Abstract: A management system and method of a reticle in an exposing process are disclosed. A calculator calculates an accumulated dosage of an illuminating light irradiated onto a reticle used in a photolithography process. The calculator is connected to an exposing apparatus to expose photoresist on a semiconductor substrate. A comparator compares the calculated accumulated dosage with a preset reference dosage. When the calculated accumulated dosage is greater than or equal to the reference dosage, a controller suspends the photolithography process. Minimizing haze contamination on the reticle, thus preventing process failures.

Abstract: In order to perform a measurement operation of a pattern and a processing operation in parallel while the positions of two substrate stages are accurately measured and wire/hose units are prevented from becoming tangled, a substrate processing apparatus includes an alignment system for measuring the pattern arrangements of the substrates, a processing system disposed separately from the alignment system and used for processing the substrates, substrate stages which are able to support the substrates and move in an xy plane, and position measurement systems which measure the positions of the substrate stages. Four position measurement systems are arranged for the measurement in the x direction, and three position measurement systems are arranged for the measurement in the y direction. One of the position measurement systems for the measurement in the y direction is disposed at a side opposite to the remaining positioning measurement systems across the substrate stages.

Abstract: Disclosed is a scan type exposure apparatus for exposing a substrate, placed on an exposure plane, to a pattern of a mask with light from a light source. In one preferred embodiment, the apparatus includes a stop member for restricting an exposure range on the exposure plane, a measuring system for measuring an illuminance distribution which is produced on a predetermined plane displaced from the exposure plane in an optical axis direction and by a predetermined amount and which is provided by light passed through an opening of the stop member and projected or to be projected at a predetermined position on the exposure plane, and a calculating device for calculating an angular characteristic of light projected or to be projected on the exposure plane, on the basis of integrating illuminance distributions which are defined by lights incident at plural positions along a scan direction upon the exposure plane and which are measured by the measuring system.

Abstract: A radiation system includes a radiation generator to generate radiation, a source, and an illumination system configured to receive the radiation and provide a beam of radiation. The illumination system includes a beam measuring system configured measure at least one of position and tilt of the beam of radiation relative to the illumination system and a projecting device configured to redirect only a part of a cross section of the beam of radiation to the beam measuring system. The beam measuring system may include several position sensors, the readouts of which can be used to determine incorrect alignment of the radiation source with respect to the illumination system. Diaphragms are connected to the collector of the radiation generator, so that in addition to X, Y, and Z corrections, Rx, Ry and Rz corrections are possible.

Abstract: In order to perform a measurement operation of a pattern and a processing operation in parallel while the positions of two substrate stages are accurately measured and wire/hose units are prevented from becoming tangled, a substrate processing apparatus includes an alignment system for measuring the pattern arrangements of the substrates, a processing system disposed separately from the alignment system and used for processing the substrates, substrate stages which are able to support the substrates and move in an xy plane, and position measurement systems which measure the positions of the substrate stages. Four position measurement systems are arranged for the measurement in the x direction, and three position measurement systems are arranged for the measurement in the y direction. One of the position measurement systems for the measurement in the y direction is disposed at a side opposite to the remaining positioning measurement systems across the substrate stages.

Abstract: A photosensor detecting light-emission quantity from a light-emission lamp is set up, in order to regulate the current supplied with the light-emission lamp from a power according to a light-quantity detecting signal from the photosensor, so as to make the light-emission quantity from the light-emission lamp constant. Projected light-quantity onto a movie film is regulated and an image obtained from a shooting section becomes an image having a good quality with a little flicker.

Abstract: In a lithographic apparatus the angle dependence of the intensity distribution of a projection beam at a substrate is controlled. A beam splitter is located in the beam near a pupil plane. The beam splitter splits off an auxiliary beam, which is used to measure information about the spatial intensity distribution of the beam at the pupil plane. The measured position dependence in the auxiliary beam may be decontrolled using boundary conditions inherent to the illuminator to compensate for offset between the pupil plane and a detection element. The measured position dependence may be used to control parameters of an optical element that manipulates the position dependence in the pupil plane. An example of such an optical element is a matrix of elements that controllably steer the direction of parts of the beam. Thus a continuous feedback loop may be realized.

Abstract: A light energy inspecting apparatus provides an optimum exposure condition in photolithographic apparatus by sensing the energy levels of light passing through the aperture of a diaphragm. The light energy inspecting apparatus includes a photoelectric transformation unit, a drive mechanism for the photoelectric transformation unit, and a controller. The photoelectric transformation unit is made up of a plurality of photoelectric transformation devices (PTDs) which can each sense the level of energy of incident light and convert the incident light to a corresponding electric signal. The drive mechanism positions the photoelectric transformation unit relative to the diaphragm.

Abstract: A method forms a feature pattern on a substrate by exposing the substrate, using a mask having a pattern of features thereon, with illumination having a first set of settings. The substrate is exposed a second time, using the same mask having the pattern of features thereon, with illumination having a second set of settings. The mask having the pattern of features thereon remains stationary between the two illumination exposures of the substrate.

Abstract: The mask-less lithography system has a converter that includes an array of light controllable electron sources. Each electron source is arranged for converting light into an electron beam and has an activation area. Individually controllable light sources are included where each light source is arranged for activating one electron source. A Controller controls each light source individually and each electron beam is focused on an object plane with a diameter smaller than the diameter of an individually controllable light source.

Abstract: A luminous source apparatus, an image projecting apparatus, and an image projection converting apparatus to prevent a projected image, or an electronic image obtained through electronization of the projected image from intensity variations. A photosensor detects the light-emission quantity from a light-emission lamp in order to regulate the current supplied with the light-emission lamp according to a light-quantity detecting signal from the photosensor, so as to make the light-emission quantity from the light-emission lamp constant. Projected light-quantity onto a movie film is regulated and an image obtained from a shooting section becomes an image having a good quality with a little flicker.

Abstract: A film-processing method according to the present invention includes: a processing step of irradiating electron beams onto a film on a surface of an object to be processed to conduct a process to the film; an electric-current measuring step of capturing the electron beams in a vicinity of the object to be processed to measure an electric-current value during the processing step; and a detecting step of detecting an end point of the process to the film, based on an amount of electron obtained by means of a time integration of the electric-current value. According to the present invention, a suitable irradiation of the electron beams onto the film on a surface of the object to be processed can be realized. Thus, a suitable film quality can be obtained.

Abstract: An illumination optical system for illuminating a reticle using light from a light source includes an illumination-light generating mechanism for generating a light amount distribution on a plane that has a substantially Fourier conversion relationship with the reticle while making variable a ratio of a light amount between a first area and a second area different from the first area, the first and second areas being on the plane.

Abstract: A scan type exposure apparatus wherein a pattern of an original is lithographically transferred to a substrate sequentially while the original and the substrate are scanningly moved relative to exposure light, the apparatus including a photodetector disposed at a position optically conjugate with the original, and a storing device for storing correction information with respect to an output of the photodetector, in relation to different positions of the original to be illuminated with the exposure light, such that, in the lithographic pattern transfer, the output of the photodetector can be corrected by use of the correction information.

Abstract: An exposure apparatus which has a light source and transfers a pattern of an original to a substrate using light supplied from the light source includes a photoelectric sensor used to control an amount of light to which the substrate is exposed, a memory storing a first value for correcting an output value of the photoelectric sensor with respect to each accumulated energy of light, having a first power, with which the photoelectric sensor is irradiated, a calculator which calculates a second value for correcting an output value of the photoelectric sensor corresponding to a second accumulated energy of light, having a second power, with which the photoelectric sensor is irradiated, based on the first value in the memory corresponding to the second accumulated energy, and a ratio of the second power to the first power, and a correction unit which corrects an output value of said photoelectric sensor using the second value.

Abstract: In order to perform a measurement operation of a pattern and a processing operation in parallel while the positions of two substrate stages are accurately measured and wire/hose units are prevented from becoming tangled, a substrate processing apparatus includes an alignment system for measuring the pattern arrangements of the substrates, a processing system disposed separately from the alignment system and used for processing the substrates, substrate stages which are able to support the substrates and move in an xy plane, and position measurement systems which measure the positions of the substrate stages. Four position measurement systems are arranged for the measurement in the x direction, and three position measurement systems are arranged for the measurement in the y direction. One of the position measurement systems for the measurement in the y direction is disposed at a side opposite to the remaining positioning measurement systems across the substrate stages.

Abstract: A wafer edge exposure apparatus is provided with an optical section for radiating exposure light onto the edge of a semiconductor wafer. The optical section is provided with a focus sensor for sensing a distance from the lower end of the optical section to the edge of the semiconductor wafer. There is provided a position control mechanism for moving the optical section vertically on the basis of a value detected by the focus sensor such that the distance matches a focal distance of the optical section.

Abstract: A lithographic apparatus is provided that has an aperture, a detector configured to detect an intensity of a radiation beam directed through the aperture and a processor configured to vary the intensity of the radiation beam through the aperture by a relative movement of the radiation beam and the aperture and to calculate a beam size of the radiation beam from the detected intensity and relative movement. Alternatively or in addition, a lithographic apparatus may include a focusing element configured to focus a part of a radiation beam in a focus plane, an aperture arranged in the focus plane of the focusing element, a detector configured to detect an intensity of the part of the radiation beam through the aperture, and a processor configured to vary the intensity of the radiation beam through the aperture by a change in a pointing direction of the radiation beam and to calculate a beam divergence of the radiation beam from the detected intensity and pointing direction.

Abstract: A projection exposure apparatus includes a projection optical system arranged to project a pattern onto a substrate, a holding portion arranged to hold an optical element which propagates light toward the projection optical system, a mask having a transmission portion and being disposed on or near an image plane or object plane of the projection optical system or a plane conjugate to the image plane and the object plane, an actuator arranged to drive the mask along a plane of an image of the optical element formed by the projection optical system, and a measurement device arranged to measure an intensity of light while the mask is driven. The light emerges from the optical element, and passes through the projection optical system and the transmission portion of the mask.

Abstract: A predictive method is used to compensate for intermediate batch sensitivities which inevitably occur during resist batch changeover. The compensation is applied to historical dose levels to arrive at a new dose level estimating an optimum dose. When the system discovers that a new batch of resist is loaded to a tool, historical data is used to calculate a reference dose for each tool. A batch factor is continuously calculated and using historical data along with the batch factor, a dose adjustment is made to maintain proper image size.

Abstract: A system for processing a multilayer liquid crystal film display material, with multiple irradiation apparatus (60) for applying a zone of polarized UV irradiation onto a substrate fed from a web (16) with incident light at a desired angle. Each irradiation apparatus (60) includes a UV light source (64), and one or more optional filters (82). A polarizer 90 is provided, sized and arranged to polarize light over the web (16) as it moves. The irradiation apparatus (60) employs an array of louvers (81) and/or a prism array (72). One irradiation apparatus (60) irradiates a first LPP1 layer (22) at a 0-degree alignment, in the web movement direction, the other irradiation apparatus (60) irradiates an LPP2 layer (26) with an orthogonal 90-degree alignment.

Abstract: A photolithography process with multiple exposures is provided. A photomask is placed and aligned above a wafer having a photoresist formed thereon at a predetermined distance. Multiple exposures are sequentially performed on the photoresist through the photomask. Each of the multiple exposures is provided with a respective illuminating setting that is optimized for one duty ratio of the photomask. Thereby, an optimum through-pitch performance for pattern transfer from the photomask unto the photoresist is obtained. Then, a development is performed on the photoresist.

Abstract: EUV exposure apparatus for transferring a pattern on a reticle to a wafer, includes an illumination optical system having a plurality of illumination system mirrors for directing EUV light to the reticle, and a projection optical system having a plurality of projection system mirrors for directing reflection light from the reticle to the wafer. In the illumination optical system, a reflection-type optical integrator is arranged to form a plurality of light source images with the light from the light source. The optical integrator has a pinhole to branch a part of the EUV light to an EUV-light intensity detector. A controller controls the amount of exposure based on the intensity of EUV light detected by the EUV-light intensity detector. In this manner, precision in measuring the intensity of exposure light is improved, and compensation control of the amount of exposure is appropriately performed.

Abstract: An exposure amount control method includes steps of illuminating an original with exposure light, emitted from a light source, through one or more light intensity uniforming optical systems, so that a pattern of the original illuminated is projected and printed on a substrate, measuring, by use of a first illuminance sensor, and illuminance of the exposure light as branched at a light source of the or one of the light intensity uniforming optical systems which is closest to the original, controlling an exposure amount of the substrate on the basis of a measurement output of the first illuminance sensor, measuring, by use of a second illuminance sensor, an illuminance at a position substantially conjugate with the substrate, and calibrating an output of the first illuminance sensor on the basis of a measurement output of the second illuminance sensor.

Abstract: An image processing method to conduct an image processing on image signals indicating an image obtained through photographing by a photographing apparatus for generating image signals for output. The image processing method has a determining process to determine a content of image processing to be conducted on the image signals based on information about environment light in the course of photographing, information about flashlight in the course of photographing, and on at least one of information about zoom magnification in the course of photographing and information about ISO speed.

Abstract: An exposure apparatus comprising a light source which emits a light including a main light having a wavelength to expose a substrate and sub light having a different wavelength from that of the main light collaterally generated in accordance with an oscillation of the main light, a main optical system which introduces a light from the light source to the substrate via the mask, a light sensor having sensitivity to a wavelength including the main light, and a separation device disposed an a light path from the light source to the light sensor, the separation device separating the main light and the sub light.

Abstract: A light receiving apparatus, a mark detecting apparatus or the like, which can generate an image with high accuracy without changing oscillation frequency of an oscillating unit, permit increased accuracy of measurement and reduction of measurement time and contribute to improvement of throughput, include a unit for obtaining storage time when light is received by a CCD camera 8 which is a storage-type position sensor and pulse light emitting frequency of a pulse light emitting apparatus 14 from a cycle of the oscillating unit 7 and predetermined number of pulses of the pulse light emitted from the pulse light emitting apparatus 14 to start storage of the CCD camera 8 and emit the pulse light from the pulse light emitting apparatus 14 by the obtained pulse light emitting frequency.

Abstract: In a method of producing an optical imaging system, for example a projection objective for microlithography, which has a plurality of optical elements, the imaging system is initially assembled and adjusted. In the process, at least one optical surface located in the vicinity of a pupil surface of the imaging system remains uncoated. During a subsequent measurement of the imaging system, for example using shearing interferometry, the wavefront errors in the exit pupil or an area conjugate therewith belonging to the imaging system are determined in a specially resolving manner. The optical element which has the correction surface is held in a separate mount and, following the measurement, is removed together with the mount. On the basis of the measurement, a topography and/or refractive index distribution of the correction surface which is required to compensate for the wavefront errors determined during the measurement is calculated.

Abstract: An image reader for optically reading an image on an original and an image sensor unit for mounting to the image reader. The image sensor unit is provided with a shaft used for rotatably mounting the image sensor unit to an image sensor unit holding member of the image reader. This reduces the size of the image reader.

Abstract: It is an object of this invention to accurately correct an output variation due to a change in temperature of a photoelectric sensor. An exposure apparatus includes a photoelectric sensor (13, 15) for controlling exposure of a wafer, a memory (21) that stores the output variation characteristic of the photoelectric sensor (13, 15) with respect to the quantity of light with which the photoelectric sensor is irradiated, a calculator (22) that calculates the output variation amount of the photoelectric sensor (13, 15) on the basis of the quantity of the light with which the photoelectric sensor (13, 15) is irradiated, the energy per unit time of the light, and the output variation characteristic stored in the memory (21), and a compensator (23) that corrects an output from the photoelectric sensor (13, 15) on the basis of the output variation amount calculated by the calculator (22).

Abstract: An illumination system comprises (a) a first optical element upon which a light beam impinges, where the first optical element has first raster elements that partition said light beam into light channels; (b) a second optical element that receives said light channels, where the second optical element has a second raster elements; (c) an object plane that receives said light channels via said second optical element; and (d) an exit pupil that is provided with an illumination via said object plane. The system is characterized by an assignment of a member of said first raster elements and a member of said second raster elements to each of said light channels to provide a continuous beam path from said first optical element to said object plane for each of said plurality of light channels. The assignment is changeable to provide an adjustment of said illumination in said exit pupil.

Abstract: A lithographic apparatus is provided that has an aperture, a detector configured to detect an intensity of a radiation beam directed through the aperture and a processor configured to vary the intensity of the radiation beam through the aperture by a relative movement of the radiation beam and the aperture and to calculate a beam size of the radiation beam from the detected intensity and relative movement. Alternatively or in addition, a lithographic apparatus may include a focusing element configured to focus a part of a radiation beam in a focus plane, an aperture arranged in the focus plane of the focusing element, a detector configured to detect an intensity of the part of the radiation beam through the aperture, and a processor configured to vary the intensity of the radiation beam through the aperture by a change in a pointing direction of the radiation beam and to calculate a beam divergence of the radiation beam from the detected intensity and pointing direction.

Abstract: A measurement system configured to measure wave front aberrations of a projection system, as well as a lithographic apparatus including such a measurement system, is provided wherein the measurement system includes a diffractive element and structure configured to increase the pupil filling of the radiation in the pupil of the projection system, both movable into the projection beam between a radiation system and the projection system, and a sensor module configured to sense radiation that has traversed the projection system to measure wave front aberrations of the projection system.

Abstract: In a photography method, a determination is made that a set of captured images includes one or more encoded captured images having a partial shading encodement. The encodement has a predetermined edge pattern and is disposed within a predetermined subarea of an image. An encoded captured image is digitized to provide a digital image having a plurality of pixels. A plurality of pixel templates of an edge pattern and the pixels in the subarea of the digital image are convolved to provide a plurality of template position metrics. Each pixel template has the same shape. Each pixel template is differently located in said subarea. The highest of the template position metrics and a predetermined threshold template position metric value of the edge pattern are compared. The digital image is digitally modified when said highest template position metric matches the threshold template position metric value.

Abstract: An illumination optical apparatus (14-40) and exposure apparatus (10) provided with the illumination apparatus, capable of employing a high-output light source. The illumination apparatus comprises, in order along an optical axis, a light source (14) capable of providing a primary light beam (B) having a cross-section, a condenser optical system (30) to condense the primary light beam so as to form a convergence point (F) adjacent the condenser optical system, a light-pipe optical integrator (160) having a rectangular cross-sectional shape with a first side of length dx, a second side of length dy, and a most light-source-wise incident surface (160a) axially spaced from the convergence point by a spacing (L2). The integrator is capable of forming a plurality of secondary light sources and corresponding secondary light beams (B′) from the primary light beam. Adjacent the integrator is an imaging optical system (40) to converge the primary and secondary light beams to illuminate the illumination surface.

Abstract: A predictive method is used to compensate for intermediate batch sensitivities which inevitably occur during resist batch changeover. The compensation is applied to historical dose levels to arrive at a new dose level estimating an optimum dose. When the system discovers that a new batch of resist is loaded to a tool, historical data is used to calculate a reference dose for each tool. A batch factor is continuously calculated and using historical data along with the batch factor, a dose adjustment is made to maintain proper image size.

Abstract: A photolithography exposure apparatus exposes a substrate to a pattern image formed on a mask to transfer the pattern onto the substrate. The apparatus includes a substrate stage on which the substrate is mounted. The substrate stage together with the substrate is movable when the substrate is being exposed to the pattern image. A memory stores pattern image distortion information generated in accordance with an exposure position on the substrate when the pattern image is being transferred onto the substrate. A compensator compensates for the distortion so that the pattern is formed cleanly on the substrate.

Abstract: An exposure apparatus and an exposure method according to the present invention comprise an average illuminance operation unit for averaging illuminance values obtained from four illuminance meters provided on a stage and obtaining average illuminance and a light exposure control unit controlling a light exposure on the basis of information obtained from the average illuminance operation unit. Thus, an exposure apparatus and an exposure method capable of correctly managing the light exposure can be provided.

Abstract: An apparatus for stacking a predetermined number of X-ray films has a sheet member holding device disposed above a stacking position for temporarily holding at least a first X-ray film, and an actuating device for displacing the sheet member holding device from the stacking position to drop the X-ray film held by the sheet member holding device into the stacking position. The apparatus is capable of stacking a plurality of X-ray films highly accurately and efficiently in the stacking position while avoiding damage to the X-ray films.

Abstract: Single-stage projection systems typically have a twice-folded optical path, with mask leg, crossover, 1:1 projection lens system, and substrate leg. They offer seamless patterning of large microlithographic substrates by overlapping complementary small-field scanning. A reverser maintains mask/substrate pattern congruence despite optical reversal, but presents the requirement of large working distance to permit access to the scanning stage. The required working distance demands large-diameter lens elements which are expensive in materials, grinding and assembly. A high-resolution 1:1 projection lens, for high-fluence laser light, adds extreme expense. Dividing the projection lens into two distributed-part-lenses, in mask and substrate legs, maintains satisfactory working distance, minimizes lens diameter requirements, and thus cuts cost. The aperture stop is positioned at the midpoint of the optical path, preferably at the time of manufacture, by an auxiliary stage.

Abstract: An system and method that expand emitted light from a laser beam without changing spatial coherence or producing speckle. The system includes a laser source and an optical projection system having a multiplexing device. The multiplexing device expands light emitted by laser source into plural beams having light intensity about equal to each other without changing spatial coherence. The multiplexing device has a plurality of spatially separated beam splitters positioned parallel to and on a same side of a mirror. The system further includes an illuminating optical system that focuses each of the plural beams and a projection optical system that projects an image of a mask illuminated with light output from illuminating optical system onto a substrate.

Abstract: The mask guiding device of the present invention has a mask guiding device that guides a substrate received from the outside. The mask guiding device is provided with a plurality of receiving portions that receives said mask from the outside.

Abstract: A predictive method is used to compensate for intermediate batch sensitivities which inevitably occur during resist batch changeover. The compensation is applied to historical dose levels to arrive at a new dose level estimating an optimum dose. When the system discovers that a new batch of resist is loaded to a tool, historical data is used to calculate a reference dose for each tool. A batch factor is continuously calculated and using historical data along with the batch factor, a dose adjustment is made to maintain proper image size.

Abstract: A pattern of a reticle is irradiated with excimer laser light to expose an image of the pattern of the reticle onto a wafer through a projection optical system. Driving elements for driving optical elements in the projection optical system and a transfer mechanism for transferring a pupil filter into the projection optical system are covered by covers to isolate the inside of the projection optical system from its outside. During exposure, helium gas is supplied to the inside of the projection optical system with a purity and a temperature of the helium gas being continuously monitored and the purity and the temperature of the helium gas in the projection optical system being maintained within a predetermined tolerance range based upon the monitored results.

Abstract: A condenser for a photolithography system, in which a mask image from a mask is projected onto a wafer through a camera having an entrance pupil, includes a source of propagating radiation, a first mirror illuminated by the radiation, a mirror array illuminated by the radiation reflected from said first mirror, and a second mirror illuminated by the radiation reflected from the array. The mirror array includes a plurality of micromirrors. Each of the micromirrors is selectively actuatable independently of each other. The first mirror and the second mirror are disposed such that the source is imaged onto a plane of the mask and the mirror array is imaged into the entrance pupil of the camera.

Abstract: A projection exposure apparatus includes an illumination optical system for illuminating a pattern of a reticle with laser light from a continuous emission excimer laser, a projection optical system for projecting the illuminated pattern onto a substrate, wherein the projection optical system includes a lens system being made of a substantially single glass material, a wavelength detecting device for detecting a wavelength of the laser light from the excimer laser and for producing an output, and a displacing device for shifting a mirror for resonance of the excimer laser, in an optical axis direction of the excimer laser, on the basis of the output of the wavelength detecting device.

Abstract: Optical exposure apparatus and methods of using same, for patterning a workpiece and photo-cleaning the optical components in the apparatus, which can be contaminated by moisture and organic compounds in the atmosphere. The apparatus comprises an illumination optical system having a light source and one or more optical components, and a projection lens having an object plane and an image plane and one or more optical components. The optical exposure apparatus includes an exposure optical path or an exposure light beam through a predetermined space in the optical exposure system. An optical path deflection member for deflecting light is introduced into the exposure optical path so as to create a second optical path that differs from the exposure optical path. Also disclosed is a method of photo-cleaning the aforementioned optical components, including the steps of forming an exposure optical path and then changing this path to create a second optical path that differs from the exposure optical path.

Abstract: An illumination optical system for illuminating a reticle using light from a light source includes an illumination-light generating mechanism for generating a light amount distribution on a plane that has a substantially Fourier conversion relationship with the reticle while making variable a ratio of a light amount between a first area and a second area different from the first area, the first and second areas being on the, plane.

Abstract: A system and method are provided for microlithographic writing on photosensitive substrates, and especially high precision printing of patterns, such as photomasks, for semiconductor device patterns, display panels, integrated optical devices and electronic interconnect structures. The method includes the steps of detecting significant temporary writing error conditions and interrupting the writing process as a response to a detection of such an error condition. Thereafter a support table is reversed to the position it had when the writing was interrupted, and the writing process is restarted at the same position where the writing was interrupted when the error condition ceases to exist.

Abstract: In order to provide a lithography exposure device for producing exposed structures in a layer sensitive to light, comprising an exposure unit with a movement unit for the relative movement between the optical focusing means and a mounting device and a control for controlling intensity and position of the exposure spots in such a manner that a plurality of conversion areas can be produced in the light-sensitive layer by means of the exposure spots, with which work can be carried out with a reduced number of laser radiation sources, it is suggested that with the exposure spot of each laser radiation source all the conversion areas located within a strip area, which has a width amounting to a multiple of the extension of the exposure spot, be generatable within the same due to movement of the exposure spot in a deflection direction extending transversely to the exposure movement direction and that a controllable deflection device be provided between the laser radiation sources and the optical focusing means for