Abstract: An inspection apparatus inspecting a wafer on which a plurality of patterns are formed by a plurality of exposure shots, the inspection apparatus comprising: acquisition unit configured to acquire first information representing a positional relation between an inspection mark included in a pattern formed by a first exposure shot and an inspection mark included in a pattern formed by a second exposure shot, and second information representing a positional relation between the inspection mark included in the pattern formed by the second exposure shot and an inspection mark included in a pattern formed by a third exposure shot; and derivation unit configured to derive a linear component of an error caused by a reticle, and a linear component of an error caused by a position of a wafer, on the basis of the first information and the second information.

Abstract: A position measurement system including a first interferometer and a second interferometer arranged to determine a distance of the object in a first direction when the object is in a first measurement area by emitting beams onto a target surface of the object. The position measurement system further has a third interferometer and a fourth interferometer arranged to determine a distance of the object in the first direction when the object is in a second measurement area by emitting beams onto the target surface of the object. An arrangement of relative positions in a second direction of beams spots impinging on the target surface from the beams emitted by the first and second interferometers is different from an arrangement of relative positions in the second direction of beams spots impinging on the target surface from the beams emitted by the third and fourth interferometers.

Abstract: A multi-channel device and method for measuring the distortion and magnification of objective lens. The multi-channel device for measuring the distortion and magnification of objective lens comprises an illumination system, a reticle stage, a test reticle, a projection objective lens, a wafer stage and a multi-channel image plane sensor, wherein the multi-channel image plane sensor simultaneously measures the image placement shifts between actual image points and nominal image points after a plurality of object plane test marks are imaged by the projection objective lens, and calculates the distortion and magnification errors of the objective lens by fitting, which shortens the measurement time, eliminates the influence of wafer stage errors on the measurement accuracy and improves the measurement accuracy.

Abstract: Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis.

Abstract: A method of controlling wash equipment in an automated vehicle wash system having a conveyor includes, measuring one or more contours of a vehicle as the vehicle moves thorough an entry area of the automated vehicle wash system on the conveyor; tracking the distance a fixed point relative to the conveyor moves; associating the one or more contours of the vehicle with the position of the fixed point; determining, based on the one or more contours of the vehicle and the position of the fixed point, commands for operating the wash equipment; delivering the commands to the wash equipment; and operating the wash equipment in accordance with the commands.

Abstract: A method includes moving a wafer stage to a first station on a table body of a lithography chamber; placing a wafer on a top surface of the wafer stage; emitting a first laser beam from a first laser emitter toward a first beam splitter on a first sidewall of the wafer stage, wherein a first portion of the first laser beam is reflected by the first beam splitter to form a first reflected laser beam, and a second portion of the first laser beam transmits through the first beam splitter to form a first transmitted laser beam; calculating a position of the wafer stage on a first axis based on the first reflected laser beam; after calculating the position of the wafer, moving the wafer stage to a second station on the table body; and performing a lithography process to the wafer.

Abstract: Embodiments of a marking pattern in forming the staircase structure of a three-dimensional (3D) memory device are provided. In an example, a marking pattern for controlling a trimming rate of a photoresist trimming process includes a plurality of interleaved layers, the plurality of interleaved layers including at least two layers of different materials stacking along a vertical direction over a substrate. In some embodiments, the marking pattern also includes a central marking structure that divides the marking area into a first marking sub-area farther from a device area and a second marking sub-area closer to the device area, a first pattern density of the first marking sub-area being higher than or equal to a second pattern density of the second marking sub-area.

Abstract: A metrology tool may include an illumination sub-system to illuminate sample within two or more acquisition fields with two or more illumination beams, where the two or more acquisition fields are distributed along a scan direction in a non-overlapping configuration, and where a translation stage translates a metrology target on the sample along the scan direction sequentially through the two or more acquisition fields. The metrology tool may further include an imaging sub-system to image the two or more acquisition fields while the sample is scanned along the scan direction. The imaging sub-system may include a field-repositioning optical relay to relay images of the two or more acquisition fields to a scanning detector including one or more pixel columns distributed along a column direction, where the field-repositioning optical relay positions the images of the two or more acquisition fields on the scanning detector along the column direction.

Abstract: A carrier system and method carries an object to an object mounting member provided with an object mounting section. The system includes: a measurement device which obtains information related to a flatness of the object; a carrier member that carries the object; and a controller which controls a driving speed of the carrier member using the information related to the flatness of the object obtained by the measurement device.

Abstract: Provided is a fluid analysis apparatus and a method of controlling the same. The fluid analysis apparatus include an actuator provided on a part of the fluid analysis apparatus, a mounting portion on which a fluid accommodating cartridge is mounted thereon, the fluid accommodating cartridge provided with a well in which a fluid sample is accommodated, a measurement portion configured to transmit light to the fluid accommodating cartridge and detect an optical signal from the light passed through the fluid accommodating cartridge, and a controller configured to control an operation of the actuator based on the optical signal detected by the measurement portion such that the light transmitted from the measurement portion passes through a central portion of the well to perform an accurate inspection on the fluid sample.

Abstract: An anchoring system designed to anchor a position detector on a support plane in a predetermined lateral position relative to a vehicle. The anchoring system comprises a positioning plate, which is firmly fixed on the support plane in the predetermined lateral position, a flat base, which is firmly fixed to the position detector and is designed, in use, to be laid on the positioning plate, magnetic devices, which are arranged on the flat base and on the positioning plate and are structured so as to magnetically attract one another so as to firmly anchor, though in a removable manner, the base of the position detector on the positioning plate.

Abstract: A method, system and program for determining a position of a feature referenced to a substrate. The method includes measuring a position of the feature, receiving an intended placement of the feature and determining an estimate of a placement error based on knowledge of a relative position of a first reference feature referenced to a first layer on a substrate with respect to a second reference feature referenced to a second layer on a substrate. The updated position may be used to position the layer of the substrate having the feature, or another layer of the substrate, or another layer of another substrate.

Abstract: There is provided a surveying instrument including a tripod which is installed on an installation surface and a surveying instrument main body which is provided on the tripod and laterally rotatable around a longitudinal axis, wherein the tripod includes a reference leg has a known relationship between a lower end of the reference leg and a machine reference point which is a machine center of the surveying instrument main body, and two auxiliary legs, the reference leg is installed in such a manner that a lower end of the reference leg coincides with a reference point, wherein the surveying instrument main body calculates a position of the machine reference point with respect to the reference point based on the positional relationship between the lower end of the reference leg and the machine reference point.

Abstract: An overlay metrology target (T) is formed by a lithographic process. A first image (740(0)) of the target structure is obtained using with illuminating radiation having a first angular distribution, the first image being formed using radiation diffracted in a first direction (X) and radiation diffracted in a second direction (Y). A second image (740(R)) of the target structure using illuminating radiation having a second angular illumination distribution which the same as the first angular distribution, but rotated 90 degrees. The first image and the second image can be used together so as to discriminate between radiation diffracted in the first direction and radiation diffracted in the second direction by the same part of the target structure. This discrimination allows overlay and other asymmetry-related properties to be measured independently in X and Y, even in the presence of two-dimensional structures within the same part of the target structure.

Abstract: Apparatuses, systems and methods for indicating whether a target has been impacted by a projectile are disclosed. Embodiments may include a microcontroller, an impact sensor, and an impact indicator. Apparatus may include an acoustic sensor and a miss indicator. Acoustic information or impact information may be received by the sensors and sent to the microcontroller unit. A determination may be made regarding whether the target has been impacted. An indication of a hit or a miss may be made by the impact indicator based on the determination. A light redirection element, which may include a light pipe, may direct light from the impact indicator around the edge of a target to a viewer.

Abstract: The invention relates to a product inspection and characterization device, including conveyance means, a two-dimensional inspection region, a radiation source generating a spot light beam for partially illuminating the surface of the product, optical means for directing the light beam provided with at least one mirror to aim the spot light beam in the inspection region, optical means for directing the reflected and/or scattered light to detection means, detection means for analyzing the light scattered and/or reflected by the product and a processing unit for characterizing the product. The radiation source emitting the light beam is therefore pointed at the product by optical means directing the light beam to the two-dimensional inspection region. Another object of the present invention relates to the method for product inspection and characterization.

Abstract: A misregistration metrology system and method useful in the manufacture of semiconductor devices, the multilayered semiconductor devices including a first periodic structure having a first pitch along a first axis, the first periodic structure being formed together with a first layer of the multilayered semiconductor device, a second periodic structure having a second pitch along a second axis, the second axis not being parallel to the first axis, the second periodic structure being formed together with the first layer of the multilayered semiconductor device and a third periodic structure having a third pitch along a third axis, the third axis not being parallel to the first axis and the third axis not being parallel to the second axis, the third periodic structure being formed together with a second layer of the multilayered semiconductor device, the third periodic structure and the first and second periodic structures overlying one another, the misregistration metrology system and method including generati

Abstract: Apparatuses, systems and methods for indicating whether a target has been impacted by a projectile are disclosed. Embodiments may include a microcontroller, an impact sensor, and an impact indicator. Apparatus may include an acoustic sensor and a miss indicator. Acoustic information or impact information may be received by the sensors and sent to the microcontroller unit. A determination may be made regarding whether the target has been impacted. An indication of a hit or a miss may be made by the impact indicator based on the determination. A light redirection element, which may include a light pipe, may direct light from the impact indicator around the edge of a target to a viewer.

Abstract: A method for forming a pattern of an imprint material on a shot region of a substrate by using a mold, includes determining a plurality of marks for alignment of the shot region and the mold, performing measurement for the alignment using the plurality of marks determined in the determining, setting an origin position of a coordinate system for acquisition of an alignment error between the shot region and the mold based on an arrangement of the plurality of marks determined in the determining, and acquiring the alignment error based on a measurement result in the measurement and the origin position determined in the setting.

Abstract: A vehicle sensing and guidance system for a vehicle wash, and a vehicle wash, are provided. The system includes a first vehicle sensing system having at least one sensor configured to detect a vehicle and generate sensor data, a storage storing computer readable instructions, at least one processor that, when executing the computer readable instructions, determines a pose of the first vehicle using the sensor data, and at least one output device configured to present at least one of a first vehicle positioning marker and a vehicle positioning signal at least partially based on the pose of the first vehicle.

Abstract: Provided are a method and an electronic device that may be coupled to a host device, the electronic device including a housing detachable to the host device, a light generator disposed on a first surface of the housing, a power transmission circuit disposed on a second surface of the housing, the second surface being opposite to the first surface, and a processor that controls the light generator to output a light, wherein an external electronic device moves to a predetermined position based on the outputted light, and control to wirelessly transmit power to the external electronic device via the power transmission circuit based on the external electronic device moving to the predetermined position.

Abstract: A parameter-stable misregistration measurement amelioration system and method including providing a wafer, including a plurality of multilayered semiconductor devices formed thereon, selected from a batch wafers intended to be identical, using a misregistration metrology tool to measure misregistration at multiple sites between at least a first layer and a second layer of the wafer, using a plurality of sets of measurement parameters, thereby generating measured misregistration data for each of the sets of measurement parameters, identifying and removing a parameter-dependent portion and a mean error portion from the measured misregistration data for the wafer for each of the sets of measurement parameters, thereby generating ameliorated parameter-stable ameliorated misregistration data for the wafer.

Abstract: A multispectral material detection system captures spectral data and compares select spectral bands to reflectance spectra of a plurality of materials. The system identifies distinguishing features in reflectance spectra of a plurality of materials and in a plurality of spectral channels identifying distinguishing structural aspects of each material with respect to the background environments. Upon an observed spectral reflectance being proximate to one or more known spectra characteristics, the object is associated with a material of interest.

Abstract: A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.

Abstract: An adjustment method is for a marking laser beam of an imaging modality. The marking laser beam includes a central beam and at least one peripheral beam and extends from a laser source to a detection plane. The detection plane includes a central target position for the central beam and at least one peripheral target position for the at least one peripheral beam and a detection unit. The detection unit is embodied to capture whether the marking laser beam is striking at least one of the target positions. In an embodiment, the method includes a first adjustment of the marking laser beam via an adjusting unit, until it strikes the central target position; and a second adjustment of the marking laser beam via the adjusting unit, until it strikes the at least one peripheral target position. The marking laser beam will also be kept at the central target position.

Abstract: An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.

Abstract: Disclosed is a universal fixture based machine tool used in the machining industry. The tool includes a numerically controlled machine tool body, a multifunctional machine tool countertop, a first fixture pallet, a second fixture pallet, a fixture integration platform, a split bench vise, and a flexible fixture element. The multifunctional machine tool countertop, the first fixture pallet and the second fixture pallet are all made of perforated foundation plates. The numerically controlled machine tool body can achieve a three-axis linkage machining function of X-, Y-, and Z-coordinate moving axes. The fixture integration platform can achieve a rotary machining function of three rotation axes A, B, and C of the universal fixture based machine tool. The flexible fixture element can have various combinations and changes, so that the universal fixture based machine tool has a machining function of three increment axes U, V, and W.

Abstract: A movable body apparatus has: a substrate holder holding a substrate and can move in the X and Y-axes directions; a Y coarse movement stage movable in the Y-axis direction; a first measurement system acquiring position information on the substrate holder by heads on the substrate holder and a scale on the Y coarse movement stage; a second measurement system acquiring position information on the Y coarse movement stage by heads on the Y coarse movement stage and a scale; and a control system controlling the position of the substrate holder based on position information acquired by the first and second measurement systems. The first measurement system irradiates a measurement beam while moving the heads in the X-axis direction with respect to the scale, and the second measurement system irradiates a measurement beam while moving the heads in the Y-axis direction with respect to the scale.

Abstract: A sample holder 100 for use in a device for image-based analysis of multiple samples, the sample holder comprising: an optically flat surface 10; multiple locations of interest 16, 18 dispersed across the optically flat surface 10 that each, in use, correspond to locations of a sample of the multiple samples; and multiple focal structures 12 associated with the multiple locations of interest 16, 18; wherein the focal structures 12 each comprise at least one pyramid shaped indentation 30 in the optically flat surface 10.

Abstract: A measurement device has: a slider which holds a substrate and is movable parallel to the XY plane; a drive system that drives the slider; a position measurement system which emits beams from a head section to a measurement surface in which grating section are provided on the slider, which receives respective return beams of the beams from the measurement surface, and which is capable of measuring position information in at least directions of three degrees of freedom including the absolute position coordinates of the slider; a mark detection system that detects a mark on the substrate; and a controller which detects the marks on the substrate using the mark detection system while controlling the drive of the slider, and which obtains the absolute position coordinates of each mark based on the detection result of each mark and measurement information by the position measurement system at the time of detection.

Abstract: A semiconductor pattern for monitoring overlay and critical dimension at post-etching stage is provided in the present invention, which include a first inverted-T shaped pattern with a base portion and a middle portion extending from the base portion and a second pattern adjacent and spaced apart from the base portion of the first inverted-T shaped pattern, wherein the first inverted-T shaped pattern and the second pattern are composed of a plurality of spacer patterns spaced apart from each other.

Abstract: A method of wafer dicing and a die are provided. The method includes the following processes. A wafer is provided, the wafer includes a plurality of die regions and a scribe region between the die regions. The scribe region includes a substrate, and a dielectric layer and a test structure on the substrate, the test structure is disposed in the dielectric layer. A first removal process is performed to remove the test structure and the dielectric layer around the test structure, so as to expose the substrate. The first removal process includes performing a plurality of etching cycles, and each etching cycle includes performing a first etching process to remove a portion of the test structure and performing a second etching process to remove a portion of the dielectric layer. A second removal process is performed to remove the substrate in the scribe region, so as to form a plurality of dies separated from each other.

Abstract: Position-sensitive light beam detector comprising photodiodes and at least two weighting networks, each of which includes a signal output and network nodes. According to the invention, a plurality of the network nodes of the first weighting network is provided for the photodiode terminal in such a way that each node of said plurality of nodes is connected to a node of the second weighting network via a photodiode.

Abstract: An alignment system (100) and method for positioning and/or keeping a first object (1) at a controlled distanced (D1) with respect to a second object (2). An object stage (11) is configured to hold a surface (1a) of the first object (1) at a distance (D1) over a surface (2a) of the second object (2). A sensor device (31) comprising a probe tip (31a) is connected at a predetermined probe level distance (Dp) relative to the surface (1a) of the first object (1). The probe tip (31a) is configured to perform an atomic force measurement (AFM) of a force (F1) exerted via the probe tip (31a) on a surface (2a) of the second object (2). A controller (80) is configured to control an object stage actuator (21) as a function of the probe level distance (Dp) and the measured force (F1) to maintain the controlled distanced (D1).

Abstract: A display device for displaying a marking in the form of a distance to be kept between game equipment, in particular a football, and a participant on a playing field of a sports facility, includes a display device for projecting light beams representing the marking onto the playing field. The projected light beams display the distance to be kept, and can be projected at least in sections in the shape of a circle, for example at a distance of 9.15 m, around the game equipment on the playing field. The display device is jointly movable with a transport device that is movable above the sports facility.

Abstract: Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

Abstract: A bonding apparatus 10 having a diagonal optical system 30, the bonding apparatus moves a capillary 24 down to a first heightwise position to calculate a position A11 of a tip end portion of the capillary 24 and a position A12 of a tip end portion of the capillary in an image on an imaging plane of the diagonal optical system 30, and similarly moves the capillary 24 down to a further lower second heightwise position to calculate a position A21 of the tip end portion of the capillary 24 and a position A22 of the tip end portion of the capillary in the image on the imaging plane. The bonding apparatus then estimates the position of the landing point of the capillary 24 on a bonding target 8 based on positional data for the four calculated positions A11, A12, A21, and A22, the first heightwise position, and the second heightwise position. With this, it is possible to use the diagonal optical system in the bonding apparatus to further improve positional accuracy in the bonding process.

Abstract: Methods are provided that, in some embodiments that provide alignment of a first layer of a printing plate on a chuck. For example, in one embodiment, images of reference marks on a chuck are captured to determine the initial positions of the reference marks on the chuck. A reference model is created from those initial positions. Images of alignment marks on a reference plate are captured and the locations of the alignment marks are determined. A reference plate model is created from the positions of the alignment marks. A mapping model is then created from the reference model and the reference plate model.

Abstract: A semiconductor device includes a first overlay group and a second overlay group disposed on a semiconductor substrate. The first overlay group includes first lower overlay patterns which extend in a first direction, first upper overlay patterns overlapping the first lower overlay patterns, and first via overlay patterns interposed between the first lower overlay patterns and the first upper overlay patterns. The second overlay group includes second lower overlay patterns which extend in a second direction, second upper overlay patterns overlapping the second lower overlay patterns, and second via overlay patterns interposed between the second lower overlay patterns and the second upper overlay patterns. The second lower overlay patterns include end portions adjacent to and spaced apart from the first overlay group.

Abstract: An inspection method includes a rough alignment process of acquiring optical images of first and second patterns previously set to confirm whether a position misalignment amount in a rotation direction of a sample with respect to an X or Y direction is equal to or smaller than a first acceptable value, and conforming whether the position misalignment amount is equal to or smaller than the first acceptable value on the basis of an acquisition result, and a fine alignment process of acquiring optical images of third patterns positioned on different corners of a rectangular frame constituted of four sides along the X or Y direction on an optical image of the sample and rotating a stage until a position misalignment amount detected based on the optical images of the third patterns becomes equal to or smaller than a second acceptable value being smaller than the first acceptable value.

Abstract: Imaging metrology targets and methods are provided, which combine one-dimensional (1D) elements designed to provide 1D imaging metrology signals along at least two measurement directions and two-dimensional (2D) elements designed to provide at least one 2D imaging metrology overlay signal. The target area of the 1D elements may enclose the 2D elements or the target areas of the 1D and 2D elements may be partially or fully congruent. The compound targets are small, possibly multilayered, and may be designed to be process compatible (e.g., by segmentation of the elements, interspaces between elements and element backgrounds) and possibly be produced in die. Two dimensional elements may be designed to be periodic to provide additional one dimensional metrology signals.

Abstract: A method for overlay monitoring and control is introduced in the present disclosure. The method includes selecting a group of patterned wafers from a lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot.

Abstract: A method of determining a parameter of a patterning process applied to an object comprising two features (for example an overlay of the two features) comprises: irradiating the two features of the object with a radiation beam and receiving at least a portion of the radiation beam scattered from the two features of the object. The at least a portion of the radiation beam comprises: a first portion comprising at least one diffraction order and a second portion comprising at least one diffraction order that is different to a diffraction order of the first portion. The method further comprises moderating a phase difference between the first and second portions and combining the first and second portions such that they interfere to produce a time dependent intensity signal. The method further comprises determining the parameter of the patterning process from a contrast of the time dependent intensity signal.

Abstract: Binocular augmented reality display devices and corresponding methods allow alignment calibration to be performed by an end user. According to one approach, a camera is positioned to have a field of view which includes simultaneously part of a projected image from the left-eye display and part of a projected image from the right-eye display. By projecting via each display at least part of a calibration image and identifying within the camera-sampled image right-field and left-field alignment features, an alignment correction can be derived. Alternative approaches employ correlation of images sampled by forward-looking cameras rigidly associated with the respective right-eye and left-eye display units, or require a user to input a manual adjustment for aligning transversely-swapped camera images with the real world view.

Abstract: A projection system which arranges n×m projection images and forms one composite projection image on a projection surface includes: n×m projectors; an operation unit which accepts an operation by a user; and a control unit which controls the projection by each of the n×m projectors. The control unit causes a reference image showing a reference point common to a plurality of projection areas to be projected in an overlap area where the plurality of projection areas overlap each other, and causes each of a plurality of projectors projecting the projection image in the overlap are where the reference image to be moved is projected, to execute geometric correction of the projection image in such a way that the reference image moves to a position on the projection surface designated by the user by the operation via the operation unit, and to project the projection image.

Abstract: An organic light-emitting display apparatus includes: a substrate including a display area and a peripheral area outside the display area; an alignment mark located in the peripheral area; and an insulating film located in the peripheral area and including a first opening through which at least a part of the alignment mark is exposed and a plurality of slits that extend from the first opening.

Abstract: A system is provided for correcting an error of a camera for a camera monitoring system (CMS), including a camera attached to a side of a vehicle, a memory configured to store processor-executable instructions for correcting an error of an image captured by the camera, and a processor configured with the processor-executable instructions to detect a correction point is the image captured by the camera, generate a correction parameter based on a resultant value of a comparison between the detected correction point and a preset correction point, and correct the error of the image based on the generated correction parameter.

Abstract: A probe includes a movable plate to which a stylus capable of contacting a measurable object is mounted, the movable plate displaceable in an X direction; a static plate arranged to overlap with the movable plate; a counter plate facing the movable plate and the static plate; an elastic movable side connection plate, the movable side connection plate connecting the counter plate at at least three places with each of a first end connector positioned toward a first end of the movable plate in the X direction and second end connectors positioned toward a second end in the X direction; and a static side connection plate which connects the static plate and the counter plate. An entire length of the first end connector in a Y direction orthogonal to the X direction is the same size as the entire length of the second end connectors in the Y direction.

Abstract: In a board work machine that performs board work with reference to a reference mark provided on a board, in a case of performing board work with respect to a board provided with overall reference mark and local area reference mark that acts as a reference for a local area as reference marks, when recognizing the reference marks by imaging, checking is performed as to whether a recognized reference mark is recognized correctly. For this checking, when checking whether the position deviation amount from a normal position and the relative position deviation amount of an imaging target identified as a reference mark is within the range of a set tolerance, set tolerances for a local area reference mark are smaller than set tolerances for an overall reference mark.

Abstract: According to one embodiment, there is provided an antireflection member including a first plate part, a second plate part, and a third plate part. The first plate part has a first end and a second end. The second end is arranged at a side opposite to the first end. The second plate part extends from a vicinity of the first end. A first notch part is arranged on the second plate part. The second plate part has an antireflection surface. The third plate part extends from a vicinity of the second end to be opposed to the second plate part A second notch part is arranged at a position corresponding to the first notch part on the third plate part. The third plate part has an antireflection surface directed to the antireflection surface of the second plate part.