Abstract: To reduce deformations which may be caused by a functional coating on a substrate in an optical element for UV or EUV lithography, an optical element is suggested comprising a functional coating (46) on a first surface (42) of a substrate (41), wherein the substrate (41) comprises a second surface (43) having a common edge (45) with the first surface (42), and the second surface (43) also has a coating (47) and the thickness t2 and the stress ?2 of the coating (47) on the second surface (33, 43) are chosen such that, in combination with the thickness t1 and the stress ?1 of the functional coating (36, 46) on the first surface (32, 42), the condition t 1 · ? 1 t 2 · ? 2 = X is fulfilled, wherein X has a value between 0.8 and 5.0.

Abstract: An imaging optics has a plurality of mirrors to image an object field in an object plane into an image field in an image plane. At least one of the mirrors has a through opening for the passage of imaging light. An arrangement of the mirrors is such that principal rays run parallel or divergently in the beam path of the imaging light between the object plane and the first downstream mirror. The imaging optics can have an entrance pupil plane that lies in the beam path of the imaging light in the range of between 5 m and 2000 m in front of the object plane. The imaging optics can have an entrance pupil plane that lies in the beam path of the imaging light in the range of between 100 mm and 5000 mm in front of the object plane. Imaging optics with improved imaging quality are provided.

Abstract: An imaging optical system of the far pupil type, which is applicable to an exposure apparatus, is provided with six reflecting mirrors and forms an image of a first plane on a second plane. An incident pupil of the imaging optical system is positioned on a side opposite to the imaging optical system with the first plane intervening therebetween. A condition of ?14.3<(PD/TT)/R<?8.3 is fulfilled by a distance PD which is provided along an optical axis between the incident pupil and the first plane, a distance TT which is provided along the optical axis between the first plane and the second plane, and an angle of incidence R (rad) of a main light beam which comes into the first plane.

Abstract: An exposure apparatus projects a pattern of an original onto a substrate by a projection optical system to expose the substrate, wherein the projection optical system includes a mirror assembly, and the mirror assembly includes a first mirror member which has a first reflecting surface and is configured to bend an optical axis of the projection optical system, a second mirror member which has a second reflecting surface and is configured to bend the optical axis, a supporting mechanism configured to support the first mirror member and the second mirror member, and the supporting mechanism is positioned to position the first mirror member and the second mirror member while a positional relationship between the first mirror member and the second mirror member is maintained.

Abstract: An off-axis catadioptric projection optical systems for use in lithography tools for processing modulated light used to form an image on a substrate is provided. The optical system includes an off-axis mirror segment, a fold mirror, a relay, an aperture stop and a refractive lens group. Modulated light is transmitted through the system to form an image on a substrate. The projection system includes an off-axis mirror segment, an aperture stop and a refractive lens group. Alternatively, the projection system includes an off-axis mirror segment, a negative refractive lens group, a concave mirror, a relay, an aperture stop, and a refractive lens group.

Abstract: A mirror for the EUV wavelength range (1) having a layer arrangement (P) applied on a substrate (S), the layer arrangement having a periodic sequence of individual layers, where the periodic sequence has at least two individual layers—forming a period—composed respectively of silicon (Si) and ruthenium (Ru). Also disclosed are a projection objective for microlithography (2) including such a mirror, and a projection exposure apparatus for microlithography having such a projection objective (2).

Abstract: An optical element includes first regions which reflect or transmit the light falling on the optical element. The optical element also includes second regions which are in each instance separated by a distance from a first region and which at least partially surround a first region. The second regions are designed to be at least in part electrically conductive and are electrically insulated from the first regions. The optical element includes a carrier element and at least two first regions in the form of mirror facets which are arranged on the carrier element. The second regions are arranged with a separation from the mirror facets on the carrier element and are electrically insulated against the carrier element as well as against the mirror facet. At least one mirror facet is surrounded by an electrically conductive second region.

Abstract: A method and system for inspecting a semiconductor wafer. The method includes providing an illumination flux through a pattern plate and a lens to a surface of a specimen to project a pattern onto the surface of the specimen. The pattern is associated with the pattern plate. Additionally, the method includes detecting the illumination flux reflected from the surface of the specimen with a detector, processing information associated with the detected illumination flux, and generating a first image based on at least information associated with the detected illumination flux. The first image includes a first image part for the pattern and a second image part for the specimen. Moreover, the method includes adjusting the lens to a state in order to achieve a first predetermined quality for the first image part, and moving the specimen to a first position.

Abstract: In a light-transmitting mirror substrate having an axisymmetrical aspherical surface, a surface of the mirror substrate on a side opposite to the axisymmetrical aspherical surface is inclined with respect to an axis of symmetry of the axisymmetrical aspherical surface.

Abstract: Illumination devices of a microlithographic projection exposure apparatus, include a deflection device with which at least two light beams impinging on the deflection device can be variably deflected independently of one another by variation of the deflection angle in each case in such a way that each of the light beams can be directed onto at least one location in a pupil plane of the illumination device via at least two different beam paths; wherein, on the beam paths, at least one optical property of the respective light beam is influenced differently.

Abstract: A lithographic apparatus includes a radiation system having reflective optical elements constructed and arranged to condition a beam of radiation. The reflective optical elements include a first faceted mirror constructed and arranged to generate a plurality of source images on a second mirror. The lithographic apparatus also includes a facet mask constructed and arranged to selectively mask one or more of the facets of the first faceted mirror. The facet mask includes a masking blade selectively interposable into the beam.

Abstract: The invention concerns a method for the indirect determination of local irradiance in an optical system; wherein the optical system comprises optical elements between which an illuminated beam path is formed and a measurement object which absorbs the radiation in the beam path at least partially is positioned in a partial region of the beam path selected for the locally-resolved determination of the irradiance and the temperature distribution of at least one part of the measurement object is determined by means of a temperature detector.

Abstract: An object is to provide a projection optical system, for example, capable of improving the throughput of scanning exposure in application to scanning exposure apparatus. A projection optical system for forming an image of a first surface and an image of a second surface on a third surface comprises a first imaging optical system, a second imaging optical system, a third imaging optical system, a fourth imaging optical system, a fifth imaging optical system, a sixth imaging optical system, a seventh imaging optical system, a first folding member disposed between the third imaging optical system and the seventh imaging optical system, and a second folding member disposed between the sixth imaging optical system and the seventh imaging optical system.

Abstract: An exposure apparatus includes a first optical unit configured to condense light from a light source, a catoptric integrator configured to form plural secondary light sources using light from the first optical unit, the catoptric integrator including plural cylindrical reflection surfaces having the same generatrix direction, an aperture stop arranged perpendicular to the generatrix direction, and a second optical unit configured to superpose light from each secondary light source onto an illumination surface, wherein the catoptric integrator includes plural integrator parts each having plural cylindrical reflection surfaces, and the plural integrator parts are arranged in a direction perpendicular to the generatrix direction and to an arrangement direction of the cylindrical reflection surfaces and located at an incident side of the aperture stop.

Abstract: A reflection projection optical system projects a pattern positioned on an object plane onto an image plane via a mirror. The system has bilateral telecentricity on a side of the object plane and a side of the image plane, and has the object plane and the image plane positioned to be tilted with respect to a plane perpendicular to an optical axis of the system so as to satisfy a Scheimpflug condition.

Abstract: A catadioptric optical imaging system and method is provided, in which up to four (4) reticles are imaged to a single imaging location (e.g. for imaging substrates), in a manner designed to provide high throughput, with a relatively high resolution, and with substrates whose size may approach 450 mm.

Abstract: A system and method allow for a more effective synchronous scanning mirror (SSM). A lithography apparatus comprises an illumination system, a patterning device, a substrate table, and a projection system. The illumination system conditions a beam of radiation received from a radiation source operating at a first frequency. The patterning device patterns the beam. The substrate table supports and scans a substrate at a scanning velocity. The projection system includes a scanning device including a reflective device and a plurality of flexures. The plurality of flexures being configured to allow the reflective device to resonate about an axis of rotation. The scanning device is configured to scan the patterned beam onto a target area of the substrate The resonant frequency of the scanning device is substantially equal to the first frequency, and is synchronized with the scanning velocity.

Abstract: A projection objective of a projection exposure apparatus for microlithography serves for imaging an object arranged in an object plane onto a light-sensitive wafer in an image plane. The projection objective has a plurality of optical elements which have at least one reflective element and at least one refractive element. The plurality of optical elements lie, in the light propagation direction of the useful light, downstream of the reflective element on a common straight optical axis. The at least one reflective element has a substrate having at least one opening through which light beams can pass. The at least one reflective element is at least partly made from a material which suppresses stray light impinging on the reflective element rearward.

Abstract: An illumination system for illuminating a mask in a microlithographic exposure apparatus has an optical axis and a pupil surface. The system can include an array of reflective or transparent beam deflection elements such as mirrors. Each deflection element can be adapted to deflect an impinging light ray by a deflection angle that is variable in response to a control signal. The beam deflection elements can be arranged in a first plane. The system can further include an optical raster element, which includes a plurality of microlenses and/or diffractive structures. The beam deflection elements), which can be arranged in a first plane, and the optical raster element, which can be arranged in a second plane, can commonly produce a two-dimensional far field intensity distribution. An optical imaging system can optically conjugate the first plane to the second plane.

Abstract: In an illumination optical system, a light flux from a light source is made to come into a first fly's eye optical system, and an illumination area is illuminated, via a second fly's eye optical system and a condenser optical system, with light fluxes from a plurality of mirror elements which construct the first fly's eye optical system, wherein a reflecting surface of each of the mirror elements has a width in one direction narrower than a width of each of the mirror elements in a direction perpendicular to the one direction, and a reflectance distribution in the one direction of each of the mirror elements is trapezoidal. The intensity distribution of the illumination area can be set to be a nonuniform distribution, and respective points in the illumination area can be illuminated with the light fluxes having an approximately same aperture angle distribution.

Abstract: The disclosure relates to methods for producing mirrors, in particular facet mirrors, and projection exposure apparatuses equipped with the mirrors.

Abstract: An exposure system for manufacturing flat panel displays (FPDs) includes a reticle stage adapted to support a reticle. A substrate stage is adapted to support a substrate. A reflective optical system is adapted to image the reticle onto the substrate. The reflective optical system includes a primary mirror including a first mirror and a second mirror, and a secondary mirror. The reflective optical system has sufficient degrees of freedom for both alignment and correction of third order aberrations when projecting an image of the reticle onto the substrate by reflections off the first mirror, the secondary mirror, and the second mirror.

Abstract: There is provided a projection objective for a projection exposure apparatus that has a primary light source for emitting electromagnetic radiation having a chief ray with a wavelength?193 nm. The projection objective includes an object plane, a first mirror, a second mirror, a third mirror, a fourth mirror; and an image plane. The object plane, the first mirror, the second mirror, the third mirror, the fourth mirror and the image plane are arranged in a centered arrangement around a common optical axis. The first mirror, the second mirror, the third mirror, and the fourth mirror are situated between the object plane and the image plane. The chief ray, when incident on an object situated in the object plane, in a direction from the primary light source, is inclined away from the common optical axis.

Abstract: An optical carriage of scanner has a mirror assembly and a device assembly, the mirror assembly has a mirror mount, some mirror holder, and some supporters, and the device assembly has a chassis. In this invention, the mirror assembly and the device assembly are mechanically connected after separately formation. Further, to ensure correct shape of these mirror holders and these supporters, they could be formed by metal punch, plastic ejection, or plastic process.

Abstract: A positioning unit is configured to position an optical element in a barrel, and includes a holder configured to hold the optical element, a first intermediate plate mounted with the holder, a second intermediate plate configured to support the first intermediate plate, a plurality of drivers each configured to drive the second intermediate plate with respect to a plurality of axes, and each fixed inside of the barrel, and a positioning part configured to position the first intermediate plate relative to the second intermediate plate, wherein the second intermediate plate couples ends of the plurality of drivers with one another.

Abstract: A projection objective of a microlithographic projection exposure apparatus has a plurality of optical elements, for example lenses or mirrors. The objective furthermore includes an actuator for exerting a mechanical force that deforms a selected optical element of the projection objective. A manipulator modifies the spatial position of one of the optical elements as a function of the force exerted by the actuator.

Abstract: The disclosure relates to an optical device, such as for microlithography, that includes an optical module and a supporting structure. The disclosure also relates to an optical module that includes an optical element and a carrier structure for the optical element. the carrier structure can be connected to the optical element via at least one holding element. The carrier structure can be fixed to the supporting structure and produced, for example, from a material having a coefficient of thermal expansion ?<0.2*10?6K?1.

Abstract: A scanning exposure apparatus has plural projection optical systems having plural mirrors configured to form an optical-axis shift vector. Its component in a direction orthogonal to a scanning direction is set so that adjacent areas in plural areas on the original can adjoin each other when viewed from the direction orthogonal to the scanning direction and adjacent areas in plural areas on the substrate can adjoin each other when viewed from the direction. A size of its component in the scanning direction is set so that a product between the imaging magnification of each projection optical system and a distance between centers of two areas on the original in the scanning direction corresponding to two projection optical systems in the plurality of projection optical systems can be equal to a distance between centers of two areas on the substrate corresponding to the two projection optical systems in the scanning direction.

Abstract: There is provided a projection optical system for projecting a pattern on an object surface onto an image surface in a reduced size. The projection optical system includes six reflective surfaces that includes, in order of reflecting light from the object surface, a first reflective surface, a second convex reflective surface, a third convex reflective surface, a fourth reflective surface, a fifth reflective surface and a sixth reflective surface, and an aperture stop along an optical path between the first and second reflective surfaces.

Abstract: The present invention is directed to off-axis catadioptric projection optical systems for use in lithography tools for processing modulated light used to form an image on a substrate, such as a semiconductor wafer or flat panel display. In one embodiment the optical system includes an off-axis mirror segment, a fold mirror, a relay, an aperture stop and a refractive lens group. Modulated light is transmitted through the system to form an image on a substrate. In a second embodiment the projection system includes an off-axis mirror segment, an aperture stop and a refractive lens group. In a third embodiment the projection system includes an off-axis mirror segment, a negative refractive lens group, a concave mirror, a relay, an aperture stop, and a refractive lens group. A method to produce a device using a lithographic apparatus including a projection system with an off-axis mirror segment as the first element in a projection optics system is also provided.

Abstract: A projection objective of a microlithographic projection exposure apparatus has a plurality of optical elements, for example lenses or mirrors. The objective furthermore includes an actuator for exerting a mechanical force that deforms a selected optical element of the projection objective. A manipulator modifies the spatial position of one of the optical elements as a function of the force exerted by the actuator.

Abstract: A reflective optical element (1) for radiation with a wavelength ? in the ultraviolet wavelength range comprises a reflective surface (6), and a dielectric multilayer system (4) formed on the reflective surface (6) which comprises at least two successive pairs of layers (5.i, 5.i+1), each pair of layers (5.1 to 5.N) consisting of a high refractive index layer (H1 to HN) alternating with a low refractive index layer (L1 to LN), wherein the optical thicknesses (Hi, Hi+1) of the high refractive index layers (Hi, Hi+1) and the optical thicknesses (Li, Li+1) of the low refractive index layers (Li, Li+1) of each adjacent pair of layers (5.i, 5.i+1) are different from each other.

Abstract: Microlithography projection objectives for imaging into an image plane a pattern arranged in an object plane are described with respect to suppressing false light in such projection objectives.

Abstract: An off-axis catadioptric projection optical systems for use in lithography tools for processing modulated light used to form an image on a substrate is provided. In one embodiment the optical system includes an off-axis mirror segment, a fold mirror, a relay, an aperture stop and a refractive lens group. Modulated light is transmitted through the system to form an image on a substrate. In a second embodiment the projection system includes an off-axis mirror segment, an aperture stop and a refractive lens group. In a third embodiment the projection system includes an off-axis mirror segment, a negative refractive lens group, a concave mirror, a relay, an aperture stop, and a refractive lens group. A method to produce a device using a lithographic apparatus including a projection system with an off-axis mirror segment as the first element in a projection optics system is also provided.

Abstract: There is provided a projection objective for a projection exposure apparatus that has a primary light source for emitting electromagnetic radiation having a chief ray with a wavelength ?193 nm. The projection objective includes an object plane, a first mirror, a second mirror, a third mirror, a fourth mirror; and an image plane. The object plane, the first mirror, the second mirror, the third mirror, the fourth mirror and the image plane are arranged in a centered arrangement around a common optical axis. The first mirror, the second mirror, the third mirror, and the fourth mirror are situated between the object plane and the image plane. The chief ray, when incident on an object situated in the object plane, in a direction from the primary light source, is inclined away from the common optical axis.

Abstract: An exposure apparatus illuminates a pattern on a first object with an illuminating beam to expose an area to be exposed on a second object with a pattern image. The exposure apparatus includes a scanning apparatus that scans the first object in a prescribed scanning direction with the illuminating beam, and an optical guiding device that guides the illuminating beam which has scanned the first object onto the area to be exposed on the second object.

Abstract: An illumination optical apparatus of the present invention includes an illumination optical system having a plurality of reflection mirrors arranged to guide illumination light flux to an irradiated plane. A first partial field stop is arranged in an optical path of the illumination optical system to form a first profile line of an illumination region that is to be formed on the irradiated plane. A second partial field stop is arranged between the illumination optical system and the irradiated plane to form a second profile line of the illumination region. The illumination optical system includes a relay optical system for substantially optically conjugating the position of the first partial field stop and the position of the second partial field stop.

Abstract: A lithographic apparatus includes an illumination system configured to condition a radiation beam; a support configured to support a patterning device, the patterning device being configured to impart the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table configured to hold a substrate; and a projection system configured to project the patterned radiation beam onto a target portion of the substrate, wherein the radiation beam is reflected from at least one grazing incidence mirror that enhances the spectral purity of the radiation beam.

Abstract: An illumination optical apparatus is able to quickly perform switching of illumination conditions between illumination in a first region and illumination in a second region. The illumination optical apparatus of the present invention to illuminate an illumination target surface on the basis of light from a light source comprises: a path switching member arranged in an optical path between the light source and the illumination target surface and switching an optical path of an exiting beam between a first optical path and a second optical path; a path combining member combining the first optical path and the second optical path; a first pupil distribution forming member arranged in the first optical path and forming a predetermined light intensity distribution on an illumination pupil; and a second pupil distribution forming member arranged in the second optical path and forming a predetermined light intensity distribution on the illumination pupil.

Abstract: A device manufacturing method includes conditioning a beam of radiation using an illumination system. The conditioning includes controlling an array of individually controllable elements and associated optical components of the illumination system to convert the radiation beam into a desired illumination mode, the controlling including allocating different individually controllable elements to different parts of the illumination mode in accordance with an allocation scheme, the allocation scheme selected to provide a desired modification of one or more properties of the illumination mode, the radiation beam or both. The method also includes patterning the radiation beam having the desired illumination mode with a pattern in its cross-section to form a patterned beam of radiation, and projecting the patterned radiation beam onto a target portion of a substrate.

Abstract: Illumination systems are disclosed that illuminate a surface M for irradiation with illumination light emitted from a light source 5. An exemplary illumination system includes an incidence-side reflection-type fly-eye optical system 12 having multiple reflection-type partial optical systems arranged in rows, an emission-side reflection-type fly-eye optical system 14 having multiple reflection-type partial optical systems arranged in rows and corresponding to respective reflection-type partial optical systems of the incidence-side reflection-type fly-eye optical system 12, and a condensing optical system including two reflecting mirrors 18, 20 that guide illumination light, reflected by the emission-side reflection-type fly-eye optical system 14, to the surface M. The center of curvature of at least one of the reflecting mirrors is optically eccentric with respect to a normal to the surface for irradiation at the center of the illuminated region.

Abstract: A lithographic apparatus that includes a reflector configured to reflect a cleaning beam of radiation projected through a projection system onto an underside of a liquid retrieval system is disclosed. The construction of the reflector is also disclosed as is a method for irradiating the underside of a liquid supply system for use in cleaning.

Abstract: A projection exposure apparatus for microlithography is disclosed. The apparatus can include a radiation source to generate illumination radiation and a reticle holder to receive a reticle in an object plane. The apparatus can further include illumination optics to guide the illumination radiation to an object field, which is to be illuminated, in the object plane. The apparatus can also include a wafer holder to receive a wafer in an image plane and projection optics to image the object field into an image field in the image plane. The radiation source and projection optics can be arranged in separate chambers (e.g., one above the other). The chambers can be separated by a wall. There can be an illumination radiation leadthrough in the wall. In some embodiments, the projection exposure apparatus can guide the illumination radiation with low loss.

Abstract: The invention relates to an illumination unit for point illumination of a medium comprising a plurality of light emitters in the form of light guides, which are arranged to illuminate at least one illumination face via a light valve arrangement, said light valve arrangement comprising a plurality of electrically controlled light valves, at least one of the light emitters (1) being arranged to illuminate a plurality of light valves.

Abstract: The present invention relates to a projection exposure apparatus that forms predetermined patterns onto a substrate. The projection exposure apparatus for forming patterns onto a substrate, which includes a mask-stage for holding a photo-mask having predetermined patterns thereon, a light source for emitting a light ray containing spectral lines including g, h, i and j-lines, a wavelength selector for selecting a light ray containing predetermined spectral lines from the light ray emitted from the light source, an illumination optical system for irradiating the photo-mask with the selected light ray, an Offner type projection system for projecting the light having passed through the photo-mask onto the substrate, a substrate stage including a vacuum portion for holding the substrate, the substrate stage for positioning the substrate, and a light-shielding body for partially blocking the light irradiated to the substrate.

Abstract: An exposure apparatus includes a first exposure apparatus used for exposing a peripheral portion of a wafer in maskless manner, the first exposure apparatus including a light source configured to emit light, a stage on which the wafer is to be placed, and a light controller configured to control the light emitted from the light source and irradiated onto a peripheral portion of the wafer placed on the stage, the light controller controlling at least one of shape, size and coverage on the wafer of the light emitted from the light source.

Abstract: Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.

Abstract: There is provided an optical module for an objective. The optical module includes (a) a first holding device with an inner circumference, which extends in a first circumferential direction, (b) at least one first supporting device for supporting a first optical element and being fixed at said inner circumference of said first holding device, (c) an annular circumferential first assembly space being defined by displacing said first supporting device once in a revolving manner along said first circumferential direction, (d) at least one second supporting device being provided for supporting a second optical element and being fixed at said inner circumference of said first holding device, and (e) an annular circumferential second assembly space being defined by displacing said second supporting device once in a revolving manner along said first circumferential direction. The first assembly space intersects the second assembly space.

Abstract: An irradiating apparatus includes a support member and a reflector supported by the support member to define a concave light energy reflector surface. A light source of radiating energy is disposed generally at the source focal point of the reflector. The support member has a passage for cooling air to flow therethrough and openings for distributing the cooling air to the apparatus. The support member, thereby, performs a dual function of supporting the reflector as well as providing a manifold for the cooling air.

Abstract: The present invention provides a scanning device. The scanning device comprises a document plate for placing a document, at least a sliding guide placed at one side of the document plate, a scanning module which is in front of the document plate for scanning the document along the direction of the sliding guide, a first light source assembled in the scanning module for providing light to scan documents, and a driving module electrically connected to the scanning module for driving the scanning module to perform scanning procedure to the document.