substrate (P), and a plate member (30) having a liquid repellent flat surface (30A) is replaceably provided to the substrate table (PT) to prevent the liquid from remaining, maintaining excellent exposure accuracy.

Abstract: A method for preventing or reducing contamination of an immersion type projection apparatus is provided. The apparatus includes at least one immersion space that is at least partially filled with a liquid when the apparatus projects a beam of radiation onto a substrate. The method includes rinsing at least part of the immersion space with a rinsing liquid before the apparatus is used to project the beam of radiation onto a substrate.

Abstract: A projection apparatus for microlithography for imaging an object field includes an objective, one or a plurality of manipulators for manipulating one or a plurality of optical elements of the objective, a control unit for regulating or controlling the one or the plurality of manipulators, a determining device for determining at least one or a plurality of image aberrations of the objective, a memory comprising upper bounds for one or a plurality of specifications of the objective, including upper bounds for image aberrations and/or movements for the manipulators, wherein when determining an overshooting of one of the upper bounds by one of the image aberrations and/or an overshooting of one of the upper bounds by one of the manipulator movements by regulation or control of at least one manipulator within at most 30000 ms, or 10000 ms, or 5000 ms, or 1000 ms, or 200 ms, or 20 ms, or 5 ms, or 1 ms, an undershooting of the upper bounds can be effected.

Abstract: In immersion exposure, a resist pattern forming method suppressing resist pattern defects comprises mounting a substrate formed a resist film thereon and a reticle formed a pattern thereon onto an exposure apparatus, supplying a first chemical solution onto the resist film to selectively form a first liquid film in a local area on the resist film and draining the solution, the first liquid film having a flow and being formed between the resist film and a projection optical system, transferring the pattern of the reticle to the resist film through the first liquid film to form a latent image, supplying a second chemical solution onto the resist film to clean the resist film, heating the resist film, and developing the resist film to form a resist pattern from the resist film.

Abstract: Provided is a charged particle beam lens apparatus having a small size and high resolution, and a charged particle beam column and a charged particle beam exposure apparatus. A charged particle beam lens apparatus includes a lens unit positioned around a through hole through which a charged particle beam travels, where the lens unit is configured to converge or diffuse the charged particle beam, and a supporting unit surrounding the lens unit. Here, at least one of an outer peripheral portion of the lens unit that is in contact with the supporting unit and an inner peripheral portion of the supporting unit that is in contact with the lens unit includes a groove through which a coolant fluid flows along an outer periphery of the lens unit. In this way, the charged particle beam lens apparatus can achieve a small size and high resolution.