Abstract: An imprint lithography system that pressurizes and depressurizes an air cavity behind a retained imprint template or substrate so as to deflect the template or substrate to aid in filling the template pattern with fluid resist and/or separating the template from the cured resist on the substrate. The system includes a controller, pressure sensors, and an impedance valve for modulating the air cavity pressure so as to reduce pressure wave oscillations within the cavity that otherwise negatively impact overlay accuracy control, fluid spread control and separation control.

Abstract: The present invention provides a measurement apparatus including a first filter unit including a plurality of first filters, and each configured to allow light having a different wavelength band to pass, a second filter unit including a plurality of second filters, and each configured to reduce light intensity of light and allow the light to pass, an obtaining unit configured to obtain data representing a transmittance of each of the plurality of second filters for a wavelength band of light having passed through each of the plurality of first filters, and a selection unit configured to select, based on the data obtained by the obtaining unit, from the plurality of second filters, one second filter arranged on an optical path together with one first filter among the plurality of first filters.

Abstract: A substrate support, includes: a substrate support location configured to support a substrate, and a vacuum clamping device configured to clamp the substrate on the substrate support location, wherein the vacuum clamping device includes at least one reduced pressure source to create a reduced pressure, at least one vacuum section connected to the at least one reduced pressure source, wherein the at least one vacuum section is configured to attract the substrate towards the substrate support location, and a control device configured to control a spatial pressure profile along the at least one vacuum section with which the substrate is attracted by the vacuum clamping device, wherein the control device includes a substrate shape data input to receive substrate shape data representing shape data of the substrate to be clamped, and wherein the control device is configured to adapt the spatial pressure profile in dependency of the substrate shape data.

Abstract: A movable body apparatus includes: a substrate holder which can move in the X-axis and Y-axis directions; a Y coarse movement stage which can move in the Y-axis direction; a first measurement system which acquires position information on the substrate holder by heads on the substrate holder and a scale on the Y coarse movement stage; a second measurement system which acquires position information on the Y coarse movement stage by heads on the Y coarse movement stage and a scale; and a control system which controls the position of the substrate holder based on position information acquired by the first and second measurement systems. The first measurement system irradiates a measurement beam while moving the heads in the X-axis direction with respect to the scale, and the second measurement system irradiates a measurement beam while moving the heads in the Y-axis direction with respect to the scale.

Abstract: A new way of drying and/or wetting a surface, such as a top surface of a substrate, is disclosed which is useful in immersion lithography. The surface is placed under a single phase extractor and a priming liquid is delivered between the single phase extractor and the surface. The single phase extractor is only activated after the priming liquid has been provided between the single phase extractor and the surface. Priming liquid is delivered to the single phase extractor during the whole of the drying and/or wetting process.

Abstract: An optical apparatus and its vibration removing method capable of stabilizing a place where light is applied are provided. An optical apparatus according to an aspect of the present disclosure includes a light source chamber, an EUV light source, an optical system chamber, an optical system configured to guide light entering the optical system chamber to an object through a bellows, an optical sensor configured to detect EUV light L2 emitted from the EUV light source, a position sensor disposed to detect a relative position of the optical system chamber with respect to the light source chamber, and a second vibration removal unit configured to remove vibrations from the light source chamber based on detection results of the optical sensor and the position sensor.

Abstract: A vacuum processing apparatus 100 includes: a vacuum chamber 1; a stage 2 placed inside the vacuum chamber 1, on which an object to be processed is placed; an internal guide rail 31 laid in the vacuum chamber 1 to guide the stage 2; a through-hole 103 made in a sidewall 102 of the vacuum chamber 1; a connecting rod 4 coupled to the stage 2 at one end and inserted in the through-hole 103, the other end being disposed outside the vacuum chamber 1; a movable member 5 connected to the other end of the connecting rod 4; a driving mechanism 8 disposed outside the vacuum chamber 1 to move the movable member 5; and a bellows 6 disposed between the movable member 5 and the sidewall 102, the bellows 6 following the movement of the movable member 5 while maintaining airtightness of the vacuum chamber 1.

Abstract: Systems, methods and computer program products generally include a vector by vector subtraction method per wafer. A first layer is exposed to form a pattern image on a wafer and the overlay data of alignment registration marks at multiple locations relative to alignment registration marks of a baseline reference are measured. The first layer is then reworked and exposed to form the same pattern image and the overlay data of alignment registration marks at multiple locations relative to alignment registration marks of a first layer are measured. The overlay data of the reworked first layer is subtracted from the overlay data of the first layer to provide an overlay difference at each of the multiple locations. The overlay difference is converted to a pre-correction factor of a magnitude opposite that of the overlay difference and is applied to exposure of a second layer provided on the first layer.

Abstract: A method of controlling reticle masking blade positioning to minimize the impact on critical dimension uniformity includes determining a target location of a reticle masking blade relative to a reflective reticle and positioning the reticle masking blade at the target location. A position of the reticle masking blade is monitored during an imaging operation. The position of the reticle masking blade is compared with the target location and the position of the reticle masking blade is adjusted if the position of the reticle masking blade is outside a tolerance of the target location.

Abstract: A method of making a semiconductor device includes collecting process control parameters during operation of a processing tool processing a product. The method further includes calculating a processing tool offset for the processing tool based on the collected process control parameters and calculating a product offset based on the collected process control parameters. The method further includes determining whether the product offset is stable and calculating an offset time for processing the product using the processing tool based on the calculated processing tool offset if the product offset is stable.

Abstract: A fluid application system and method having a support structure for guiding a plurality of pallets along a path of travel through the system. The plurality of pallets for arranging a medium that receives fluid during operation. The system further includes an application assembly for applying fluid and energy to a medium arranged on the plurality of pallets and a conveyance arrangement comprising first and second conveyors for transferring the one or more pallets through the fluid application system. The first and second conveyors have a dedicated trolley selectively coupled to one of the plurality of pallets during movement along a first direction of the path of travel and selectively decoupled from the one of the plurality of pallets during movement along a second direction of the path of travel.

Abstract: Disclosed are methods and apparatus for inspecting an extreme ultraviolet (EUV) reticle using an optical inspection tool. An inspection tool having a pupil filter positioned at an imaging pupil is used to obtain a test image or signal from an output beam that is reflected and scattered from a test portion of an EUV test reticle. The pupil filter is configured to provide phase contrast in the output beam. A reference image or signal is obtained for a reference reticle portion that is designed to be identical to the test reticle portion. The test and reference images or signals are compared and it is determined whether the test reticle portion has any candidate defects based on such comparison. For each of a plurality of test reticle portions of the reticle, the operations for using the inspection tool, obtaining a reference image or signal, comparing, and determining are repeated. A defect report is generated based on any candidate defects that have been determined to be present.

Abstract: An exposure apparatus that exposes a substrate is provided. The apparatus includes a stage configured to hold and move the substrate, and a controller configured to control focus driving of the stage based on a measurement value and a correction value obtained for the focus driving of the stage for a shot region on the substrate. The controller is configured to determine the correction value in accordance with an angle of view at a time of exposure.

Abstract: A route for a substrate support that supports a substrate in an immersion lithographic apparatus is calculated to satisfy the following constraints: after the edge of the substrate first contacts the immersion space, the substrate remains in contact with the immersion space until all target portions are exposed; exposures of target portions are performed while the substrate moves in a scan direction; and all movements of the substrate between exposures are, in a plane parallel to its upper surface, either curved or only in one of the scan directions or transverse directions. In order to reduce exposure defects at the edge of the substrate the outside portion of the substrate is avoided from being exposed to the immersion liquid. The transfer routes are designed to overly the substrate surface.

Abstract: A lithography system may include a wafer stage. The wafer stage may include a wafer mounting part configured to carry a wafer and configured to oscillate along a plane that is parallel to a top surface of the wafer in a wafer exposure process. The wafer stage may further include a driving device configured to affect an oscillatory movement of the wafer mounting part in the wafer exposure process.

Abstract: The present invention relates to an ultra-short distance projection lens with a refractive meridional image surface and a refractive sagittal image surface being isolated, including a display chip, a refractive lens group, and a rotationally symmetric reflector. The display chip undergoes imaging by the refractive lens group to form, between the refractive lens group and the rotationally symmetric reflector, a meridional intermediate image and a sagittal intermediate image that are isolated, wherein the two images undergo imaging by the rotationally symmetric reflector and astigmatism is eliminated on a screen, to form a clear picture. The present invention has a simple structure, a projection ratio 0.27 to 0.31, a magnification ratio 170 times to 220 times, and ultra-small distortion, has an optical structure that cancels out astigmatism, high resolution, very desirable tolerance, and relatively low mounting precision requirements on optical parts, and has a very high yield in mass production.

Abstract: The present invention is to provide a stage device capable of improving field-of-view positioning accuracy of a stage having a Z-axis mechanism. The invention is directed to a sample stage device having a first table that moves a sample in a first direction, a second driving mechanism that moves the first table in a second direction different from the first direction, and a part having a function of moving a laser interferometer optical axis that measures the position of the first table, in the second direction.

Abstract: A substrate table to support a substrate on a substrate supporting area, the substrate table having a heat transfer fluid channel at least under the substrate supporting area, and a plurality of heaters and/or coolers to thermally control the heat transfer fluid in the channel at a location under the substrate supporting area.

Abstract: Disclosed herein is a high throughput optical scanning device and methods of use. The optical scanning device and methods of use provided herein can allow high throughput scanning of a continuously moving object with a high resolution despite fluctuations in stage velocity. This can aid in high throughput scanning of a substrate, such as a biological chip comprising fluorophores. Also provided herein are improved optical relay systems and scanning optics.

Abstract: In a substrate processing apparatus, an optical sensor is provided at a hand that transports a substrate to a processing unit, and an optical fiber is provided at a fixed member that has a certain positional relationship with a spin chuck in the processing unit. When the hand has a predetermined positional relationship with the spin chuck in the processing unit, the light emitted from a first light emitter of the optical sensor is received by a second light receiver of the optical fiber and guided to a second light emitter of the optical fiber, and the light emitted from the second light emitter is received by a first light receiver. A light receiving signal corresponding to an amount of light received by the first light receiver is output from the optical sensor.

Abstract: The invention relates to an alignment apparatus for aligning a substrate, and a substrate processing system comprising such alignment apparatus. The alignment apparatus comprises an alignment base for supporting said substrate and/or a substrate support member, and a force generating device for applying a contact force on said substrate. The force generating device comprises: an arm comprising a rigid proximal end a rigid distal end provided with a contact section for contacting an edge of said substrate, and an elastically deformable arm section extending between the rigid proximal and distal ends, a connection part connecting said rigid proximal end to said alignment base, said arm being movable with respect to said alignment base via said connection part, and an actuator for acting on and causing a displacement of said rigid proximal end, whereby said contact force, defined by said elastically deformable arm section, is applied to said substrate by said contact section.

Abstract: Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.

Abstract: Some embodiments include a system. The system can comprise one or more processors and one or more non-transitory storage devices.

Abstract: A lithographic apparatus applies a device pattern at multiple fields across a substrate. A height map is decomposed into a plurality of components. A first height map component represents topographical variations associated with the device pattern. One or more further height map components represent other topographical variations. Using each height map component, control set-points are calculated according to a control algorithm specific to each component. The control set-points calculated for the different height map components are then combined and used to control imaging of the device pattern to the substrate. The specific control algorithms can be different from one another, and may have differing degrees of nonlinearity. The combining of the different set-points can be linear. Focus control in the presence of device-specific topography and other local variations can be improved.

Abstract: In one embodiment, a charged particle beam writing apparatus includes a writer writing a pattern on a substrate on a stage with a charged particle beam, a mark substrate disposed on the stage and having a mark, an irradiation position detector detecting an irradiation position of the charged particle beam on a mark surface, a height detector detecting a surface height of the substrate and the mark substrate, a drift correction unit calculating an amount of drift correction, and a writing control unit correcting the irradiation position of the charged particle beam by using the amount of drift correction. The mark substrate has a pattern region with a plurality of marks and a non-pattern region with no pattern therein, and at least part of the non-pattern region is disposed between different portions of the pattern region. The height detector detects a height of a detection point in the non-pattern region.

Abstract: A detection apparatus that detects a mark formed on a substrate is provided. The detection apparatus includes a substrate holder configured to hold the substrate, an optical system accommodated in the substrate holder, an image sensor configured to capture an image of the mark from the reverse surface side of the substrate through the optical system, and a processor configured to perform detection processing for the mark based on the image of the mark captured by the image sensor. The processor corrects a detection value of the mark based on the position of the mark on the substrate in the height direction and information concerning the telecentricity of the optical system.

Abstract: An optical apparatus including a substrate and a refractive element formed above the substrate. The refractive element including a surface with a predetermined radius of curvature, and a group of periodic structures formed on the surface configured to refract or to filter one or more wavelengths of an incident light.

Abstract: A patterning apparatus, including: a substrate holder constructed to support a substrate; a particle generator configured to generate particles in the patterning apparatus, the particle generator configured to deposit the particles onto the substrate to form a layer of particles on the substrate; and a pattern generator in the patterning apparatus, the pattern generator configured to applying a pattern in the patterning apparatus to the deposited layer of particles.

Abstract: Embodiments of methods and systems for wafer bonding alignment compensation are disclosed. The method comprises bonding a first pair of wafers including multiple bonding alignment mark pairs on the first pair of wafers; first analyzing a translational misalignment and a rotational misalignment between the first pair of wafers based on a measurement of at least two bonding alignment mark pairs; controlling a wafer position adjustment module to compensate for the translational misalignment and the rotational misalignment during bonding of a second pair of wafers based on the first analysis; second analyzing a mean run-out misalignment between the first pair of wafers based on a measurement of the multiple bonding alignment mark pairs; and controlling a wafer deformation adjustment module to compensate for the run-out misalignment during bonding of a third pair of wafers based on the second analysis.

Abstract: A method for determining one or more optimized values of an operational parameter of a sensor system configured to measure a property of a substrate is disclosed. The method includes: determining a quality parameter for a plurality of substrates; determining measurement parameter values for the plurality of substrates using the sensor system for a plurality of values of the operational parameter; comparing a substrate to substrate variation of the quality parameter and a substrate to substrate variation of a mapping of the measurement parameter values; and determining the one or more optimized values of the operational parameter based on the comparing.

Abstract: An exposure apparatus including: a substrate holder constructed to support a substrate; a patterning device configured to provide radiation modulated according to a desired pattern, the patterning device including an array of radiation source modules configured to project the modulated radiation onto a respective array of exposure regions on the substrate; and a distributed processing system configured to process projection related data to enable the projection of the desired pattern onto the substrate, the distributed processing system including at least one central processing unit and a plurality of module processing units each associated with a respective radiation source module.

Abstract: An illuminance distribution response amount as the change amount of the illuminance distribution pattern, associating the position in the irradiation region in the lengthwise direction with the change amount of the illuminance with respect to the change in the drive current, has previously been acquired and stored in a storage unit for each light-emitting block. There is provided an arithmetic processing unit that determines (estimates) a current command value of each of the light-emitting blocks based on a present current command value of each of the light-emitting blocks and the change amount of the illuminance distribution pattern of each light-emitting block in order to bring a present illuminance distribution pattern in the irradiation region in a lengthwise direction close to a target illuminance distribution pattern.

Abstract: A photoresist film is patterned into an array of island shapes with improved critical dimension uniformity and no phase edges by using two alternating phase shifting masks (AltPSMs) and one post expose bake (PEB). The photoresist layer is exposed with a first AltPSM having a line/space (L/S) pattern where light through alternating clear regions on each side of an opaque line is 180° phase shifted. Thereafter, there is a second exposure with a second AltPSM having a L/S pattern where opaque lines are aligned orthogonal to the lengthwise dimension of opaque lines in the first exposure, and with alternating 0° and 180° clear regions. Then, a PEB and subsequent development process are used to form an array of island shapes. The double exposure method enables smaller island shapes than conventional photolithography and uses relatively simple AltPSM designs that are easier to implement in production than other optical enhancement techniques.

Abstract: A method for processing a plurality of semiconductor wafers includes acquiring a process parameter measurement for each of the semiconductor wafers, associating each of the semiconductor wafers with one of a plurality of groups based on a respective process parameter measurement for each of the semiconductor wafers, where each respective group corresponds to a respective recipe, and for each one of the groups, processing ones of the semiconductor wafers associated with that group together according to a respective recipe.

Abstract: The present disclosure discloses a direct type backlight module, which includes a back plate and a light source disposed on the back plate, wherein the light source includes a printed circuit board and a plurality of micro-LED chips electrically connected to the printed circuit board, the plurality of micro-LED chips are arranged in a matrix array on the printed circuit board, and a light shielding unit is disposed between any adjacent two micro-LED chips; and the printed circuit board is further connected with a backlight driving chip thereon which drives each of the plurality of micro-LED chips independently. The present disclosure further provides a liquid crystal display which includes the abovementioned direct type backlight module.

Abstract: An exposure apparatus has a substrate holding member, a first supporting member, a second supporting member, and a driving system. The first supporting member supports the substrate holding member from below. The second supporting member supports the first supporting member from below such that the first supporting member and the second supporting member are capable of moving relative to each other. The driving system moves the substrate holding member, the first supporting member and the second supporting member. The driving system includes a first driving device and a second driving device, the first driving device moving the substrate holding member and the first supporting member in a direction along a predetermined axis, and the second driving device moving the second supporting member in the direction along the predetermined axis.

Abstract: A method detects a position of a target in an image using a template having first to Nth feature points. The method includes obtaining an index indicating correlation between the template and the image by repeating processing for each relative positions of the template with respect to the image, while sequentially setting first to nth (n?N) feature points as a feature point of interest. When the feature point of interest is a Jth feature point, whether an intermediate index indicating the correlation obtained based on processing of the first to Jth feature points satisfies a censoring condition is determined, and processing of (J+1)th and subsequent feature points is canceled if the intermediate index satisfies the censoring condition.

Abstract: There is provided a configuration that includes a plurality of substrate processing apparatuses and a management device for managing the plurality of substrate processing apparatuses. Upon receiving information specifying a substrate processing apparatus as a reference and file information designating a predetermined device file, the plurality of substrate processing apparatuses transmits request data including first device information and first data information to the management device. Upon receiving the request data, the management device transmits the received request data to the reference substrate processing apparatus. The reference substrate processing apparatus creates response data including second data information responding to the first data information and transmits the created response data to the management device. Upon receiving the response data, the management device transmits the received response data to the plurality of substrate processing apparatuses.

Abstract: Metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.

Abstract: A method performed by one or more processing devices for ensuring that a vehicle seat top is qualified for use with a seat base for a vehicle seat, the method comprising: receiving information that identifies a type of vehicle seat top for coupling to the seat base; verifying that the vehicle seat top is authorized for use with the seat base; and in response to verifying, retrieving, based on the received information that identifies the type of vehicle seat top, pre-determined values of controller parameters of a closed loop control system for isolating vibrations from the vehicle seat top, wherein the predetermined values of the controller parameters are specifically tuned for the vehicle seat top.

Abstract: Embodiments of the present disclosure provide improved photolithography systems and methods using a solid state emitter array. The solid state emitter array comprises solid state emitter devices arranged in rows and columns, wherein each solid state emitter device comprises two or more subpixels. Each solid state emitter device comprises one program gate which may transmit a voltage to a state storage node. The state storage node is in electrical communication with a drive gate. The drive gate is in communication with two or more solid state emitter subpixels. The arrangement of a plurality of subpixels in communication with a single drive gate allows more than one pulse to be delivered to the drive gate, resulting in illumination of more than one subpixel at each drive gate. The redundancy results in improved data efficiency.

Abstract: A lithography system is provided. The lithography system includes a mask and an optical module. The optical module is configured to optically form an invisible pellicle over the mask to protect the mask from contaminant particles. As a solid pellicle used in the prior arts is omitted, the critical dimension (CD) error from the boarder effect due to reflection of some light by the solid pellicle and the exposure radiation energy consumption caused by the solid pellicle can be avoided.

Abstract: The present invention provides an exposure apparatus which transfers a pattern of a mask onto a substrate by exposing the substrate while scanning the mask and the substrate, the apparatus including a stage configured to hold the substrate and move, a control unit configured to control movement of the stage, a first measurement unit configured to measure a position, in a height direction, of a shot region of the substrate held by the stage before the shot region reaches an exposure area where the shot region is exposed, and a second measurement unit configured to measure the position of the shot region in the height direction prior to the first measurement unit.

Abstract: A system, method, and computer program product are provided for inspecting a wafer using a film thickness map generated for the wafer. In use, a plurality of locations on a wafer are determined from a design of the wafer. Additionally, a measured brightness at each of the determined locations on the wafer is obtained. Further, a film thickness map for the wafer is generated from the obtained measurements. The wafer is then inspected using the film thickness map.

Abstract: A lithographic apparatus (LA) prints product features and at least one focus metrology pattern (T) on a substrate. The focus metrology pattern is defined by a reflective reticle and printing is performed using EUV radiation (404) incident at an oblique angle (?). The focus metrology pattern comprises a periodic array of groups of first features (422). A spacing (S1) between adjacent groups of first features is much greater than a dimension (CD) of the first features within each group. Due to the oblique illumination, the printed first features become distorted and/or displaced as a function of focus error. Second features 424 may be provided as a reference against which displacement of the first features may be seen. Measurement of this distortion and/or displacement may be by measuring asymmetry as a property of the printed pattern. Measurement can be done at longer wavelengths, for example in the range 350-800 nm.

Abstract: An exposure method for projecting a pattern on an exposure mask onto a work by an exposure control of an exposure light including calculating an exposure position on the work from a relative positional relationship of the exposure mask and the work, setting a range acceptable for projecting the pattern even when the exposure position is off a target exposure position on the work as an exposure position range, and (3) executing an exposure control that irradiates the exposure light to the exposure mask when the exposure position is in the exposure position range, and that stops the exposure light when the exposure position is out of the exposure position range.

Abstract: A mark forming method includes: forming recessed portion on a mark formation area of a substrate; coating the recessed portion with a polymer layer containing a block copolymer, allowing the polymer layer in the recessed portion to form a self-assembled area; selectively removing a portion of the self-assembled area; and forming a positioning mark by using the self-assembled area from which the portion thereof has been removed.

Abstract: A lithographic apparatus including a support to support a patterning device, a substrate table to hold a substrate, and a projection system to project a radiation beam patterned by the patterning device onto a target portion of the substrate. A transparent layer is provided to protect the pattering device. The apparatus further includes a transparent layer deformation-determining device to determine a deformation profile of the transparent layer, the deformation profile of the transparent layer expressing a deformation of the transparent layer during a scanning movement of the lithographic apparatus, and a compensator device which is configured to control the projection system, the substrate table and/or the support in response to the deformation profile of the transparent layer to compensate for the deformation of the transparent layer during the scanning movement of the apparatus.

Abstract: Methods are provided including obtaining at least one image of a surgical region of a subject oriented for the surgical procedure using an OCT imaging system. An initial structural view of the surgical region to be used during the surgical procedure is constructed based on the obtained at least one OCT image. Parameters are computed as an end point for assessing an outcome of the surgical procedure using data derived from the OCT image. The surgical procedure is periodically assessed and clinical outcomes are monitored using changes to the OCT-derived initial structural view of the surgical region or changes to the computed at least one clinical parameter. It is determined if the surgical plan needs modification and it is modified during the surgical procedure. Operations repeat until it is determined that no more modifications are needed.

Abstract: A detecting apparatus that detects a mark includes: an imaging device configured to perform imaging of the mark; and a controller configured to control the imaging device. The controller is configured to control the imaging device such that only a period in which a position of an object with the mark is within a tolerance is a period of the imaging before the position converges within the tolerance.